CN112638050B - Circuit board electroplating method - Google Patents
Circuit board electroplating method Download PDFInfo
- Publication number
- CN112638050B CN112638050B CN202011642937.0A CN202011642937A CN112638050B CN 112638050 B CN112638050 B CN 112638050B CN 202011642937 A CN202011642937 A CN 202011642937A CN 112638050 B CN112638050 B CN 112638050B
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- Prior art keywords
- sliding
- clamping
- circuit board
- mounting seat
- group
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- 238000009713 electroplating Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000006835 compression Effects 0.000 claims abstract description 3
- 238000007906 compression Methods 0.000 claims abstract description 3
- 238000007747 plating Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 2
- 230000001360 synchronised effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a circuit board electroplating method, which is completed based on circuit board electroplating equipment, so as to realize electroplating of a circuit board; the circuit board electroplating equipment comprises an upper mounting seat; the bottom of the upper mounting seat is provided with four pairs of adjusting connecting rods; the bottoms of the four pairs of adjusting connecting rods are connected with a group of lower mounting seats together. The clamping device has good adjusting capability and stronger adaptability, the clamping effect of the circuit board is better, and meanwhile, the synchronous compression of the five groups of active clamping blocks can be realized by rotating the clamping operation parts, so that the operation is reduced, and the working efficiency is improved.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a circuit board electroplating method.
Background
An important step in the production of circuit boards is electroplating. The principle of electroplating is to plate a layer of metal or form an alloy on the surface of other metals. The method mainly utilizes the action of electrolysis to form the same oxidized metal film on the metal surface or non-metal surface, thereby playing the roles of preventing oxidation, light reflection, corrosion resistance (copper sulfate and the like) and the like.
For example, application No.: CN200910310544.7 the present invention provides an ultra-thin magnetically-fixed electroplating clamp for printed circuit board, which is used for clamping the printed circuit board. The PCB electroplating device comprises a PCB electroplating device and is characterized in that the PCB electroplating device comprises a first clamping part, the first clamping part comprises a main body and a clamping cover, the main body comprises a first magnet, the clamping cover comprises a second magnet, and the first magnet and the second magnet attract each other to enable the main body and the clamping cover to jointly clamp the edge of the PCB. The electroplating clamp for the printed circuit board can avoid the damage of the plated piece, improve the electroplating uniformity and improve the production efficiency.
Based on the above, the existing circuit board electroplating method needs to fix the circuit board on the electroplating equipment, the circuit board of the existing electroplating equipment needs to be fixed through the clamp when being fixed, the position of the existing clamp is generally fixed, when the sizes of the circuit boards are different, the distance between the clamps is difficult to adjust, so that the fixation is poor, and meanwhile, the circuit boards need to be completely operated one by one when being fixed, so that the operation is troublesome, and the production efficiency is influenced; therefore, the existing requirements are not met, and a circuit board electroplating method is provided for the method.
Disclosure of Invention
The invention aims to provide a circuit board electroplating method, which aims to solve the problems that the prior circuit board electroplating method proposed in the background art needs to fix a circuit board on electroplating equipment, the circuit board of the prior electroplating equipment needs to be fixed by a clamp during fixing, the position of the prior clamp is generally fixed, when the sizes of the circuit boards are different, the distance between the clamps is difficult to adjust, the fixing is poor, and meanwhile, the circuit boards need to be completely operated one by one when being fixed, the operation is troublesome, and the production efficiency is influenced.
In order to achieve the purpose, the invention provides the following technical scheme:
a circuit board electroplating method is completed based on circuit board electroplating equipment, so that electroplating of a circuit board is realized; the circuit board electroplating equipment comprises an upper mounting seat; the bottom of the upper mounting seat is provided with four pairs of adjusting connecting rods; the bottoms of the four pairs of adjusting connecting rods are connected with a group of lower mounting seats together; the bottom of the lower mounting seat is connected with five groups of sliding clamping blocks in a sliding manner; the front end surface of each pair of sliding clamping blocks is connected with a group of driving clamping blocks in a sliding manner; each pair of the active clamping blocks is in compression connection with the sliding clamping blocks through a group of clamping bolts; the front part of the lower mounting seat is rotatably connected with a group of clamping operation pieces; the upper parts of the two pairs of adjusting connecting rods in the middle are hinged with the upper mounting seat, and the lower parts of the two pairs of adjusting connecting rods in the middle are hinged with the lower mounting seat; the upper mounting seat also comprises adjusting sliding grooves, a group of adjusting sliding grooves are formed in the left side and the right side of the top of the upper mounting seat, a group of sliding shafts are rotatably connected to upper and lower hinge connection points of the adjusting connecting rod, and the four groups of sliding shafts on the upper part are slidably connected with the adjusting sliding grooves; the adjusting connecting rod also comprises a fixing nut, and two groups of sliding shafts on the left side and the right side of the top are in threaded connection with a group of fixing nuts; the lower mounting seat further comprises a position adjusting guide groove, a group of position adjusting guide grooves are formed in the bottom of the lower mounting seat, the sliding clamping block is connected with the position adjusting guide grooves in a sliding mode, and the sliding clamping block is connected with a sliding shaft at the bottom in a rotating mode.
Preferably, the sliding clamping block further comprises a circuit board positioning block, and the middle part of the sliding clamping block is fixedly connected with a group of circuit board positioning blocks; the active clamping block further comprises a guide slide rail, a group of guide slide rails is fixedly connected to the left side and the right side of the rear side of the active clamping block, and the active clamping block is connected with the sliding clamping block in a sliding mode through the guide slide rails.
Preferably, the clamping bolt further comprises an eccentric block, and a group of eccentric blocks is rotatably connected in front of the clamping bolt; the clamping operation part further comprises a clamping sliding groove, the clamping sliding groove is formed in the middle of the clamping operation part in a circumferential array mode, and the eccentric block is connected with the clamping operation part in a sliding mode through the clamping sliding groove.
Compared with the prior art, the invention has the beneficial effects that:
when the clamping device is used, the circuit board is inserted through the bottom, the circuit board is positioned through the circuit board positioning block, the clamping operation part is rotated, the clamping operation part drives the eccentric block to rotate through the clamping sliding groove, the driving clamping block is driven to slide backwards through the rotation of the eccentric block, and the circuit board is pressed tightly through the driving clamping block and the sliding clamping block; when the clamping width needs to be adjusted when circuit boards of different sizes are replaced, the fixing nuts are loosened, the lower mounting seat slides up and down, the upper mounting seat and the lower mounting seat drive the four-stage scissor mechanism formed by four pairs of adjusting connecting rods to deform, the change of the distance between the five groups of sliding clamping blocks is realized through the deformation of the scissor mechanism, and the fixing nuts are screwed after the distance between the sliding clamping blocks is proper.
The five groups of sliding clamping blocks can be adjusted in distance, circuit boards with different width sizes can be clamped, the adjusting capacity is good, the adaptability is high, the clamping effect of the circuit boards is good, meanwhile, the five groups of active clamping blocks can be synchronously pressed through rotating the clamping operation piece, the operation is reduced, and the working efficiency is improved.
Drawings
FIG. 1 is a schematic side view of the present invention;
FIG. 2 is a schematic side view of the adjusting connecting rod of the present invention;
FIG. 3 is a schematic side view of the mounting shaft of the sliding clamping block of the present invention;
FIG. 4 is a schematic side view of the rear axle of the sliding clamping block of the present invention;
FIG. 5 is a schematic side view of the clamping bolt of the present invention;
FIG. 6 is a schematic side view of the active clamping block of the present invention;
FIG. 7 is a schematic side view of the clamping operation member and the clamping operation member mounting shaft of the present invention;
FIG. 8 is a schematic side view of the sliding clamping block of the present invention;
FIG. 9 is a schematic side view of the active clamping block mounting shaft of the present invention;
in the figure: 1. an upper mounting seat; 101. adjusting the sliding groove; 2. adjusting the connecting rod; 201. a sliding shaft; 202. fixing a nut; 3. a lower mounting seat; 301. a position adjustment guide groove; 4. a sliding clamping block; 401. a circuit board positioning block; 5. an active clamping block; 501. a guide slide rail; 6. a clamping operation member; 601. clamping the sliding groove; 7. clamping the bolt; 701. an eccentric mass.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1 to 9, an embodiment of the present invention includes:
a circuit board electroplating method is completed based on circuit board electroplating equipment, so that electroplating of a circuit board is realized; the circuit board electroplating equipment comprises an upper mounting seat 1; the bottom of the upper mounting seat 1 is provided with four pairs of adjusting connecting rods 2; the bottoms of the four pairs of adjusting connecting rods 2 are connected with a group of lower mounting seats 3 together; the bottom of the lower mounting seat 3 is connected with five groups of sliding clamping blocks 4 in a sliding manner; the front end surface of each pair of sliding clamping blocks 4 is connected with a group of driving clamping blocks 5 in a sliding manner; each pair of the active clamping blocks 5 is tightly connected with the sliding clamping block 4 through a group of clamping bolts 7; the front part of the lower mounting seat 3 is rotatably connected with a group of clamping operation parts 6; the four pairs of adjusting connecting rods 2 form a four-stage scissor mechanism together, the upper parts of the two pairs of adjusting connecting rods 2 in the middle are hinged with the upper mounting seat 1, and the lower parts of the two pairs of adjusting connecting rods 2 in the middle are hinged with the lower mounting seat 3, so that in use, when the upper mounting seat 1 and the lower mounting seat 3 slide relatively, the upper mounting seat 1 and the lower mounting seat 3 drive the four-stage scissor mechanism formed by the four pairs of adjusting connecting rods 2 to deform; the upper mounting seat 1 further comprises adjusting sliding grooves 101, a group of adjusting sliding grooves 101 are formed in the left side and the right side of the top of the upper mounting seat 1, a group of sliding shafts 201 are rotatably connected to upper hinge connection points and lower hinge connection points of the adjusting connecting rods 2, and four groups of sliding shafts 201 on the upper portion are slidably connected with the adjusting sliding grooves 101; the adjusting connecting rod 2 further comprises a fixing nut 202, a group of fixing nuts 202 are connected to the two groups of sliding shafts 201 on the left side and the right side of the top in a threaded mode, and the sliding shafts 201 and the upper mounting base 1 are locked and mounted through the fixing nuts 202 in use, so that the form of the scissor mechanism is fixed; lower mount pad 3 is still including position control guide way 301, a set of position control guide way 301 has been seted up to the bottom of lower mount pad 3, slip clamp 4 piece and position control guide way 301 sliding connection, slip clamp 4 piece rotates with the sliding shaft 201 of bottom to be connected, in use realizes the direction to slip clamp 4 piece through position control guide way 301, work as scissors fork mechanism deformation, realize the change of distance between five groups slip clamp 4 pieces through the deformation of scissors fork mechanism, in order to satisfy the fixed to the not unidimensional circuit board.
Furthermore, the sliding clamping block 4 further comprises a circuit board positioning block 401, the middle part of the sliding clamping block 4 is fixedly connected with a group of circuit board positioning blocks 401, in use, a circuit board is inserted through the bottom part, and the circuit board is positioned through the circuit board positioning blocks 401; the active clamping block 5 further comprises a guide slide rail 501, a group of guide slide rails 501 are fixedly connected to the left side and the right side of the rear side of the active clamping block 5, the active clamping block 5 is slidably connected with the sliding clamping block 4 through the guide slide rails 501, and in use, the active clamping block 5 is guided through the guide slide rails 501.
Furthermore, the clamping bolt 7 also comprises an eccentric block 701, the front of the clamping bolt 7 is rotatably connected with a group of eccentric blocks 701, the active clamping block 5 is driven by the eccentric blocks 701 to slide backwards in use, and the circuit board is pressed tightly by the sliding of the active clamping block 5; the clamping operation part 6 further comprises a clamping sliding groove 601, the clamping sliding grooves 601 are arranged in a circumferential array in the middle of the clamping operation part 6, the eccentric block 701 is connected with the clamping operation part 6 in a sliding mode through the clamping sliding groove 601, and in use, when the clamping operation part 6 is rotated, the clamping operation part 6 drives the eccentric block 701 to rotate through the clamping sliding groove 601.
The circuit board electroplating method specifically comprises the following steps:
when the circuit board clamping device is used, a circuit board is inserted through the bottom, the circuit board is positioned through the circuit board positioning block 401, the clamping operation piece 6 is rotated, the clamping operation piece 6 drives the eccentric block 701 to rotate through the clamping sliding groove 601, the driving clamping block 5 is driven to slide backwards through the rotation of the eccentric block 701, and the circuit board is pressed tightly through the driving clamping block 5 and the sliding clamping block 4; when circuit boards of different sizes need to be replaced and clamping widths need to be adjusted, the fixing nuts 202 are loosened, the lower mounting seat 3 slides up and down, the upper mounting seat 1 and the lower mounting seat 3 drive a four-stage scissor mechanism formed by four pairs of adjusting connecting rods 2 to deform, the change of distances among five groups of sliding clamping blocks 4 is realized through the deformation of the scissor mechanism, and the fixing nuts 202 are screwed after the distances among the sliding clamping blocks 4 are proper.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (2)
1. A circuit board electroplating method is characterized in that: the circuit board electroplating method is completed based on circuit board electroplating equipment, so that the electroplating of the circuit board is realized; the circuit board electroplating equipment comprises an upper mounting seat (1); the bottom of the upper mounting seat (1) is provided with four pairs of adjusting connecting rods (2); the bottoms of the four pairs of adjusting connecting rods (2) are connected with a group of lower mounting seats (3) together; the bottom of the lower mounting seat (3) is connected with five groups of sliding clamping blocks (4) in a sliding manner; the front end surface of each pair of sliding clamping blocks (4) is connected with a group of driving clamping blocks (5) in a sliding manner; each pair of the active clamping blocks (5) is in compression connection with the sliding clamping block (4) through a group of clamping bolts (7); the front part of the lower mounting seat (3) is rotatably connected with a group of clamping operation pieces (6); the four pairs of adjusting connecting rods (2) form a four-stage scissor mechanism together, the upper parts of the two pairs of adjusting connecting rods (2) in the middle are hinged with the upper mounting seat (1), and the lower parts of the two pairs of adjusting connecting rods (2) in the middle are hinged with the lower mounting seat (3); the upper mounting seat (1) further comprises adjusting sliding grooves (101), a group of adjusting sliding grooves (101) are formed in the left side and the right side of the top of the upper mounting seat (1), a group of sliding shafts (201) are rotatably connected to upper and lower hinge connection points of the adjusting connecting rod (2), and four groups of sliding shafts (201) on the upper portion are slidably connected with the adjusting sliding grooves (101); the adjusting connecting rod (2) also comprises a fixing nut (202), and two groups of sliding shafts (201) on the left side and the right side of the top are in threaded connection with a group of fixing nuts (202); the lower mounting seat (3) further comprises a position adjusting guide groove (301), the bottom of the lower mounting seat (3) is provided with a group of position adjusting guide grooves (301), the sliding clamping block (4) is in sliding connection with the position adjusting guide grooves (301), and the sliding clamping block (4) is in rotating connection with a sliding shaft (201) at the bottom; the clamping bolt (7) further comprises an eccentric block (701), and a group of eccentric blocks (701) are rotatably connected to the front of the clamping bolt (7); the clamping operation piece (6) further comprises clamping sliding grooves (601), the clamping sliding grooves (601) are arranged in the middle of the clamping operation piece (6) in a circumferential array mode, and the eccentric block (701) is connected with the clamping operation piece (6) in a sliding mode through the clamping sliding grooves (601); the clamping operation piece (6) is rotated, the clamping operation piece (6) drives the eccentric block (701) to rotate through the clamping sliding groove (601), the driving clamping block (5) is driven to slide backwards through the rotation of the eccentric block (701), and the circuit board is pressed tightly through the driving clamping block (5) and the sliding clamping block (4).
2. A circuit board plating method according to claim 1, characterized in that: the sliding clamping block (4) further comprises circuit board positioning blocks (401), and the middle part of the sliding clamping block (4) is fixedly connected with a group of circuit board positioning blocks (401); the active clamping block (5) further comprises a guide sliding rail (501), a group of guide sliding rails (501) are fixedly connected to the left side and the right side of the rear side of the active clamping block (5), and the active clamping block (5) is connected with the sliding clamping block (4) in a sliding mode through the guide sliding rails (501).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011642937.0A CN112638050B (en) | 2020-12-30 | 2020-12-30 | Circuit board electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011642937.0A CN112638050B (en) | 2020-12-30 | 2020-12-30 | Circuit board electroplating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112638050A CN112638050A (en) | 2021-04-09 |
| CN112638050B true CN112638050B (en) | 2021-12-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011642937.0A Active CN112638050B (en) | 2020-12-30 | 2020-12-30 | Circuit board electroplating method |
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| Country | Link |
|---|---|
| CN (1) | CN112638050B (en) |
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|---|---|---|---|---|
| JP2003293194A (en) * | 2002-04-09 | 2003-10-15 | Canon Inc | Tool for plating printed circuit board |
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| CN104986684A (en) * | 2015-07-31 | 2015-10-21 | 李赞芬 | Lift |
| CN106393018A (en) * | 2016-11-24 | 2017-02-15 | 上海云线娃娃信息科技有限公司 | Worktable provided with clamping device |
| CN206895017U (en) * | 2017-05-12 | 2018-01-16 | 重庆宇隆光电科技有限公司 | A kind of chucking device of surface-mounted integrated circuit |
| CN209390466U (en) * | 2018-11-24 | 2019-09-13 | 苏州旗开得电子科技有限公司 | A kind of programmable repair system |
| CN210232041U (en) * | 2019-06-14 | 2020-04-03 | 淮安茂泰科技有限公司 | PCB welding jig convenient to location |
| CN210292125U (en) * | 2019-07-26 | 2020-04-10 | 南京信息工程大学 | Outer quick-witted support protector of air conditioner |
| CN211392182U (en) * | 2019-12-28 | 2020-09-01 | 深圳市优创鑫电子有限公司 | Circuit board and corresponding high-compatibility transfer carrier thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3379755B2 (en) * | 2000-05-24 | 2003-02-24 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Metal plating equipment |
-
2020
- 2020-12-30 CN CN202011642937.0A patent/CN112638050B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003293194A (en) * | 2002-04-09 | 2003-10-15 | Canon Inc | Tool for plating printed circuit board |
| CN104339176A (en) * | 2014-09-29 | 2015-02-11 | 无锡康柏斯机械科技有限公司 | Tiltable adjustable vice bench |
| CN104986684A (en) * | 2015-07-31 | 2015-10-21 | 李赞芬 | Lift |
| CN106393018A (en) * | 2016-11-24 | 2017-02-15 | 上海云线娃娃信息科技有限公司 | Worktable provided with clamping device |
| CN206895017U (en) * | 2017-05-12 | 2018-01-16 | 重庆宇隆光电科技有限公司 | A kind of chucking device of surface-mounted integrated circuit |
| CN209390466U (en) * | 2018-11-24 | 2019-09-13 | 苏州旗开得电子科技有限公司 | A kind of programmable repair system |
| CN210232041U (en) * | 2019-06-14 | 2020-04-03 | 淮安茂泰科技有限公司 | PCB welding jig convenient to location |
| CN210292125U (en) * | 2019-07-26 | 2020-04-10 | 南京信息工程大学 | Outer quick-witted support protector of air conditioner |
| CN211392182U (en) * | 2019-12-28 | 2020-09-01 | 深圳市优创鑫电子有限公司 | Circuit board and corresponding high-compatibility transfer carrier thereof |
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| CN112638050A (en) | 2021-04-09 |
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Effective date of registration: 20211201 Address after: 221000 No. 1, Dongfeng Road, Huxi farm, Pei County, Xuzhou City, Jiangsu Province Applicant after: Xuzhou milestone Intelligent Technology Co.,Ltd. Address before: No.125 Zhujiang Road, Zhangzhuang Town, Pei County, Xuzhou City, Jiangsu Province Applicant before: Peixian zhuofen science and Technology Service Center |
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Application publication date: 20210409 Assignee: Jiangsu Saiwu New Material Technology Co.,Ltd. Assignor: Xuzhou milestone Intelligent Technology Co.,Ltd. Contract record no.: X2024980010615 Denomination of invention: A method for electroplating circuit boards Granted publication date: 20211217 License type: Common License Record date: 20240725 |
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