CN112605349A - Semi-solid forming process for water-cooling plate for bearing automobile chip - Google Patents
Semi-solid forming process for water-cooling plate for bearing automobile chip Download PDFInfo
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- CN112605349A CN112605349A CN202011442874.4A CN202011442874A CN112605349A CN 112605349 A CN112605349 A CN 112605349A CN 202011442874 A CN202011442874 A CN 202011442874A CN 112605349 A CN112605349 A CN 112605349A
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- forming process
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D1/00—Treatment of fused masses in the ladle or the supply runners before casting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
- B22D27/04—Influencing the temperature of the metal, e.g. by heating or cooling the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
- B22D27/20—Measures not previously mentioned for influencing the grain structure or texture; Selection of compositions therefor
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- Mechanical Engineering (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Abstract
The invention discloses a water-cooling plate semi-solid forming process for bearing an automobile chip, relates to the technical field of automobile water-cooling plate forming, and aims to solve the problems that the purity of semi-solid slurry is low and the structural performance of a formed water-cooling plate is poor in the existing semi-solid forming process. The method comprises the following steps: the method comprises the following steps: preparing raw materials, namely obtaining semi-solid slurry containing a spherical solid phase by electromagnetic stirring; step two: secondary stirring, wherein before stirring, the stirring tank is subjected to vacuum degassing, and a stirring rod is utilized to perform mechanical motion in the semi-solid slurry; step three: pretreating SiC particles to remove gas, moisture, organic matters and impurities adsorbed on the surfaces of the SiC particles; step four: mixing materials, namely adding SiC particles into the semi-solid slurry, and uniformly distributing the SiC particles serving as reinforcement materials in the semi-solid slurry by the aid of rotation motion of mechanical stirring; step five: preheating the die, namely preheating the temperature of the die to 250 ℃, and coating a coating on the forming surface of the die after power failure.
Description
Technical Field
The invention relates to the technical field of automobile water-cooling plate forming, in particular to a water-cooling plate semi-solid forming process for bearing an automobile chip.
Background
With the development of modern technologies, various new energy automobile radiators are being applied to every corner of the society. The battery pack is used as a main energy storage element of a battery pack loaded on a new energy automobile, is a key part of the new energy automobile, directly influences the performance of the new energy automobile, and increases the heat productivity of the battery along with the increasing energy density and power density of a power battery of the new energy automobile and the larger charge-discharge multiplying power of the battery. The traditional battery heat dissipation mode such as natural cooling or air cooling can not meet the requirements, in a new energy era, a water cooling plate can better dissipate heat and cool down a battery chip module of an automobile and can also protect and navigate a large-scale server, a semi-solid processing technology is an advanced near-net forming technology established by fully utilizing the characteristics that a metal alloy material presents an equiaxial spherical structure, good and controllable fluidity, smaller deformation resistance and the like in a semi-solid temperature range, and at present, the semi-solid forming technology is mainly applied to the industries of automobiles, electronic products, instruments and the like.
The purity of the semi-solid slurry in the existing semi-solid forming process is lower, and the structural performance of the formed water-cooled plate is poorer; therefore, the market urgently needs to develop a semi-solid forming process of the water-cooling plate for bearing the automobile chip to help people to solve the existing problems.
Disclosure of Invention
The invention aims to provide a water-cooling plate semi-solid forming process for bearing an automobile chip, which aims to solve the problems that the purity of semi-solid slurry is lower and the structural performance of a water-cooling plate after forming is poorer in the existing semi-solid forming process proposed in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a semi-solid forming process of a water-cooling plate for bearing an automobile chip comprises the following steps:
the method comprises the following steps: preparing raw materials, namely obtaining semi-solid slurry containing a spherical solid phase by electromagnetic stirring;
step two: secondary stirring, wherein before stirring, the stirring tank is subjected to vacuum degassing, and a stirring rod is utilized to perform mechanical motion in the semi-solid slurry;
step three: pretreating SiC particles to remove gas, moisture, organic matters and impurities adsorbed on the surfaces of the SiC particles;
step four: mixing materials, namely adding SiC particles into the semi-solid slurry, and uniformly distributing the SiC particles serving as reinforcement materials in the semi-solid slurry by the aid of rotation motion of mechanical stirring;
step five: preheating a die, namely preheating the temperature of the die to 250 ℃, and coating a coating on the forming surface of the die after power failure;
step six: forming, namely feeding raw materials into a hopper, feeding the raw materials into a charging barrel through the hopper, and enabling the semi-solid slurry to move towards a die by a rotating screw rod in the charging barrel;
step seven: and demolding and taking materials, opening a power supply of the oil press, and separating the upper die from the lower die.
Preferably, in the first step, alternating current with a certain phase is introduced into the induction coil, so that a magnetic field for changing rotation is generated, induced current is generated in the molten metal, and the lorentz force drives the molten metal to generate violent movement, so that the traditional dendritic crystal solidification trend is replaced by a non-dendritic crystal solidification mode.
Preferably, in the second step, the inside of the stirring tank is pumped into a vacuum state by using a vacuum pump to generate negative pressure, the stirring rod rotates to change crystal nucleation and growth evolution modes in the semi-solid slurry again, and the semi-solid slurry is stirred for the second time in the cooling process to obtain a good semi-solid slurry tissue.
Preferably, in the third step, the silicon carbide is heated to 300 ℃ for heat preservation, when the temperature of the induction heating furnace is raised to 800 ℃, the preheated silicon carbide particles are put into the heating furnace and baked for 1 hour at 800 ℃, the silicon carbide particles are continuously stirred in the baking process to fully oxidize the silicon carbide particles, after the baking, the temperature is reduced to 300 ℃ for heat preservation for 3 hours, then the silicon carbide particles are cooled along with the heating furnace, and before the silicon carbide particles are added into the semi-solid slurry, the silicon carbide particles are heated to 600 ℃ for heat preservation for one hour.
Preferably, in the fourth step, SiC particles are used as reinforcement bodies to form a multi-phase composite material with a distinct interface, and the composite material has comprehensive superior performance which is not possessed by a single metal.
Preferably, in the fifth step, after the coating is finished, the mold is continuously heated to keep the temperature of the mold above 250 ℃.
Preferably, in the sixth step, when the semi-solid slurry is accumulated to a predetermined volume, the semi-solid slurry is pressed into the preheating mold at a high speed, and the water-cooled plate product is formed after cooling.
Preferably, in the seventh step, after the product is taken out, the mold is closed under the driving of an oil press.
Compared with the prior art, the invention has the beneficial effects that:
1. the method has the advantages that SiC particles are pretreated, the surface activity of the SiC particles is enhanced, the wettability of the SiC particles and the semi-solid slurry and the distribution uniformity of the particles in the semi-solid slurry are improved, and the low-density, high-rigidity and high-strength reinforcement particles are added into the semi-solid slurry, so that the elastic modulus, the hardness, the wear resistance and the high-temperature resistance of the material are improved while the density of the material is reduced, the forming process is improved, the forming quality of the semi-solid forming process of the water-cooling plate is improved, and the formed water-cooling plate has comprehensive superior performance which is not possessed by single metal;
2. the invention adopts an electromagnetic stirring mode to prepare raw materials, stirs alloy melt in a non-contact way, greatly reduces the pollution to the alloy, can realize the control of the stirring effect by adjusting parameters such as current, magnetic field intensity, frequency and the like, can continuously and efficiently prepare semi-solid slurry, can change crystal nucleation and growth evolution mode in the semi-solid slurry again by stirring of the stirring rod, carries out secondary stirring on the semi-solid slurry in the cooling process, can obtain good semi-solid slurry tissue, and pumps the inside of the stirring cavity to a vacuum state in the stirring process, greatly reduces the introduction of oxide inclusions in the traditional semi-solid slurry process, and ensures the purity of the semi-solid slurry.
3. The invention preheats the die, and the heating plates are arranged around the die to heat the die, so that the temperature of the die can be uniformly increased, and the temperature of the die is controlled to be about two hundred and fifty ℃, thereby reducing the thermal fatigue of the die and avoiding the cracking and deformation of the die.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.
The embodiment provided by the invention comprises the following steps: a semi-solid forming process of a water-cooling plate for bearing an automobile chip comprises the following steps:
the method comprises the following steps: preparing raw materials, namely obtaining semi-solid slurry containing a spherical solid phase by electromagnetic stirring;
step two: secondary stirring, wherein before stirring, the stirring tank is subjected to vacuum degassing, and a stirring rod is utilized to perform mechanical motion in the semi-solid slurry;
step three: pretreating SiC particles to remove gas, moisture, organic matters and impurities adsorbed on the surfaces of the SiC particles;
step four: mixing materials, namely adding SiC particles into the semi-solid slurry, and uniformly distributing the SiC particles serving as reinforcement materials in the semi-solid slurry by the aid of rotation motion of mechanical stirring;
step five: preheating a die, namely preheating the temperature of the die to 250 ℃, and coating a coating on the forming surface of the die after power failure;
step six: forming, namely feeding raw materials into a hopper, feeding the raw materials into a charging barrel through the hopper, and enabling the semi-solid slurry to move towards a die by a rotating screw rod in the charging barrel;
step seven: and demolding and taking materials, opening a power supply of the oil press, and separating the upper die from the lower die.
Furthermore, in the first step, alternating current with a certain phase is introduced into the induction coil, so that a magnetic field for changing rotation is generated, induced current is generated in the molten metal, Lorentz force drives the molten metal to generate violent movement, a non-dendritic crystal solidification mode replaces the traditional dendritic crystal solidification trend, gas is not involved, and the semi-solid slurry can be continuously and efficiently prepared.
Furthermore, in the second step, the inside of the stirring tank is pumped into a vacuum state by using a vacuum pump to generate negative pressure, the stirring rod rotates to change crystal nucleation and growth evolution modes in the semi-solid slurry again, the semi-solid slurry is stirred for the second time in the cooling process to obtain good semi-solid slurry tissues, the introduction of oxide inclusions in the traditional semi-solid pulping process is greatly reduced in the vacuum state, the purity of the semi-solid slurry is ensured, and the preparation quality is improved.
Further, in the third step, the silicon carbide is heated to 300 ℃ for heat preservation, when the temperature of the induction heating furnace is raised to 800 ℃, the preheated silicon carbide particles are put into the heating furnace and baked for 1 hour at 800 ℃, the silicon carbide particles are continuously stirred in the baking process to fully oxidize the silicon carbide particles, after the baking is finished, the temperature is reduced to 300 ℃ for heat preservation for 3 hours, then the silicon carbide particles are cooled along with the heating furnace, before the silicon carbide particles are added into the semi-solid slurry, the silicon carbide particles are heated to 600 ℃ for heat preservation for one hour, the bonding condition of the particles and the matrix is improved, and the wettability of the SiC particles and the semi-solid slurry and the distribution uniformity of the particles in the semi-solid slurry are improved.
Furthermore, in the fourth step, SiC particles are used as reinforcement to form a multi-phase composite material with an obvious interface, and the reinforcement particles with low density, high rigidity and high strength, which are not possessed by single metal, are added into the semi-solid slurry, so that the density of the material is reduced, and simultaneously, the elastic modulus, hardness, wear resistance and high temperature resistance of the material are improved, thereby improving the forming process and the forming quality of the water-cooled plate semi-solid forming process.
Further, in the fifth step, after the coating is finished, the mold is continuously heated, so that the temperature of the mold is kept above 250 ℃, heating plates are arranged around the mold to heat the mold, the temperature of the mold can be uniformly increased, the temperature of the mold is controlled to be about two hundred and fifty ℃, the thermal fatigue of the mold is reduced, and the cracking and deformation of the mold are avoided.
Further, in the sixth step, when the semi-solid slurry is accumulated to a preset volume, the semi-solid slurry is pressed into a preheating mould in a high-speed state, and a water-cooling plate product is formed after cooling.
And step seven, after the product is taken out, the mold is closed under the driving of an oil press, and preparation is made for next forming processing.
The working principle is as follows: the method comprises the steps of firstly preparing raw materials, obtaining semi-solid slurry containing spherical solid phase through electromagnetic stirring, stirring alloy melt in a non-contact manner, greatly reducing alloy pollution, controlling the stirring effect by adjusting parameters such as current, magnetic field intensity and frequency, continuously and efficiently preparing the semi-solid slurry without involving gas, enabling the prepared semi-solid slurry to enter the stirring mechanism to realize secondary stirring of the semi-solid slurry, performing vacuum degassing on the stirring tank by using a vacuum pump before stirring, pumping the stirring tank to a vacuum state, performing mechanical motion in the semi-solid slurry by using a stirring rod, changing crystal nucleation and growth evolution modes in the semi-solid slurry again, performing secondary stirring on the semi-solid slurry in the cooling process, obtaining good semi-solid slurry tissues, and greatly reducing oxidation inclusion in the vacuum environment in the traditional semi-solid pulping process, ensuring the purity of the semi-solid slurry, thereby improving the preparation quality, simultaneously carrying out pretreatment on SiC particles, removing gas, moisture, organic matters and impurities adsorbed on the surfaces of the SiC particles, enhancing the surface activity of the SiC particles, improving the wettability of the SiC particles and the semi-solid slurry and the distribution uniformity of the particles in the semi-solid slurry, firstly heating the silicon carbide to 300 ℃ and preserving heat, putting the preheated silicon carbide particles into a heating furnace when the temperature of the induction heating furnace is raised to 800 ℃, baking the silicon carbide particles for 1 hour at 800 ℃, continuously stirring the silicon carbide particles in the baking process to fully oxidize the silicon carbide particles, cooling the silicon carbide particles to 300 ℃ and preserving heat for 3 hours after the baking is finished, then cooling the silicon carbide particles along with a heating furnace, heating the silicon carbide particles to 600 ℃ before the silicon carbide particles are added into the semi-solid slurry and preserving heat for one hour, adding the silicon carbide particles into a stirring tank after the pretreatment is finished, SiC particles enter the semi-solid slurry, the rotation motion of mechanical stirring enables the SiC particles to be used as reinforcement materials and to be uniformly distributed in the semi-solid slurry, the reinforcement particles with low density, high rigidity and high strength are added into the semi-solid slurry, the material density is reduced, simultaneously, the elastic modulus, the hardness, the wear resistance and the high temperature resistance of the material are improved, thereby improving the forming process, the forming quality of the water-cooling plate semi-solid forming process is improved, the formed water-cooling plate has comprehensive superior performance which a single metal does not have, a forming die to be used is preheated, the temperature of the die is preheated to 250 ℃, after power failure, the forming surface of the die is coated with coating, after the coating is finished, the die continues to be heated, the temperature of the die is kept above 250 ℃, heating plates are arranged around the die to heat the die, and the temperature of the die can be uniformly increased, and the temperature of the die is controlled to be about two hundred and fifty ℃, the thermal fatigue of the die is reduced, the cracking and deformation of the die are avoided, the semi-solid slurry is firstly fed into a hopper and then enters a charging barrel from the hopper, the semi-solid slurry moves towards the die by a screw rod rotating in the charging barrel, when the semi-solid slurry is accumulated to a preset volume, the semi-solid slurry is pressed into a preheating die at a high speed, a water-cooled plate product is formed after cooling, demoulding and material taking are carried out after forming is finished, a power supply of an oil press is turned on, an upper die and a lower die are separated, the product is taken out, and then the die is closed under the driving of the.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (8)
1. A water-cooling plate semi-solid forming process for bearing an automobile chip comprises the following steps:
the method comprises the following steps: preparing raw materials, namely obtaining semi-solid slurry containing a spherical solid phase by electromagnetic stirring;
step two: secondary stirring, wherein before stirring, the stirring tank is subjected to vacuum degassing, and a stirring rod is utilized to perform mechanical motion in the semi-solid slurry;
step three: pretreating SiC particles to remove gas, moisture, organic matters and impurities adsorbed on the surfaces of the SiC particles;
step four: mixing materials, namely adding SiC particles into the semi-solid slurry, and uniformly distributing the SiC particles serving as reinforcement materials in the semi-solid slurry by the aid of rotation motion of mechanical stirring;
step five: preheating a die, namely preheating the temperature of the die to 250 ℃, and coating a coating on the forming surface of the die after power failure;
step six: forming, namely feeding raw materials into a hopper, feeding the raw materials into a charging barrel through the hopper, and enabling the semi-solid slurry to move towards a die by a rotating screw rod in the charging barrel;
step seven: and demolding and taking materials, opening a power supply of the oil press, and separating the upper die from the lower die.
2. The semi-solid forming process for the water-cooled plate for bearing the automobile chip as claimed in claim 1, wherein the semi-solid forming process comprises the following steps: in the first step, alternating current with a certain phase is introduced into the induction coil, so that a magnetic field for converting rotation is generated, induced current is generated in the molten metal, Lorentz force drives the molten metal to generate violent movement, and a non-dendritic crystal solidification mode replaces the traditional dendritic crystal solidification trend.
3. The semi-solid forming process for the water-cooled plate for bearing the automobile chip as claimed in claim 1, wherein the semi-solid forming process comprises the following steps: and in the second step, the inside of the stirring tank is pumped into a vacuum state by using a vacuum pump to generate negative pressure, the stirring rod rotates to change crystal nucleation and growth evolution modes in the semi-solid slurry again, and the semi-solid slurry is stirred for the second time in the cooling process to obtain a good semi-solid slurry tissue.
4. The semi-solid forming process for the water-cooled plate for bearing the automobile chip as claimed in claim 1, wherein the semi-solid forming process comprises the following steps: and in the third step, the silicon carbide is heated to 300 ℃ for heat preservation, when the temperature of the induction heating furnace is raised to 800 ℃, the preheated silicon carbide particles are put into the heating furnace and baked for 1 hour at 800 ℃, the silicon carbide particles are continuously stirred in the baking process to fully oxidize the silicon carbide particles, after the baking, the temperature is reduced to 300 ℃ for heat preservation for 3 hours, then the silicon carbide particles are cooled along with the heating furnace, and the silicon carbide particles are heated to 600 ℃ for heat preservation for one hour before being added into the semi-solid slurry.
5. The semi-solid forming process for the water-cooled plate for bearing the automobile chip as claimed in claim 1, wherein the semi-solid forming process comprises the following steps: in the fourth step, SiC particles are used as reinforcement bodies to form a multi-phase composite material with an obvious interface, and the composite material has comprehensive superior performance which is not possessed by single metal.
6. The semi-solid forming process for the water-cooled plate for bearing the automobile chip as claimed in claim 1, wherein the semi-solid forming process comprises the following steps: and in the fifth step, after the coating is finished, the mould is continuously heated, so that the temperature of the mould is kept above 250 ℃.
7. The semi-solid forming process for the water-cooled plate for bearing the automobile chip as claimed in claim 1, wherein the semi-solid forming process comprises the following steps: and step six, when the semi-solid slurry is accumulated to a preset volume, pressing the semi-solid slurry into a preheating mould in a high-speed state, and cooling to form a water-cooling plate product.
8. The semi-solid forming process for the water-cooled plate for bearing the automobile chip as claimed in claim 1, wherein the semi-solid forming process comprises the following steps: and seventhly, after taking out the product, closing the die under the driving of an oil press.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011442874.4A CN112605349A (en) | 2020-12-08 | 2020-12-08 | Semi-solid forming process for water-cooling plate for bearing automobile chip |
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| CN202011442874.4A CN112605349A (en) | 2020-12-08 | 2020-12-08 | Semi-solid forming process for water-cooling plate for bearing automobile chip |
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| CN105063406A (en) * | 2015-07-20 | 2015-11-18 | 昆明理工大学 | Semi-solid metal-matrix ceramic composite material preparation device |
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2020
- 2020-12-08 CN CN202011442874.4A patent/CN112605349A/en active Pending
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| CN101306464A (en) * | 2008-05-23 | 2008-11-19 | 北京科技大学 | Process for preparing high performance structural member with high SiC grain volume fraction |
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| CN103862005A (en) * | 2014-04-08 | 2014-06-18 | 哈尔滨工业大学 | Device for manufacturing metal matrix composite or semisolid slurry and using method thereof |
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Application publication date: 20210406 |