CN112582455B - Pixel definition layer opening design method, display panel manufacturing method and display panel - Google Patents
Pixel definition layer opening design method, display panel manufacturing method and display panel Download PDFInfo
- Publication number
- CN112582455B CN112582455B CN202011448720.6A CN202011448720A CN112582455B CN 112582455 B CN112582455 B CN 112582455B CN 202011448720 A CN202011448720 A CN 202011448720A CN 112582455 B CN112582455 B CN 112582455B
- Authority
- CN
- China
- Prior art keywords
- opening
- size
- pixel definition
- definition layer
- preset
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the application provides a pixel definition layer opening design method, a display panel manufacturing method and a display panel, wherein the pixel definition layer opening design method comprises the steps of determining the opening size of a metal mask plate based on the preset opening size of a pixel definition layer, further determining the opening allowance of the pixel definition layer, determining the target opening size of the pixel definition layer according to the opening allowance of the pixel definition layer, and further determining the opening design scheme of the pixel definition layer; according to the method, the target opening size of the pixel definition layer is increased or reduced in an unequal proportion according to the opening allowance of the pixel definition layer, so that the opening size and the opening gap of the pixel definition layer can well balance the service life requirement of the light emitting layer and the manufacturing yield requirement of the light emitting layer, the manufacturing yield of the light emitting layer is promoted to be improved, and the service life of the light emitting layer is well maintained.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a method for designing an opening of a pixel definition layer, a method for manufacturing a display panel, and a display panel.
Background
The size of the gap of the pixel definition layer of the organic light emitting diode display panel is an important index for measuring the manufacturing process capability of the light emitting layer and is also a main parameter influencing the service life of the product. On one hand, considering the life factor of the display panel, the opening of the pixel definition layer needs to be large, and the opening gap needs to be small; on the other hand, the factors of the manufacturing process capability and the manufacturing yield of the light emitting layer limit that the opening gap cannot be too small. Therefore, a balance between these two factors is required. The process of manufacturing the light-emitting layer by the evaporation method needs to use a metal mask plate, wherein the metal mask plate has a stretching direction and a non-stretching direction, and the stretching direction is the opening direction of the metal mask plate. The sizes of the existing bright-bead type pixel openings in the stretching direction and the non-stretching direction are equal; the reduction of the scale of the bright bead type pixel openings in the two directions leads to a significant reduction in the lifetime of the light emitting layer, while the increase in the scale leads to a significant reduction in the yield of the light emitting layer, making it difficult to achieve a good balance.
Therefore, the existing design for the opening size and the opening gap of the pixel definition layer is difficult to realize good balance between the service life of the light emitting layer and the manufacturing yield of the light emitting layer.
Disclosure of Invention
The application provides a pixel definition layer opening design method, a display panel manufacturing method and a display panel, which are used for solving the problem that the balance between the service life of a light emitting layer and the manufacturing yield of the light emitting layer is difficult to realize in the conventional design of the opening size and the opening gap of a pixel definition layer.
The application provides a design method for opening a pixel definition layer, which comprises the following steps:
determining the opening size of the metal mask plate based on the preset opening size of the pixel definition layer;
determining a first preset opening allowance of the pixel definition layer along a first direction and a second preset opening allowance of the pixel definition layer along a second direction based on the opening size of the metal mask plate;
and determining the target opening size of the pixel definition layer based on the first preset opening allowance, the second preset opening allowance and the preset opening size of the pixel definition layer.
According to an embodiment of the present application, the preset opening size of the pixel definition layer includes a first preset size along the first direction and a second preset size along the second direction, and the step of determining the opening size of the metal mask plate based on the preset opening size of the pixel definition layer includes:
enlarging the first preset size according to a first proportion to obtain a first opening size of the metal mask plate;
enlarging the second preset size according to a second proportion to obtain a second opening size of the metal mask plate;
and determining the opening size of the metal mask plate based on the first opening size and the second opening size.
According to an embodiment of the application, the step of determining, based on the size of the opening of the metal mask plate, a first preset opening margin of the pixel definition layer along a first direction and a second preset opening margin along a second direction includes:
determining the opening parameters of the metal mask plate based on the opening size of the metal mask plate;
determining a first projection deviation of the projection of the metal mask plate on the pixel definition layer along the first direction and a second projection deviation of the projection of the metal mask plate along the second direction based on the opening parameters of the metal mask plate;
determining the first preset tapping allowance based on the first projection deviation;
determining the second preset tapping margin based on the second projection deviation.
According to an embodiment of the present application, the step of determining the target opening size of the pixel definition layer based on the first predetermined opening margin, the second predetermined opening margin and the predetermined opening size of the pixel definition layer includes:
determining the opening gap difference of the pixel definition layer based on the first preset opening allowance and the second preset opening allowance;
and determining the target opening size of the pixel definition layer based on the opening gap difference of the pixel definition layer and the preset opening size of the pixel definition layer.
According to an embodiment of the present application, the step of determining the opening gap difference of the pixel definition layer based on the first predetermined opening margin and the second predetermined opening margin includes:
and subtracting the second preset opening allowance from the first preset opening allowance to obtain an opening gap difference of the pixel definition layer.
According to an embodiment of the present application, the predetermined opening size of the pixel definition layer includes a first predetermined size along the first direction and a second predetermined size along the second direction, and the target opening size of the pixel definition layer includes a first target size along the first direction and a second target size along the second direction; the step of determining a target opening size of the pixel definition layer based on the opening gap difference of the pixel definition layer and a preset opening size of the pixel definition layer includes:
determining a target aperture offset based on the aperture gap difference of the pixel definition layer;
subtracting the first preset size from the target opening offset to obtain the first target size;
summing the second preset size and the target opening offset to obtain a second target size;
determining a target aperture size of the pixel definition layer based on the first target size and the second target size.
According to an embodiment of the present application, the step of determining a target opening offset based on the opening gap difference of the pixel definition layer includes:
and taking one half of the opening gap difference of the pixel definition layer to obtain the target opening offset.
The present application also provides a method for manufacturing a display panel, which includes:
forming a pixel base layer on the array substrate;
designing a target opening size of a pixel opening on the pixel substrate layer by adopting the pixel definition layer opening design method;
forming a pixel opening on the pixel base layer based on the target opening size.
According to an embodiment of the present application, after the step of forming a pixel opening on the pixel base layer based on the target opening size, the method further includes:
forming a light emitting layer in the pixel opening;
an encapsulation layer is formed on the pixel base layer and the light emitting layer.
The application also provides a display panel which is manufactured by the manufacturing method of the display panel.
The beneficial effect of this application is: the method for designing the open pore of the pixel definition layer comprises the steps of determining the open pore size of a metal mask plate based on the preset open pore size of the pixel definition layer, further determining the open pore allowance of the pixel definition layer, determining the target open pore size of the pixel definition layer according to the open pore allowance of the pixel definition layer, and further determining the open pore design scheme of the pixel definition layer; the pixel definition layer opening design method increases and reduces the target opening size of the pixel definition layer in an unequal proportion according to the opening allowance, so that the opening size and the opening gap of the pixel definition layer can well balance the service life requirement of the light emitting layer and the manufacturing yield requirement of the light emitting layer, the manufacturing yield of the light emitting layer is promoted to be improved, and the service life of the light emitting layer is well maintained.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a flowchart of a method for designing an opening of a pixel definition layer according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a predetermined opening structure of a pixel definition layer according to an embodiment of the present disclosure;
fig. 3 is a schematic diagram of structures of a preset opening of a pixel defining layer and an opening of a metal mask provided in an embodiment of the present application;
FIG. 4 is a schematic diagram of an embodiment of a target opening of a pixel definition layer formed by a predetermined opening of the pixel definition layer;
FIG. 5 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a display panel according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a pixel definition layer opening design method, which comprises the steps of determining the opening size of a metal mask plate based on the preset opening size of a pixel definition layer, further determining the opening allowance of the pixel definition layer, determining the target opening size of the pixel definition layer according to the opening allowance of the pixel definition layer, and further determining an opening design scheme of the pixel definition layer; the pixel definition layer opening design method increases and reduces the target opening size of the pixel definition layer in an unequal proportion according to the opening allowance, so that the opening size and the opening gap of the pixel definition layer can well balance the service life requirement of the light emitting layer and the manufacturing yield requirement of the light emitting layer, the manufacturing yield of the light emitting layer is promoted to be improved, and the service life of the light emitting layer is well maintained.
Referring to fig. 1, fig. 1 is a flowchart illustrating a method for designing an opening of a pixel definition layer according to an embodiment of the present disclosure. The pixel definition layer opening design method is applied to designing the opening size of the pixel definition layer before opening operation is carried out on the pixel definition layer. It should be understood that the openings of the pixel defining layer are for receiving the light emitting layer material to form a plurality of pixel cells; the light-emitting layer material emits light in the pixel defining layer opening, thereby realizing the display function of the display panel. The pixel definition layer opening design method comprises the following steps:
step S101, determining the size of the opening of the metal mask plate based on the preset opening size of the pixel definition layer.
The preset opening size of the pixel definition layer is a preset opening design scheme of the pixel definition layer based on the service life requirement of a customer on the light emitting layer and the requirement of a light emitting layer manufacturing process, and comprises the preset opening size of the pixel definition layer and the preset opening gap size. Specifically, the step of determining the preset opening size of the pixel definition layer comprises: determining a minimum aperture size of the pixel defining layer based on customer requirements for a lifetime of the light emitting layer; determining the minimum opening gap size of the pixel definition layer based on the manufacturing process of the light emitting layer; determining a preset opening size of the pixel definition layer based on the minimum opening size of the pixel definition layer and the minimum opening gap size of the pixel definition layer.
It should be noted that, the larger the opening size of the pixel definition layer is, the more the light emitting layer materials are arranged in the opening of the pixel definition layer, the longer the service life of the light emitting layer is, and therefore, after the requirement of a customer on the service life of the light emitting layer is obtained, the required minimum opening size of the pixel definition layer can be calculated; the larger the opening gap of the pixel definition layer is, the smaller the probability of color mixing of adjacent pixel units is when the light emitting layer is manufactured, and therefore, the required minimum opening gap of the pixel definition layer can be calculated based on the accuracy which can be achieved by the current light emitting layer manufacturing process. The preset opening size of the pixel definition layer is obtained on the basis of balancing the minimum opening size and the minimum opening gap of the pixel definition layer.
In one embodiment, the predetermined opening size of the pixel defining layer includes a first predetermined size along a first direction and a second predetermined size along a second direction. The step of determining the size of the opening of the metal mask plate based on the preset opening size of the pixel definition layer comprises the following steps: enlarging the first preset size according to a first proportion to obtain a first opening size of the metal mask plate; enlarging the second preset size according to a second proportion to obtain a second opening size of the metal mask plate; and determining the opening size of the metal mask plate based on the first opening size and the second opening size.
Further, the first preset size is equal to the second preset size, and the first proportion is equal to the second proportion, so that the preset opening size of the pixel definition layer has the same size in the first direction and the second direction, and after the preset opening size of the pixel definition layer is enlarged in the first direction and the second direction in an equal proportion, the formed opening size of the metal mask plate also has the characteristic that the first direction size and the second direction size are equal, that is, the first opening size of the metal mask plate is equal to the second opening size. It should be noted that, the more regular the shape of the opening of the metal mask is, the better the mechanical stability is, and the less wrinkles are likely to appear in the processing and using processes; therefore, this embodiment will the first trompil size and the second trompil size of metal mask set up to equal, are favorable to maintaining the mechanical stability of metal mask.
In one embodiment, please refer to fig. 2, wherein fig. 2 is a schematic diagram illustrating a predetermined opening structure of a pixel definition layer according to an embodiment of the present disclosure. The predetermined openings of the pixel defining layer include a red pixel opening 101, a blue pixel opening 103, and a green pixel opening 102. It should be noted that the red pixel opening 101 is used for accommodating a red pixel light-emitting material to form a red pixel light-emitting unit; the blue pixel opening 103 is used for accommodating a blue pixel light-emitting material to form a blue pixel light-emitting unit; the green pixel opening 102 is used to accommodate a green pixel emissive material to form a green pixel emissive unit. The red pixel aperture 101 has a first predetermined dimension W1 along the first direction X and a second predetermined dimension L1 along the second direction Y; the blue pixel aperture 103 has a first predetermined dimension W2 along the first direction X and a second predetermined dimension L2 along the second direction Y; the green pixel openings 102 are elliptical pixel openings, and an included angle G is formed between the major axis direction or the minor axis direction of the green pixel openings and the first direction X; in one embodiment, the first predetermined dimension W1 and the second predetermined dimension L1 of the red pixel aperture 101 satisfy: w1 ═ L1; the first and second predetermined sizes W2 and L2 of the blue pixel aperture 103 satisfy: w2 ═ L2; an included angle G between the long axis direction or the short axis direction of the green pixel opening 102 and the first direction X satisfies: g is 45 degrees. In this embodiment, the red pixel opening 101, the blue pixel opening 103 and the green pixel opening 102 all have regular opening shapes, so that the regular opening shapes of the metal mask plate can be conveniently formed according to the red pixel opening 101, the blue pixel opening 103 and the green pixel opening 102.
In an embodiment, please refer to fig. 2 and fig. 3, wherein fig. 3 is a schematic diagram of a structure of a predetermined opening of a pixel defining layer and an opening of a metal mask according to an embodiment of the present disclosure. The preset openings of the pixel definition layer comprise a red pixel opening 101, a blue pixel opening 103 and a green pixel opening 102; the openings of the metal mask plate 200 include a first mask hole 201 corresponding to the red pixel opening 101, a third mask hole 203 corresponding to the blue pixel opening 103, and a second mask hole 202 corresponding to the green pixel opening 102. The first preset size W1 of the red pixel aperture 101 is enlarged by a first proportion, resulting in a first aperture size of the first mask aperture 201 along the first direction X; the second preset size L1 of the red pixel aperture 101 is enlarged by a second ratio, resulting in a second aperture size of the first mask aperture 201 along the second direction Y; the first mask hole 201 is obtained based on the first and second opening sizes of the first mask hole 201. Similarly, the first predetermined dimension W2 of the blue pixel opening 103 is enlarged by a first ratio, resulting in a first opening dimension of the third mask hole 203 along the first direction X; a second preset dimension L2 of the blue pixel opening 103 is enlarged by a second ratio, resulting in a second opening dimension of the third mask hole 203 along the second direction Y; the third mask hole 203 is obtained based on the first and second opening sizes of the third mask hole 203. The major and minor axes of the green pixel apertures 102 are enlarged at a first and second rate, respectively, resulting in major and minor axes of the second mask apertures 202; and the second mask hole 202 is obtained based on the major axis and the minor axis of the second mask hole 202. Optionally, the first proportion is equal to the second proportion, that is, the preset openings of the pixel definition layer are expanded in the first direction and the second direction in the equal proportion, so as to obtain openings of the metal mask plate.
Step S102, determining a first preset hole opening allowance of the pixel definition layer along a first direction and a second preset hole opening allowance of the pixel definition layer along a second direction based on the hole opening size of the metal mask plate.
It should be noted that after the size of the opening of the metal mask is determined, error evaluation is performed by combining the manufacturing process of the metal mask and the process of performing evaporation of the light-emitting layer material by using the metal mask, and allowance is set for the opening of the pixel definition layer according to the error evaluation result, so that the opening of the pixel definition layer meets the process precision requirement.
Specifically, the step of determining a first preset opening margin of the pixel definition layer along a first direction and a second preset opening margin along a second direction based on the opening size of the metal mask plate includes:
and determining the opening parameters of the metal mask plate based on the opening size of the metal mask plate. The opening parameters of the metal mask plate comprise the thickness of a film material of the metal mask plate, the opening deviation value of the metal mask plate and the net opening deviation of the metal mask plate when the metal mask plate is opened.
And determining a first projection deviation of the projection of the metal mask plate on the pixel definition layer along the first direction and a second projection deviation along the second direction based on the opening parameters of the metal mask plate. It should be noted that the projection deviation of the projection of the metal mask on the pixel definition layer is directly related to the accuracy of making the opening of the pixel definition layer by using the metal mask, so that the opening margin of the pixel definition layer can be set according to the projection deviation of the projection of the metal mask on the pixel definition layer, so as to meet the requirement of process accuracy.
And determining the first preset opening margin based on the first projection deviation, and determining the second preset opening margin based on the second projection deviation. The first predetermined opening margin and the second predetermined opening margin are set for a predetermined opening size of the pixel definition layer, and are buffer amounts of opening sizes set to match the projection deviation. Based on the preset opening size of the pixel definition layer, the first preset opening margin is directly reflected in the opening gap size along the first direction, and the second preset opening margin is directly reflected in the opening gap size along the second direction, so that in the design scheme of the preset opening size of the pixel definition layer, the preset opening gap can be different in the first direction and the second direction.
Step S103, determining a target opening size of the pixel definition layer based on the first preset opening margin, the second preset opening margin and a preset opening size of the pixel definition layer.
Specifically, the step S103 includes:
and determining the opening gap difference of the pixel definition layer based on the first preset opening allowance and the second preset opening allowance. It should be noted that the first direction is a stretching direction of the metal mask plate, and the precision of the first direction can be adjusted by the stretching force, so that an excessive value does not need to be set for the first preset hole-opening allowance; the second direction is a non-net-spreading direction, and the precision of the second direction cannot be adjusted by external force, so that a larger value needs to be set for the second preset hole-opening allowance; based on the above factors, the aperture gap in the first direction is smaller than the aperture gap in the second direction at the predetermined aperture size of the pixel definition layer.
The step of determining the opening gap difference of the pixel definition layer based on the first preset opening margin and the second preset opening margin comprises: and subtracting the second preset opening allowance from the first preset opening allowance to obtain the opening gap difference of the pixel definition layer. The opening gap difference of the pixel definition layer is the difference value of the opening gap along the second direction and the opening gap along the first direction under the preset opening size of the pixel definition layer.
And determining the target opening size of the pixel definition layer based on the opening gap difference of the pixel definition layer and the preset opening size of the pixel definition layer. Specifically, the preset opening size of the pixel definition layer comprises a first preset size along the first direction and a second preset size along the second direction, and the target opening size of the pixel definition layer comprises a first target size along the first direction and a second target size along the second direction. The step of determining the target opening size of the pixel definition layer based on the opening gap difference of the pixel definition layer and the preset opening size of the pixel definition layer comprises the following steps: determining a target opening offset based on the opening gap difference of the pixel definition layer, the target offset being equal to one-half of the opening gap difference of the pixel definition layer; subtracting the first preset size from the target opening offset to obtain the first target size; summing the second preset size and the target opening offset to obtain a second target size; determining a target aperture size of the pixel definition layer based on the first target size and the second target size.
In one embodiment, please refer to fig. 2 to 4, wherein fig. 4 is a schematic diagram illustrating a target opening of a pixel definition layer formed by a predetermined opening of the pixel definition layer according to an embodiment of the present application. Based on the foregoing embodiment, the predetermined openings of the pixel defining layer include the red pixel opening 101, the blue pixel opening 103 and the green pixel opening 102, and the first predetermined size W1 and the second predetermined size L1 of the red pixel opening 101 satisfy: w1 ═ L1; the first and second predetermined sizes W2 and L2 of the blue pixel aperture 103 satisfy: w2 ═ L2; an included angle G between the long axis direction or the short axis direction of the green pixel opening 102 and the first direction X satisfies: g-45 degrees. The first mask hole 201 of the metal mask plate 200 is formed based on the red pixel opening 101, the third mask hole 203 of the metal mask plate 200 is formed based on the blue pixel opening 103, and the second mask hole 202 of the metal mask plate 200 is formed based on the green pixel opening 102. A first preset opening margin and a second preset opening margin corresponding to the red pixel opening 101, the blue pixel opening 103 and the green pixel opening 102 are determined based on the first mask hole 201, the third mask hole 203 and the second mask hole 202, respectively. Based on the first preset opening allowance and the second preset opening allowance of the red pixel opening 101, the blue pixel opening 103 and the green pixel opening 102, the first preset size W1 and the second preset size L1 of the red pixel opening 101, the first preset size W2 and the second preset size L2 of the blue pixel opening 103, and the included angle G of the green pixel opening 102 are adjusted. The size of the target opening size of the finally formed red pixel opening 101 in the first direction X is smaller than the size of the target opening size of the finally formed blue pixel opening 103 in the second direction Y, and the angle between the long axis direction or the short axis direction of the finally formed green pixel opening 102 and the first direction X is not equal to 45 degrees. The adjustment basically keeps the opening area of the pixel definition layer on one hand, is beneficial to maintaining the service life of the light emitting layer, and enlarges the minimum size of the opening gap of the pixel definition layer on the other hand, thereby being beneficial to improving the manufacturing yield of the light emitting layer.
Referring to fig. 5 and fig. 6, fig. 5 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application, and fig. 6 is a schematic structural diagram of the display panel according to the embodiment of the present application. The manufacturing method of the display panel comprises the following steps:
in step S501, a pixel base layer is formed on the array substrate.
Optionally, the array substrate includes: a substrate 601 and a buffer layer 602 disposed on the substrate 601, wherein the substrate 601 may include an insulating material, such as polyimide, glass, quartz, or ceramic, and the buffer layer 602 may include various organic materials or inorganic materials; a semiconductor layer 603 disposed on the buffer layer 602, wherein a substrate material of the semiconductor layer 603 may be an N-type or P-type polysilicon semiconductor, or a metal oxide semiconductor; a first gate insulating layer 604 formed over the semiconductor layer 603, and made of an insulating material such as silicon nitride or silicon oxide; a first gate electrode 605 disposed on the first gate insulating layer 604, wherein the material of the first gate electrode 605 may be a metal material Mo, the semiconductor layer 603 may be divided into a source electrode, a channel portion and a drain electrode, and the source electrode, the channel and the drain electrode of the first gate electrode 605 and the semiconductor layer 603 form a gate electrode, a source electrode and a drain electrode of a low temperature polysilicon transistor or a metal oxide transistor; a second gate insulating layer 606 disposed on the first gate 605, and the material of the second gate insulating layer may be an insulating material including silicon nitride or silicon oxide; a second gate 607 disposed on the second gate insulating layer 606, wherein the material of the second gate 607 may be Mo, and the second gate 607 and the first gate 605 form upper and lower electrodes of a storage capacitor; an interlayer insulating layer 608 covering the second gate 607, and made of an insulating material such as silicon nitride or silicon oxide; a source/drain electrode 609, disposed on the interlayer insulating layer 608, and made of one or more of gold, silver, copper, lithium, sodium, potassium, magnesium, aluminum, zinc, and combinations thereof, wherein the source/drain electrode 609 is electrically connected to the source and the drain of the semiconductor layer 603 through via holes on the interlayer insulating layer 608, the second gate insulating layer 606, and the first gate insulating layer 604; a planarization layer 610 disposed on the source/drain electrode 609, wherein the material of the planarization layer may be an insulating material including silicon nitride or silicon oxide; and an anode 611 disposed on the planarization layer 610 and made of a combination of ITO and Ag.
The pixel base layer is formed on the planarization layer 610 and covers the anode 611; after the opening operation, the pixel base layer forms a pixel defining layer 612.
Step S502, a target opening size of a pixel opening on the pixel substrate layer is designed by using a pixel definition layer opening design method.
Specifically, the pixel definition layer opening design method includes the pixel definition layer opening design method provided in the embodiments of the present application, please refer to the specific operations described in the above embodiments, and details are not repeated herein.
In step S503, a pixel opening 100 is formed on the pixel base layer based on the target opening size.
The pixel defining layer 612 is formed after the pixel opening 100 is formed in the pixel base layer. Specifically, the step of forming a pixel aperture 100 on the pixel base layer based on the target aperture size includes: based on the size of the target opening, the pixel opening 100 is formed on the pixel substrate layer by exposure, development, etching, and other processes.
Further, after the step of forming the pixel opening 100 on the pixel base layer based on the target opening size, the method further includes: forming a light emitting layer in the pixel opening 100; an encapsulation layer 615 is formed on the pixel base layer and the light emitting layer. Wherein the light emitting layer comprises a light emitting functional layer 613 and a cathode 614.
The embodiment of the application further provides a display panel, which can be manufactured by the manufacturing method of the display panel provided by the embodiment of the application, and the structure of the display panel can be as shown in fig. 6. For the specific structural features of the display panel, please refer to the above embodiments, which are not described herein again.
To sum up, the embodiment of the application provides a pixel definition layer opening design method, a display panel manufacturing method and a display panel, wherein the pixel definition layer opening design method includes determining the opening size of a metal mask plate based on the preset opening size of a pixel definition layer, further determining the opening allowance of the pixel definition layer, determining the target opening size of the pixel definition layer according to the opening allowance of the pixel definition layer, and further determining an opening design scheme of the pixel definition layer; the pixel definition layer opening design method increases and reduces the target opening size of the pixel definition layer in an unequal proportion according to the opening allowance, so that the opening size and the opening gap of the pixel definition layer can well balance the service life requirement of the light emitting layer and the manufacturing yield requirement of the light emitting layer, the manufacturing yield of the light emitting layer is promoted to be improved, and the service life of the light emitting layer is well maintained.
It should be noted that, although the present application has been described with reference to specific examples, the above-mentioned examples are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be limited by the appended claims.
Claims (10)
1. A method for designing an opening of a pixel definition layer includes:
determining the opening size of the metal mask plate based on the preset opening size of the pixel definition layer;
determining a first preset hole opening allowance of the pixel definition layer along a first direction and a second preset hole opening allowance of the pixel definition layer along a second direction based on the hole opening size of the metal mask plate;
determining a target opening size of the pixel definition layer based on the first preset opening margin, the second preset opening margin and a preset opening size of the pixel definition layer, wherein the increase and decrease proportion of the target opening size in the first direction is different from the increase and decrease proportion of the target opening size in the second direction.
2. The method according to claim 1, wherein the preset opening size of the pixel definition layer comprises a first preset size along the first direction and a second preset size along the second direction, and the step of determining the opening size of the metal mask plate based on the preset opening size of the pixel definition layer comprises:
enlarging the first preset size according to a first proportion to obtain a first opening size of the metal mask plate;
enlarging the second preset size according to a second proportion to obtain a second opening size of the metal mask plate;
and determining the opening size of the metal mask plate based on the first opening size and the second opening size.
3. The method according to claim 1, wherein the step of determining a first predetermined opening margin of the pixel definition layer along a first direction and a second predetermined opening margin along a second direction based on the opening size of the metal mask comprises:
determining the opening parameters of the metal mask plate based on the opening size of the metal mask plate;
determining a first projection deviation of the projection of the metal mask plate on the pixel definition layer along the first direction and a second projection deviation of the projection of the metal mask plate along the second direction based on the opening parameters of the metal mask plate;
determining the first preset tapping allowance based on the first projection deviation;
determining the second preset tapping margin based on the second projection deviation.
4. The method of claim 1, wherein the step of determining the target opening size of the pixel definition layer based on the first predetermined opening margin, the second predetermined opening margin and the predetermined opening size of the pixel definition layer comprises:
determining a hole gap difference of the pixel definition layer based on the first preset hole allowance and the second preset hole allowance;
and determining the target opening size of the pixel definition layer based on the opening gap difference of the pixel definition layer and the preset opening size of the pixel definition layer.
5. The method of claim 4, wherein the step of determining the opening gap difference of the pixel definition layer based on the first predetermined opening margin and the second predetermined opening margin comprises:
and subtracting the second preset opening allowance from the first preset opening allowance to obtain an opening gap difference of the pixel definition layer.
6. The pixel definition layer opening design method according to claim 4, wherein the preset opening size of the pixel definition layer comprises a first preset size along the first direction and a second preset size along the second direction, and the target opening size of the pixel definition layer comprises a first target size along the first direction and a second target size along the second direction; the step of determining a target opening size of the pixel definition layer based on the opening gap difference of the pixel definition layer and a preset opening size of the pixel definition layer includes:
determining a target opening offset based on the opening gap difference of the pixel definition layer;
subtracting the first preset size from the target opening offset to obtain the first target size;
summing the second preset size and the target opening offset to obtain a second target size;
determining a target aperture size of the pixel definition layer based on the first target size and the second target size.
7. The method of claim 6, wherein the step of determining a target opening offset based on the opening gap difference of the pixel definition layer comprises:
and taking one half of the opening gap difference of the pixel definition layer to obtain the target opening offset.
8. A method for manufacturing a display panel is characterized by comprising the following steps:
forming a pixel base layer on the array substrate;
designing a target opening size of a pixel opening located on the pixel base layer using the pixel definition layer opening design method of any one of claims 1 to 7;
forming a pixel aperture on the pixel base layer based on the target aperture size.
9. The method of claim 8, further comprising, after the step of forming a pixel opening in the pixel base layer based on the target opening size:
forming a light emitting layer in the pixel opening;
an encapsulation layer is formed on the pixel base layer and the light emitting layer.
10. A display panel manufactured by the method according to any one of claims 8 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011448720.6A CN112582455B (en) | 2020-12-09 | 2020-12-09 | Pixel definition layer opening design method, display panel manufacturing method and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011448720.6A CN112582455B (en) | 2020-12-09 | 2020-12-09 | Pixel definition layer opening design method, display panel manufacturing method and display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112582455A CN112582455A (en) | 2021-03-30 |
| CN112582455B true CN112582455B (en) | 2022-06-07 |
Family
ID=75131971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011448720.6A Active CN112582455B (en) | 2020-12-09 | 2020-12-09 | Pixel definition layer opening design method, display panel manufacturing method and display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112582455B (en) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104532183B (en) * | 2015-01-26 | 2017-09-26 | 深圳市华星光电技术有限公司 | The preparation method of high-precision mask plate |
| CN104952905A (en) * | 2015-05-06 | 2015-09-30 | 京东方科技集团股份有限公司 | Organic light-emitting display panel, preparation method thereof and display device |
| CN206163494U (en) * | 2016-11-16 | 2017-05-10 | 京东方科技集团股份有限公司 | Structure, organic electroluminescence device , display device , mask slice are arranged to pixel |
| US20200058875A1 (en) * | 2018-08-16 | 2020-02-20 | Int Tech Co., Ltd. | Light emitting manufacturing method |
| CN110098239B (en) * | 2019-05-17 | 2021-11-02 | 京东方科技集团股份有限公司 | Pixel structure, display substrate, mask plate and evaporation method |
| CN111969005B (en) * | 2019-05-20 | 2021-09-17 | 京东方科技集团股份有限公司 | Display panel and method of manufacturing the same |
| CN110578112B (en) * | 2019-08-09 | 2020-09-01 | 武汉华星光电半导体显示技术有限公司 | Mask and pixel structure |
| CN210926019U (en) * | 2019-10-31 | 2020-07-03 | 京东方科技集团股份有限公司 | Display back plate, mask plate assembly and display device |
| CN111079261B (en) * | 2019-11-19 | 2023-12-01 | 京东方科技集团股份有限公司 | Simulation prediction method and system for mask Zhang Wangli and mask net-stretching equipment |
-
2020
- 2020-12-09 CN CN202011448720.6A patent/CN112582455B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN112582455A (en) | 2021-03-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11152443B2 (en) | Display panel having a storage capacitor and method of fabricating same | |
| US10276641B2 (en) | Display panel and display device | |
| US11101443B2 (en) | Organic electroluminescence display panel, manufacturing method therefor, and display device | |
| CN113488514B (en) | Display panel and preparation method thereof | |
| WO2019080255A1 (en) | Transparent oled display and manufacturing method therefor | |
| US7615922B2 (en) | Electro-luminescent display device and method for fabricating the same | |
| CN111180496A (en) | Display substrate, preparation method thereof, display panel and display device | |
| WO2020253336A1 (en) | Display substrate and manufacturing method therefor, and organic light emitting diode display apparatus | |
| KR20150127368A (en) | Organic light emitting display device and method of manufacturing the same | |
| CN111722761A (en) | Touch control display device | |
| KR102477608B1 (en) | Display substrate, method of manufacturing the same, and display device including the same | |
| CN112002823A (en) | OLED display panel and preparation method thereof | |
| CN114122296B (en) | Display backboard, manufacturing method thereof and display device | |
| KR20160017339A (en) | Organic light emitting display device and method for manufacturing the same | |
| CN109755285B (en) | Display panel, manufacturing method thereof and display device | |
| KR100635064B1 (en) | an active matrix organic electrominescence display and method for fabricating the same | |
| CN112420782A (en) | OLED display panel and preparation method thereof | |
| CN113707725B (en) | Thin film transistor, preparation method thereof, array substrate and display device | |
| CN112582455B (en) | Pixel definition layer opening design method, display panel manufacturing method and display panel | |
| US20220336552A1 (en) | Display substrates and methods of manufacturing the same, display panels, and display apparatuses | |
| US20210408440A1 (en) | Display substrate, display apparatus, and method of fabricating display substrate | |
| CN110071148A (en) | Organic LED display device and its manufacturing method | |
| CN110148680B (en) | Organic light emitting display panel and method of manufacturing the same | |
| CN112271195A (en) | Light-emitting element, preparation method thereof, display screen and electronic device | |
| JP4278353B2 (en) | Electroluminescence display device and pattern layout method of electroluminescence display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |