CN112590035A - Silicon rod gluing method and silicon rod gluing structure - Google Patents
Silicon rod gluing method and silicon rod gluing structure Download PDFInfo
- Publication number
- CN112590035A CN112590035A CN202011408666.2A CN202011408666A CN112590035A CN 112590035 A CN112590035 A CN 112590035A CN 202011408666 A CN202011408666 A CN 202011408666A CN 112590035 A CN112590035 A CN 112590035A
- Authority
- CN
- China
- Prior art keywords
- plate
- silicon rod
- gluing
- adhesive
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Abstract
The invention relates to a silicon rod gluing method and a silicon rod gluing structure, wherein the silicon rod gluing method comprises the following steps: coating a bottom adhesive between the first surface of the adhesive plate and the crystal support; placing a pressing plate on the second surface of the adhesive plate, wherein the flatness of the pressing plate is less than or equal to 0.1mm, and uniformly pressing the pressing plate in the process of curing the adhesive base glue; and bonding the silicon rod on the second surface of the adhesive plate. According to the silicon rod gluing device, the pressing plate is placed on the gluing plate, pressure is uniformly dispersed on the gluing plate through the pressing plate when pressure is applied, the gluing plate is uniformly stressed, the flatness of the glued gluing plate is good, a gap between the silicon rod and the gluing plate is small, the thickness of a glue layer after the silicon rod is glued is uniform, abnormal conditions such as empty glue or poor gluing surface are avoided, and the quality of gluing the silicon rod is improved.
Description
Technical Field
The invention relates to the technical field of monocrystalline silicon slice slicing, in particular to a silicon rod gluing method and a silicon rod gluing structure.
Background
With the continuous development of economy and the continuous increase of the demand of modern construction on high-efficiency energy, photovoltaic power generation is increasingly valued by various countries in the world and is vigorously developed as one of green energy and main energy for the sustainable development of human beings. Among them, the monocrystalline silicon wafer has a wide market demand as a base material for photovoltaic power generation.
The monocrystalline silicon slice slicing process is an important process in the production process of the solar photovoltaic silicon slice substrate, a material sticking plate is firstly stuck on a crystal support by using a sticky bottom glue before the monocrystalline silicon slice slicing process is carried out, a silicon rod is stuck on the material sticking plate by using a stick glue after the silicon rod is completely solidified, and then a sticking assembly formed by the silicon rod, the material sticking plate and the crystal support is fixed in a multi-wire cutting machine for wire cutting processing after the glue of the stick glue is solidified.
At present, when a monocrystalline silicon wafer is sliced, a heavy object is pressed on a material sticking plate after primer glue is smeared in a gluing working section, the material sticking plate is stressed unevenly, so that the thickness of a primer glue layer of the primer glue is uneven, and the flatness of the material sticking plate is uneven. Before the sticking rod glue is not smeared, the silicon rod is placed on the sticking plate, and a larger gap is formed between the tail end of the silicon rod head and the sticking plate. When the field personnel daub the operation, the careless glue layer of head tail end is smeared thickly and is avoided the glue overflow can not come out the empty gluey problem that leads to. Therefore, the adhesive plate is stressed unevenly, which easily causes the abnormalities of inconsistent adhesive layer thickness, empty adhesive, poor adhesive surface and the like.
Disclosure of Invention
In view of the above, the present invention provides a silicon rod gluing method and a silicon rod gluing structure, and aims to solve the problems of inconsistent thickness of a glue layer, empty glue, poor gluing surface, and the like caused by uneven stress during gluing of a gluing plate in the prior art.
According to a first aspect of the present invention, there is provided a silicon rod sticking method, comprising the steps of:
coating a bottom adhesive between the first surface of the adhesive plate and the crystal support;
placing a pressing plate on the second surface of the adhesive plate, wherein the flatness of the pressing plate is less than or equal to 0.1mm, and uniformly pressing the pressing plate in the process of curing the adhesive base glue;
and bonding the silicon rod on the second surface of the adhesive plate.
Preferably, in the second step, the pressing plate is one of a tempered glass plate, a marble plate and a ceramic plate.
Preferably, the size of the pressing plate is larger than or equal to that of the sizing plate.
Preferably, each edge of the pressure plate is subjected to corner rounding treatment.
Preferably, the pressing plate is uniformly pressed by a weight.
Preferably, the weight is one of a heavy hammer, a steel plate and a counterweight block, and a buffer protection layer is arranged on the outer surface of the weight.
Preferably, the pressure for uniformly pressing the pressing plate is 245N to 294N.
Preferably, the curing time of the primer glue is 25-40 min.
According to a second aspect of the present invention, there is provided a silicon rod sticking structure manufactured by the silicon rod sticking method, the silicon rod sticking structure comprising a crystal support, a sticking plate and a silicon rod, wherein a first surface of the sticking plate is stuck on the crystal support, a second surface of the sticking plate is stuck on the silicon rod, and the flatness of the sticking plate is less than or equal to 0.1 mm.
Preferably, the adhesive sheet is a resin sheet.
The silicon rod gluing method and the silicon rod gluing structure provided by the invention at least have the following beneficial effects:
according to the silicon rod gluing method provided by the invention, in the process of gluing the material sticking plate and the crystal support, the pressing plate is placed on the material sticking plate, the pressing plate is pressed in the process of solidifying the bottom glue, the pressure is uniformly dispersed on the material sticking plate through the pressing plate, the material sticking plate is uniformly stressed, the flatness of the glued material sticking plate is better, the gap between the silicon rod and the material sticking plate is smaller, the thickness of the glue layer is uniform after the silicon rod is glued, the abnormal conditions such as empty glue or poor glue surface are avoided, and the silicon rod gluing quality is improved.
According to the silicon rod adhesive structure provided by the invention, the flatness of the adhesive plate is good, and the defects of empty adhesive and uneven thickness of the adhesive layer do not exist in the silicon rod adhesive layer, so that the cutting line is uniformly stressed and is not impacted when the silicon rod is cut, and the silicon wafer is prevented from collapsing and hidden cracking; the material sticking plate is a resin plate, so that the abrasion to the cutting line can be effectively reduced, and the service life of the cutting line is prolonged.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 shows a schematic diagram of bonding a material bonding plate and a crystal support in a silicon rod gluing method according to an embodiment of the invention.
In the figure: 1-crystal support, 2-material sticking plate, 3-toughened glass plate and 4-weight.
Detailed Description
Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by the same or similar reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale.
The invention provides a silicon rod gluing method, which comprises the following steps:
step one, coating a bottom adhesive between the first surface of the adhesive plate and the crystal support.
In this step, the surface of the wafer support and the first surface of the pasting plate are first wiped clean, so as to prevent impurities on the surface of the wafer support or the first surface of the pasting plate from affecting the pasting quality. Coating the bottom adhesive on the first surface of the material sticking plate or the crystal support, uniformly coating the bottom adhesive, and then placing the material sticking plate on the crystal support, wherein the first surface of the material sticking plate faces the direction of the crystal support. In this embodiment, the bottom-gluing glue adopts two-component AB glue, and the bottom-gluing glue is uniformly coated on the first surface of the material-gluing plate, and the material-gluing plate is placed in the middle on the crystal support.
And step two, placing a pressing plate on the second surface of the adhesive plate, wherein the flatness of the pressing plate is less than or equal to 0.1 mm.
In the step, the pressing plate is required to have enough rigidity without deformation and the flatness is less than or equal to 0.1mm, and meanwhile, the convenience of operation and the service life of the material are considered.
One of them in toughened glass board, marble slab, the ceramic plate can be chooseed for use to the clamp plate, and the size of clamp plate size more than or equal to sizing plate to guarantee that the clamp plate can push down the sizing plate completely, each edge fillet of clamp plate is handled simultaneously, prevents that sharp edge from causing the damage to operating personnel and sizing plate in the operation process.
In this embodiment, the clamp plate adopts the toughened glass board, and the toughened glass board roughness is good, has better mechanical strength and shock resistance, and rigidity and hardness are better, and bearing capacity is high to when toughened glass received external force because of the unexpected condition and destroys, the piece can become similar cellular obtuse angle garrulous tiny particle, can not lead to the fact the injury to operating personnel and clay board etc. has better security during the use.
And step three, uniformly pressing the pressing plate in the process of curing the bottom adhesive.
In this step, evenly exert pressure to the clamp plate, pressure passes through the clamp plate homodisperse on the bonding plate, makes the bonding plate atress even, simultaneously because the roughness of clamp plate is better, can and then make the bonding plate closely laminate with the clamp plate under the effect of even pressure, keeps the roughness equally better with the clamp plate.
The pressing plate is uniformly pressed, a weight can be placed on the pressing plate to uniformly press, and automatic pressing equipment can also be used to uniformly press. The adoption is placed the heavy object on the clamp plate and is exerted pressure, and personnel's convenient operation is high-efficient and the cost is lower, for preferred mode of exerting pressure, the heavy object can be one of weight, steel sheet, balancing weight.
The pressure for uniformly pressing the pressure plate is 245N to 294N. The adhesive plate with too small pressure is less stressed and cannot be tightly attached to the pressing plate, and the flatness of the adhesive plate after being adhered cannot meet the requirement; too big pressure can cause the glue film thickness between flitch and the brilliant support less, influences the bonding strength of flitch, and too big pressure also can cause the clamp plate to warp or damage, can not be with pressure homodisperse to on the flitch. When the pressure for uniformly pressing the pressing plate is 245N-294N, the bonding plate can keep better flatness and higher bonding quality after bonding. As shown in fig. 1, in this embodiment, when the die pad 2 is bonded to the die pad 1, after the first surface of the die pad 2 is coated with the primer, the die pad 2 is placed on the die pad 1 in the middle, the rectangular tempered glass plate 3 with a size slightly larger than that of the die pad 2 is pressed on the die pad 2, then the tempered glass plate 3 is uniformly pressed by the weight 4, the weight 4 is a rectangular steel plate with a weight of about 60 pounds, and after the tempered glass plate 3 is pressed by the weight 4, the pressure is uniformly dispersed on the die pad 2, so that the die pad 2 maintains a good flatness, and the problems of inconsistent thickness of the adhesive layer, empty adhesive and the like are prevented.
And (3) the setting time of the bottom adhesive is 25-40 min, after the bottom adhesive is cured, the pressure is stopped, the pressing plate is taken down, the flatness of the adhesive plate is detected through the knife edge flat ruler, and the adhesive of the adhesive plate is qualified when the measured flatness of the adhesive plate is less than or equal to 0.1 mm.
And step four, bonding the silicon rod on the second surface of the adhesive plate.
In the step, before the silicon rod is glued, the silicon rod is placed on the second surface of the gluing plate, the gap between the silicon rod and the gluing plate is detected through the feeler gauge, and the requirement of gluing the rod is met when the gap between the silicon rod and the gluing plate is smaller than or equal to 0.1 mm.
Before the silicon rod is bonded with the sticky material plate, the second surface of the bonding plate and the to-be-bonded surface of the silicon rod are wiped clean, impurities on the surface of the bonded surface are removed, and the quality of the bonded surface is prevented from being influenced. And coating the sticky bar glue on the second surface of the sticky plate or the surface to be glued of the silicon rod, uniformly coating the sticky bar glue, and then placing the silicon rod on the second surface of the sticky plate, wherein the gluing surface of the silicon rod faces the second surface of the sticky plate. And meanwhile, in the process of solidifying the rod adhesive, uniformly applying pressure to the silicon rod. In this embodiment, the rod adhesive is a two-component AB adhesive, and the rod adhesive is uniformly coated on the surface to be adhered of the silicon rod.
And (3) uniformly pressing the silicon rod by placing a heavy object on the silicon rod, wherein the heavy object can be one of a heavy hammer, a steel plate and a balancing weight. In this embodiment, the weight is a steel plate, and the steel plate is pressed on the silicon rod. The flatness of the bonded material sticking plates is good, the gap between the silicon rod and the material sticking plates is less than or equal to 0.1mm, after a weight is pressed on the silicon rod, glue at the head end and the tail end of the silicon rod can be observed to overflow in 4-6 seconds, and meanwhile, the glue overflow amount is increased compared with the previous glue overflow amount, so that the glue quality of the silicon rod can be obviously improved. After the head end and the tail end of the silicon rod overflow glue, the overflowing glue is scraped by using tools such as a soft scraper, the uniform action of the application force is slow when the overflowing glue at the head end and the tail end of the silicon rod is scraped, and the surface of the silicon rod is prevented from being scraped. And (5) curing the viscose for 80-100 min, taking down the weight after the viscose is cured, and gluing the silicon rod.
In the above embodiments, the weight is provided with the buffer protection layer, the buffer protection layer is disposed on the outer surface of the weight, and the buffer protection layer is preferably a rubber layer, and the rubber layer is bonded to the outer surface of the weight through an adhesive. Through set up the buffering inoxidizing coating on the heavy object, when the heavy object was pressed on clamp plate and silicon rod, can avoid the rigid contact between heavy object and the clamp plate and between heavy object and the silicon rod, prevent that clamp plate and silicon rod from receiving the damage.
According to the silicon rod gluing method provided by the invention, in the process of gluing the material sticking plate and the crystal support, the pressing plate is placed on the material sticking plate, the pressing plate is pressed in the process of solidifying the bottom glue, the pressure is uniformly dispersed on the material sticking plate through the pressing plate, the material sticking plate is uniformly stressed, the flatness of the glued material sticking plate is better, the gap between the silicon rod and the material sticking plate is smaller, the thickness of the glue layer is uniform after the silicon rod is glued, the abnormal conditions such as empty glue or poor glue surface are avoided, and the silicon rod gluing quality is improved.
The invention also provides a silicon rod viscose structure manufactured by the method, which comprises a crystal support, a viscose plate and a silicon rod, wherein the first surface of the viscose plate is stuck on the crystal support, the second surface of the viscose plate is stuck on the silicon rod, and the flatness of the viscose plate is less than or equal to 0.1 mm.
Further, the adhesive plate is a resin plate.
According to the silicon rod adhesive structure provided by the invention, the flatness of the adhesive plate is good, and the defects of empty adhesive and uneven thickness of the adhesive layer do not exist in the silicon rod adhesive layer, so that the cutting line is uniformly stressed and is not impacted when the silicon rod is cut, and the silicon wafer is prevented from collapsing and hidden cracking. The adhesive plate is a resin plate, so that the abrasion to the cutting line can be effectively reduced, and the service life of the cutting line is prolonged.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Finally, it should be noted that: it should be understood that the above examples are only for clearly illustrating the present invention and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the scope of the invention.
Claims (10)
1. A silicon rod gluing method is characterized by comprising the following steps:
coating a bottom adhesive between the first surface of the adhesive plate and the crystal support;
placing a pressing plate on the second surface of the adhesive plate, wherein the flatness of the pressing plate is less than or equal to 0.1mm, and uniformly pressing the pressing plate in the process of curing the adhesive base glue;
and bonding the silicon rod on the second surface of the adhesive plate.
2. The silicon rod gluing method according to claim 1, wherein the pressing plate is one of a tempered glass plate, a marble plate and a ceramic plate.
3. The silicon rod sticking method as set forth in claim 1 or 2, wherein the size of the pressing plate is equal to or larger than the size of the sizing plate.
4. The silicon rod sticking method as set forth in claim 1 or 2, wherein each edge of the pressure plate is rounded.
5. The silicon rod sticking method according to claim 1, wherein the weight is placed on the pressing plate to be uniformly pressed.
6. The silicon rod sticking method as claimed in claim 5, wherein the weight is one of a weight, a steel plate and a weight block, and the outer surface of the weight is provided with a buffer protection layer.
7. The silicon rod sticking method as recited in claim 5, wherein the pressure for uniformly pressing the pressing plate is 245N to 294N.
8. The silicon rod gluing method according to claim 1, wherein the primer glue curing time is 25-40 min.
9. The silicon rod viscose structure is characterized by comprising a crystal support, a viscose plate and a silicon rod, wherein a first surface of the viscose plate is bonded on the crystal support, a second surface of the viscose plate is bonded on the silicon rod, and the flatness of the viscose plate is less than or equal to 0.1 mm.
10. The silicon rod viscose structure according to claim 9, wherein the viscose plate is a resin plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011408666.2A CN112590035A (en) | 2020-12-04 | 2020-12-04 | Silicon rod gluing method and silicon rod gluing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011408666.2A CN112590035A (en) | 2020-12-04 | 2020-12-04 | Silicon rod gluing method and silicon rod gluing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112590035A true CN112590035A (en) | 2021-04-02 |
Family
ID=75188270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011408666.2A Pending CN112590035A (en) | 2020-12-04 | 2020-12-04 | Silicon rod gluing method and silicon rod gluing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112590035A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116551863A (en) * | 2023-06-27 | 2023-08-08 | 江苏双晶新能源科技有限公司 | Rescue method for separating plate from crystal support and removing bar after cutting in crystal silicon slicing industry |
| CN116834162A (en) * | 2023-06-30 | 2023-10-03 | 安徽舟港新能源科技有限公司 | Photovoltaic silicon chip section preprocessing device |
| CN116852563A (en) * | 2023-07-31 | 2023-10-10 | 安徽华晟新材料有限公司 | Crystal bar processing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104290204A (en) * | 2014-09-11 | 2015-01-21 | 湖南红太阳光电科技有限公司 | Silicon rod gluing method in slice gluing process |
| CN104760145A (en) * | 2015-04-22 | 2015-07-08 | 江西赛维Ldk太阳能高科技有限公司 | Adhesion method for crystal bar |
| CN204546805U (en) * | 2015-04-08 | 2015-08-12 | 童立峰 | A kind of multi-wire saw cutting crystal bar bonding glue spreading apparatus |
| CN208681837U (en) * | 2018-04-13 | 2019-04-02 | 内蒙古中环光伏材料有限公司 | A kind of craft rod sticky device |
-
2020
- 2020-12-04 CN CN202011408666.2A patent/CN112590035A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104290204A (en) * | 2014-09-11 | 2015-01-21 | 湖南红太阳光电科技有限公司 | Silicon rod gluing method in slice gluing process |
| CN204546805U (en) * | 2015-04-08 | 2015-08-12 | 童立峰 | A kind of multi-wire saw cutting crystal bar bonding glue spreading apparatus |
| CN104760145A (en) * | 2015-04-22 | 2015-07-08 | 江西赛维Ldk太阳能高科技有限公司 | Adhesion method for crystal bar |
| CN208681837U (en) * | 2018-04-13 | 2019-04-02 | 内蒙古中环光伏材料有限公司 | A kind of craft rod sticky device |
Non-Patent Citations (1)
| Title |
|---|
| 张宏哲: "《木工粘接技术》", 31 December 1985, 中国建筑工业出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116551863A (en) * | 2023-06-27 | 2023-08-08 | 江苏双晶新能源科技有限公司 | Rescue method for separating plate from crystal support and removing bar after cutting in crystal silicon slicing industry |
| CN116834162A (en) * | 2023-06-30 | 2023-10-03 | 安徽舟港新能源科技有限公司 | Photovoltaic silicon chip section preprocessing device |
| CN116834162B (en) * | 2023-06-30 | 2024-02-09 | 广东招阳新能源有限公司 | Photovoltaic silicon chip section preprocessing device |
| CN116852563A (en) * | 2023-07-31 | 2023-10-10 | 安徽华晟新材料有限公司 | Crystal bar processing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112590035A (en) | Silicon rod gluing method and silicon rod gluing structure | |
| US6007407A (en) | Abrasive construction for semiconductor wafer modification | |
| JPS5833699B2 (en) | Polishing equipment for semiconductor wafers | |
| JP2008254123A (en) | Manufacturing method of polishing pad, polishing pad, and polishing method of wafer | |
| KR20110107181A (en) | Thin plate glass processing method | |
| CN103307070A (en) | Pressing device and pressing method | |
| CN106182152B (en) | The dividing method and segmenting device of composite substrate | |
| KR20100127427A (en) | Abrasive sheet | |
| KR20090112824A (en) | Adhesion type thin plate glass processing method | |
| WO2010119606A1 (en) | Method of preparing polishing head and polishng apparatus | |
| JP2000007390A (en) | Intermediate film for safety glass | |
| JP5222070B2 (en) | Polishing pad | |
| CN113444466B (en) | Reworking double-sided foam adhesive tape, reworking method and preparation method | |
| CN107073676B (en) | Polishing pad | |
| CN109630521B (en) | Resistor strain gauge pasting device | |
| JP2002219686A (en) | Film cutter, and method for preventing sticking therein | |
| CN113064230A (en) | Roll-to-roll automatic film-attached light guide plate stack polishing and milling mechanism | |
| JP2017064820A (en) | Polishing pad | |
| JP2018085481A (en) | Method for regeneration of rubber elastic member | |
| CN210575833U (en) | Anti-adhesive sectional type chip press-fit mold | |
| CN211940512U (en) | Abrasive belt | |
| CN113910743B (en) | Organic silicon OCA full-lamination method | |
| CN117621277A (en) | Crystal bar bonding method and crystal bar assembly | |
| KR20230092625A (en) | Double-sided adhesive tape for adhesion of a polishing pad that can easily release bubbles and chemical mechanical polishing device to which the adhesive tape is applied | |
| US20230168283A1 (en) | Probe cleaning sheet for preventing a probe pin damage and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210907 Address after: 655000 floor 3, No. 83, Cuifeng Road, liaokuo street, Qilin District, Qujing City, Yunnan Province Applicant after: Qujing Longji silicon material Co.,Ltd. Address before: No.102, Ximei Road, Xinwu District, Wuxi City, Jiangsu Province Applicant before: WUXI LONGI SILICON MATERIALS Corp. |
|
| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210402 |
|
| RJ01 | Rejection of invention patent application after publication |