CN112597734B - Method for calculating number of through holes and resistance value of cross-layer chain type connection structure - Google Patents

Method for calculating number of through holes and resistance value of cross-layer chain type connection structure Download PDF

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CN112597734B
CN112597734B CN202011635184.0A CN202011635184A CN112597734B CN 112597734 B CN112597734 B CN 112597734B CN 202011635184 A CN202011635184 A CN 202011635184A CN 112597734 B CN112597734 B CN 112597734B
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structural block
blocks
block
connection structure
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CN112597734A (en
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彭焱
袁天浩
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Hangzhou Guangli Microelectronics Co ltd
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Hangzhou Guangli Microelectronics Co ltd
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    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/392Floor-planning or layout, e.g. partitioning or placement
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/398Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2115/00Details relating to the type of the circuit
    • G06F2115/06Structured ASICs

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Abstract

The application provides a method for calculating the number of through holes of a cross-layer chain type connection structure, which comprises the following steps: dividing the connecting line into a plurality of sequentially connected structural blocks; identifying a layer jump structure block in the Mi layer, and identifying an overlapping area of a structure block or a pin of an adjacent layer and the layer jump structure block; identifying the vias in the overlap region, and the number of viasCalculating the total number of through holes:. The application also provides a corresponding resistance value calculation method, which uses the formula. The method can not be omitted or repeated, and can effectively reduce errors, so that the accurate resistance value of the cross-layer chain type connection structure is obtained through calculation, and the selection of the testing range is guided. The steps are simple, the result is accurate, and the improvement and optimization of the production process are facilitated.

Description

Method for calculating number of through holes and resistance value of cross-layer chain type connection structure
Technical Field
The application belongs to the field of semiconductor design and production, and particularly relates to a method for calculating the number of through holes and resistance values of a cross-layer chain type connection structure.
Background
In the semiconductor integrated circuit industry, high performance integrated circuit chips require high performance back-end electrical interconnects. Copper metal has found increasing use in integrated circuit chips due to its low resistivity characteristics. In the test of the cross-layer chain connection structure, different measuring ranges are selected for testing according to different resistances of the structure so as to improve the accuracy of data, so that the calculation of the resistance value of the cross-layer chain connection structure is an important research subject in the test of an integrated circuit.
In a cross-layer chain connection structure, the resistance of the cross-layer chain connection structure is mainly derived from the resistance of the through holes, so that the number of the through holes is needed to be obtained to estimate the resistance of the structure; meanwhile, in the subsequent data analysis, the data can be normalized by using the number of through holes (numOfSingleVias), so that the analysis and comparison are convenient. Therefore, a more accurate number of through holes needs to be obtained before test analysis.
Currently, a chain structure is usually formed by combining repeating units according to specific rows (Row) and columns (Col), so that a designer is required to calculate the number of through holes in the repeating units according to design parameters and formulas, and calculate the number of through holes in the whole structure according to the number of up rows and columns. As shown in fig. 1, the number of through holes of one repeating unit=num_1+num_2+ … … +num_n, the number of through holes for the entire structure numofsinglevia= (num_1+num_2+ … … +num_n) ×col×row; in addition, if a plurality of through holes are used at a certain place where the upper and lower layers are connected, the number of through holes is counted as a fraction of the number of through holes, i.e., 1/num. However, it can be found that for complex structures with multiple types of via numbers (single via/multiple via) or multiple repeating units, the formula is cumbersome, and the calculation is easy to miss or repeat, and the resulting result may have errors, which may affect the subsequent testing and analysis. Therefore, a new method is needed to obtain the number of through holes of the chain structure, and thus the resistance value of the cross-layer chain connection structure can be obtained.
Disclosure of Invention
The present application has been made in view of the above-mentioned problems occurring in the prior art, and an object of the present application is to provide a method capable of automatically identifying and calculating the number of through holes thereof according to the specific trend and structure of a cross-layer chain connection structure, and correspondingly calculating a resistance value. The terminology used in the description of the application below and the associated technical principles are for the purpose of illustration only and are not intended to be limiting.
The method for calculating the number of through holes of the cross-layer chain type connection structure provided by the aspect of the application comprises the following steps: step one: acquiring a cross-layer chain type connection structure to be calculated in a layout, wherein the cross-layer chain type connection structure comprises a plurality of connecting lines and a plurality of through holes, the connecting lines are positioned in a connecting line layer Mi, the through holes are positioned in a through hole layer Vj, and the through holes are used for connecting the connecting lines or pins in two adjacent connecting line layers; wherein i is E [1, E],j∈[1,F]E, F is a natural number greater than 1; will connectDividing the line into a plurality of sequentially connected structural blocks; step two: identifying the connecting wire layer M i A layer jump structure block in the (a); the layer jump structure block means that at least one side does not have M i The structure block pins of the layer are connected with the structure blocks; judging at M i Whether a structure block or a pin with an overlapping area exists between the adjacent connecting line layers of the layers and the layer jump structure block exists or not, if so, whether a through hole for connecting the two adjacent connecting line layers exists in the overlapping area or not is continuously judged (namely, the through hole for connecting M is used for connecting i Layer jump structure block and adjacent connecting line layer M thereof i-1 Layers or M i+1 Structural blocks or pins of the layer); if so, the number of the through holes in the overlapped area is obtainedThe method comprises the steps of carrying out a first treatment on the surface of the Wherein j represents that the through hole is positioned in the through hole layer V j Wherein m is the value indicating that the via is located in the via layer V j In the m-th said overlap region; step three: calculating the total number of through holes: />The method comprises the steps of carrying out a first treatment on the surface of the The G is a through hole layer V j For connecting the overlapping areas of two adjacent layers.
The method for calculating the resistance value of the cross-layer chain type connection structure provided by the other aspect of the application comprises the steps of obtaining the number of the through holes of the cross-layer chain type connection structure by adopting the method for calculating the number of the through holes of the cross-layer chain type connection structureThe method comprises the steps of carrying out a first treatment on the surface of the The resistance value R is calculated and,the G is a through hole V j The number of overlapping areas in a layer that connect two adjacent layers; said->Is a through hole V j A unit via resistance value in the layer; j E [1, F],m∈[1,G]F, G is a natural number greater than 1.
As a further improvement, the R also comprisesI.e.Said->For connecting the wire layer M i Resistance value of single-layer connection structure, connection line layer M i The single-layer connection structure of (a) comprises a connection line layer M i A connecting wire in (a); i E [1, E]E is a natural number greater than 1. The resistance value in the formula comprises the resistance value of the single-layer connecting structure, and the resistance value of the cross-layer chain connecting structure can be further accurately calculated.
In one specific implementation, the method comprises the steps ofThe method specifically comprises the following steps: obtaining the number of single-layer connection structure blocks; then multiplying the square number by square resistance to obtain the resistance value of the single-layer connection structure>
In an advantageous embodiment, the obtaining the number of single-layer connection structure blocks comprises: s1, obtaining a single-layer connection structure to be calculated in a layout; the single-layer connecting structure comprises a plurality of connecting lines in the same layer, and the corners of the connecting lines are right angles; then dividing the single-layer connection structure into a plurality of rectangular structure blocks according to the layout; s2, setting the edge of the structural block along the trend of the connecting line as long and the edge perpendicular to the trend of the connecting line as wide; obtaining L and W of the structural block: the L is a distance value between a starting point and an ending point of a structural block and is used for representing a length value of the structural block; along the trend of the connecting line, the starting point refers to a shared point between the structural block and a previous adjacent structural block or a connected pin, and the ending point refers to a shared point between the structural block and a subsequent adjacent structural block or a connected pin; the W is a distance value between two lengths of the structural block and is used for representing a width value of the structural block; step S3, calculating the number of blocks (num of square) of each structural block: n=l ⁄ W; and adding the square blocks of all the structural blocks to obtain the square blocks of the single-layer connecting structure.
In one specific implementation case, in the step S1, the structural block obtained by dividing the single-layer connection structure includes: end blocks and middle blocks; the end part structure blocks are structure blocks at two ends of the connecting wire, one side of each end part structure block is connected with a pin, and the other side of each end part structure block is adjacent to the middle structure block; the middle structural block is a structural block between two end structural blocks of the connecting line, and two sides of the middle structural block are respectively adjacent to the end structural blocks.
In still another specific implementation case, in the step S2, the method for determining the common point between the end structural block and the connected pin includes: when an overlapping area (overlap) exists between the end structure block and the pin, taking the central point of the overlapping area as a common point; when the end structural block and the pin do not have an overlapping area but have a shared edge, and the shared edge and the length of the end structural block have an overlapping part (the shared edge and the length are not necessarily completely overlapped), a quadrilateral area is expanded from the shared edge into the end structural block, two adjacent edges of the quadrilateral area are respectively the shared edge and one width of the end structural block, and the central point of the quadrilateral area is taken as a shared point; when there is no overlapping area between the end structural block and the pin but there is a common edge, the common edge coincides with the width of the end structural block, and the midpoint of the common edge is taken as a common point.
In a preferred embodiment, the adjacent structural blocks are provided as a first structural block and a second structural block, and the method for determining the shared point between the first structural block and the second structural block specifically comprises the following steps of: when an overlapping area (overlap) exists between the first structural block and the second structural block, taking the central point of the overlapping area as a common point; when the first structural block and the second structural block have no overlapping area but have a shared edge, the shared edge is overlapped with the width of the first structural block, and the shared edge and the length of the second structural block have an overlapped part (the shared edge and the length are not necessarily completely overlapped), expanding a quadrilateral area into the second structural block from the shared edge, wherein two adjacent edges of the quadrilateral area are respectively the shared edge and one width of the second structural block, and taking the central point of the quadrilateral area as a shared point; when there is no overlapping area between the first and second blocks but there is a common edge, the common edge has a portion overlapping the width of the first block and the common edge also has a portion overlapping the width of the second block, then the midpoint of the common edge is taken as the common point. It should be understood that in this solution, there is a case where the widths of the common edge and the first and second structural blocks are not completely overlapped, and the overlapping portion may be the widths of the first and second structural blocks or a line segment on the widths of the first and second structural blocks.
In another possible embodiment, in the single-layer connection structure, the connection line is a linear structure or a snake (snake) structure.
Preferably, the connecting line has a linear structure, and in the step S2, a plurality of sequentially adjacent structural blocks with equal widths on the connecting line are regarded as one structural block to calculate L and W.
Optionally, the connecting line is in a snake-shaped structure, and in the step S2, a plurality of sequentially adjacent structural blocks with equal widths, which exist between two adjacent corners of the connecting line, are regarded as one structural block to calculate L and W.
In another preferred embodiment, the single-layer connection structure is a metal single-layer structure.
The application has the following beneficial effects: (1) According to the method for calculating the number of the through holes of the cross-layer chain type connecting structure, the cross-layer chain type connecting structure can be regarded as a combination of a single-layer wiring area and a through hole layer jump area (namely, the areas of an upper layer, through holes and a lower layer exist at the same time) according to a layout, then the through hole layer jump area is automatically identified according to the upper layer, the through holes and the lower layer, the number of the through holes of each area is automatically obtained, if a plurality of through holes num_n exist, the number of the through holes is calculated as 1/num_n, so that the number of the through holes of a final structure can be obtained. (2) According to the method for calculating the resistance value of the cross-layer chain type connection structure, the number of blocks of the through holes of the cross-layer chain type connection structure is calculated according to the layout, the single-layer connection structure is regarded as the combination of a plurality of structural blocks, and W and L of each structural block are automatically identified according to the trend of the connecting line, so that the number of blocks of the whole single-layer connection structure can be calculated, the resistance value of the single-layer connection structure is obtained, and the resistance value of the accurate cross-layer chain type connection structure is calculated, so that the selection of a testing range is guided. The steps are simple, the result is accurate, and the improvement and optimization of the production process are facilitated.
Drawings
FIG. 1 is a schematic diagram showing the calculation of the number of through holes of a cross-layer chain connection structure by using a repeating unit in the prior art.
Fig. 2 is a schematic diagram of a method for calculating the number of through holes of a cross-layer chain connection structure according to a first embodiment of the present application.
FIG. 3 is a schematic diagram of a cross-layer chain link structure according to an embodiment of the present application.
Fig. 4 is a diagram of an embodiment of a layer structure block in accordance with an embodiment of the present application.
Fig. 5 (a) is a schematic diagram of a single-layer connecting block L, W in the present application.
Fig. 5 (b) is a schematic diagram of a block number obtaining method of a single-layer connection structure in a second embodiment of the application.
Fig. 6 (a), fig. 6 (b) and fig. 6 (c) are schematic diagrams of a method for determining a common point between a structural block and a pin connected to the structural block in the third embodiment of the present application.
Fig. 7 (a), fig. 7 (b), fig. 7 (c) and fig. 7 (d) are schematic diagrams of a method for determining a common point between adjacent structural blocks in the fourth embodiment of the present application.
Fig. 7 (e) is a schematic diagram of an L-shaped connection line with a snake-shaped structure according to the fifth embodiment of the application.
Detailed Description
The foregoing and/or additional aspects and advantages of the present application will be apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings.
Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While the present disclosure has been illustrated in the drawings in some form, it is to be understood that the present disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but are provided to provide a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and examples of the present disclosure are for illustrative purposes only and are not intended to limit the scope of the present disclosure. The operations of the embodiments are depicted in the following examples in a particular order, which is presented to provide a better understanding of the details of the embodiments and to provide a thorough understanding of the application, but is not necessarily a one-to-one correspondence with the methods of the application, nor is it intended to limit the scope of the application in this regard.
It should be noted that the flowcharts and block diagrams in the figures illustrate the operational processes that may be implemented by the methods according to the embodiments of the present application. It should also be noted that in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the intervening blocks, depending upon the objectives sought to be achieved by the steps involved. Furthermore, each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and manual operations.
Example 1
As shown in fig. 2, a method for calculating the number of through holes of a cross-layer chain connection structure disclosed in a first embodiment of the present application includes: step one, acquiring a cross-layer chain type connection structure to be calculated in a layout;
the cross-layer chain type connecting structure comprises a plurality of connecting wires and a plurality of through holes, wherein the connecting wires are positioned in the connecting wiresLayer M i In which the via is at via layer V j And is at V j The through holes in the layers are used for connecting the connecting wires or pins (pins) in two adjacent connecting wire layers; wherein i is E [1, E],j∈[1,F]E, F is a natural number greater than 1. Dividing the connecting wires in the cross-layer chain type connecting structure into a plurality of sequentially connected structure blocks according to the layout.
As shown in fig. 3, in this embodiment, the cross-layer chain connection structure includes connection lines of M1, M2 and M3 layers, and through holes of V1 and V2 layers, the through holes of V1 layer are used for connecting the M1 layer and the M2 layer, the through holes of V2 layer are used for connecting the M2 layer and the M3 layer, and the connection lines of M1, M2 and M3 layers are divided into a plurality of structure blocks according to the layout.
Step two, for any M in the cross-layer chain connection structure i Layer, first identify the M i A layer jump block in a layer; the layer jump structure block is arranged at the M i At least one side of the layers is provided with a structural block without the same layer or a structural block with pins connected with the structural block; such as the building blocks in fig. 4 are all layer jump building blocks.
For M i Layer jump structure block in layer, judge at M i Adjacent connecting line layers (M i-1 Layer and M i+1 Layer), whether there is a structure block or pin that has an overlap region with the layer jump structure block: if M i If there is an overlap region between the skip layer structure block in a layer and the structure block or pin of its adjacent connection line layer, then it is determined whether there is a connection line layer (i.e. connection M i Layer jump building blocks in a layer and building blocks or pins of its adjacent layer): if so, the number of through holes in the overlapping region for connecting the two adjacent connecting wire layers is identifiedThe method comprises the steps of carrying out a first treatment on the surface of the Wherein j means that the via is located in the via layer V j Wherein m is that the through hole is positioned on the through hole layer V j In the m-th said overlap region. Referring specifically to FIG. 3, the building block A is a layer-jump building block of the M1 layer, and in the adjacent layer M2 of the M1 layer, there is an overlapping region with the building block AA structural block B, wherein the number of through holes via in the overlapped area is 1; the structural block C is a layer-jump structural block of M2 layers, and in adjacent layers M1 and M2 of the M2 layers, a structural block D and a structural block E which have an overlapping area with the structural block C exist respectively, wherein the overlapping area between the structural block C and the structural block D is provided with no V1 layer through holes for connecting the two structural blocks, and the overlapping area between the structural block C and the structural block E is provided with 2V 2 layer through holes via for connecting the two structural blocks.
Step three, after obtaining the through hole information in the cross-layer chain type connection structure, calculating the total through hole number of the cross-layer chain type connection structure:
wherein the saidIs a through hole layer V j The number of through holes in the overlap region connecting two adjacent layers; the G is a through hole layer V j The number of overlapping areas for connecting two adjacent layers; j E [1, F],m∈[1,G]F, G is a natural number greater than 1.
The number of the through holes of the cross-layer chain type connecting structure is calculated in the mode, the number of the through holes is not missed, the calculation is not repeated, the error can be effectively reduced, and compared with the previous calculation method of the repeated units, the advantages are more remarkable especially when the structure of the cross-layer chain type connecting structure is complex.
Based on the method for calculating the number of the through holes of the cross-layer chain type connection structure, the method for calculating the resistance value of the cross-layer chain type connection structure according to the layout is further provided, and a specific calculation formula is as follows:the method comprises the steps of carrying out a first treatment on the surface of the Wherein, R is the resistance of the cross-layer chain type connection structure; said->Is a through hole layer V j In the overlap region for connecting two adjacent layersIs the number of through holes and->The method for calculating the number of the through holes of the cross-layer chain type connection structure is utilized to obtain the cross-layer chain type connection structure; the G is a through hole V j The number of overlapping areas in a layer that connect two adjacent layers; said->Is a through hole V j A unit via resistance value in the layer; j E [1, F],m∈[1,G]F, G is a natural number greater than 1.
Example two
In the second embodiment, according to different application requirements, the method for calculating the resistance value of the cross-layer chain connection structure can further accurately calculate the resistance value of the cross-layer chain connection structure, and the calculation formula is as follows:the method comprises the steps of carrying out a first treatment on the surface of the Wherein said->For connecting the wire layer M i Resistance value of single-layer connection structure, connection line layer M i The single-layer connection structure of (a) comprises M i Connecting lines in the layers; i E [1, E]E is a natural number greater than 1. Wherein said->The method specifically comprises the following steps: obtaining the number of single-layer connection structure blocks; then multiplying the square number by square resistance to obtain the resistance value +.>. As shown in fig. 5 (a), L, W of the single-layer connection structure blocks in this embodiment is a combination of a plurality of structure blocks (the structure blocks in the embodiment are all rectangular) in the layout, and in this embodiment, the block number obtaining method automatically identifies according to the trend of each connection line in the single-layer connection structureW and L of each structure block polygon1, wherein L refers to a distance value between a starting point and an ending point of the structure block polygon1 and is used for representing a length value of the rectangular structure block; along the connecting line, the starting point refers to the point of commong between the block polygon1 and the preceding adjacent block polygon 0. The end point in some embodiments refers to the point of commong between the building block polygon1 and the next adjacent building block polygon 2. In some embodiments, the starting point is a common point between pins connected to a building block and the ending point is a common point between the building block or connected pins. Although not shown in the drawings, it can be understood that the determination manners of the start point and the end point are not limited according to the actual situation of the layout. The W is the distance value between two lengths of the structural block polygon1 and is used for representing the width value of the rectangular structural block; thereby calculating the number of blocks of the single-layer connection structure. In this embodiment, the method for obtaining the number of blocks of the single-layer connection structure is shown in fig. 5 (b), and specifically includes the following steps: s1, obtaining a single-layer connection structure to be calculated in a layout, and then dividing the single-layer connection structure into a plurality of rectangular structure blocks by combining layout information. The single-layer connection structure comprises a plurality of connection lines of linear structures or snake-shaped structures (snake) in the same layer, and the corners of the snake-shaped structure connection lines are all right angles. The plurality of rectangular structural blocks comprise end structural blocks and middle structural blocks; the end part structure blocks are structure blocks at two ends of the connecting wire, one side of each end part structure block is connected with a pin, and the other side of each end part structure block is adjacent to the middle structure block; the middle structural block is a structural block between two end structural blocks of the connecting line, and two sides of the middle structural block are respectively adjacent to the end structural blocks. S2, setting the edge of the structural block along the trend of the connecting line as long and the edge perpendicular to the trend of the connecting line as wide; and obtaining L and W of the structural block. Step S3, calculating the number of blocks (num of square) of each structural block: n=l ⁄ W; and adding the square blocks of all the structural blocks to obtain the square blocks of the single-layer connecting structure.
In this embodiment, the method for calculating the resistance value of the single-layer connection structure includes obtaining the square number of the single-layer connection structure by using the square number obtaining method of the single-layer connection structure as shown in fig. 5 (b); and multiplying the square number by the square resistance to obtain the resistance value of the single-layer connection structure. In this example the square resistance is obtained by looking up a process manual or design manual.
The following method for determining the common point of the structural blocks according to different positions is specifically described in connection with the embodiment:
example III
As shown in fig. 6 (a), in the present embodiment, when there is an overlap region overlap between the end structure block polygon and the pin, the center point of the overlap region is taken as the common point G.
As shown in fig. 6 (b), in the present embodiment, when there is no overlapping area between the end structure block polygon and the pin but there is a common edge M, and the common edge M overlaps with the length X of the end structure block polygon, a quadrangular region S is extended from the common edge M into the end structure block polygon, and two adjacent edges of the quadrangular region S are a width Y of the common edge M and the end structure block polygon, respectively, and a center point of the quadrangular region S is defined as a common point G.
As shown in fig. 6 (c), in the present embodiment, when there is no overlapping area between the end structure block polygon and the pin but there is a common edge M, the center point of the common edge M is set as a common point G.
Regarding the common points between the adjacent middle structural blocks, the adjacent structural blocks are set as the first structural block polygon a and the second structural block polygon B, and the common point determination method between the first structural block polygon a and the second structural block polygon B according to different relative positional relationships is described in the following fourth embodiment.
Example IV
As shown in fig. 7 (a), in the present embodiment, when there is an overlap region overlap between the first and second structure blocks polygon a and polygon B, the center point of the overlap region is taken as the common point G.
As shown in fig. 7 (B), in this embodiment, the first structural block polygon a and the second structural block polygon B have no overlapping area but have a common edge M, the common edge M overlaps with the width YB of the second structural block polygon B, and the common edge M overlaps with the length XA of the first structural block polygon a, then the quadrilateral area S is extended from the common edge into the first structural block polygon a, two adjacent edges of the quadrilateral area S are the common edge M and one width YA of the first structural block polygon a, respectively, and the center point of the quadrilateral area N is taken as the common point G. In another case of the embodiment, as shown in fig. 7 (c), the determination of the common point G is the same, and will not be repeated.
As shown in fig. 7 (d), in the present embodiment, the first structural block polygon a and the second structural block polygon B have no overlapping area but have a common edge M, which coincides with the width YA of the first structural block polygon a and also coincides with the width YB of the second structural block polygon B, and the midpoint of the common edge M is taken as the common point G.
Example five
When a plurality of sequentially adjacent structure blocks with equal widths exist on the connecting line of the linear structure, setting the structure blocks as a whole structure block to calculate L and W; when a plurality of structure blocks with equal width are arranged between two adjacent corners on the connecting line of the snake-shaped structure, the structure blocks are taken as a whole structure block to calculate L and W. As shown in FIG. 7 (e) which shows a snake-shaped structural connection line, a plurality of polygons with equal widths between polygon0 and polygon2, the structural blocks polygon between polygon0 and polygon2 can be regarded as a whole structural block polygon1, and only L and W of the whole structural block are calculated, so that the optimization of the calculation of the number of single-layer connection structural blocks is realized.
It should be noted that the above list is only specific embodiments of the present application. Obviously, the application is not limited to the above embodiments, but many variations are possible. All modifications directly derived or suggested to one skilled in the art from the present disclosure should be considered as being within the scope of the present application.
The above embodiments are preferred examples of the present application, and are not intended to limit the scope of the present application. For purposes of clarity, many implementation details are set forth in the above description. However, it should be understood that the details in these implementations are not to be taken as limiting the application.
The embodiments described in the embodiments may be combined with each other, but it is necessary to base the implementation on the basis of the technical personnel in the field, and when the combination of the technical solutions contradicts or cannot be implemented, it should be considered that the combination of the technical solutions does not exist and is not within the scope of protection claimed by the present application.

Claims (6)

1. The method for calculating the resistance value of the cross-layer chain type connection structure is characterized by comprising the following steps of;
obtaining K jm The method comprises the steps of carrying out a first treatment on the surface of the Calculating the resistance value R of the cross-layer chain connection structure, the acquisition K jm The method of (1) is as follows: identifying the connecting wire layer M i A layer jump structure block in the (a); the layer jump structure block means that at least one side does not have M i Building blocks or M of layers i Pins of the layer are connected with the structural blocks; judging at M i Whether a structure block or a pin with an overlapping area exists in the adjacent connecting line layers of the layers and the layer jump structure block or not, if so, whether a through hole for connecting the two adjacent connecting line layers exists in the overlapping area or not is continuously judged; if so, the number of through holes in the overlapped area, namely K, is obtained jm The method comprises the steps of carrying out a first treatment on the surface of the Wherein j represents that the through hole is positioned in the through hole layer V j Wherein m is the value indicating that the via is located in the via layer V j In the m-th said overlap region;
the R is i For connecting the wire layer M i Resistance value of single-layer connection structure, connection line layer M i The single-layer connection structure of (a) comprises a connection line layer M i A connecting wire in (a); i E [1, E]The R is j Is a through hole layer V j A unit via resistance value in (a); j E [1, F],m∈[1,G]E, F, G is a natural number greater than 1;
obtaining the R i The method specifically comprises the following steps: obtaining the number of single-layer connection structure blocks; then multiplying the square number with square resistance to obtain the resistance value R of the single-layer connection structure i
Obtaining the number of single-layer connection structure blocks comprises the following steps:
s1, obtaining a single-layer connection structure to be calculated in a layout; the single-layer connecting structure comprises a plurality of connecting lines in the same layer, and the corners of the connecting lines are right angles; then dividing the single-layer connection structure into a plurality of rectangular structure blocks according to the layout;
s2, setting the edge of the structural block along the trend of the connecting line as long and the edge perpendicular to the trend of the connecting line as wide; obtaining L and W of the structural block: the L is a distance value between a starting point and an ending point of a structural block and is used for representing a length value of the structural block; along the trend of the connecting line, the starting point refers to a shared point between the structural block and a previous adjacent structural block or a connected pin, and the ending point refers to a shared point between the structural block and a subsequent adjacent structural block or a connected pin; the W is a distance value between two lengths of the structural block and is used for representing a width value of the structural block;
s3, calculating the number of blocks of each structural block: n=l/W; adding the square blocks of all the structural blocks to obtain the square blocks of the single-layer connecting structure;
the method for determining the shared point between the first structural block and the second structural block specifically comprises the following steps of:
when the first structural block and the second structural block have an overlapping area, taking the central point of the overlapping area as a common point;
when the first structural block and the second structural block have no overlapping area but have a shared edge, the shared edge is overlapped with the width of the first structural block, and the shared edge is overlapped with the length of the second structural block, a quadrilateral area is expanded from the shared edge into the second structural block, two adjacent edges of the quadrilateral area are respectively the shared edge and one width of the second structural block, and the central point of the quadrilateral area is taken as a shared point;
when there is no overlapping area between the first and second blocks but there is a common edge, the common edge has a portion overlapping the width of the first block and the common edge also has a portion overlapping the width of the second block, then the midpoint of the common edge is taken as the common point.
2. The method for calculating the resistance value of the cross-layer chain connection structure according to claim 1, wherein in the step S1, the structure blocks obtained by dividing the single-layer connection structure include:
end blocks and middle blocks;
the end part structure blocks are structure blocks at two ends of the connecting line, one side of each end part structure block is connected with the corresponding pin, and the other side of each end part structure block is adjacent to the middle structure block;
the middle structural block is a structural block between two end structural blocks of the connecting line, and two sides of the middle structural block are respectively adjacent to the end structural blocks.
3. The method for calculating the resistance value of the cross-layer chain connection structure according to claim 2, wherein in the step S2, the method for determining the common point between the end structure block and the connected pin is as follows:
when an overlapping area exists between the end part structure block and the pin, taking the central point of the overlapping area as a common point;
when the end structural block and the pin do not have an overlapping area but have a shared edge, and the shared edge is overlapped with the length of the end structural block, a quadrilateral area is expanded from the shared edge into the end structural block, two adjacent edges of the quadrilateral area are respectively the shared edge and one width of the end structural block, and the center point of the quadrilateral area is taken as a shared point;
when there is no overlapping area between the end structural block and the pin but there is a common edge, the common edge coincides with the width of the end structural block, and the midpoint of the common edge is taken as a common point.
4. The method for calculating the resistance value of a cross-layer chain connection structure according to claim 1, wherein in the single-layer connection structure, the connection line is a linear structure or a snake-shaped structure;
when the connecting line is of a linear structure, in the step S2, a plurality of sequentially adjacent structure blocks with equal widths on the connecting line are regarded as one structure block to calculate L and W;
when the connecting line is in a snake-shaped structure, in the step S2, a plurality of sequentially adjacent structural blocks with equal width between two adjacent corners on the connecting line are regarded as a whole structural block to calculate L and W.
5. The method of calculating the resistance value of a cross-layer chain connection structure according to claim 1, wherein the single-layer connection structure is a metal single-layer structure.
6. A method for calculating the number of through holes of a cross-layer chain connection structure, wherein the calculated number of through holes is used for realizing the method for calculating the resistance value of the cross-layer chain connection structure according to any one of claims 1 to 5; it is characterized by comprising the following steps of,
step one: acquiring a cross-layer chain type connection structure to be calculated in a layout, wherein the cross-layer chain type connection structure comprises a plurality of connecting wires and a plurality of through holes, and the connecting wires are positioned in a connecting wire layer M i In which the via is at via layer V j The through holes are used for connecting wires or pins in two adjacent connecting wire layers; wherein i is E [1, E],j∈[1,F]E, F is a natural number greater than 1; dividing the connecting line into a plurality of sequentially connected structural blocks;
step two: obtaining the K jm The method comprises the steps of carrying out a first treatment on the surface of the The K is jm Characterizing the number of building blocks or pins used to connect the layer-jump building blocks in Mi and its neighboring connection line layers Mi-1 or mi+1;
step three: calculating the total number of through holes:the G is a through hole layer V j For connecting the overlapping areas of two adjacent layers.
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Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5521576A (en) * 1993-10-06 1996-05-28 Collins; Franklyn M. Fine-line thick film resistors and resistor networks and method of making same
CN101673728A (en) * 2009-08-21 2010-03-17 上海宏力半导体制造有限公司 Model and method for measuring resistance of contact holes or through holes in bipolar transistor components
CN101788642A (en) * 2009-01-23 2010-07-28 中芯国际集成电路制造(上海)有限公司 Integrated circuit testing device for measuring resistance of metal through hole and manufacture method thereof
JP2011232933A (en) * 2010-04-27 2011-11-17 Elpida Memory Inc Wiring resistance calculation device for semiconductor device
CN102819626A (en) * 2011-11-23 2012-12-12 北京工业大学 Method for locating intermediate region of through-silicon via (TSV) in three-dimensional (3D) integrated circuit automatic layout
CN103137606A (en) * 2011-12-05 2013-06-05 上海北京大学微电子研究院 Resistance test structure and method
CN103150430A (en) * 2013-03-01 2013-06-12 杭州广立微电子有限公司 Generating method for test chip layout
CN104282661A (en) * 2013-07-08 2015-01-14 中芯国际集成电路制造(上海)有限公司 Testing structure for analyzing reliability of integrated circuit and testing method thereof
CN104465446A (en) * 2014-12-30 2015-03-25 上海集成电路研发中心有限公司 Manufacturing method of electric testing structure for detecting through holes
CN104716114A (en) * 2013-12-13 2015-06-17 株式会社东芝 Semiconductor device
CN108830003A (en) * 2018-06-26 2018-11-16 上海华力微电子有限公司 The inspection method of integrated circuit diagram
CN109116112A (en) * 2017-06-26 2019-01-01 上海卓弘微系统科技有限公司 A kind of conducting resistance test structure and method
CN109346130A (en) * 2018-10-24 2019-02-15 中国科学院水生生物研究所 A method of directly micro- haplotype and its parting are obtained from full-length genome weight sequencing data
CN110147564A (en) * 2018-02-13 2019-08-20 台湾积体电路制造股份有限公司 Integrated circuit layout, device, system and its generation method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006019690A (en) * 2004-06-02 2006-01-19 Matsushita Electric Ind Co Ltd Pattern analysis method, pattern analysis apparatus, yield calculation method and yield calculation apparatus

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5521576A (en) * 1993-10-06 1996-05-28 Collins; Franklyn M. Fine-line thick film resistors and resistor networks and method of making same
CN101788642A (en) * 2009-01-23 2010-07-28 中芯国际集成电路制造(上海)有限公司 Integrated circuit testing device for measuring resistance of metal through hole and manufacture method thereof
CN101673728A (en) * 2009-08-21 2010-03-17 上海宏力半导体制造有限公司 Model and method for measuring resistance of contact holes or through holes in bipolar transistor components
JP2011232933A (en) * 2010-04-27 2011-11-17 Elpida Memory Inc Wiring resistance calculation device for semiconductor device
CN102819626A (en) * 2011-11-23 2012-12-12 北京工业大学 Method for locating intermediate region of through-silicon via (TSV) in three-dimensional (3D) integrated circuit automatic layout
CN103137606A (en) * 2011-12-05 2013-06-05 上海北京大学微电子研究院 Resistance test structure and method
CN103150430A (en) * 2013-03-01 2013-06-12 杭州广立微电子有限公司 Generating method for test chip layout
CN104282661A (en) * 2013-07-08 2015-01-14 中芯国际集成电路制造(上海)有限公司 Testing structure for analyzing reliability of integrated circuit and testing method thereof
CN104716114A (en) * 2013-12-13 2015-06-17 株式会社东芝 Semiconductor device
CN104465446A (en) * 2014-12-30 2015-03-25 上海集成电路研发中心有限公司 Manufacturing method of electric testing structure for detecting through holes
CN109116112A (en) * 2017-06-26 2019-01-01 上海卓弘微系统科技有限公司 A kind of conducting resistance test structure and method
CN110147564A (en) * 2018-02-13 2019-08-20 台湾积体电路制造股份有限公司 Integrated circuit layout, device, system and its generation method
CN108830003A (en) * 2018-06-26 2018-11-16 上海华力微电子有限公司 The inspection method of integrated circuit diagram
CN109346130A (en) * 2018-10-24 2019-02-15 中国科学院水生生物研究所 A method of directly micro- haplotype and its parting are obtained from full-length genome weight sequencing data

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