CN112614828B - Display panel and manufacturing method thereof - Google Patents
Display panel and manufacturing method thereof Download PDFInfo
- Publication number
- CN112614828B CN112614828B CN202011482727.XA CN202011482727A CN112614828B CN 112614828 B CN112614828 B CN 112614828B CN 202011482727 A CN202011482727 A CN 202011482727A CN 112614828 B CN112614828 B CN 112614828B
- Authority
- CN
- China
- Prior art keywords
- light emitting
- array substrate
- organic light
- emitting diode
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 238000006243 chemical reaction Methods 0.000 claims abstract description 56
- 239000003086 colorant Substances 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims description 112
- 239000002346 layers by function Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 21
- 239000002096 quantum dot Substances 0.000 claims description 21
- 238000005538 encapsulation Methods 0.000 claims description 17
- 238000000862 absorption spectrum Methods 0.000 claims description 9
- 238000000295 emission spectrum Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 12
- 238000001914 filtration Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 2
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- AQCDIIAORKRFCD-UHFFFAOYSA-N cadmium selenide Chemical compound [Cd]=[Se] AQCDIIAORKRFCD-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a display panel and a manufacturing method thereof, wherein the display panel comprises: an array substrate; the light emitting device comprises a plurality of light emitting devices and a plurality of color conversion layers, wherein the light emitting devices are arranged on the array substrate and comprise first light emitting devices and second light emitting devices, the light emitting colors of the first light emitting devices are different from each other, the first light emitting devices are inorganic light emitting diodes, the second light emitting devices comprise first organic light emitting diodes and color conversion layers, and the color conversion layers are located on one sides, deviating from the array substrate, of the first organic light emitting diodes and can convert the colors of light emitted by the first organic light emitting diodes. The invention can reduce the transfer quantity of the inorganic light-emitting diodes and improve the yield of the display panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a manufacturing method thereof.
Background
With the development of display technology, people have higher and higher requirements on display panels, and the technology update in the display field is also a change day by day.
The Micro-Light Emitting diode (Micro-LED) Display technology is a novel Display technology, and compared with the existing OLED technology, the Micro-LED Display technology has the advantages of high brightness, high efficiency, low power consumption and the like, but the Micro-LED Display technology needs to transfer millions or even tens of millions of LED chips onto a driving backplane by using a huge transfer technology, and the transfer quantity is huge, so that the yield of the Display panel is lower.
Therefore, it is desirable to provide a new display panel and a method for fabricating the same.
Disclosure of Invention
The embodiment of the invention provides a display panel and a manufacturing method thereof, aiming at improving the yield of the display panel.
In a first aspect, an embodiment of the present invention provides a display panel, including: an array substrate; the light emitting device comprises a plurality of light emitting devices and a plurality of color conversion layers, wherein the light emitting devices are arranged on the array substrate and comprise first light emitting devices and second light emitting devices, the light emitting colors of the first light emitting devices are different from each other, the first light emitting devices are inorganic light emitting diodes, the second light emitting devices comprise first organic light emitting diodes and color conversion layers, and the color conversion layers are located on one sides, deviating from the array substrate, of the first organic light emitting diodes and can convert the colors of light emitted by the first organic light emitting diodes.
According to the foregoing embodiments of the first aspect of the present invention, the plurality of light emitting devices further includes a third light emitting device having a light emission color different from the first light emitting device and the second light emitting device, the third light emitting device including a second organic light emitting diode.
According to any of the preceding embodiments of the first aspect of the invention, the first light emitting device is a blue light emitting device, the second light emitting device is a red light emitting device, and the third light emitting device is a green light emitting device.
According to any of the preceding embodiments of the first aspect of the invention, further comprising at least any of: the first light filtering unit is positioned on one side of the first light-emitting device, which deviates from the array substrate; the second light filtering unit is positioned on one side of the second light emitting device, which is far away from the array substrate; and the third filtering unit is positioned on one side of the third light-emitting device, which deviates from the array substrate.
According to any of the preceding embodiments of the first aspect of the invention, the first organic light emitting diode and the second organic light emitting diode emit light of the same color.
According to any of the preceding embodiments of the first aspect of the present invention, an orthographic projection of at least one functional layer of the first organic light emitting diode and the second organic light emitting diode on the array substrate overlaps with an orthographic projection of the first light emitting device on the array substrate.
According to any of the preceding embodiments of the first aspect of the invention, the color conversion layer comprises a quantum dot layer, the absorption spectrum of the color conversion layer at least partially overlapping the emission spectrum of the first organic light emitting diode.
According to any of the preceding embodiments of the first aspect of the invention, further comprising: and the packaging layer covers the first organic light emitting diode, and the color conversion layer is positioned on one side of the packaging layer, which is far away from the array substrate.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a display panel, including: providing an array substrate; transferring a first light-emitting device onto the array substrate, wherein the first light-emitting device is an inorganic light-emitting diode; forming a first organic light emitting diode on the array substrate; and forming a color conversion layer on one side of the first organic light emitting diode, which is far away from the array substrate, so as to obtain a second light emitting device, wherein the color conversion layer can convert the color of the light emitted by the first organic light emitting diode.
According to the foregoing embodiment of the second aspect of the present invention, before the step of forming the color conversion layer, the manufacturing method further includes: an encapsulation layer is formed overlying the first organic light emitting diode.
According to any of the foregoing embodiments of the second aspect of the present invention, the step of forming the first organic light emitting diode on the array substrate includes: and forming a plurality of functional layers of the first organic light-emitting diode on the array substrate through a universal mask plate, wherein the orthographic projection of at least one functional layer on the array substrate is overlapped with the orthographic projection of the first light-emitting device on the array substrate.
According to any one of the foregoing embodiments of the second aspect of the present invention, the step of forming the first organic light emitting diode on the array substrate further includes forming a second organic light emitting diode to obtain a third light emitting device.
According to the manufacturing method of the display panel, the display panel comprises the array substrate and the plurality of light emitting devices, the first light emitting device is the inorganic light emitting diode, the second light emitting device comprises the first organic light emitting diode and the color conversion layer, the light emitting device layer of the display panel is formed by the inorganic light emitting diode and the organic light emitting diode together, only the first light emitting device needs to be transferred in a large amount during the preparation of the display panel, and compared with the existing preparation process of the light emitting panel which is formed by the inorganic light emitting diodes completely, the transfer number and the transfer times of the inorganic light emitting diodes are greatly reduced, so that the yield of the display panel is improved. In addition, set up the color conversion layer in one side that first organic light emitting diode deviates from the array substrate, can convert the light of first organic light emitting diode transmission into the light of different colours through selecting for use different color conversion layers, can satisfy different user demands.
Drawings
Other features, objects and advantages of the invention will become apparent from the following detailed description of non-limiting embodiments thereof, when read in conjunction with the accompanying drawings, in which like reference characters designate the same or similar parts throughout the figures thereof, and which are not to scale.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the invention;
fig. 2 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
fig. 3 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a display panel according to still another embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a display panel according to still another embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating a display panel according to still another embodiment of the present invention;
FIG. 7 is a flow chart of a method for fabricating a display panel according to an embodiment of the present invention;
fig. 8a to 8f are schematic views illustrating an operation process of a method for manufacturing a display panel according to another embodiment of the invention.
Description of reference numerals:
10-an array substrate;
21-a first light emitting device;
22-a second light emitting device; 221-a first organic light emitting diode; 2211-a first anode; 222-a color conversion layer;
23-a third light emitting device; 231 — a second organic light emitting diode; 2311-a second anode;
30-an encapsulation layer;
41-a first filtering unit; 42-second filtering unit.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
With the development of display technology, people have higher and higher requirements on display panels, and the technology update in the display field is also a change day by day.
Micro-Light Emitting diode (Micro-LED) Display technology is a novel Display technology, and compared with the existing OLED technology, the Micro-LED Display technology has the advantages of high brightness, high efficiency, low power consumption and the like, but Micro-LED Display needs a huge transfer technology to transfer millions or even tens of millions of LED chips to a driving back plate, and the transfer amount is huge, so that the yield of a Display panel is low.
In order to solve the above problems, embodiments of the present invention provide a display panel and a manufacturing method thereof, which can reduce the transfer amount of LED chips and improve the yield of the display panel.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the invention.
The display panel provided by the embodiment of the invention comprises an array substrate 10 and a plurality of light-emitting devices.
The array substrate 10 may include a substrate and a driving array layer. The substrate may be a substrate made of glass, silicon, or in some embodiments, a Polyimide (PI) material or a PI-containing material, such that the substrate is bendable. The driving array layer is provided with a plurality of pixel circuits.
A plurality of light emitting devices are disposed on the array substrate 10, and each light emitting device is electrically connected to a corresponding one of the pixel circuits.
The plurality of light emitting devices may include a first light emitting device 21 and a second light emitting device 22 having different emitting colors, the first light emitting device 21 is an inorganic light emitting diode, the second light emitting device 22 includes a first organic light emitting diode 221 and a color conversion layer 222, and the color conversion layer 222 is located on a side of the first organic light emitting diode 221 facing away from the array substrate 10 and is capable of converting a color of light emitted from the first organic light emitting diode 221.
It is understood that the first organic light emitting diode 221 includes a first anode 2211, and the first anode 2211 is electrically connected to the pixel circuit corresponding to the second light emitting device 22 on the array substrate 10.
It should be noted that the present application does not specifically limit the light emission colors of the first light emitting device 21 and the second light emitting device 22, and the first light emitting device 21 may emit blue light, the first light emitting device 21 may be a blue inorganic light emitting diode, and the second light emitting device 22 may emit red light, for example.
The color conversion layer 222 may be a color conversion layer 222 comprising a photoluminescent material, wherein the photoluminescent material may be a quantum dot layer, a phosphor particle layer, or the like. In the present embodiment, the color conversion layer 222 is exemplified as a quantum dot layer.
The quantum dot layer is made of quantum dot material capable of forming a specific excitation wavelength, the quantum dot material includes, but is not limited to, quantum dot material with zinc sulfide (ZnS) as shell and one or more of cadmium selenide (CdSe), cadmium telluride (CdTe), cadmium sulfide (CdS), indium phosphide (InP), perovskite as core, and scatterer such as titanium oxide, silicon dioxide, or the like.
To achieve color conversion of the light emitted by the first organic light emitting diode 221, the absorption spectrum of the color conversion layer 222 at least partially overlaps with the emission spectrum of the first organic light emitting diode 221. Alternatively, the absorption spectrum of the color conversion layer 222 may cover the emission spectrum of the first organic light emitting diode 221 to improve light conversion efficiency.
In some embodiments, the first light emitting device 21 may emit blue light, the first organic light emitting diode 221 may emit green light, and the color conversion layer 222 may be a red quantum dot layer having an absorption spectrum matched with that of the green light, which absorbs the green light emitted from the first organic light emitting diode 221 and converts the green light into red light to be emitted outward, so as to make the second light emitting device 22 emit red light.
It is understood that the light emitting color of the first organic light emitting diode 221 and the color conversion manner of the color conversion layer 222 are only examples, and in other embodiments, other configurations may be performed. For example, in some embodiments, the first organic light emitting diode 221 may emit blue light, and the color conversion layer 222 may be a red quantum dot layer or a green quantum dot layer with an absorption spectrum matched with that of the blue light, which absorbs the blue light emitted from the first organic light emitting diode 221 and converts the blue light into red light or green light to be emitted outward, so as to make the second light emitting device 22 emit red light or green light. In addition, the color conversion layer 222 is not limited to convert the light emitted from the first organic light emitting diode 221 into red and green light, and in other embodiments, the color conversion layer 222 may also be a quantum dot layer that converts the light emitted from the first organic light emitting diode 221 into yellow light, cyan light, and the like.
According to the display panel provided by the embodiment of the invention, the inorganic light-emitting diode and the organic light-emitting diode are adopted to form the light-emitting device layer together, so that the display panel is prepared only by transferring the first light-emitting devices 21 in a large quantity, and compared with the existing preparation process of the light-emitting panel formed by all the inorganic light-emitting diodes, the transfer number and times of the inorganic light-emitting diodes are greatly reduced, and the yield of the display panel is improved.
In addition, the color conversion layer 222 is disposed on a side of the first organic light emitting diode 221 away from the array substrate 10, and light emitted by the first organic light emitting diode 221 can be converted into light of different colors by selecting different color conversion layers 222, so that different use requirements can be met.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a display panel according to another embodiment of the invention.
In some optional embodiments, the plurality of light emitting devices may further include a third light emitting device 23, and the light emitting color of the third light emitting device 23 is different from that of the first light emitting device 21 and the second light emitting device 22, so that the display panel includes light emitting devices of at least three colors to meet the color display requirement of the display panel.
Alternatively, the third light emitting device 23 may include the second organic light emitting diode 231, i.e., the third light emitting device 23 is an organic light emitting device, which can meet the color display requirement of the display panel without increasing the number of inorganic light emitting diodes.
It is understood that the second organic light emitting diode 231 includes a second anode 2311, and the second anode 2311 is electrically connected to a pixel circuit corresponding to the third light emitting device 23 on the array substrate 10.
For convenience of description and illustration, the first light emitting device 21 may be configured to emit light of a first color, the second light emitting device 22 may be configured to emit light of a second color, and the third light emitting device 23 may be configured to emit light of a third color, it being understood that the color conversion layer 222 may convert light emitted from the first organic light emitting diode 221 into light of the second color and the second organic light emitting diode 231 may emit light of the third color.
Referring to fig. 3 and 4 together, fig. 3 is a schematic structural diagram of a display panel according to another embodiment of the present invention; fig. 4 is a schematic structural diagram of a display panel according to still another embodiment of the invention.
In some alternative embodiments, the light emitting colors of the first organic light emitting diode 221 and the second organic light emitting diode 231 may be the same, that is, the first organic light emitting diode 221 and the second organic light emitting diode 231 both emit the third color light, and the color conversion layer 222 is configured to convert the third color light into the second color light.
The light emitting color of the first organic light emitting diode 221 is configured to be the same as the light emitting color of the second organic light emitting diode 231, so that when the display panel is manufactured, the functional layers of the first organic light emitting diode 221 and the second organic light emitting diode 231 can be manufactured at the same time, the manufacturing steps can be simplified, and the manufacturing efficiency of the display panel can be improved. It is understood that the functional layers of the first and second organic light emitting diodes 221 and 231 may include, but are not limited to, at least one of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer.
In some alternative embodiments, an orthographic projection of at least one functional layer of the first organic light emitting diode 221 and the second organic light emitting diode 231 on the array substrate 10 overlaps with an orthographic projection of the first light emitting device 21 on the array substrate 10. Optionally, the orthographic projection of at least one functional layer of the first organic light emitting diode 221 and the second organic light emitting diode 231 on the array substrate 10 covers the orthographic projection of the first light emitting device 21 on the array substrate 10.
Alternatively, the orthographic projection of all the functional layers of the first organic light emitting diode 221 and the second organic light emitting diode 231 on the array substrate 10 covers the orthographic projection of the first light emitting device 21 on the array substrate 10.
When the display panel is manufactured, the multi-layer functional layer of the first organic light emitting diode 221 can be formed on the array substrate 10 through the general mask, so that the use of a precise mask is avoided, the panel manufacturing cost can be reduced, and the large-size display panel can be easily realized.
Alternatively, the functional layers of the first and second organic light emitting diodes 221 and 231 may be located on a side of the first light emitting device 21 facing away from the array substrate 10 to facilitate electrical connection of the first light emitting device 21 with the array substrate 10.
In some alternative embodiments, the first light emitting device 21 may be a blue light emitting device, the second light emitting device 22 may be a red light emitting device, and the third light emitting device 23 may be a green light emitting device, so that the first light emitting device 21 is a blue inorganic light emitting diode, the first organic light emitting diode 221 and the second organic light emitting diode 231 may both be green organic light emitting diodes, and the color conversion layer 222 may be a red quantum dot layer having an absorption spectrum matched with a green spectrum, which absorbs green light emitted by the first organic light emitting diode 221 and converts the green light into red light to emit outwards, so as to make the second light emitting device 22 emit red light.
The blue inorganic light emitting diode is selected as the blue light emitting device, so that the luminous efficiency and the service life of the blue light emitting device can be improved, the power consumption is reduced, and the luminous efficiency and the service life of the display panel can be improved compared with the existing blue organic light emitting device.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a display panel according to still another embodiment of the invention.
In some optional embodiments, the display panel provided in the embodiments of the present invention may further include an encapsulation layer 30, where the encapsulation layer 30 may cover the first organic light emitting diode 221, and the color conversion layer 222 is located on a side of the encapsulation layer 30 facing away from the array substrate 10; the encapsulation layer 30 is disposed to seal the first organic light emitting diode 221, so as to prolong the service life of the display panel.
Alternatively, the display panel may include a third light emitting device 23, the third light emitting device 23 includes a second organic light emitting diode 231, and the encapsulation layer 30 may cover the first organic light emitting diode 221 and the second organic light emitting diode 231 to achieve common sealing of the first organic light emitting diode 221 and the second organic light emitting diode 231.
Optionally, when the orthographic projections of the functional layers of the first organic light emitting diode 221 and the second organic light emitting diode 231 on the array substrate 10 overlap the orthographic projection of the first light emitting device 21 on the array substrate 10, the encapsulation layer 30 may also cover the first light emitting device 21.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a display panel according to still another embodiment of the invention.
In some optional embodiments, in order to improve the purity of the light emitted by each light emitting device, the display panel provided in the embodiments of the present invention may further include a filtering unit, where the filtering unit includes at least one of the first filtering unit 41, the second filtering unit 42, and the third filtering unit. The first filter unit 41 is located on a side of the first light emitting device 21 away from the array substrate 10, and the first filter unit 41 is configured to allow only light emitted by the first light emitting device 21 to pass through; the second filter unit 42 is located on a side of the second light emitting device 22 facing away from the array substrate 10, and the second filter unit 42 is configured to allow only light emitted by the third light emitting device 23 to pass through.
Alternatively, if the first light emitting device 21 is a blue light emitting device, the second light emitting device 22 is a red light emitting device, and the third light emitting device 23 is a green light emitting device, the first filter unit 41 may be a blue filter allowing only blue light to pass through, the second filter unit 42 may be a red filter allowing only red light to pass through, and the third filter unit may be a green filter allowing only green light to pass through.
In addition, an embodiment of the present invention further provides a manufacturing method of a display panel, which can be used for manufacturing the display panel described in the foregoing embodiments, please refer to fig. 7, where fig. 7 shows a flowchart of the manufacturing method of the display panel according to an embodiment of the present invention, and the manufacturing method includes the following steps:
s100: an array substrate 10 is provided.
The array substrate 10 may include a substrate and a driving array layer. The driving array layer is provided with a plurality of pixel circuits.
S200: the first light emitting device 21 is transferred onto the array substrate 10, and the first light emitting device 21 is an inorganic light emitting diode.
The first light emitting device 21 may be transferred onto the array substrate 10 using a bulk transfer technique, and the electrodes of the first light emitting device 21 and the corresponding pixel circuits on the array substrate 10 are electrically connected.
Optionally, the first light emitting device 21 may be a blue light emitting device, and the blue inorganic light emitting diode is selected as the first light emitting device 21, so that the light emitting efficiency and the service life of the blue light emitting device can be improved.
S300: the first organic light emitting diode 221 is formed on the array substrate 10.
Alternatively, the multi-layer functional layer of the first organic light emitting diode 221 may be formed on the array substrate 10 by a general mask, which can reduce the panel preparation cost and facilitate the realization of a large-sized display panel.
It can be understood that, when the plurality of functional layers of the first organic light emitting diode 221 are formed on the array substrate 10 by using a universal mask, an orthographic projection of at least one functional layer on the array substrate 10 may overlap with an orthographic projection of the first light emitting device 21 on the array substrate 10.
It should be noted that step S200 and step S300 are not in sequence. Optionally, when the display panel is manufactured, the first light emitting device 21 is transferred to the array substrate 10, and then the first organic light emitting diode 221 is formed on the array substrate 10, so that the first light emitting device 21 and the array substrate 10 can be electrically connected conveniently.
S400: a color conversion layer 222 is formed on a side of the first organic light emitting diode 221 facing away from the array substrate 10, so as to obtain the second light emitting device 22, wherein the color conversion layer 222 can convert the color of the light emitted by the first organic light emitting diode 221.
The color conversion layer 222 is disposed corresponding to a position where the second light emitting device 22 is located. Alternatively, the color conversion layer 222 may be a quantum dot layer. The quantum dot layer may be attached to a side of the first organic light emitting diode 221 away from the array substrate 10 by a pair-wise adhesive film, or the quantum dot layer may be printed on a side of the first organic light emitting diode 221 away from the array substrate 10 by a printing technique.
Alternatively, the light emission color of the second light emitting device 22 may be different from that of the first light emitting device 21.
The light emitting color of the first organic light emitting diode 221 and the light emitting color of the inorganic light emitting diode may be the same or different; optionally, when the first light emitting device 21 is a blue light emitting device, the light emitting color of the first organic light emitting diode 221 is different from that of the first light emitting device 21, so as to avoid using a blue organic light emitting device, and ensure the light emitting efficiency and the lifetime of the display panel.
According to the manufacturing method of the display panel provided by the embodiment of the invention, the inorganic light-emitting diode and the organic light-emitting diode are adopted to form the light-emitting device layer together, and the display panel is prepared by transferring the first light-emitting device 21 in a large quantity.
In some alternative embodiments, in step S300, a second organic light emitting diode 231 may also be formed, resulting in a third light emitting device 23.
The functional layers of the first organic light emitting diode 221 and the second organic light emitting diode 231 can be simultaneously formed on the array substrate 10 by evaporation, so that the manufacturing efficiency of the display panel can be improved, and the light emitting color of the first organic light emitting diode 221 is the same as the light emitting color of the second organic light emitting diode 231.
The light emitting colors of the first, second, and third light emitting devices 21, 22, and 23 may be different from each other, so that the display panel includes light emitting devices of at least three colors to meet the color display requirements of the display panel.
Optionally, the first light emitting device 21 is a blue inorganic light emitting diode, the first organic light emitting diode 221 and the second organic light emitting diode 231 may be both green organic light emitting diodes, and the color conversion layer 222 is a red quantum dot layer whose absorption spectrum matches the green spectrum, so that the first light emitting device 21 is a blue light emitting device, the third light emitting device 23 is a green light emitting device, and the second light emitting device 22 is a red light emitting device.
In some optional embodiments, step S310 may be further included before step S400:
an encapsulation layer 30 is formed covering the first organic light emitting diode 221.
The encapsulation layer 30 is disposed to seal the first organic light emitting diode 221, so as to prolong the service life of the display panel.
Alternatively, in step S310, an encapsulation layer 30 covering the first and second organic light emitting diodes 221 and 231 may be formed to achieve common sealing of the first and second organic light emitting diodes 221 and 231.
In step S400, a color conversion layer 222 may be formed on a surface of the encapsulation layer 30 facing away from the array substrate 10.
The following describes the operation process of the method for manufacturing a display panel according to the embodiment of the present invention with reference to fig. 8a to 8 f.
As shown in fig. 8a, an array substrate 10 is provided.
As shown in fig. 8b, the first light emitting device 21 is transferred onto the array substrate 10. The first light emitting device 21 may be a blue inorganic light emitting diode, i.e., the first light emitting device 21 may be a blue light emitting device.
As shown in fig. 8c, the first and second organic light emitting diodes 221 and 231 are formed on the array substrate 10, and the second organic light emitting diode 231 forms the third light emitting device 23.
It can be understood that the first organic light emitting diode 221 and the second organic light emitting diode 231 are formed on the array substrate 10, and the first anode 2211 of the first organic light emitting diode 221 is electrically connected to a corresponding one of the pixel circuits on the array substrate 10, and the second anode 2311 of the second organic light emitting diode 231 is electrically connected to a corresponding one of the pixel circuits on the array substrate 10.
Alternatively, a plurality of functional layers of the first organic light emitting diode 221 and the second organic light emitting diode 231 may be formed on the array substrate 10 by a common mask, so as to reduce the panel preparation cost, facilitate the manufacture of a large-sized display panel, and each functional layer of the organic light emitting diodes may cover the first light emitting device 21.
Of course, it is also within the scope of the present application that a plurality of functional layers of the first organic light emitting diode 221 and the second organic light emitting diode 231 may be formed on the array substrate 10 by using a precision mask, so that each functional layer of the organic light emitting diode does not cover the first light emitting device 21.
As shown in fig. 8d, an encapsulation layer 30 is formed on one side surfaces of the first and second organic light emitting diodes 221 and 231 facing away from the array substrate 10 to cover and seal the organic light emitting diodes.
As shown in fig. 8e, a color conversion layer 222 is formed on a surface of the encapsulation layer 30 opposite to the array substrate 10, and the color conversion layer 222 is disposed corresponding to the region of the first organic light emitting diode 221, so as to obtain the second light emitting device 22.
The color conversion layer 222 may be a quantum dot layer, and the quantum dots may be printed on the area of the encapsulation layer 30 corresponding to the first organic light emitting diode 221 by a printing technique, or the quantum dot layer may be attached to the encapsulation layer 30 by a para-position film bonding method.
Alternatively, the first and second organic light emitting diodes 221 and 231 may be green organic light emitting diodes, and the color conversion layer 222 may be a red quantum dot layer whose absorption spectrum matches the green spectrum, i.e., the second light emitting device 22 may be a red light emitting device and the third light emitting device 23 may be a green light emitting device.
As shown in fig. 8f, a first filter unit 41 is formed on the side of the first light emitting device 21 away from the array substrate 10, and a third filter unit is formed on the side of the color conversion layer 222 away from the array substrate 10.
When the first light emitting device 21 is a blue light emitting device and the second light emitting device 22 is a red light emitting device, the first filter unit 41 may be a blue filter that allows only blue light to pass through, and the second filter unit 42 may be a red filter that allows only red light to pass through, so as to improve the purity of light emitted by each light emitting device.
In accordance with the above-described embodiments of the present invention, these embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. The invention is limited only by the claims and their full scope and equivalents.
Claims (9)
1. A display panel, comprising:
an array substrate;
the light-emitting devices are arranged on the array substrate and comprise first light-emitting devices and second light-emitting devices, the light-emitting colors of the first light-emitting devices are different from each other, the first light-emitting devices are inorganic light-emitting diodes, the second light-emitting devices comprise first organic light-emitting diodes and color conversion layers, and the color conversion layers are positioned on one sides of the first organic light-emitting diodes, which are far away from the array substrate, and can convert the colors of light emitted by the first organic light-emitting diodes;
and the orthographic projection of at least one functional layer of the first organic light-emitting diode on the array substrate is overlapped with the orthographic projection of the first light-emitting device on the array substrate.
2. The display panel according to claim 1, wherein the plurality of light-emitting devices further comprises a third light-emitting device having a light-emitting color different from the first light-emitting device and the second light-emitting device, the third light-emitting device comprising a second organic light-emitting diode.
3. The display panel according to claim 2, wherein the first organic light emitting diode and the second organic light emitting diode emit light of the same color.
4. The display panel of claim 3, wherein an orthographic projection of at least one functional layer of the second organic light emitting diode on the array substrate overlaps with an orthographic projection of the first light emitting device on the array substrate.
5. The display panel of claim 3 wherein the color conversion layer comprises a quantum dot layer, the absorption spectrum of the color conversion layer at least partially overlapping the emission spectrum of the first organic light emitting diode.
6. The display panel according to claim 1, further comprising:
and the packaging layer covers the first organic light emitting diode, and the color conversion layer is positioned on one side of the packaging layer, which is far away from the array substrate.
7. A method for manufacturing a display panel is characterized by comprising the following steps:
providing an array substrate;
transferring a first light emitting device onto the array substrate, wherein the first light emitting device is an inorganic light emitting diode;
forming a first organic light emitting diode on the array substrate, wherein the forming comprises forming a plurality of functional layers of the first organic light emitting diode on the array substrate through a universal mask plate, and an orthographic projection of at least one functional layer on the array substrate is overlapped with an orthographic projection of the first light emitting device on the array substrate;
and forming a color conversion layer on one side of the first organic light emitting diode, which is far away from the array substrate, so as to obtain a second light emitting device, wherein the color conversion layer can convert the color of the light emitted by the first organic light emitting diode.
8. The method of claim 7, wherein before the step of forming a color conversion layer, the method further comprises:
and forming an encapsulation layer covering the first organic light emitting diode.
9. The method according to claim 7, wherein the step of forming the first organic light emitting diode on the array substrate further comprises forming a second organic light emitting diode to obtain a third light emitting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011482727.XA CN112614828B (en) | 2020-12-15 | 2020-12-15 | Display panel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011482727.XA CN112614828B (en) | 2020-12-15 | 2020-12-15 | Display panel and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112614828A CN112614828A (en) | 2021-04-06 |
| CN112614828B true CN112614828B (en) | 2022-10-14 |
Family
ID=75240048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011482727.XA Active CN112614828B (en) | 2020-12-15 | 2020-12-15 | Display panel and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112614828B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007265973A (en) * | 2006-03-03 | 2007-10-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
| CN106158914A (en) * | 2016-07-29 | 2016-11-23 | 京东方科技集团股份有限公司 | OLED array and preparation method thereof, OLED display panel |
| CN109360903A (en) * | 2018-10-31 | 2019-02-19 | 武汉华星光电技术有限公司 | Organic light emitting diode display and its manufacturing method |
| CN110896088A (en) * | 2018-09-13 | 2020-03-20 | 上海微电子装备（集团）股份有限公司 | Display panel, display device and display panel manufacturing method |
-
2020
- 2020-12-15 CN CN202011482727.XA patent/CN112614828B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007265973A (en) * | 2006-03-03 | 2007-10-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
| CN106158914A (en) * | 2016-07-29 | 2016-11-23 | 京东方科技集团股份有限公司 | OLED array and preparation method thereof, OLED display panel |
| CN110896088A (en) * | 2018-09-13 | 2020-03-20 | 上海微电子装备（集团）股份有限公司 | Display panel, display device and display panel manufacturing method |
| CN109360903A (en) * | 2018-10-31 | 2019-02-19 | 武汉华星光电技术有限公司 | Organic light emitting diode display and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112614828A (en) | 2021-04-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10886257B2 (en) | Micro LED display device and method for manufacturing same | |
| CN111048656B (en) | Display device and method for manufacturing the same | |
| EP3422827B1 (en) | Display device and method for fabricating the same | |
| CN110121781B (en) | Display light emitting diode unit including a plurality of pixels and display device having the same | |
| EP3512305B1 (en) | Display device using semiconductor light-emitting element | |
| CN108022940A (en) | Display device | |
| CN111508989B (en) | Display substrate and preparation method thereof, display panel and preparation method thereof | |
| CN111370461B (en) | Display panel and display device | |
| CN113748518B (en) | Display substrate, manufacturing method thereof and display device | |
| CN110071134A (en) | Light-emitting component, its manufacturing method and display module | |
| CN111902952A (en) | Mass transfer method of light emitting diode and display backboard assembly | |
| CN115472658A (en) | Display panel, preparation method thereof and display device | |
| TWM623890U (en) | Light emitting diode device with common electrodes and packaging structure thereof | |
| EP3979341A1 (en) | Light emitting element having cantilever electrode, display panel having same, and display device | |
| CN112614828B (en) | Display panel and manufacturing method thereof | |
| CN109768074B (en) | Display substrate, manufacturing method thereof, display panel and display device | |
| CN103123956A (en) | Organic light emitting display panel and manufacturing method thereof | |
| CN113948620A (en) | Integrated micro LED chip and manufacturing method thereof | |
| WO2020042652A1 (en) | Led display device and manufacturing method therefor, and led display panel | |
| KR102238776B1 (en) | Hybrid LED display | |
| CN219163403U (en) | Micro LED device and display apparatus including the same | |
| WO2022005005A1 (en) | Display device and method for producing same | |
| JP2023093281A (en) | Light-emitting device and manufacturing method thereof | |
| TW202306103A (en) | Light-emitting diode device with common electrode and packaging structure thereof comprising a substrate, a plurality of light-emitting diode units, a plurality of electrode units, and a wavelength conversion unit, and is convenient for connecting an electrical component | |
| TW202301665A (en) | Stacked luminescent device and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |