CN112582385A - Blue light LED packaging structure, backlight module and display device - Google Patents

Blue light LED packaging structure, backlight module and display device Download PDF

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Publication number
CN112582385A
CN112582385A CN202011450766.1A CN202011450766A CN112582385A CN 112582385 A CN112582385 A CN 112582385A CN 202011450766 A CN202011450766 A CN 202011450766A CN 112582385 A CN112582385 A CN 112582385A
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CN
China
Prior art keywords
light
blue
packaging layer
blue led
diffusion particles
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Pending
Application number
CN202011450766.1A
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Chinese (zh)
Inventor
程显荣
于昊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Gaochuang Suzhou Electronics Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Gaochuang Suzhou Electronics Co Ltd
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Application filed by BOE Technology Group Co Ltd, Gaochuang Suzhou Electronics Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN202011450766.1A priority Critical patent/CN112582385A/en
Publication of CN112582385A publication Critical patent/CN112582385A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Abstract

The invention relates to the field of liquid crystal display, and discloses a blue light LED packaging structure, a backlight module and a display device, wherein the blue light LED packaging structure comprises: a support having a cavity; the blue light LED chips are arranged at the bottom of the cavity; the packaging layer is filled in the cavity; and the diffusion particles are distributed in the packaging layer to scatter the light rays entering the blue LED chip in the packaging layer. The light rays enter the packaging layer from the light-sparse medium to the light-dense medium and are refracted, and the light rays entering the packaging layer are scattered through the diffusion particles, so that the light rays are diffused; the whole packaging layer comprising the diffusion particles and the at least two blue light LED chips become new light sources, and the new light sources are uniform bodies, so that the diaphragm is effectively eliminated. And the production difficulty is lower by arranging the diffusion particles in the packaging layer, and the realization difficulty is low.

Description

Blue light LED packaging structure, backlight module and display device
Technical Field
The invention relates to the technical field of liquid crystal display, in particular to a blue light LED packaging structure, a backlight module and a display device.
Background
The blue light LED chips are uniform in light emission, and when the two chips are uniformly emitted respectively, the overall distributed light after the two adjacent uniform light bodies are overlapped is not uniform.
After light rays emitted by the chip pass through the lens, the light rays have apertures which are very uneven and are not beneficial to a backlight source; referring to fig. 1, after light emitted from a chip passes through a lens, optical simulation is performed on a predetermined light receiving surface to obtain a light radiation pattern, from a 'to B' in fig. 1, the light density is increased from a small value to a large value, and from B 'to C' is decreased from a large value, and a light spot appears as an annular aperture, which is referred to as a lamp shadow in the industry.
When the above problems occur in light, the industry generally solves the problems by adding a film or adding printing, but the cost is increased by the above methods.
Disclosure of Invention
The invention discloses a blue light LED packaging structure, a backlight module and a display device, which are used for solving the problem of light rings of a plurality of blue light LED chips on the premise of low cost.
In order to achieve the purpose, the invention provides the following technical scheme:
in a first aspect, the present invention provides a blue LED package structure, including: a support having a cavity;
the blue light LED chips are arranged at the bottom of the cavity;
the packaging layer is filled in the cavity;
and the diffusion particles are distributed in the packaging layer so as to scatter the light rays entering the blue LED chip in the packaging layer.
The at least two blue light LED chips are two uniform light bodies which respectively emit light rays according to cosine distribution, the light rays pass through the packaging layer distributed with diffusion particles and change according to an H-N phase function, and the H-N phase function is a function describing the angle distribution of the scattered light rays in the medium and is related to the physical characteristics (particle size and refractive index) of the medium. After the light passes through the packaging layer with the diffusion particles, the light distribution can be calculated through an H-N phase function, so that the light is diffused, the whole packaging layer with the diffusion particles and at least two blue light LED chips become new light sources, and the new light sources are uniform bodies, so that the diaphragm is effectively eliminated. And the production difficulty is lower by arranging the diffusion particles in the packaging layer, and the realization difficulty is low.
Optionally, the diffusion particles are made of a transparent material.
Optionally, the diffusion particles are made of a translucent material.
Optionally, the diffusion particles are made of metal.
Optionally, the diffusion particles are spherical in shape.
Optionally, the diameter of the diffusion particles is 9 μm to 11 μm.
Optionally, the encapsulation layer is made of a transparent material.
Optionally, the encapsulation layer is made of a translucent material.
In a second aspect, the present invention provides a backlight module, including the blue LED package structure of any one of the first aspects.
In a third aspect, the present invention provides a display device, including the backlight module of the second aspect.
Drawings
FIG. 1 is a schematic diagram illustrating the light radiation effect of a blue LED chip in the prior art;
fig. 2 is a schematic structural diagram of a blue LED package structure according to an embodiment of the present invention;
fig. 3 is a schematic view of a position structure of a blue LED chip for optical simulation according to an embodiment of the present invention;
fig. 4 is a diagram illustrating an optical radiation effect of a blue LED package structure according to an embodiment of the present invention.
Icon: 001-a receiving surface; 10-LED package structure; 100-a scaffold; 110-a cavity; 200-blue light LED chip; 300-an encapsulation layer; 400-diffusing particles; 500-lens.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 2, an embodiment of the present invention provides a blue LED package structure, including: a holder 100 having a cavity 110;
at least two blue LED chips 200 disposed at the bottom of the cavity 110;
an encapsulation layer 300 filled in the cavity 110;
the diffusion particles 400 are distributed in the encapsulation layer 300 to diffuse light entering the blue LED chip 200 in the encapsulation layer 300.
It should be noted that, here, the at least two blue LED chips 200 are two uniform light bodies, and emit light rays respectively according to cosine distribution, and the light rays pass through the packaging layer 300 distributed with the diffusion particles 400 and change according to the H-N phase function, which is a function describing the angle distribution of the scattered light rays in the medium, and is related to the physical characteristics (grain size, refractive index) of the medium. After the light passes through the packaging layer 300 with the diffusion particles 400, the light distribution can be calculated through an H-N phase function, so that the light is diffused, the whole packaging layer 300 comprising the diffusion particles 400 and at least two blue LED chips 200 become new light sources, and the new light sources are uniform bodies, so that the aperture is effectively eliminated. And the production difficulty is low by arranging the diffusion particles 400 in the packaging layer 300, and the realization difficulty is low.
It should be understood that the H-N phase function is a function describing the angular distribution of scattered light within a medium, which is related to the physical characteristics of the medium (grain size, refractive index), and that the light distribution can be calculated from the H-N phase function after the light has passed through a certain medium with diffusing particles.
Specifically, two or more blue LED chips 200 may be selected, and the selection is specifically performed according to actual needs. The bracket 100 with the cavity 110 plays a bearing role, and a circuit is arranged in the bracket and can supply power to the blue LED chip 200 to ensure the normal work of the blue LED chip 200; the shape of the cavity 110 may be set as the basin-shaped cavity 110, and the basin-shaped cavity 110 is beneficial to improving the light emitting efficiency of the blue LED chip 200 and reducing the reflection loss of light inside the cavity. The at least two blue light LED chips 200 are arranged at the bottom of the basin-shaped cavity 110, the basin-shaped cavity 110 is filled with packaging glue to form a packaging layer 300, and the packaging layer 300 is used for wrapping the blue light LED chips 200 and protecting the blue light LED chips 200.
When the encapsulation layer 300 is specifically selected, the encapsulation layer 300 may have a variety of options:
in the first embodiment, the package layer 300 is made of a transparent material.
When encapsulating layer 300 is transparent material, in blue light LED chip 200's light from the air admission encapsulating layer 300, from light sparse medium entering light dense medium and take place the refraction promptly, the encapsulating layer 300 of transparent material here has certain diffusion effect to light, but because encapsulating layer 300 is transparent, therefore the diffusion effect is comparatively weak, in order to increase the diffusion effect to light, can also set up encapsulating layer 300 into following material.
In the second embodiment, the package layer 300 is made of a translucent material.
When the package layer 300 is made of a translucent material, when light of the blue LED chip 200 enters the package layer 300 from the air, that is, enters the optically dense medium from the optically sparse medium and is refracted, the package layer 300 made of the translucent material has a relatively good diffusion effect on the light.
The above-mentioned diffusion effect of the emitted light of the at least two blue LED chips 200 by the encapsulation layer 300 is not very good, and therefore, the diffusion particles 400 are distributed in the diffusion layer, and particularly, the diffusion particles 400 can be selected according to actual needs, and it should be understood that the diffusion particles 400 can be uniformly distributed in the encapsulation layer 300, or can be randomly distributed in the encapsulation layer 300.
In selecting the diffusion particles 400 specifically, there may be a variety of options:
in the first embodiment, the material of the diffusion particles 400 may be a translucent material.
When the material of the diffusion particle 400 is a semitransparent material, the light of the blue LED chip 200 is refracted to enter the package layer 300 for the first time, and the specific process is as follows: the light emitted by the blue light LED chip passes through a P junction (when the P junction of the blue light LED chip is placed upwards) or an N junction (when the N junction of the blue light LED chip is placed upwards) in the middle of the PN junction, and the refractive indexes of the P junction and the N junction are larger than that of the packaging layer no matter which side is upward, so that the light enters the light thinning medium from the optical dense medium, the refracted light deflects towards the direction away from the normal line, and the light is diffused for the first time and enters the packaging layer 300; under the action of the diffusion particles 400, the refracted light rays are refracted for the second time, namely when the refractive index of the diffusion particles 400 is larger than that of the packaging layer 300, the diffusion particles 400 are optical dense media, the packaging layer 300 is an optical sparse medium, and then the refracted light rays are deflected towards the normal direction according to the refraction relation of the light rays; then, the refracted light in the diffusion particles 400 is refracted for the third time, and the refracted light is emitted from the diffusion particles 400 to the encapsulation layer 300, namely, is refracted from the optically dense medium to the optically thinner medium, and is deflected in the direction away from the normal; and then the light is emitted from the packaging layer 300 to the air, and is refracted for the fourth time, namely, the light is refracted from the optically dense medium to the optically sparse medium, so that the whole process of refracting the light of the blue LED chips 200 is completed, and each light is refracted according to the process, so that the packaging layer 300 comprising the diffusion particles 400 and at least two blue LED chips 200 become new light sources which are uniform, and the aperture is effectively eliminated.
In a second mode, the material of the diffusion particles 400 may be a transparent material, and the light of the blue LED chip 200 is refracted to enter the package layer 300 for the first time, and the specific process is as follows: the light emitted by the blue light LED chip passes through a P junction (when the P junction of the blue light LED chip is placed upwards) or an N junction (when the N junction of the blue light LED chip is placed upwards) in the middle of the PN junction, and the refractive indexes of the P junction and the N junction are larger than that of the packaging layer no matter which side is upward, so that the light enters the light thinning medium from the optical dense medium, the refracted light deflects towards the direction away from the normal line, and the light is diffused for the first time and enters the packaging layer 300; when the refractive index of the diffusion particle 400 is smaller than the refractive index of the encapsulation layer 300, that is, the diffusion particle 400 is an optically thinner medium, and the encapsulation layer 300 is an optically denser medium, according to the refraction relationship of the light, the refracted light enters the diffusion particle 400 and is refracted for the second time, the refracted light is deflected in the direction away from the normal, the refracted light in the diffusion particle 400 is refracted for the third time, the light is emitted from the diffusion particle 400 to the encapsulation layer 300, that is, from the optically thinner medium to the optically denser medium, the refracted light is deflected in the direction of the normal, and then is emitted from the encapsulation layer 300 to the air, the fourth refraction is refracted from the optically denser medium to the optically thinner medium, the whole process of the refraction of the light of the blue LED chips 200 is completed, and each of the light is refracted according to the above process, so that the encapsulation layer 300 including the diffusion particle 400 and at least two blue LED chips 200 become new light sources, the new light source is a homogeneous body, thereby effectively eliminating the aperture.
In the third embodiment, the diffusion particles 400 are made of metal.
That is, the diffusion particles 400 are made of a transparent metal material, and after the incident light emitted from the blue LED chip 200 is first refracted and enters the encapsulation layer 300, the specific process is as follows: the light emitted by the blue light LED chip passes through a P junction (when the P junction of the blue light LED chip is placed upwards) or an N junction (when the N junction of the blue light LED chip is placed upwards) in the middle of the PN junction, and the refractive indexes of the P junction and the N junction are larger than that of the packaging layer no matter which side is upward, so that the light enters the light thinning medium from the optical dense medium, the refracted light deflects towards the direction away from the normal line, and the light is diffused for the first time and enters the packaging layer 300; here, the refracted light is reflected after being emitted to the diffusion particles 400 made of a metal material, the reflected light is refracted for the second time, the light is refracted from the packaging layer 300 and enters the air, namely, the light is refracted from the optically dense medium to the optically sparse medium, the refracted light is deflected in the direction away from the normal line at this time, the above process is the whole process of the light path, each light is refracted and reflected according to the above process, so that the packaging layer 300 including the diffusion particles 400 and at least two blue light LED chips 200 become new light sources, and the new light sources are uniform bodies, thereby effectively eliminating the aperture.
The shape of the diffusion particles 400 may be spherical, cylindrical or prismatic, and other shapes, and different shapes will have an influence on the deflection direction of the refracted light, and the specific shape may be selected according to actual needs.
When the diffusion particles 400 are spherical in shape, the diameter of the diffusion particles 400 is 9 μm, 10 μm, or 11 μm. And in order to increase the diffusion effect of the refracted light rays emitted from the blue LED chip 200 entering the encapsulation layer 300, the diffusion particles 400 may be randomly distributed in the encapsulation layer 300 with different diameters and random sizes.
As shown in fig. 3, the blue LED chip 200 is located below the lens 500, the light emitted from the blue LED chip 200 is refracted and diffused by the lens 500, and the receiving surface 001 is disposed at a distance of 20mm in the blue LED package structure 10 provided in the embodiment of the present invention, and the OD value (optical density) is optically simulated, so that the light radiance distribution is shown in fig. 4. From fig. 4, it is clear that the optical density is uniformly distributed, and the optical density is increased from low to high in the a-B direction, thereby effectively eliminating the aperture.
Because the aperture is effectively eliminated, the light utilization rate is improved, and the LED packaging structure using at least two blue light LED chips 200 in the prior art can generate light spots in an annular aperture which is called as a lamp shadow in the industry; the number of the LED packaging structures required by the same size is more, namely, the distance between the LED packaging structures needs to be set smaller; the blue LED package structure 10 according to the embodiment of the present invention enables the package layer 300 including the diffusion particles 400 and the at least two blue LED chips 200 to be new light sources, and the new light sources are uniform, so as to effectively eliminate the aperture. The light source is more uniform when the aperture is eliminated, the distance between the LED packaging structures 10 can be increased, the number of the LED packaging structures 10 can be reduced, and the cost is reduced.
In a second aspect, an embodiment of the present invention provides a backlight module, including the blue LED package structure 10 according to any one of the first aspects.
In a third aspect, an embodiment of the present invention provides a display device, including the backlight module according to the second aspect.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1. A blue LED package structure, comprising: a support having a cavity;
the blue light LED chips are arranged at the bottom of the cavity;
the packaging layer is filled in the cavity;
and the diffusion particles are distributed in the packaging layer so as to scatter the light rays entering the blue LED chip in the packaging layer.
2. The blue LED package structure of claim 1, wherein the diffusing particles are transparent.
3. The blue LED package structure of claim 1, wherein the diffusing particles are translucent.
4. The blue LED package structure of claim 1, wherein the diffusing particles are made of metal.
5. The blue LED package structure of claim 1, wherein the diffusion particles are spherical in shape.
6. The blue LED package structure according to claim 5, wherein the diameter of the diffusion particle is 9-11 μm.
7. The blue LED package structure of claim 1, wherein the package layer is a transparent material.
8. The blue LED package structure of claim 1, wherein the encapsulant layer is a translucent material.
9. A backlight module comprising the blue LED package structure of any one of claims 1-8.
10. A display device comprising the backlight module of claim 9.
CN202011450766.1A 2020-12-10 2020-12-10 Blue light LED packaging structure, backlight module and display device Pending CN112582385A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011450766.1A CN112582385A (en) 2020-12-10 2020-12-10 Blue light LED packaging structure, backlight module and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011450766.1A CN112582385A (en) 2020-12-10 2020-12-10 Blue light LED packaging structure, backlight module and display device

Publications (1)

Publication Number Publication Date
CN112582385A true CN112582385A (en) 2021-03-30

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Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060220046A1 (en) * 2005-03-04 2006-10-05 Chuan-Pei Yu Led
US20090050911A1 (en) * 2007-08-24 2009-02-26 Cree, Inc. Light emitting device packages using light scattering particles of different size
CN101555993A (en) * 2008-04-09 2009-10-14 辅祥实业股份有限公司 LED light source module and backlight module using same
US20110001148A1 (en) * 2009-07-06 2011-01-06 Zhuo Sun Thin flat solid state light source module
KR20130136259A (en) * 2012-06-04 2013-12-12 삼성전자주식회사 Light emitting device package using quantum dot
CN104953010A (en) * 2012-10-30 2015-09-30 四川新力光源股份有限公司 LED light emitting module
CN105156941A (en) * 2015-07-06 2015-12-16 高创(苏州)电子有限公司 Backlight module and display device
CN105895787A (en) * 2016-06-06 2016-08-24 青岛海信电器股份有限公司 Light-emitting diode (LED), LED packaging method, straight down type backlight module and liquid crystal display television
BR102016004795A2 (en) * 2015-03-05 2016-09-06 Nichia Corp light emitting device
US20200103582A1 (en) * 2017-06-08 2020-04-02 Leia Inc. Light source and multiview backlight using the same
US20200227600A1 (en) * 2019-01-14 2020-07-16 Sharp Kabushiki Kaisha Led light source substrate, lighting device, and method of producing led light source substrate

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060220046A1 (en) * 2005-03-04 2006-10-05 Chuan-Pei Yu Led
US20090050911A1 (en) * 2007-08-24 2009-02-26 Cree, Inc. Light emitting device packages using light scattering particles of different size
CN101555993A (en) * 2008-04-09 2009-10-14 辅祥实业股份有限公司 LED light source module and backlight module using same
US20110001148A1 (en) * 2009-07-06 2011-01-06 Zhuo Sun Thin flat solid state light source module
KR20130136259A (en) * 2012-06-04 2013-12-12 삼성전자주식회사 Light emitting device package using quantum dot
CN104953010A (en) * 2012-10-30 2015-09-30 四川新力光源股份有限公司 LED light emitting module
BR102016004795A2 (en) * 2015-03-05 2016-09-06 Nichia Corp light emitting device
US20160260873A1 (en) * 2015-03-05 2016-09-08 Nichia Corporation Light emitting device
CN105156941A (en) * 2015-07-06 2015-12-16 高创(苏州)电子有限公司 Backlight module and display device
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