CN112601381A

CN112601381A - IGBT module crimping device

Info

Publication number: CN112601381A
Application number: CN202011583859.1A
Authority: CN
Inventors: 申勇; 夏中元
Original assignee: Shanghai Zhaoshuo Technology Co ltd
Current assignee: Shanghai Zhaoshuo Technology Co ltd
Priority date: 2020-12-28
Filing date: 2020-12-28
Publication date: 2021-04-02

Abstract

The invention discloses a crimping device of an IGBT module, which comprises a base, a sliding platform and a pressure applying mechanism, wherein the sliding platform is arranged above the base in a sliding manner, the pressure applying mechanism is arranged above the sliding platform, and the pressure applying mechanism is fixedly connected with the base; the surface of sliding platform is provided with an operation panel, be provided with PCBA locating pin and crimping location elasticity thimble on the operation panel. According to the invention, the positioning of the IGBT module on the operating platform is realized by the compression-joint positioning elastic thimble, the left and right positions of the sliding platform are adjusted by the sliding mechanism so as to realize the alignment of the IGBT module and the pressure applying mechanism, and finally, the pins of the IGBT module are pressed into the corresponding packaging through holes of the PCBA by the pressure applying mechanism, and the electric connection is completed by the height fit between the pins and the inner walls of the through holes; when needing to be maintained and changed, can be directly with the direct extrusion of IGBT module, the IGBT module of renewal is impressed can to solve the maintenance problem of IGBT module, improved the uniformity of IGBT module crimping.

Description

IGBT module crimping device

Technical Field

The invention relates to the technical field of semiconductor application, in particular to an IGBT module crimping device.

Background

The IGBT is a novel power electronic device for controlling a transistor by using an MOS, has the characteristics of high voltage, large current, high frequency, small on-resistance and the like, is widely applied to an inverter circuit of a frequency converter, and along with the development of an IGBT element to a high-power direction, the heat productivity of the IGBT element is larger and larger, the temperature of the IGBT element can be correspondingly increased, so that certain influence can be caused on the use of the IGBT element.

In the prior art, the connection mode of the high-power IGBT module and the circuit board is mostly completed by adopting a manual welding mode. Because of the severe heat dissipation requirement of the high-power IGBT, the bottom surface of the high-power IGBT is required to be closely attached to the surface of a radiator as much as possible in the process, and the consistency of welding is difficult to ensure by adopting a manual welding process; and after accomplishing through welding process, follow-up need be changed the new module because of the damage of IGBT module, because pin quantity is many, distribution area is great, the surface has the blockking of other devices again to make the change be unfavorable for realizing, and the maintenance process is wasted time and energy and irreversible damage can lead to whole PCBA maintenance yield to be lower, leads to great economic loss for the enterprise.

Disclosure of Invention

In order to overcome the technical troubles and unnecessary cost increase brought by the above conditions for enterprises, the invention provides an IGBT module crimping device, wherein the positioning of an IGBT module on an operation table is realized through a crimping positioning elastic thimble, the left and right positions of a sliding platform are adjusted through a sliding mechanism so as to realize the alignment of the IGBT module and a pressure applying mechanism, and finally, pins of the IGBT module are pressed into package through holes corresponding to PCBAs through the pressure applying mechanism, and the electric connection is completed through the height fit between the pins and the inner walls of the through holes; the device can be fine through pressFIT technique has realized the application of high-power IGBT module in three-level topology module or the parallelly connected technique of multimode in actual production, when needing to maintain the change, can be directly with IGBT module direct extrusion, the module of renewal impress can to the maintenance problem of IGBT module has been solved, the uniformity of improvement module crimping.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a crimping device of IGBT module, includes base, sliding platform and mechanism of exerting pressure, sliding platform slides and sets up the base top, the mechanism of exerting pressure sets up the sliding platform top, the mechanism of exerting pressure with base fixed connection, the mechanism of exerting pressure is used for impressing the IGBT module on the PCBA who sets up on sliding platform. The sliding arrangement is a common technical means for those skilled in the art, for example, the sliding is realized by the mutual cooperation between the sliding rails and the sliding grooves.

The surface of sliding platform is provided with an operation panel, be provided with PCBA locating pin and crimping location elasticity thimble on the operation panel, the PCBA locating pin is used for fixing a position the PCBA who sets up on the operation panel, crimping location elasticity thimble is used for fixing a position the crimping position of IGBT module.

Preferably, the sliding platform comprises a sliding bottom plate, a supporting plate and the operating platform, the supporting plate is vertically arranged above the sliding bottom plate, and the operating platform is arranged above the supporting plate.

Preferably, a sliding mechanism is arranged between the sliding platform and the base, the sliding mechanism comprises a sliding rail arranged on the base, a sliding handle and an elastic positioning pin, the sliding handle and the elastic positioning pin are arranged on the sliding bottom plate, and the elastic positioning pin is matched with a positioning hole arranged on the bottom plate. The left and right translation sliding platform adjusts the relative position of the IGBT module and the pressure mechanism, and after the IGBT module is adjusted in place, the elastic positioning pin is inserted into the positioning hole in the bottom plate to realize fixation.

Preferably, the pressure applying mechanism comprises a pressure applying machine table, a pressure applying handle and a pressure applying head, the bottom of the pressure applying machine table is fixedly connected with the base, the pressure applying head is arranged above the sliding platform, and the pressure applying handle drives the pressure applying head to move up and down

Preferably, the sliding platform slides to realize the crimping of a plurality of IGBT modules on the PCBA.

Preferably, the PCBA is provided with three IGBT modules.

Preferably, the IGBT module is a three-level topology module. Of course, one skilled in the art can arrange modules of other topologies on the PCB board, or a plurality of IGBT templates, for example, a plurality of parallel IGBT modules, as required.

Compared with the prior art, the invention has the beneficial effects that:

according to the invention, the positioning of the IGBT module on the operating platform is realized by the compression-joint positioning elastic thimble, the left and right positions of the sliding platform are adjusted by the sliding mechanism so as to realize the alignment of the IGBT module and the pressure applying mechanism, finally, the pins of the IGBT module are pressed into the corresponding packaging through holes of the PCBA by the pressure applying mechanism, and the electric connection is completed by the height fit between the pins and the inner walls of the through holes. The translation of sliding platform can realize the crimping of multimode, has improved the efficiency of crimping. When needing to be maintained and changed, can be directly with the direct extrusion of IGBT module, the IGBT module of renewal is impressed can to solve the maintenance problem of IGBT module, improved the uniformity of IGBT module crimping.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the present invention in operation;

fig. 3 is a schematic structural diagram of a finished product obtained by compression joint of the invention.

In the figure: a base plate 1; positioning holes 2; a slide rail 3; a slide base 4; a sliding platform 5; a heat sink 6; a pressure applying machine table 10; a pressing handle 11; a pressure applying head 12; PCBA locating pins 21; an operation table 22; a support plate 23; a slide handle 24; an elastic positioning pin 25; a compression positioning elastic thimble 26; PCBA 30; the IGBT module 31.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Fig. 1 shows a schematic structural diagram of an IGBT module crimping apparatus of this embodiment, including a base 1, a sliding platform 5 and a pressing mechanism, where the sliding platform 5 is slidably disposed above the base 1, the pressing mechanism is disposed above the sliding platform 5, the pressing mechanism is fixedly connected with the base 1, and the pressing mechanism is used to press the IGBT module 31 into PCBA30 disposed on the sliding platform 5. The sliding arrangement is a common technical means for those skilled in the art, for example, the sliding is realized by the mutual cooperation between the sliding rails and the sliding grooves. Preferably, the base plate 1 is made of an aluminum plate by milling.

As shown in fig. 2, an operation table 22 is disposed on the surface of the sliding platform 5, a PCBA positioning pin 21 and a press-contact positioning elastic ejector pin 26 are disposed on the operation table 22, the PCBA positioning pin 21 is used for positioning a PCBA30 disposed on the operation table 22, and the press-contact positioning elastic ejector pin 26 is used for positioning the press-contact position of the IGBT module 31. Preferably, the console 22 is machined from aluminum sheet.

The slide platform 5 includes a slide base plate 4, a support plate 23, and an operation table 22, the support plate 23 being vertically disposed above the slide base plate 4, and the operation table 22 being disposed above the support plate 23. A sliding mechanism is arranged between the sliding platform 5 and the base 1, the sliding mechanism comprises a sliding rail 3 arranged on the base 1, a sliding handle 24 and an elastic positioning pin 25 which are arranged on the sliding bottom plate 4, and the elastic positioning pin 25 is matched with the positioning hole 2 arranged on the bottom plate. The sliding platform 5 is translated left and right to adjust the relative position of the IGBT module 31 and the pressing mechanism, and after the adjustment is in place, the elastic positioning pin 25 is inserted into the positioning hole 2 on the bottom plate to realize the fixation. In the present embodiment, the elastic positioning pins 25 are moved to the positions of the positioning holes 2 on the base plate 1 by moving the slide handle 24, so that the plurality of IGBT modules 31 are crimped to the same PCBA 30.

The pressing mechanism comprises a pressing machine table 10, a pressing handle 11 and a pressing head 12, the bottom of the pressing machine table 10 is fixedly connected with the base 1, the pressing head 12 is arranged above the sliding platform 5, the pressing handle 11 drives the pressing head 12 to move up and down, the pressing mechanism ensures the consistency of the pressing connection of the IGBT module 31, the IGBT module 31 can be well attached to the surface of the radiator 6, and the reliability of heat dissipation is ensured, as shown in fig. 3.

The sliding platform 5 slides to realize the crimping of the plurality of IGBT modules 31 on the PCBA30, as shown in fig. 2, this embodiment is suitable for the crimping process of 3 three-level topology IGBT modules 31, and of course, a person skilled in the art can realize the crimping of IGBT modules of other topology structures or realize the crimping of a plurality of IGBT modules 31 as required, for example, a plurality of parallel IGBT modules 31 are disposed on the PCBA 31.

During operation, the sliding handle 24 is matched with the elastic positioning pin 25, the sliding platform 5 is moved to the positioning hole 2 corresponding to the bottom plate 1, the relative positioning of the pressure applying head 12 and the IGBT module 31 is completed, the pressure applying handle 11 applies pressure to press the IGBT module 31 into the mounting hole corresponding to the PCBA30, and the crimping process of the IGBT is completed. In the process, the crimping height and the levelness of the IGBT module 31 can be kept in a controllable range, so that the production efficiency is improved, and the crimping consistency of the IGBT module 31 is ensured; the device also provides feasibility for the later replacement, reduces the waste of materials and reduces the production cost.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element. The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. The crimping device for the IGBT module is characterized by comprising a base, a sliding platform and a pressure applying mechanism, wherein the sliding platform is arranged above the base in a sliding mode, the pressure applying mechanism is arranged above the sliding platform, and the pressure applying mechanism is fixedly connected with the base; the surface of sliding platform is provided with an operation panel, be provided with PCBA locating pin and crimping location elasticity thimble on the operation panel.

2. The IGBT module crimping device according to claim 1, wherein the slide platform includes a slide base plate, a support plate disposed vertically above the slide base plate, and the operation table disposed above the support plate.

3. The IGBT module crimping device of claim 2, wherein a sliding mechanism is arranged between the sliding platform and the base, the sliding mechanism comprises a sliding rail arranged on the base, and a sliding handle and an elastic positioning pin arranged on the sliding bottom plate, and the elastic positioning pin is matched with a positioning hole arranged on the bottom plate.

4. The IGBT module crimping device of claim 1, wherein the pressure mechanism comprises a pressure machine table, a pressure handle and a pressure head, the bottom of the pressure machine table is fixedly connected with the base, the pressure head is arranged above the sliding platform, and the pressure handle drives the pressure head to move up and down.

5. The IGBT module crimping device of claim 1, wherein the sliding platform slides to effect crimping of a plurality of IGBT modules on a PCBA.

6. The IGBT module crimping device of claim 5, wherein three IGBT modules are provided on the PCBA.

7. The IGBT module crimping device of claim 1, wherein the IGBT module is a three-level topology module.