CN112601349B - Y-shaped rigid-flexible composite high-speed circuit board for space navigation - Google Patents
Y-shaped rigid-flexible composite high-speed circuit board for space navigation Download PDFInfo
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- CN112601349B CN112601349B CN202011363997.9A CN202011363997A CN112601349B CN 112601349 B CN112601349 B CN 112601349B CN 202011363997 A CN202011363997 A CN 202011363997A CN 112601349 B CN112601349 B CN 112601349B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The Y-shaped rigid-flexible composite high-speed circuit board for aerospace comprises a first sub-board, a second sub-board and a third sub-board, wherein the first sub-board and the second sub-board are symmetrically arranged, L-shaped flexible circuit boards are correspondingly led out from opposite side surfaces of the first sub-board and the second sub-board respectively, and the tail ends of the two L-shaped flexible circuit boards after being overlapped into a Y shape are respectively collected on the third sub-board. According to the Y-shaped rigid-flexible composite high-speed circuit board for aerospace, three rigid circuit boards are guaranteed to be on the same plane in design through the Y-shaped structural design, so that a tin spraying process can be adopted during processing of the structural circuit board, and the requirement of aerospace application is met. The structural design that the flexible board is drawn out from the side edge of the rigid circuit board enables the two rigid circuit boards to be bent and mutually overlapped for assembly, thereby ensuring that the final product meets the design requirement of small volume.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a Y-shaped rigid-flexible composite high-speed circuit board for aerospace.
Background
China has entered the manned aerospace era, and is developing a space station platform independently, the space station platform needs to carry various loads, the data volume to be transmitted is very huge, the traditional cable transmission system can not meet the data transmission requirement, and the weight of the cable transmission system is unacceptable for the manned aerospace engineering, so the optical fiber is needed to be adopted for signal transmission; in order to meet the requirement of high-reliability aerospace application, two groups of transceiving channels need to be designed in an optical transmission module, wherein one group of transceiving channels is used for backup, namely, when one group of transceiving channels breaks down, the other group of transceiving channels can be quickly switched to an application state through a remote control instruction; meanwhile, when the optical transmission module is used in an orbit, the optical interface can be replaced only by astronauts, so that the optical interface is required to be designed into a form of convenient use and one-time integral butt joint, namely the optical interface is of a four-core integrated structure; the circuit boards of the two groups of transceiving channels in the module are led out through the flexible circuit board, are combined into a whole at the connector, and then are electrically connected with the user circuit board through the high-speed electric connector; therefore, an integrated optical transmission module is required to be manufactured, and the integrated optical transmission module is firstly applied in aerospace and is a key product for realizing the horizontal and crossing development of aerospace industry in China.
Through design analysis, an internal circuit board of the optical transmission module needs to be designed into a rigid-flex composite integrated structure; at present, the traditional rigid-flex composite integrated circuit board mainly comprises the following components:
one is a rigid plate on one side and only a flexible plate on the other side, and the flexible plate comprises a single-piece structure and a double-piece structure;
the other type is that the two sides are rigid plates, the middle parts are interconnected through flexible plates, the thickness of the rigid plates at the two ends is equal, and the flexible plates also comprise a single-piece structure and a double-piece structure.
A rigid-flex composite structure circuit board is a circuit board which is formed by combining a flexible circuit board and a traditional rigid circuit board according to relevant process requirements through a plurality of working procedures and has the characteristics of the flexible circuit board and the rigid circuit board. The flexible region can be used in products with special requirements, has a certain flexible region and a certain rigid region, and is greatly helpful for saving the internal space of the products, reducing the volume of finished products and improving the performance of the products.
The prior rigid-flexible composite circuit board has the following defects:
(1) the double-piece rigid-flex composite board structure is adopted, and the rigid boards at two ends are not of equal thickness, so that when the two-time pressing is needed, a tin spraying processing technology cannot be adopted, and the aerospace application requirements cannot be met;
(2) the double-piece rigid-flex composite board structure is adopted, and rigid boards at two ends are required to be designed in the same thickness, but the requirements of the final product performance cannot be met;
the flexible plates cannot be respectively led out from the side edges of the rigid plate, and are combined into one at the daughter board at the other end, so that the integrated assembly requirement of a final product cannot be met.
Disclosure of Invention
The Y-shaped rigid-flexible composite high-speed circuit board for aerospace can solve the technical problems.
In order to realize the purpose, the invention adopts the following technical scheme:
a Y-shaped rigid-flexible composite high-speed circuit board for aerospace comprises a first sub-board, a second sub-board and a third sub-board, wherein the first sub-board and the second sub-board are symmetrically arranged, L-shaped flexible circuit boards are correspondingly led out from opposite side surfaces of the first sub-board and the second sub-board respectively, and tail ends of the two L-shaped flexible circuit boards after being overlapped into a Y shape are respectively collected on the third sub-board.
Furthermore, the first daughter board and the second daughter board respectively enable the projections of the two daughter boards on the horizontal projection plane to be overlapped by bending the flexible circuit board.
Further, the daughter board III is designed into a 14-layer laminated structure, the thickness of the daughter board III is 2.8mm, the 4 th layer and the 5 th layer are designed into flexible circuit boards and are interconnected with the daughter board I, and the 10 th layer and the 11 th layer are designed into flexible circuit boards and are interconnected with the daughter board II;
the first sub-board and the second sub-board are respectively designed into a 6-layer laminated structure, and the thickness of the first sub-board and the second sub-board is 1.0 mm.
Furthermore, the two L-shaped flexible circuit boards are respectively designed into a signal layer and a copper-clad layer.
According to the technical scheme, the Y-shaped rigid-flexible composite high-speed circuit board for aerospace, provided by the invention, can adopt a tin spraying processing technology, meet the aerospace application requirements and be integrally assembled; the circuit board is designed in a Y-shaped structure, and three rigid circuit boards are guaranteed to be positioned on the same plane in design, so that the circuit board with the structure can adopt a tin spraying process during processing, and the circuit board meets the aerospace application requirements. The structural design that the flexible board is drawn out from the side edge of the rigid circuit board enables the two rigid circuit boards to be bent and mutually overlapped for assembly, thereby ensuring that the final product meets the design requirement of small volume.
The invention has the following advantages:
(1) the two rigid circuit boards are in a separated state, the two rigid circuit boards are combined into one at the right side after being connected through the two flexible circuit boards, and then the two rigid circuit boards are combined into one rigid circuit board, the three rigid circuit boards are positioned on the same plane, and a tin spraying process can be adopted during processing, so that the processing process of the circuit boards meets the aerospace application requirements.
(2) The two rigid circuit boards are separately designed, and are combined into one at the right rigid circuit board after secondary pressing, and the product performance requirements of the final product can be met only by adopting the design of different thicknesses;
(3) the flexible plates of the two rigid circuit boards are led out from the side edges, and the two rigid circuit boards are positioned in a projection plane by bending the flexible plates during assembly, so that the final product can meet the integrated design requirement.
Drawings
FIG. 1 is a schematic diagram of a conventional circuit board design;
FIG. 2 is a schematic view of the present invention before assembly;
FIG. 3 is a schematic view of the assembled structure of the present invention;
FIG. 4 is a pictorial representation of the present invention;
figure 5 is a schematic view of the structure of the product formed in use according to the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.
In early design, a circuit board inside the assembly can only be designed into a structure shown in fig. 1, and the structure needs to process two daughter boards (a daughter board 1 and a daughter board 2) respectively when processing is finished, and then the two daughter boards are pressed to form a whole. If daughter board surface treatment adopts there is plumbous tin spraying, when later stage pressfitting formed daughter board 3, because of need high temperature high pressure when the pressfitting, have the soldering dish to melt on the daughter board, the pad can become flat state after the cooling solidification, and the pad is not full, influences the outward appearance, easily causes the short circuit risk between the pad when later stage welding simultaneously. The structure can only adopt an electroless nickel-gold process during processing, and the gold melting process is forbidden in aerospace due to the gold fragile risk in aerospace application.
In order to avoid the adoption of the chemical gold process, the Y-shaped rigid-flexible composite high-speed circuit board for aerospace changes the daughter board structure from the upper and lower superposition into the upper and lower plane state. This structure adopts a pressfitting to form whole board man-hour adding, then adopts to have lead hot air solder leveling to carry out the face and handle, when simultaneously in order to guarantee the assembly of product later stage, makes two daughter board 1, daughter board two 2 still be in about the plane state through buckling, so will scratch the board and draw forth flexible board 4 from the side of daughter board, overlap together again after turning, collect daughter board three 3 departments at last, whole circuit board is Y shape structure from planar structure looks, as shown in fig. 2.
The flexible board 4 in the rigid daughter board 1 and the rigid daughter board 2 of the Y-shaped rigid-flexible composite high-speed circuit board for aerospace of the embodiment is led out from the side edge, so that the projections of the two daughter boards on the horizontal projection plane can be overlapped by bending the flexible circuit board during final product assembly, and the original design is not changed, as shown in fig. 3.
The Y-shaped rigid-flexible composite high-speed circuit board for aerospace of the present embodiment is functionally divided into three major parts, namely, rigid daughter boards 1 and 2, a Y-shaped double-piece flexible circuit board and a right rigid daughter board three 3, as shown in fig. 4.
In the invention, the rigid daughter boards 1 and 2 are in a separated state, and are combined into a whole through two flexible circuit boards, and are secondarily pressed into a whole at the position of the rigid daughter board 3, so that three rigid daughter boards need to be designed into a state with unequal thickness, the rigid daughter board 3 is designed into a 14-layer structure with the thickness of 2.8mm, wherein 4 layers and 5 layers are designed into flexible boards and are interconnected with the rigid daughter board 1, and 10 layers and 11 layers are designed into flexible boards and are interconnected with the rigid daughter board 2; the rigid daughter boards 1 and 2 are respectively designed into 6-layer laminated structures, and the thickness of each laminated structure is 1.0 mm; after the design is finished, the rigid daughter boards 1, 2 and 3 and the two interconnected flexible boards are positioned on the same horizontal plane and are in a Y-shaped structure from the view of a projection plane; the two flexible circuit boards are respectively designed into a signal layer and a copper-clad layer, so that the tight coupling of the high-speed signal line and the ground plane is ensured, and the transmission performance of the high-speed signal is ensured.
The final product used in the invention is an aerospace-level integrated high-speed optical transceiver module, which consists of a circuit board, a shell structure, an optical interface and an electrical interface, as shown in fig. 5; the optical module comprises two receiving and transmitting integrated optical modules, an electrical interface is interconnected with a user circuit board through the flexible circuit board, the optical interface adopts an integrated four-core plug interface, the module has the advantages of high transmission rate, reliable signal transmission, small volume and light weight, the problem that the conventional pigtail type optical module disc fiber and optical fiber are easy to break is thoroughly solved, the internal space of the space station switch can be greatly saved, the weight is reduced, and the optical module is very suitable for data transmission application of the space station switch.
In summary, the present invention has the following features:
1. y-shaped structural design
The two rigid circuit boards are in a separated state, the two rigid circuit boards are connected through the two flexible circuit boards and then combined into one at the right side, the two rigid circuit boards are pressed into one rigid circuit board for the second time, the whole circuit board is in a Y-shaped structure, and three rigid circuit boards are guaranteed to be positioned on one plane in design, so that the structural circuit board can adopt a tin spraying process during processing, and the aerospace application requirements are met.
2. Unequal thickness design of rigid daughter board
The two rigid circuit boards are separately designed, and are combined into one at the right rigid circuit board after secondary pressing, and the signal transmission performance under the structure is ensured and the integrated design of the final product is also ensured by adopting the design with different thicknesses.
3. Left-right bending and up-down mutual-overlapping structure design
The flexible boards of the two rigid circuit boards are respectively led out from the side edges, and the two rigid circuit boards are overlapped up and down in a projection plane by bending the flexible boards during assembly, so that the integrated design requirement of the final product is met.
The circuit board is designed in a Y-shaped structure, and three rigid circuit boards are guaranteed to be positioned on the same plane in design, so that a tin spraying process can be adopted during processing of the circuit board, and the circuit board meets the aerospace application requirements. The structural design that the flexible board is drawn out from the side edge of the rigid circuit board enables the two rigid circuit boards to be bent and mutually overlapped for assembly, thereby ensuring that the final product meets the design requirement of small volume.
In contrast, the traditional rigid-flex composite circuit board with the designed structure cannot realize that three rigid boards are positioned in the same plane, and a tin spraying process cannot be adopted during processing, so that the aerospace application requirement cannot be met; the left and right bending and up and down mutual overlapping assembly can not be realized, and the integrated design purpose of the final product can not be realized. The Y-shaped design structure is adopted, so that the processing technology can meet the aerospace application requirement, the integrated design requirement of the final product can be ensured, the structure of the final product is ingeniously utilized, and the technical purpose of the integration and aerospace application of the final product is difficult to realize if the technical scheme is not adopted.
The above examples are only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (3)
1. The utility model provides a compound high-speed circuit board of hard gentle of Y shape for aerospace, includes daughter board one (1), daughter board two (2) and daughter board three (3), its characterized in that:
the daughter board I (1) and the daughter board II (2) are symmetrically arranged, the opposite side surfaces of the daughter board I (1) and the daughter board II (2) are respectively led out of the L-shaped flexible circuit boards (4) correspondingly, and the tail ends of the two L-shaped flexible circuit boards (4) which are overlapped into a Y shape are respectively collected on the daughter board III (3);
the daughter board III (3) is designed into a 14-layer laminated structure, the thickness of the daughter board III is 2.8mm, the 4 th layer and the 5 th layer are designed into flexible circuit boards (4) and are interconnected with the daughter board I (1), and the 10 th layer and the 11 th layer are designed into flexible circuit boards (4) and are interconnected with the daughter board II (2);
the daughter board I (1) and the daughter board II (2) are respectively designed into 6 laminated layer structures, and the thickness is 1.0 mm;
the first daughter board (1) and the second daughter board (2) enable projections of the two daughter boards on a horizontal projection plane to be overlapped through bending the flexible circuit board (4).
2. The Y-shaped rigid-flexible composite high-speed circuit board for aerospace of claim 1, wherein: the two L-shaped flexible circuit boards (4) are respectively designed into a signal layer and a copper-clad layer.
3. The Y-shaped rigid-flexible composite high-speed circuit board for aerospace of claim 1, characterized in that:
the daughter board I (1), the daughter board II (2), the daughter board III (3) and the flexible circuit board (4) are subjected to one-step pressing to form a whole board during processing, and then lead tin spraying is adopted for board surface treatment.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011363997.9A CN112601349B (en) | 2020-11-27 | 2020-11-27 | Y-shaped rigid-flexible composite high-speed circuit board for space navigation |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011363997.9A CN112601349B (en) | 2020-11-27 | 2020-11-27 | Y-shaped rigid-flexible composite high-speed circuit board for space navigation |
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| CN112601349A CN112601349A (en) | 2021-04-02 |
| CN112601349B true CN112601349B (en) | 2022-08-23 |
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| CN209861273U (en) * | 2019-02-11 | 2019-12-27 | 上海嘉捷通电路科技股份有限公司 | Rigid-flex board of flying tail structure |
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| JP5941645B2 (en) * | 2011-09-27 | 2016-06-29 | エスアイアイ・プリンテック株式会社 | Liquid ejecting head and liquid ejecting apparatus |
| BR112015007015B1 (en) * | 2012-09-28 | 2022-10-11 | Tyco Electronics Nederland Bv | FIBER OPTIC CASSETTE TAPE, METHOD FOR ASSEMBLING A FIBER OPTIC CASSETTE TAPE AND FLEXIBLE OPTICAL CIRCUIT |
| CN104582325B (en) * | 2013-10-12 | 2018-03-27 | 鹏鼎控股(深圳)股份有限公司 | Rigid-flex combined board and preparation method thereof, circuit board module |
| CN104735923B (en) * | 2015-03-12 | 2017-12-01 | 广州杰赛科技股份有限公司 | A kind of preparation method of rigid-flex combined board |
| JP6159434B1 (en) * | 2016-03-01 | 2017-07-05 | レノボ・シンガポール・プライベート・リミテッド | Interface card connection method and flexible printed circuit board |
| CN106646778B (en) * | 2016-12-23 | 2019-02-15 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| KR20180075872A (en) * | 2016-12-27 | 2018-07-05 | 엘지디스플레이 주식회사 | Circuit board module for display device, display device including the same, and manufacturing method of circuit board module for display device |
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- 2020-11-27 CN CN202011363997.9A patent/CN112601349B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101266350A (en) * | 2007-03-14 | 2008-09-17 | 松下电器产业株式会社 | Touch panel |
| CN102752954A (en) * | 2011-04-22 | 2012-10-24 | 鸿富锦精密工业（深圳）有限公司 | Flexible printed circuit board and electronic device using flexible printed circuit board |
| CN206893832U (en) * | 2016-03-18 | 2018-01-16 | 苹果公司 | Electronic building brick, electronic equipment and electronic system |
| CN209861273U (en) * | 2019-02-11 | 2019-12-27 | 上海嘉捷通电路科技股份有限公司 | Rigid-flex board of flying tail structure |
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