CN112599705B - Display panel and preparation method thereof - Google Patents
Display panel and preparation method thereof Download PDFInfo
- Publication number
- CN112599705B CN112599705B CN202011471499.6A CN202011471499A CN112599705B CN 112599705 B CN112599705 B CN 112599705B CN 202011471499 A CN202011471499 A CN 202011471499A CN 112599705 B CN112599705 B CN 112599705B
- Authority
- CN
- China
- Prior art keywords
- light
- layer
- transmitting insulating
- sub
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000002096 quantum dot Substances 0.000 claims description 21
- 238000011049 filling Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 194
- 239000000463 material Substances 0.000 description 15
- 239000011810 insulating material Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000012212 insulator Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 239000004568 cement Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 108010001267 Protein Subunits Proteins 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The disclosure provides a display panel, the display panel includes the substrate base plate and forms the light emitting component layer on the substrate base plate, the light emitting component layer includes a plurality of pixels, and every pixel includes a plurality of sub-pixels, all is provided with the light emitting component in every sub-pixel, the display panel still includes the shading reflection layer, the shading reflection layer is located the light-emitting side of light emitting component layer, just the shading reflection layer includes a plurality of shading reflectors, the shading reflector sets up the part between two adjacent light emitting components, the shading reflector is towards the surface of the opening of sub-pixel is the reflection of light face, the shading reflection layer on with the part opposite to the light emitting component can the printing opacity. The disclosure also provides a preparation method of the display panel, and the display panel has good display effect.
Description
Technical Field
The disclosure relates to the technical field of display, in particular to a display panel and a preparation method of the display panel.
Background
Common display devices include liquid crystal display panels, light emitting diode display panels, and the like, and the light emitting diode display panels have the advantages of solid state light emission, self-luminescence, and the like and are widely used.
Improving the display effect of the display panel has been pursued in the art.
Disclosure of Invention
The disclosure provides a display panel and a preparation method of the display panel.
As a first aspect of the present disclosure, there is provided a display panel including a substrate and a light emitting element layer formed on the substrate, the light emitting element layer including a plurality of pixels each including a plurality of sub-pixels each having a light emitting element provided therein, the display panel further including a light shielding reflective layer located on a light emitting side of the light emitting element layer, and the light shielding reflective layer including a plurality of light shielding reflectors disposed at a portion between adjacent two light emitting elements, a surface of the light shielding reflector facing an opening of the sub-pixel being a light reflecting surface, a portion of the light shielding reflective layer opposite to the light emitting element being capable of transmitting light.
Optionally, the light emitting element layer includes a pixel defining layer defining a plurality of sub-pixel openings, the plurality of light emitting elements are respectively disposed in the plurality of sub-pixel openings, and the light shielding reflector is disposed on the pixel defining layer.
Optionally, the light shielding reflective layer includes a first light transmitting insulating layer covering the light emitting element layer, a reflective opening is formed on the first light transmitting insulating layer, and a light shielding reflective member is disposed in the reflective opening.
Alternatively, the cross-sectional area of the reflector opening gradually increases in a direction away from the light-emitting element layer; or alternatively
The cross-sectional area of the reflector opening gradually decreases in a direction away from the light-emitting element layer.
Optionally, the first light-transmitting insulating layer includes a first inorganic light-transmitting insulating sub-layer, an organic light-transmitting insulating sub-layer and a second inorganic light-transmitting insulating sub-layer which are stacked, and the second inorganic light-transmitting insulating sub-layer is located between the light-emitting layer and the organic light-transmitting insulating sub-layer; or alternatively
The first light-transmitting insulating layer includes a first inorganic light-transmitting insulating sub-layer and a second inorganic light-transmitting insulating sub-layer.
Alternatively, the light shielding reflecting member is made of a metal material.
Optionally, the light shielding reflector is electrically connected to a cathode of the light emitting element.
Optionally, the display panel further includes a second light-transmitting insulating layer, a light-transmitting filling layer and a packaging layer, which are stacked, and the second light-transmitting insulating layer covers the light-shielding reflective layer.
Optionally, the display panel further includes a quantum dot filter layer, where the quantum dot filter layer is disposed on a side of the encapsulation layer facing away from the light-transmitting filling layer.
As a second aspect of the present disclosure, there is provided a method of manufacturing a display panel, including:
Providing a substrate;
Forming a light emitting element layer including a plurality of pixels, each pixel including a plurality of sub-pixels, each sub-pixel having a light emitting element disposed therein;
The light shielding reflection layer is formed and comprises a plurality of light shielding reflection pieces, the light shielding reflection pieces are arranged at the part between two adjacent light emitting elements, the surface of the light shielding reflection piece, which faces the opening of the sub-pixel, is a light reflection surface, and the part, opposite to the light emitting elements, of the light shielding reflection layer can transmit light.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate the invention and together with the description serve to explain, without limitation, the invention. In the drawings:
FIG. 1 is a partial schematic view of one embodiment of a display panel provided by the present disclosure;
FIG. 2 is a partial schematic view of another embodiment of a display panel provided by the present disclosure;
FIG. 3 is a partial schematic view of yet another embodiment of a display panel provided by the present disclosure;
Fig. 4 is a schematic diagram of a related art display panel in which crosstalk occurs during display;
Fig. 5 is a schematic diagram illustrating the principle that the display panel provided by the present disclosure does not generate crosstalk when displaying;
FIG. 6 is a schematic view of one embodiment of a light blocking reflector;
FIG. 7 is a partial schematic view of yet another embodiment of a display panel provided by the present disclosure;
FIG. 8 is a partial schematic view of yet another embodiment of a display panel provided by the present disclosure;
FIG. 9 is a partial schematic view of yet another embodiment of a display panel provided by the present disclosure;
Fig. 10 is a flowchart of a method for manufacturing a display panel provided by the present disclosure.
Detailed Description
The following describes specific embodiments of the present invention in detail with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the invention, are not intended to limit the invention.
In the related art, each pixel unit of the display panel includes a plurality of sub-pixels, and as shown in fig. 4, light beams emitted from light emitting elements (e.g., light emitting diodes) are disposed in each sub-pixel to diverge within a certain angular range. A certain distance exists between the light emitting element and the packaging layer of the display panel, and light emitted by one light emitting element may enter adjacent sub-pixel units, so that color mixing and crosstalk occur, and the display effect is reduced. In fig. 4, the line segment with the arrow indicates the direction of light propagation.
In view of this, as one aspect of the present disclosure, there is provided a display panel including a substrate 100 and a light emitting element layer 200 formed on the substrate 100, the light emitting element layer 200 including a plurality of pixels, each pixel including a plurality of sub-pixels, each sub-pixel having a light emitting element disposed therein, as shown in fig. 1.
The display panel further includes a light-shielding reflective layer 300, the light-shielding reflective layer 300 is located on the light-emitting side of the light-emitting element layer, the light-shielding reflective layer includes a plurality of light-shielding reflective members 310, the light-shielding reflective members 310 are disposed at a portion between two adjacent light-emitting elements, the surface of the light-shielding reflective member 310 facing the opening of the sub-pixel is a reflective surface, and a portion of the light-shielding reflective layer 300 opposite to the light-emitting element is capable of transmitting light.
As shown in fig. 5, when the light emitting element emits light, the light beyond the sub-pixel unit where the current light emitting element is located with a larger divergence angle irradiates the reflective surface of the light shielding reflector 310, and is reflected by the light shielding reflector 310 back to the pixel sub-unit where the light emitting element is located, so that the light does not enter the adjacent pixel sub-unit, and crosstalk is not generated, and thus the display effect is improved.
Among the light emitted by the light-emitting element, the light scattered in a large angle is reflected back to the pixel subunit where the light-emitting element is positioned, and finally can be emitted from the corresponding pixel subunit, so that the utilization rate of the light emitted by the light-emitting element is improved, the brightness of the display panel is further improved, and the energy consumption of the display panel is reduced.
In the present disclosure, the number of sub-pixels in each pixel unit is not particularly limited. As an alternative embodiment, one pixel unit may include three sub-pixels, which are red, green, and blue sub-pixels, respectively. Accordingly, as shown in fig. 1, a light emitting element 211 is provided in the red sub-pixel, a light emitting element 212 is provided in the green sub-pixel, and a light emitting element 213 is provided in the blue sub-pixel.
In the present disclosure, how to provide the light shielding reflector 310 is not particularly limited as long as the light shielding reflector 310 can be provided between two adjacent light emitting elements and on the light emitting side of the light emitting layer. As an alternative embodiment, the light shielding reflector 310 is disposed on the pixel defining layer 220. In the present disclosure, the light emitting element layer 200 includes a pixel defining layer 220, the pixel defining layer 220 defining a plurality of sub-pixel openings in which a plurality of the light emitting elements are respectively disposed.
The light shielding reflective member 310 is disposed on the pixel defining layer 220 to prevent the light shielding reflective layer from shielding the opening region of the sub-pixel, thereby improving the light extraction efficiency of the display panel.
In the present disclosure, the specific material of the pixel defining layer 220 is not particularly limited. For example, the pixel defining layer 220 may be made of a resin material.
In the present disclosure, the specific structure of the light shielding reflective layer 300 is not particularly limited as long as it includes the light shielding reflective member 310 and does not affect the normal light emission of the light emitting element.
As an alternative embodiment, the light shielding reflective layer 300 may include a plurality of light shielding reflectors formed on the pixel defining layer 220 by way of transfer.
In order to facilitate the manufacture of the light blocking reflector, as an alternative embodiment, the light blocking reflector 300 may include a first light transmitting insulating layer 320 covering the light emitting element layer 200, the first light transmitting insulating layer 320 having a reflector opening formed thereon, and the light blocking reflector 310 being disposed in the reflector opening.
In the fabrication of the light-shielding reflective layer 300, a first transparent insulating material layer may be formed, and then the transparent insulating material layer may be patterned to form a plurality of reflective element openings on the transparent insulating material layer and obtain the first transparent insulating layer. Subsequently, a light shielding reflector 310 may be disposed in the reflector opening.
In the present disclosure, the specific material of the light shielding reflector 310 is not particularly limited. For example, the light shielding reflector 310 may be made of a metal material. Accordingly, in the process of manufacturing the light-shielding reflective layer 300, after the first light-transmitting insulating layer 320 is obtained, a metal layer is deposited on the first light-transmitting insulating layer 320, and the metal layer is patterned, so that the light-shielding reflective element 310 located in the reflective element opening is finally obtained.
In the present disclosure, the specific structure of the light shielding reflector 310 is not particularly limited. For the purpose of preventing light emitted from the light emitting element in one sub-pixel from passing through the light shielding reflector 310 and entering an adjacent sub-pixel, the light shielding reflector 310 includes at least a side portion 311, and the side portion 311 protrudes from the pixel defining layer 220.
As described above, the light shielding reflector 310 may be formed in the reflector opening, and only a portion of the metal layer located outside the reflector opening needs to be removed in order to simplify the patterning process, and accordingly, as shown in fig. 6, the light shielding reflector 310 includes a side surface portion 311 attached to a sidewall of the reflector opening and a bottom surface portion 312 attached to a bottom wall of the reflector opening. In this embodiment, the light shielding reflector 310 has a box-like structure with an open top.
The shape of the reflector opening determines the shape of the light-shielding reflector 310. In the embodiment shown in fig. 1, the longitudinal interface of the reflector opening is rectangular.
In the embodiment shown in fig. 2, the longitudinal section of the reflector opening is inverted trapezoidal, i.e. the cross-sectional area of the reflector opening gradually increases in a direction away from the light emitting element layer 200.
In the embodiment shown in fig. 3, the longitudinal interface of the reflector opening is positively trapezoidal, i.e. the cross-sectional area of the reflector opening gradually decreases in a direction away from the light-emitting element layer 200.
In the present disclosure, the specific material and specific structure of the first light-transmitting insulating layer 320 are not particularly limited. As shown in fig. 7 to 9, the first light-transmitting insulating layer 320 includes a first inorganic light-transmitting insulating sub-layer 321, an organic light-transmitting insulating sub-layer 322, and a second inorganic light-transmitting insulating sub-layer 323, which are stacked. And, the second inorganic light-transmitting insulator layer 323 is located between the light-emitting element layer 200 and the organic light-transmitting insulator layer 322.
In the present disclosure, the materials and thicknesses of the first inorganic light-transmitting insulating sub-layer 321, the organic light-transmitting insulating sub-layer 322, and the second inorganic light-transmitting insulating sub-layer 323 are not particularly limited. As an alternative embodiment, the material of the first inorganic light-transmitting insulating sub-layer 321 is an oxide of silicon and/or a nitride of silicon, and the thickness of the first inorganic light-transmitting insulating sub-layer 321 may be around 1 μm (for example, between 0.5 μm and 1.5 μm); the material of the organic light-transmitting insulator layer 322 is polyacrylate, and the thickness of the organic light-transmitting insulator layer may be around 8 μm (e.g., between 6 μm and 10 μm); the material of the second inorganic light-transmitting insulating sublayer 323 is an oxide of silicon and/or a nitride of silicon, and the thickness of the second inorganic light-transmitting insulating sublayer 323 may be about 1 μm (e.g., between 0.5 μm and 1.5 μm).
Of course, the present disclosure is not limited thereto, and as another alternative embodiment, the first light-transmitting insulating layer 320 includes a first inorganic light-transmitting insulating sub-layer 321 and a second inorganic light-transmitting insulating sub-layer 322.
The reflector opening is formed in the first light-transmitting insulating layer 320, and in the present disclosure, the depth of the reflector opening is not particularly limited as long as it does not cause much damage to the pixel defining layer 220 and damages the structure of the sub-pixel unit.
In the embodiment shown in fig. 7, the reflector opening is shallower, does not reach the pixel defining layer 220, and does not reach the cathode layer (which is the cathode of the light emitting element) formed on the surface of the pixel defining layer 220. In such an embodiment, the thickness of the insulating material between the reflector opening and the cathode of the light emitting element (i.e., the material of the second inorganic light transmissive insulating sublayer 322) may be around 5000 angstroms.
In the embodiment shown in fig. 8, the reflector opening is relatively deep but still reaches the pixel defining layer 220, differing from the embodiment shown in fig. 7 in that the reflector opening reaches the cathode layer at the surface of the pixel defining layer 220.
In the embodiment shown in fig. 9, the reflector opening is relatively deep, not only reaching the pixel defining layer 220, but also forming a recess with a certain depth in the pixel defining layer 220. Alternatively, the depth of the recess may be around 5000 angstroms.
The depth of the reflector opening may be determined according to the thickness of the first light-transmitting insulating layer 320, and the structure. When the first light-transmitting insulating layer 320 includes the first inorganic light-transmitting insulating sub-layer 321, the organic light-transmitting insulating sub-layer 322, and the second inorganic light-transmitting insulating sub-layer 323, the depth of the reflector opening may be between 9.5 μm and 10.5 μm. When the first light-transmitting insulating layer 320 includes the first inorganic light-transmitting insulating sub-layer 321 and the second inorganic light-transmitting insulating sub-layer 323, the depth of the reflector opening may be between 1.5 μm and 2.5 μm.
In the present disclosure, the material of which the light shielding reflecting member 311 is made is not particularly limited as long as the reflection performance of the light shielding reflecting member 311 can be ensured. As an alternative embodiment, the light shielding reflective member 311 is made of a metal material. For example, the light shielding reflective member 311 may be made of one or more materials selected from the metals Ag, al, and Cu. Further preferably, ag may be selected to make the light shielding reflective member 311. In the present disclosure, the thickness of the light shielding reflective member 311 is not particularly limited either, alternatively, the thickness of the light shielding reflective member 311 may be between 80nm and 120nm, and further, the thickness of the light shielding reflective member 311 may be around 100 nm.
In order not to affect the aperture ratio of each sub-pixel, optionally, the orthographic projection of the light shielding reflective member 311 on the substrate is located within the range of the orthographic projection of the pixel defining layer where the light shielding reflective member 311 is disposed on the substrate.
In the present disclosure, the light emitting element may be a light emitting diode, and accordingly, the light emitting diode includes an anode, a light emitting layer, and a cathode. For ease of manufacture, the cathodes of the different light emitting diodes may be formed electrically connected as full face electrodes. In the embodiment shown in fig. 8 and 9, the light shielding reflecting member 311 is electrically connected to the cathode of the light emitting element. In this case, the sheet resistance of the overall structure formed by the light-shielding reflecting member 311 and the cathode of the light-emitting element is smaller than that of a single layer of cathode, so that the electrical connection of the light-shielding reflecting member 311 and the cathode of the light-emitting element can also reduce the voltage drop of the light-emitting element during light emission and improve the uniformity of the display panel during display.
Specifically, the light emitting diode used as a light emitting element in the present disclosure employs a top emission structure, and in order to secure transmittance, the thickness of the cathode is thin, typically around 12 nm. The resistance of a metal film can be represented by a sheet resistance Rs, which satisfies the relationship rs=ρ/d, ρ is the material resistivity, and d is the film thickness. From the formula Rs, it can be seen that the thinner the metal film thickness is, the larger the sheet resistance is. In the related art, therefore, there is an IR-drop problem in the display panel using the top emission light emitting diode, and thus there is a problem in that the center and edge driving voltages are not uniform.
In the present disclosure, the thickness of the shading reflector is preferably 100nm, and the square resistance is about 1/10 of that of a common cathode, so that overlapping the shading reflector and the cathode can play a role of an auxiliary cathode, and the IR-drop problem is alleviated.
As an alternative embodiment, the display panel may further include a second light-transmitting insulating layer 400, a light-transmitting filling layer 500, and an encapsulation layer 600 that are stacked, and the second light-transmitting insulating layer 400 covers the light-shielding reflective layer 300.
The second light-transmitting insulating layer 400 can encapsulate and protect the reflective light-shielding member, so as to avoid damage to the reflective light-shielding member in the subsequent process.
In the present disclosure, the specific material of the second light-transmitting insulating layer 400 is not particularly limited. For example, the second light-transmitting insulating layer 400 may be made of silicon oxide and/or silicon nitride. As an alternative embodiment, the thickness of the second light-transmitting insulating layer 400 may be between 0.5 μm and 2 μm. Further alternatively, the thickness of the second light-transmitting insulating layer 400 is 1 μm.
As an alternative embodiment, the display panel further comprises a quantum dot filter layer 700, which quantum dot filter layer 700 is arranged on the side of the encapsulation layer 600 facing away from the light-transmitting filling layer. The quantum dot filter layer 700 includes a plurality of quantum dot filter blocks capable of emitting light of a predetermined color under excitation of light of a predetermined wavelength, so that the display panel realizes color display.
In order to better protect the display slow plate, the display panel may further include a glass cover plate 800 disposed outside the quantum dot filter layer 700.
In the present disclosure, the specific structure of the quantum dot filter layer 700 is not particularly limited, as long as the display panel can realize color display under the effect of the light emitting diode.
As an alternative embodiment, one pixel unit includes three sub-pixels. The light emitting elements (the light emitting element 211, the light emitting element 212, and the light emitting element 213, respectively) provided in the three sub-pixels are all blue light emitting diodes. Accordingly, the quantum dot filter layer 700 includes a quantum dot filter block QD-R corresponding to the red sub-pixel, a quantum dot filter block QD-G corresponding to the green sub-pixel, and a transmissive block 710 corresponding to the blue sub-pixel. The quantum dot filter block QD-R can emit red light under the excitation of blue light, and the quantum dot filter block QD-G can emit green light under the excitation of the blue light.
In the present disclosure, the specific material of the transmissive block 710 is not particularly limited as long as the transmissive block 710 can allow blue light to pass therethrough. As an alternative embodiment, the transmissive block 710 includes a transparent matrix and scattering particles dispersed in the transparent matrix.
As shown in fig. 5, when the light emitting element 211 emits light, the light having a larger divergence angle is irradiated onto the light shielding reflective member 311, and is further reflected onto the quantum dot filter block QD-R by the light shielding reflective member 311, so that the quantum dot filter block QD-R is excited to emit red light.
To enhance the display effect, the quantum dot filter layer 700 may further include a black matrix 710, and an orthographic projection of the black matrix 710 on the light emitting element layer is positioned around the sub-pixels to separate adjacent sub-pixels. The black matrix is arranged, wiring of the display panel and the shading reflection piece can be shielded, and therefore a better display effect is achieved.
In the present disclosure, the light-transmitting filling layer 500 is made of transparent optical cement, and is mainly used to bond the substrate provided with the light-emitting element layer 200 and the light-shielding reflective layer 300 with the encapsulation layer 600.
The working principle of the display panel provided by the present disclosure is briefly described below with reference to fig. 4 and 5.
The display panels shown in fig. 4 and 5 are each a display panel having a quantum dot filter layer, except that the display panel shown in fig. 5 further has a light shielding reflector 310 and a second light transmitting insulating layer 400.
The encapsulation layer 600 is made of oxynitride of silicon, has a thickness of 1 μm, and has a refractive index of 1.8;
the light-transmitting filling layer 500 is made of transparent optical cement, and has a thickness of 10 μm and a refractive index of 1.5;
the second light-transmitting insulating layer 400 is made of silicon nitride, has a thickness of 1 μm, and has a refractive index of 1.9;
The first inorganic light-transmitting insulator layer 321 is made of silicon nitride, has a thickness of 1 μm, and has a refractive index of 1.9;
The organic light-transmitting insulator layer 322 is made of light-transmitting resin, has a thickness of 8 μm, and has a refractive index of 1.5;
The second inorganic light-transmitting insulator layer 323 is made of oxynitride of silicon, has a thickness of 1 μm, and has a refractive index of 1.8;
the material of the light blocking reflector 310 is silver.
For the display panel in fig. 4, therefore, when light is emitted from the second inorganic light-transmitting insulating sub-layer 323 to the organic light-transmitting insulating sub-layer 322, the emission angle becomes large, the light becomes divergent, and when light is emitted from the first inorganic light-transmitting insulating sub-layer 321 to the light-transmitting filling layer 500, the emission angle becomes large, the light becomes divergent; meanwhile, since the thicknesses of the organic light-transmitting insulating sub-layer 322 and the light-transmitting filling layer 500 are greater, the distance in which light propagates is far greater than the propagation distance in the inorganic layer, and two factors cause the light to be more dispersed after passing through the organic light-transmitting insulating sub-layer 322 and the light-transmitting filling layer 500, so that the light emitted from the light-emitting element 211 corresponding to the red quantum dot filter block QD-R partially enters the adjacent pixel after passing through the first light-transmitting insulating layer and the light-transmitting filling layer 500, and the green quantum dot filter block QD-G is excited, so that the green sub-pixel which should not emit light emits light, causing a cross color problem and reducing the color gamut.
On the display panel shown in fig. 5, a light shielding reflector 310 is formed above the pixel defining layer, and a portion of the scattered emergent light is reflected by the light shielding reflector 310 and returns to the red subpixel, so that the emergent light entering the adjacent pixel is reduced, which helps to alleviate the cross color problem and improve the display color gamut and color purity.
As a second aspect of the present disclosure, there is provided a manufacturing method of a display panel, wherein, as shown in fig. 10, the manufacturing method includes:
In step S110, a substrate base plate is provided;
in step S120, a light emitting element layer is formed, the light emitting element layer including a plurality of pixels, each pixel including a plurality of sub-pixels, each of the sub-pixels having a light emitting element disposed therein;
In step S130, a light-shielding reflective layer is formed, where the light-shielding reflective layer includes a plurality of light-shielding reflective members, the light-shielding reflective members are disposed at a portion between two adjacent light-emitting elements, a surface of the light-shielding reflective member facing the opening of the sub-pixel is a reflective surface, and a portion of the light-shielding reflective layer opposite to the light-emitting elements is capable of transmitting light.
The display panel provided by the first aspect of the present disclosure may be manufactured by the manufacturing method provided by the present disclosure. The working principle and the beneficial effects of the display panel have been described in detail above, and are not described here again.
In the present disclosure, there is no particular limitation on how to specifically perform step S130, and optionally, step S130 may include:
forming a first light-transmitting insulating material layer;
Patterning the first transparent insulating material layer to obtain a first transparent insulating layer with a reflector opening;
the light shielding reflector is formed in the reflector opening of the first light transmitting insulating layer.
As a preferred embodiment, the patterning process of the first transparent insulating material layer is a dry etching process. Etching liquid is not introduced in the dry etching process, so that the substrate with the light-emitting element layer can be prevented from being contacted with the etching liquid, and the stability of the light-emitting element is prevented from being influenced by the etching liquid.
In the present disclosure, there is no particular limitation on how the light-shielding reflecting member is obtained.
For example, the step of forming the light shielding reflector in the reflector opening of the first light transmitting insulating layer may include:
Forming a metal layer on the first light-transmitting insulating layer;
and carrying out a patterning process on the metal layer to obtain the shading reflecting piece.
Of course, the light-shielding reflector may be formed in the reflector opening directly by a vacuum evaporation process.
As described above, the first light-transmitting insulating layer may have a three-layer structure or may have a two-layer structure.
When the first light-transmitting insulating layer has a three-layer structure including a first inorganic light-transmitting insulating sub-layer, an organic light-transmitting insulating sub-layer, and a second inorganic light-transmitting insulating sub-layer, the step of forming the first light-transmitting insulating material layer may include:
forming a second inorganic light-transmitting insulating material layer by chemical vapor deposition;
Forming an organic light-transmitting insulating material layer by inkjet printing;
The first inorganic light-transmitting insulating material layer is formed by chemical vapor deposition.
When the first light-transmitting insulating layer has a first inorganic light-transmitting insulating sub-layer and a second inorganic light-transmitting insulating sub-layer, the step of forming the first light-transmitting insulating material layer may include:
forming a second inorganic light-transmitting insulating material layer by chemical vapor deposition;
The first inorganic light-transmitting insulating material layer is formed by chemical vapor deposition.
In the present disclosure, after the light shielding reflective layer is formed, the method may further include:
Forming a second light-transmitting insulating layer;
forming a light-transmitting filling layer;
Forming a packaging layer;
And forming a quantum dot filter layer.
It is to be understood that the above embodiments are merely exemplary embodiments employed to illustrate the principles of the present disclosure, however, the present disclosure is not limited thereto. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the disclosure, and are also considered to be within the scope of the disclosure.
Claims (6)
1. A display panel comprising a substrate and a light emitting element layer formed on the substrate, the light emitting element layer comprising a plurality of pixels, each pixel comprising a plurality of sub-pixels, each sub-pixel having a light emitting element disposed therein, characterized in that the display panel further comprises a light shielding reflective layer on a light emitting side of the light emitting element layer, and the light shielding reflective layer comprises a plurality of light shielding reflectors disposed at a portion between two adjacent light emitting elements, a surface of the light shielding reflector facing an opening of the sub-pixel is a light reflecting surface, and a portion of the light shielding reflective layer opposite to the light emitting element is light transmissive;
The light shielding reflecting layer comprises a first light-transmitting insulating layer covering the light-emitting element layer, a reflecting piece opening is formed on the first light-transmitting insulating layer, and a light shielding reflecting piece is arranged in the reflecting piece opening; the cross-sectional area of the reflector opening gradually decreases in a direction away from the light-emitting element layer;
The display panel further comprises a second light-transmitting insulating layer, a light-transmitting filling layer and a packaging layer which are stacked, wherein the second light-transmitting insulating layer covers the shading reflecting layer;
The first light-transmitting insulating layer comprises a first inorganic light-transmitting insulating sub-layer, an organic light-transmitting insulating sub-layer and a second inorganic light-transmitting insulating sub-layer which are arranged in a stacked manner, and the second inorganic light-transmitting insulating sub-layer is positioned between the light-emitting element layer and the organic light-transmitting insulating sub-layer; the depth of the opening of the reflecting piece is 9.5-10.5 mu m;
Or alternatively
The first light-transmitting insulating layer comprises a first inorganic light-transmitting insulating sub-layer and a second inorganic light-transmitting insulating sub-layer; the depth of the opening of the reflecting piece is 1.5-2.5 mu m;
The shading reflector comprises a side surface part which is attached to the side wall of the reflector opening and a bottom surface part which is attached to the bottom wall of the reflector opening, so that the shading reflector is of a box-shaped structure with an open top; the second light-transmitting insulating layer is provided with a structure matched with the shading reflecting piece, and the shading reflecting piece is covered and filled with the second light-transmitting insulating layer.
2. The display panel according to claim 1, wherein the light emitting element layer includes a pixel defining layer defining a plurality of sub-pixel openings in which a plurality of the light emitting elements are respectively disposed, the light shielding reflector being disposed on the pixel defining layer.
3. The display panel according to claim 1 or 2, wherein the light shielding reflective member is made of a metal material.
4. A display panel according to claim 3, wherein the light-shielding reflective member is electrically connected to the cathode of the light-emitting element.
5. The display panel of claim 1, further comprising a quantum dot filter layer disposed on a side of the encapsulation layer facing away from the light transmissive fill layer.
6. A method for manufacturing a display panel, the method comprising:
Providing a substrate;
Forming a light emitting element layer including a plurality of pixels, each pixel including a plurality of sub-pixels, each sub-pixel having a light emitting element disposed therein;
Forming a shading reflection layer, wherein the shading reflection layer comprises a plurality of shading reflection pieces, the shading reflection pieces are arranged at the part between two adjacent light-emitting elements, the surface of the shading reflection piece, which faces to the opening of the sub-pixel, is a reflection surface, and the part, opposite to the light-emitting elements, of the shading reflection layer can transmit light; the shading reflector comprises a side surface part which is attached to the side wall of the reflector opening and a bottom surface part which is attached to the bottom wall of the reflector opening, so that the shading reflector is of a box-shaped structure with an open top;
Forming a second light-transmitting insulating layer, a light-transmitting filling layer and a packaging layer, wherein the second light-transmitting insulating layer, the light-transmitting filling layer and the packaging layer are arranged in a stacked mode, and the second light-transmitting insulating layer covers the shading reflecting layer; the second light-transmitting insulating layer is provided with a structure matched with the shading reflecting piece, and the shading reflecting piece is covered and filled by the second light-transmitting insulating layer;
The light shielding reflecting layer comprises a first light-transmitting insulating layer covering the light-emitting element layer, a reflecting piece opening is formed on the first light-transmitting insulating layer, and a light shielding reflecting piece is arranged in the reflecting piece opening; the cross-sectional area of the reflector opening gradually decreases in a direction away from the light-emitting element layer;
The step of forming the first light-transmitting insulating layer includes: sequentially forming a first inorganic light-transmitting insulating sub-layer, an organic light-transmitting insulating sub-layer and a second inorganic light-transmitting insulating sub-layer, wherein the second inorganic light-transmitting insulating sub-layer is positioned between the light-emitting element layer and the organic light-transmitting insulating sub-layer; the depth of the opening of the reflecting piece is 9.5-10.5 mu m;
Or alternatively
The step of forming the first light-transmitting insulating layer includes: sequentially forming a second inorganic light-transmitting insulating sub-layer and a first inorganic light-transmitting insulating sub-layer; the depth of the reflector opening is 1.5-2.5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011471499.6A CN112599705B (en) | 2020-12-14 | 2020-12-14 | Display panel and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011471499.6A CN112599705B (en) | 2020-12-14 | 2020-12-14 | Display panel and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112599705A CN112599705A (en) | 2021-04-02 |
| CN112599705B true CN112599705B (en) | 2024-04-19 |
Family
ID=75195285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011471499.6A Active CN112599705B (en) | 2020-12-14 | 2020-12-14 | Display panel and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112599705B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114256317A (en) * | 2021-12-22 | 2022-03-29 | 湖北长江新型显示产业创新中心有限公司 | Display panel and display device |
| CN115336001A (en) * | 2022-06-22 | 2022-11-11 | 闻泰通讯股份有限公司 | Display screen, preparation method of display screen and electronic equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1882207A (en) * | 2005-06-16 | 2006-12-20 | 悠景科技股份有限公司 | Organic electroluminescence display with high lighting efficiency and high gray contrast |
| CN104979375A (en) * | 2015-05-28 | 2015-10-14 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor and display device |
| CN106653800A (en) * | 2015-10-30 | 2017-05-10 | 三星显示有限公司 | Organic light-emitting diode display |
| CN109449192A (en) * | 2018-12-07 | 2019-03-08 | 合肥鑫晟光电科技有限公司 | A kind of oled display substrate and display panel |
| CN110085769A (en) * | 2019-05-13 | 2019-08-02 | 京东方科技集团股份有限公司 | Display panel and its manufacturing method |
| CN111863860A (en) * | 2020-07-28 | 2020-10-30 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
-
2020
- 2020-12-14 CN CN202011471499.6A patent/CN112599705B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1882207A (en) * | 2005-06-16 | 2006-12-20 | 悠景科技股份有限公司 | Organic electroluminescence display with high lighting efficiency and high gray contrast |
| CN104979375A (en) * | 2015-05-28 | 2015-10-14 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor and display device |
| CN106653800A (en) * | 2015-10-30 | 2017-05-10 | 三星显示有限公司 | Organic light-emitting diode display |
| CN109449192A (en) * | 2018-12-07 | 2019-03-08 | 合肥鑫晟光电科技有限公司 | A kind of oled display substrate and display panel |
| CN110085769A (en) * | 2019-05-13 | 2019-08-02 | 京东方科技集团股份有限公司 | Display panel and its manufacturing method |
| CN111863860A (en) * | 2020-07-28 | 2020-10-30 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112599705A (en) | 2021-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110875438B (en) | Light-emitting display device | |
| CN104733501B (en) | The production method of dot structure, display device and dot structure | |
| CN111063826B (en) | Display panel | |
| US11075326B2 (en) | Semiconductor light emitting device | |
| JP6761020B2 (en) | Organic light emission display device | |
| US7671376B2 (en) | Light emitting apparatus, method of manufacturing light emitting apparatus, and electronic apparatus | |
| JPH10189251A (en) | Display device | |
| CN112599705B (en) | Display panel and preparation method thereof | |
| US11695101B2 (en) | Display panel, method for manufacturing the display panel, and display device | |
| CN113066830B (en) | Display panel, preparation method thereof and display device | |
| JP2010272515A (en) | Organic electroluminescence display device | |
| CN110320702B (en) | Substrate, preparation method thereof and display panel | |
| CN115172432A (en) | Display panel, preparation method thereof and display device | |
| KR101433589B1 (en) | Organic Light Emitting Display Device and Method for Manufacturing The Same | |
| CN109860272B (en) | Display substrate and display device | |
| US20240224635A1 (en) | Display panel and display device | |
| JP2019200974A (en) | Display device and its manufacturing method | |
| JP2006085985A (en) | Organic el display device | |
| CN113327968B (en) | Array substrate and display panel | |
| CN115207067A (en) | Display panel and display device | |
| WO2023039792A1 (en) | Display panel and display apparatus | |
| CN115768215A (en) | Preparation method of quantum dot substrate and quantum dot display panel | |
| CN117280276A (en) | Display panel and display device | |
| JP2015222658A (en) | Organic electroluminescent element and display device | |
| CN117832367A (en) | Display panel and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |