CN112599479A - Display panel and manufacturing method thereof - Google Patents
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- CN112599479A CN112599479A CN202011451197.2A CN202011451197A CN112599479A CN 112599479 A CN112599479 A CN 112599479A CN 202011451197 A CN202011451197 A CN 202011451197A CN 112599479 A CN112599479 A CN 112599479A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 239000003292 glue Substances 0.000 claims abstract description 76
- 239000002184 metal Substances 0.000 claims abstract description 50
- 239000010410 layer Substances 0.000 claims description 37
- 239000000853 adhesive Substances 0.000 claims description 28
- 230000001070 adhesive effect Effects 0.000 claims description 28
- 239000012790 adhesive layer Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 27
- 238000000576 coating method Methods 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a display panel and a manufacturing method thereof, wherein the manufacturing method of the display panel comprises the following steps: step A: attaching a mould to the back plate, wherein the mould comprises a hollow part, and the hollow part is arranged at a part corresponding to the metal wire array of the back plate; and B: forming a solidified glue layer in the hollowed part, wherein the solidified glue layer covers the metal wire array; and C: the mold is removed. The display panel and the manufacturing method thereof provided by the invention are used for preventing glue from flowing to the light emitting part of the display panel, so that the display quality of the display panel is influenced.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a manufacturing method thereof.
Background
The LED (Light Emitting Diode) display panel has the technical characteristics of wide color gamut, low power consumption, fast response, high contrast, long service life, easy realization of transparent and flexible display, and the like, and has become a prospective display technology with great development prospect at present. The Mini LED (submillimeter light emitting diode) display panel and the Micro LED (Micro light emitting diode) display panel further reduce the distance between the lamp beads and the size of the chip on the basis of the small-distance LEDs, are the results of further refinement of the small-distance LEDs, and are considered as the mainstream trend and the development direction of the future display technology.
The display panel of the AM-Mini LED (Active Matrix Mini LED, Active Matrix submillimeter light emitting diode) and the AM-Micro LED (Active Matrix Micro LED, Active Matrix Micro light emitting diode) comprises an LED chip and a metal wire array used for supplying power to the LED chip. When external environment light or light emitted by the LED chip irradiates the metal linear array, the metal emits all directions of reflected light due to the reflection effect of the metal, and the part of light can enter eyes of an observer as light emitted by the display panel, so that the overall optical effect of the panel is influenced, the display contrast of the panel is reduced, and the display quality of the panel is reduced. For the problem of metal light reflection, the currently adopted method generally uses curing glue to coat a metal wire array to realize the shading effect, so as to avoid the influence of ambient light or the self-luminescence of an LED chip on a display panel.
In order to make the curing adhesive have better light shielding effect, generally speaking, the coating thickness of the curing adhesive is required to be thicker. On one hand, the curing adhesive is liquid and has fluidity, and the edge shape and the diffusion area of the curing adhesive are difficult to fix, so that the thickness distribution of the curing adhesive is uneven, and the shading effect is influenced; in addition, the curing adhesive flows to the LED light emitting area, so that the LED chip is shielded, and the display quality of the display panel is influenced.
Therefore, a new technical solution is needed to solve the above technical problems.
Disclosure of Invention
The embodiment of the invention provides a display panel and a manufacturing method thereof, which are used for preventing glue from flowing to a light emitting part of the display panel so as to influence the display quality of the display panel.
The embodiment of the invention provides a manufacturing method of a display panel, which comprises the following steps:
step A: attaching a mould to the back plate, wherein the mould comprises a hollow part, and the hollow part is arranged at a part corresponding to the metal wire array of the back plate;
and B: forming a solidified glue layer in the hollowed part, wherein the solidified glue layer covers the metal wire array;
and C: the mold is removed.
In the manufacturing method of the display panel provided by the embodiment of the invention, the mold further comprises a shielding part, the shielding part is arranged at a part corresponding to the light emitting part of the back plate, and the light emitting part comprises a chip.
In the manufacturing method of the display panel provided in the embodiment of the present invention, after the step C, the method further includes:
step D: and arranging a chip on the light emitting part of the back plate by using a mass transfer technology.
In the manufacturing method of the display panel provided in the embodiment of the present invention, the cured adhesive layer includes a first cured adhesive layer, and the step B includes:
step b 11: coating the hollowed part for the first time by using a curing adhesive;
step b 12: and carrying out primary curing treatment on the curing glue coated for the first time to form the first curing glue layer.
In the manufacturing method of the display panel provided in the embodiment of the present invention, the cured adhesive layer further includes a second cured adhesive layer, and after step b12, the method further includes:
step b 13: coating the first curing adhesive layer for the second time by using curing adhesive;
step b 14: and carrying out secondary curing treatment on the curing glue coated for the second time to form the second curing glue layer.
In the manufacturing method of the display panel provided by the embodiment of the invention, the curing glue comprises black curing glue and/or gray curing glue.
In the manufacturing method of the display panel provided by the embodiment of the invention, the first curing treatment includes irradiating and/or heating the curing adhesive coated for the first time by using ultraviolet rays, so that the curing adhesive coated for the first time is cured to form the first curing adhesive layer;
and the second curing treatment comprises the step of irradiating and/or heating the curing glue coated for the second time by utilizing ultraviolet rays so as to cure the curing glue coated for the second time, so as to form the second curing glue layer.
In the method for manufacturing a display panel provided by the embodiment of the invention, the metal line array comprises row metal lines and column metal lines, the edge of the hollowed part corresponding to the row metal lines has a first distance d1 with the row metal lines, wherein d1 is greater than or equal to 0.
In the method for manufacturing a display panel according to the embodiment of the invention, a second distance d2 is formed between the edge of the hollow portion corresponding to the column metal line and the column metal line, where d2 is greater than or equal to 0, and d1 is d 2.
The invention further provides a display panel, and the display panel is manufactured by the manufacturing method of the display panel.
The embodiment of the invention provides a display panel and a manufacturing method thereof.
In order to make the aforementioned and other objects of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a flowchart illustrating steps of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 2 is a schematic view of a back plate in the method for manufacturing a display panel according to the embodiment of the invention;
fig. 3 is a schematic diagram of step S1 in the method for manufacturing a display panel according to the embodiment of the invention;
FIG. 4 is an enlarged view of area C of FIG. 3;
FIG. 5 is a cross-sectional view of FIG. 3 taken along section a-a';
fig. 6 is a flowchart illustrating a step S2 in the method for manufacturing a display panel according to the embodiment of the present invention;
fig. 7 is a flowchart illustrating a step after step S2 in the method for manufacturing a display panel according to the embodiment of the present invention;
fig. 8 is a schematic diagram of step S2 in the method for manufacturing a display panel according to the embodiment of the present invention;
fig. 9 is a schematic diagram after step S2 in the method for manufacturing a display panel according to the embodiment of the invention;
FIG. 10 is a cross-sectional view of FIG. 9 taken along section A-A';
FIG. 11 is a flowchart illustrating another step of a method for fabricating a display panel according to an embodiment of the present invention;
fig. 12 is a schematic view of a display panel according to an embodiment of the invention.
Detailed Description
For purposes of clarity, technical solutions and advantages of the present invention, the present invention will be described in further detail with reference to the accompanying drawings, wherein like reference numerals represent like elements, and the following description is based on the illustrated embodiments of the present invention and should not be construed as limiting the other embodiments of the present invention which are not described in detail herein. The word "embodiment" as used herein means an example, instance, or illustration.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Referring to fig. 1, an embodiment of the invention provides a method for manufacturing a display panel, which includes the following steps:
step S1: attaching a mould to the back plate, wherein the mould comprises a hollow part which is arranged at the part corresponding to the metal wire array of the back plate;
referring to fig. 2 and fig. 3, fig. 2 is a schematic diagram of a backplane according to an embodiment of the present invention, and fig. 3 is a schematic diagram of step S1 in a manufacturing method of a display panel according to an embodiment of the present invention. In step S1, first, a backplane 10 is provided, in which the backplane 10 includes a substrate 101, a driving circuit layer (not shown) disposed on the substrate 10, and an array of metal lines 102. The metal line array 102 includes a row metal line 102a and a column metal line 102b, and the hollowed portion 102a is disposed on a portion of the structure of the driving circuit layer corresponding to the row metal line 102a and the column metal line 102b in the embodiments of the present invention, which is common knowledge in the art and will not be described herein again.
In this embodiment, the mold 20 further includes a shielding portion 202, and the shielding portion 202 is provided at a portion corresponding to the light emitting portion 10a of the back plate 10. In this embodiment, the light emitting portion 10a is provided with a chip 102, wherein the chip 102 may be a Mini LED chip or a Micro LED chip.
Referring to fig. 4, fig. 4 is an enlarged view of the area C of fig. 3. The edge 201a of the hollow 201 corresponding to the row wire 102a has a first distance d1 with the row wire 102a, wherein d1 ≧ 0.
The edge 201a of the hollow 201 corresponding to the column wire 102b has a second distance d2 with the column wire 102b, wherein d2 ≧ 0, and d1 ═ d 2.
In this embodiment, the edge 201a of the hollow portion 201 of the mold 20 has a predetermined distance from the metal line array 102, so that when a curing adhesive is coated subsequently, the curing adhesive layer can cover the side surfaces of the row metal lines 102a and the column metal lines 102b, so that the metal line array 102 is completely covered.
Further, the bottom of the mold 20 is completely attached to the substrate 101 of the back plate 10, so that the curing adhesive is prevented from flowing from the bottom of the substrate 101 to the light emitting part 10a of the back plate 10 when the subsequent curing adhesive is coated, thereby affecting the light emitting effect of the light emitting part 10 a. Moreover, the height of the mold 20 is greater than the thickness of the metal wire array 102, so that the curing adhesive is prevented from flowing from the hollow part 201 to the light emitting part 10a of the back plate 10, thereby affecting the light emitting effect of the light emitting part 10 a.
In an embodiment of the present invention, referring to fig. 5, fig. 5 is a cross-sectional view taken along a-a' of fig. 3. The part of the shielding portion 202 corresponding to the chip 103 has a cavity 202a, the bottom of the cavity 202a corresponds to the chip 103, the length, width and height of the cavity 202a are all greater than or equal to the length, width and height of the chip 103, and the cavity 202a is used for accommodating the chip 103.
Step S2: forming a solidified glue layer in the hollowed part, wherein the solidified glue layer covers the metal wire array;
referring to fig. 6, the cured adhesive layer includes a first cured adhesive layer, and step S2 includes:
step S21: coating the hollowed part for the first time by using curing glue;
step S22: and carrying out primary curing treatment on the curing glue coated for the first time to form a first curing glue layer.
Specifically, referring to fig. 8, the curing glue is applied to the hollow portion 201 by a coating method such as dropping, spin coating or doctor blade coating. Then, the curing glue coated for the first time is irradiated or heated by ultraviolet rays, so that the curing glue coated for the first time is cured to form a first curing glue layer 301. The first curing process includes irradiating and/or heating the first applied curing glue with ultraviolet rays, so that the first applied curing glue is cured to form a first cured glue layer 301.
Referring to fig. 7, after the step S22, the step S2 further includes:
step S23: coating the first curing adhesive layer for the second time by using curing adhesive;
step S24: and carrying out secondary curing treatment on the curing glue coated for the second time to form a second curing glue layer.
Specifically, referring to fig. 8 and 9, a curing adhesive is coated on the first curing adhesive layer 301 by a coating method of dropping, spin coating or blade coating. Then, the curing glue coated for the second time is irradiated and/or heated by ultraviolet rays, so that the curing glue coated for the second time is cured to form a second curing glue layer 302. The curing glue includes a black curing glue and/or a gray curing glue, but is not limited thereto, and the curing glue in this embodiment may also include glue of other colors having the same function as the black curing glue and the gray curing glue.
Referring to fig. 10, fig. 10 is a cross-sectional view of a portion a-a' taken in fig. 9. The first curing glue layer 301 covers the metal wire array 102, and the second curing glue layer 302 covers the first curing glue layer 301.
The second curing treatment includes irradiating and/or heating the curing glue coated for the second time with ultraviolet rays, so that the curing glue coated for the second time is cured to form the second curing glue layer 302.
Optionally, after step S24, the method may further include: the second curing adhesive layer 302 is coated with a curing adhesive for the third time, that is, the curing adhesive is coated on the second curing adhesive layer 302 by using a coating method of dropping, spin coating or blade coating. And then, irradiating and/or heating the curing glue coated for the third time by using ultraviolet rays, so that the curing glue coated for the third time is cured to form a third curing glue layer.
In this embodiment, the curing glue is applied by means of segmented curing, for example, when the total thickness of the curing glue layer is 15 micrometers, the first coating thickness is 5 micrometers. Specifically, a first photoresist coating is performed on the metal wire array 102, and the first coating of the curing adhesive is cured by ultraviolet irradiation and/or heating to form a first curing adhesive layer. Then, a second cured adhesive layer of 5 microns is coated on the first cured adhesive layer, and finally, a third cured adhesive layer of 5 microns is coated on the second cured adhesive layer, so that a cured adhesive layer with a thickness of 15 microns is formed. Because the curing glue is liquid and has stronger fluidity, the segmented curing can ensure that the coating thickness is more uniform.
It should be noted that, in this embodiment, in order to ensure the uniformity of coating, when the metal wire array 102 is coated with the curing adhesive for the first time and the second time, a vibration assembly may be disposed in the hollow portion 201, so that the curing adhesive is uniformly distributed in the hollow portion 201, thereby forming a curing adhesive layer with a uniform thickness.
Further, when the curing adhesive coated for the first time and the curing adhesive coated for the second time are irradiated and/or heated by ultraviolet rays, a pressing plate may be further disposed on the hollow portion 201, and the pressing plate is disposed corresponding to the hollow portion 201, so that the thickness of the curing adhesive layer is uniform. Furthermore, since the curing adhesive has fluidity, the distribution amount of the curing adhesive on the peripheral side of the hollow portion 201 is smaller than the distribution amount of the center of the hollow portion 201, and the curing adhesive layer formed on the peripheral side of the hollow portion 201 can be evenly distributed by attaching the curing adhesive with the pressing plate.
Step S3: the mold is removed.
After step S3, the method further includes: an encapsulation structure layer is disposed on the back plate 10 to form a display panel.
Referring to fig. 11, in an embodiment, a method for manufacturing a display panel includes the following steps:
step S1: attaching a mould to the back plate, wherein the mould comprises a hollow part which is arranged at the part corresponding to the metal wire array of the back plate;
step S2: forming a solidified glue layer in the hollowed part, wherein the solidified glue layer covers the metal wire array;
step S3: removing the mold;
step S4: and arranging the chip on the light emitting part of the back plate by using a mass transfer technology.
The difference between the manufacturing method of the display panel in this embodiment and the manufacturing method of the display panel is that: in this embodiment, after the cured adhesive layer is formed on the metal linear array, the chip is disposed on the light emitting portion of the back plate. The mold in this embodiment includes a hollowed-out portion without the need to shield the light emitting portion of the backplate from the portion. In this embodiment, the steps S1, S2 and S3 are the same as the steps of the manufacturing method of the display panel, and are not repeated herein.
Referring to fig. 10 and 12, the present invention further provides a display panel, and the display panel 1000 is manufactured by the above-mentioned method. Specifically, the display panel 1000 includes:
a back plate 10, the back plate 10 including a metal line array and a light emitting portion, the chip 103 being disposed at the light emitting portion 10 a. The backplate 10 further includes a substrate 101, and a driving circuit layer (not shown) disposed on the substrate 101. The metal line array 102 includes a row metal line 102a and a column metal line 102 b.
The curing glue layer comprises a first curing glue layer 301 and a second curing glue layer 302, wherein the first curing glue layer 301 covers the metal wire array 102, and the second curing glue layer 302 covers the first curing glue layer 302. Wherein the cured bondline is formed by restricting flow of the cured bondline with a mold.
The display panel 1000 further includes a package structure layer covering the back plate 10 and the chip 103.
On one hand, the display panel manufactured by the manufacturing method of the display panel can be applied to direct display. That is, the display panel in the embodiment of the invention may be an Active Light Emitting display panel, for example, an Active Matrix Light Emitting Diode (AMLED) display panel or a Passive Matrix LED (Passive Matrix LED) display panel. For example, AM-Mini LED (active matrix sub-millimeter light emitting diode) display panels, AM-Micro LED (active matrix Micro light emitting diode) display panels, PM-Mini LED (passive matrix light emitting diode) display panels, PM-Micro LED (passive matrix Micro light emitting diode) display panels.
On the other hand, the display panel manufactured by the manufacturing method of the display panel can also be a liquid crystal display panel. When the display panel is a liquid crystal display panel, the display panel further comprises a first substrate, a second substrate and a liquid crystal box arranged between the first substrate and the second substrate.
The embodiment of the invention provides a display panel and a manufacturing method thereof.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (10)
1. A manufacturing method of a display panel is characterized by comprising the following steps:
step A: attaching a mould to the back plate, wherein the mould comprises a hollow part, and the hollow part is arranged at a part corresponding to the metal wire array of the back plate;
and B: forming a solidified glue layer in the hollowed part, wherein the solidified glue layer covers the metal wire array;
and C: the mold is removed.
2. The method of manufacturing a display panel according to claim 1, wherein the mold further includes a shielding portion provided at a portion corresponding to a light emitting portion of the back plate, the light emitting portion including a chip.
3. The method for manufacturing a display panel according to claim 1, further comprising, after the step C:
step D: and arranging a chip on the light emitting part of the back plate by using a mass transfer technology.
4. The method for manufacturing a display panel according to claim 1, wherein the cured adhesive layer comprises a first cured adhesive layer, and the step B comprises:
step b 11: coating the hollowed part for the first time by using a curing adhesive;
step b 12: and carrying out primary curing treatment on the curing glue coated for the first time to form the first curing glue layer.
5. The method for manufacturing a display panel according to claim 4, wherein the cured adhesive layer further comprises a second cured adhesive layer, and after the step b12, the method further comprises:
step b 13: coating the first curing adhesive layer for the second time by using curing adhesive;
step b 14: and carrying out secondary curing treatment on the curing glue coated for the second time to form the second curing glue layer.
6. The method for manufacturing a display panel according to claim 5, wherein the curing glue comprises a black curing glue and/or a gray curing glue.
7. The method for manufacturing a display panel according to claim 5, wherein the first curing treatment includes irradiating and/or heating the first coated curing glue with ultraviolet rays, so that the first coated curing glue is cured to form the first cured glue layer;
and the second curing treatment comprises the step of irradiating and/or heating the curing glue coated for the second time by utilizing ultraviolet rays so as to cure the curing glue coated for the second time, so as to form the second curing glue layer.
8. The method as claimed in claim 7, wherein the metal line array includes a row metal line and a column metal line, and an edge of the cutout corresponding to the row metal line has a first distance d1 from the row metal line, wherein d1 is greater than or equal to 0.
9. The method of claim 8, wherein an edge of the cutout corresponding to the column metal line has a second distance d2 from the column metal line, wherein d2 is greater than or equal to 0, and d1 is d 2.
10. A display panel produced by the method for producing a display panel according to any one of claims 1 to 9.
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| CN202011451197.2A CN112599479A (en) | 2020-12-10 | 2020-12-10 | Display panel and manufacturing method thereof |
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| CN202011451197.2A CN112599479A (en) | 2020-12-10 | 2020-12-10 | Display panel and manufacturing method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030098528A1 (en) * | 2001-10-09 | 2003-05-29 | 3M Innovative Properties Company | Method for forming microstructures on a substrate using a mold |
| CN104393195A (en) * | 2014-10-10 | 2015-03-04 | 深圳市华星光电技术有限公司 | Masking plate, manufacturing method of masking plate, and manufacturing method of OLED panel |
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| US20030098528A1 (en) * | 2001-10-09 | 2003-05-29 | 3M Innovative Properties Company | Method for forming microstructures on a substrate using a mold |
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| CN110767845A (en) * | 2019-02-01 | 2020-02-07 | 云谷（固安）科技有限公司 | Display panel and manufacturing method thereof |
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