CN112582298A

CN112582298A - Substrate processing apparatus

Info

Publication number: CN112582298A
Application number: CN202010939524.2A
Authority: CN
Inventors: 滨田嵩広; 林航之介
Original assignee: Shibaura Mechatronics Corp
Current assignee: Shibaura Mechatronics Corp
Priority date: 2019-09-30
Filing date: 2020-09-09
Publication date: 2021-03-30
Also published as: JP2021057458A; KR20210038339A

Abstract

The invention provides a substrate processing apparatus, which can shorten the replacement time of a brush. The substrate processing apparatus according to the embodiment includes: a rotation holding unit capable of rotating the substrate held; a 1 st brush disposed to be opposite to one surface of the substrate; a 2 nd brush disposed opposite to one surface of the substrate and on a same axis as the 1 st brush; a moving unit configured to move the 1 st brush and the 2 nd brush in a direction intersecting one surface of the substrate; and an arm capable of changing positions of the 1 st brush and the 2 nd brush in a direction substantially parallel to one surface of the substrate.

Description

Substrate processing apparatus

Technical Field

Embodiments of the present invention relate to a substrate processing apparatus.

Background

In a manufacturing process of a semiconductor device, a flat panel display, or the like, foreign substances adhering to the surface of a substrate such as a wafer or a glass substrate are removed with a brush.

In general, when removing foreign matter, a processing liquid is supplied to a rotating substrate, and the tip of a rotating brush is brought into contact with the surface of the substrate. Therefore, the tip of the brush may be deformed or worn with the use of the brush. If the tip of the brush is deformed, the foreign matter removal ability is lowered, and therefore, the brush needs to be replaced periodically or as needed. For example, an operator of the substrate processing apparatus replaces a brush that needs to be replaced with a new brush.

Thus, the reduction of the foreign matter removal capability can be suppressed. However, since the substrate processing apparatus cannot be used during the brush replacement, if the replacement frequency of the brush is high, the production efficiency of the product may be reduced.

Further, the type of brush may be changed depending on the size of the foreign matter or the like. For example, if a plurality of brushes (brushes) having brush bristles are used, large foreign substances can be efficiently removed. On the other hand, if a so-called sponge brush is used, for example, small foreign matters can be removed efficiently. In this case, since a plurality of foreign substances having different sizes adhere to the surface of the substrate, it is common to remove a large foreign substance with a brush and then remove a small foreign substance with a sponge brush. Therefore, it is necessary to change the kind of the brush in a series of processes. For example, an operator of the substrate processing apparatus replaces the brush and the sponge brush.

Thus, a plurality of foreign matters having different sizes can be efficiently removed. However, since the substrate processing apparatus cannot be used during the brush replacement, there is room for improvement in the improvement of the production efficiency of the product.

At this time, a technique has been proposed in which the brush is moved to the outside of the area where the substrate is processed, and the brush is automatically replaced outside the area where the substrate is processed. However, the substrate processing apparatus cannot be used while moving the brush to the outside of the region where the substrate is processed and replacing the brush.

Accordingly, it is desired to develop a substrate processing apparatus capable of shortening the brush replacement time and improving the production efficiency of the substrate.

Patent document

Patent document 1: japanese unexamined patent publication Hei 10-223584

Disclosure of Invention

The invention provides a substrate processing apparatus, which can shorten the replacement time of a brush and improve the production efficiency of a substrate.

The substrate processing apparatus according to the embodiment includes: a rotation holding unit capable of rotating the substrate held; a 1 st brush disposed to be opposite to one surface of the substrate; a 2 nd brush disposed opposite to one surface of the substrate and on a same axis as the 1 st brush; a moving unit configured to move the 1 st brush and the 2 nd brush in a direction intersecting one surface of the substrate; and an arm capable of changing positions of the 1 st brush and the 2 nd brush in a direction substantially parallel to one surface of the substrate.

According to an embodiment of the present invention, there is provided a substrate processing apparatus capable of shortening a brush replacement time and improving a production efficiency of a substrate.

Drawings

Fig. 1 is a schematic diagram illustrating a substrate processing apparatus according to the present embodiment.

Fig. 2 is a schematic perspective view illustrating the rotation holding portion and the processing portion.

Fig. 3 is a schematic cross-sectional view illustrating the treatment section.

Fig. 4(a) and (b) are schematic diagrams illustrating selection of the brush.

Fig. 5(a) and (b) are schematic diagrams illustrating selection of the brush.

Fig. 6(a) and (b) are schematic diagrams illustrating selection of the brush.

Fig. 7(a) and (b) are schematic diagrams illustrating selection of the brush.

Fig. 8 is a flowchart illustrating an operation of the substrate processing apparatus.

Fig. 9 is a schematic view illustrating a brush according to another embodiment.

Fig. 10 is a schematic view illustrating a brush according to another embodiment.

Description of the symbols

1-a substrate processing apparatus; 10-a rotation holding part; 11-a roller; 20-a supply section; 30-a processing section; 31-a brush; 31 a-a brush holder; 31 b-a brush moving part; 32-a brush; 32 a-a brush holder; 32 b-a brush moving part; 33-a base; 33 a-a cover; 35-a rotary joint; 36-a brush selection section; 37-a rotation mechanism; 37 a-a cover; 38-arm; 39-arm drive section; 40-a processing section; 50-a controller; 100-a substrate; 100 a-side; 100 b-side; 101-liquid medicine; 102-pure water; 132-136-brush.

Detailed Description

Hereinafter, embodiments will be described by way of example with reference to the accompanying drawings. In the drawings, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted as appropriate.

The substrate processing apparatus according to the present embodiment can be used in a process of manufacturing a microstructure such as a semiconductor device or a flat panel display. For example, the present invention can be used in a process (e.g., a cleaning process) of removing foreign substances adhering to the surface of a substrate such as a wafer or a glass substrate.

When the substrate is a wafer, for example, a wafer made of silicon can be used. In this case, a metal film or the like may be formed on the surface of the wafer, or a metal film or the like may not be formed. The use, composition, and the like of the substrate are not limited to those exemplified.

The foreign matter present on the surface of the substrate may be, for example, foreign matter generated in an upstream process such as a cmp (chemical Me mechanical polishing) process, so-called natural waste, or the like. The foreign matter generated in the CMP step is, for example, a residue such as a polishing agent used in the CMP step, or the like, and the substrate is chipped. When a metal film is formed on a substrate, the shavings of the substrate contain, for example, metal. When the metal film is not formed on the substrate, the shavings of the substrate contain, for example, silicon. The natural waste is, for example, waste that floats in the atmosphere and adheres to the surface of the substrate when the substrate is transported from the CMP step to the cleaning step. The type, cause, and the like of the foreign matter are not limited to those exemplified.

Although a substrate processing apparatus that simultaneously processes the front and back surfaces of a substrate is exemplified below as an example, the substrate processing apparatus may be any substrate processing apparatus that processes either the front or back surface of a substrate.

Fig. 1 is a schematic diagram illustrating a substrate processing apparatus 1 according to the present embodiment.

Fig. 2 is a schematic perspective view illustrating the rotation holding portion 10 and the processing portion 30.

As shown in fig. 1, the substrate processing apparatus 1 may be provided with a rotation holding unit 10, a supply unit 20, a processing unit 30, a processing unit 40, and a controller 50.

The rotation holding unit 10 can hold the substrate 100 and rotate the held substrate 100.

As shown in fig. 1 and 2, the rotation holding portion 10 may include, for example, a plurality of rollers 11 and a driving portion 12.

The roller 11 may have a support portion 11a and a holding portion 11 b.

The support portion 11a can support the vicinity of the peripheral edge of the substrate 100. The support 11a has, for example, a columnar shape, and the back surface 100b of the substrate 100 can be brought into contact with the support 11 a.

The holding portion 11b may be provided on the side of the supporting portion 11a that supports the substrate 100. The holding portion 11b is, for example, cylindrical and can be provided coaxially with the support portion 11 a. The diameter of the holding portion 11b can be made smaller than the diameter of the supporting portion 11 a. The support portion 11a and the holding portion 11b can be integrally formed. A groove may be provided on the side surface of the holding portion 11b so that the end surface of the substrate 100 can be accommodated inside the groove.

A plurality of rollers 11 can be disposed along the periphery of the substrate 100. If the plurality of rollers 11 are rotated, the substrate 100 can be rotated. At this time, since a member for transmitting the rotational force is not provided in the center region of the substrate 100, it is easy to simultaneously process the front surface 100a and the back surface 100b of the substrate 100.

Further, since the end face of the substrate 100 is housed inside the groove provided on the side face of the holding portion 11b, the position of the substrate 100 can be prevented from being displaced in the radial direction and the thickness direction. At this time, the plurality of rollers 11 may move in the radial direction of the substrate 100. For example, when the substrate 100 is placed on the end surfaces of the plurality of supporting portions 11a or the substrate 100 is taken out from the end surfaces, the plurality of rollers 11 can be moved in a direction away from the substrate 100. When the substrate 100 is processed, the plurality of rollers 11 can be moved in a direction approaching the substrate 100, and the substrate 100 can be sandwiched by the plurality of rollers 11.

The driving unit 12 can rotate the plurality of rollers 11 by a transmission member such as a timing belt. Further, the driving unit 12 can control the rotational speed and the rotational direction of the plurality of rollers 11. The driving unit 12 may include a control motor such as a servo motor.

The supply unit 20 can supply the processing liquid to the front surface 100a and the back surface 100b of the substrate 100.

The supply unit 20 may include, for example, a nozzle 21, a nozzle 22, a treatment liquid supply unit 23, and a treatment liquid supply unit 24.

The nozzle 21 can be disposed outside the region where the plurality of rollers 11 are disposed. The nozzle 21 can be disposed above the surface 100a of the substrate 100. For example, the nozzle 21 may be provided at a position where the processing liquid can be supplied to the central region of the front surface 100a of the substrate 100. The nozzle 21 may have a discharge port 21a at an end thereof on the substrate 100 side. A space for guiding the processing liquid to the discharge port 21a can be provided inside the nozzle 21. A supply port for supplying the processing liquid into the nozzle 21 may be provided at an end of the nozzle 21 opposite to the discharge port 21a or at a side surface of the nozzle 21.

The nozzle 22 can be disposed outside the region where the plurality of rollers 11 are disposed. The nozzle 22 can be disposed below the rear surface 100b of the substrate 100. For example, the nozzle 22 may be provided at a position where the processing liquid can be supplied to the central region of the back surface 100b of the substrate 100. The nozzle 22 may have a discharge port 22a at an end thereof on the substrate 100 side. A space for guiding the processing liquid to the discharge port 22a can be provided inside the nozzle 22. A supply port for supplying the processing liquid into the nozzle 22 may be provided at an end of the nozzle 22 opposite to the discharge port 22a or at a side surface of the nozzle 22.

The treatment liquid supply unit 23 can supply the chemical liquid 101, which is one of the treatment liquids, to the

nozzles

21 and 22, for example. That is, the treatment liquid supply unit 23 can supply the chemical liquid 101 to the front surface 100a and the back surface 100b of the rotating substrate 100.

The chemical 101 may be used to dissolve at least a part of the foreign matter adhering to the front surface 100a and the back surface 100b of the substrate 100 to remove the foreign matter or to easily remove the foreign matter. For example, the chemical liquid 101 can be appropriately selected according to the size, composition, and the like of the foreign matter. The chemical liquid 101 may be, for example, ionized water (e.g., an acidic aqueous solution, an alkaline aqueous solution, or the like). More specifically, the chemical solution 101 may be, for example, ozone water (ozone-dissolved water), SC-1(Standard Claean 1: a mixed aqueous solution of ammonia and hydrogen peroxide), or the like. The type of the chemical liquid 101 is not limited to the example.

The treatment liquid supply unit 23 may include, for example, a water tank 23a, a supply unit 23b, and a treatment liquid control unit 23 c.

For example, the tank 23a may contain the medical fluid 101 therein.

The supply unit 23b can supply the chemical liquid 101 stored in the tank 23a to the

nozzles

21 and 22. The supply unit 23b may be, for example, a chemical pump.

The treatment liquid control portion 23c may be provided between the supply portion 23b and the

nozzles

21 and 22. The treatment liquid control unit 23c can control, for example, the flow rate, pressure, and the like of the chemical liquid 101. The treatment liquid controller 23c may control the supply and stop of the chemical liquid 101.

For example, the water tank 23a, the supply unit 23b, the treatment liquid control unit 23c, and pipes connecting these components can be formed of a material having high chemical resistance. For example, these can be formed from a fluorinated vinyl resin or the like, or coated with a fluorinated vinyl resin or the like.

The treatment liquid supply unit 24 can supply pure water 102, which is one of the treatment liquids, to the

nozzles

21 and 22, for example. That is, the processing liquid supply unit 24 can supply pure water 102 to the front surface 100a and the back surface 100b of the rotating substrate 100.

The treatment liquid supply unit 24 may include, for example, a water tank 24a, a supply unit 24b, and a treatment liquid control unit 24 c.

For example, water tank 24a may house pure water 102 inside.

Supply unit 24b can supply pure water 102 stored in tank 24a to

nozzles

21 and 22. The supply unit 24b may be, for example, a chemical pump.

The treatment liquid control portion 24c may be provided between the supply portion 24b and the

nozzles

21 and 22. Treatment liquid controller 24c can control the flow rate, pressure, and the like of pure water 102, for example. Further, treatment liquid controller 24c may control supply and stop of pure water 102.

The tank 24a, the supply unit 24b, the treatment liquid control unit 24c, and the pipes for connecting these are not necessarily formed of materials having high chemical resistance, but may be formed in the same manner as the treatment liquid supply unit 23. Since the processing liquid supply unit having the same configuration is provided in this manner, the manufacturing process of the substrate processing apparatus 1 can be simplified.

Although the case of supplying 2 kinds of treatment liquids has been described above, the kinds of treatment liquids may be 1 kind or 3 or more kinds. When 3 or more kinds of treatment liquids are supplied, for example, a treatment liquid supply unit having the same configuration as the treatment

liquid supply units

23 and 24 may be provided according to the kind of the treatment liquid. In this case, the nozzles may be provided for each treatment liquid, or 1 nozzle may be provided for a plurality of treatment liquids.

The processing unit 30 can process the surface 100a of the rotating substrate 100 with a brush. The processing unit 30 can move the rotating brush in a direction substantially parallel to the surface 100a of the substrate 100 while contacting the rotating brush to the surface 100a of the substrate 100. When the substrate 100 is not processed, the brush is positioned at a position (escape position) away from the substrate 100. Although described in detail later, the treatment unit 30 may have a plurality of brushes and may have a function of selecting a desired brush to use.

The processing unit 40 can process the back surface 100b of the rotating substrate 100 with a brush. The processing unit 40 can move the rotating brush in a direction substantially parallel to the back surface 100b of the substrate 100 while contacting the rotating brush with the back surface 100b of the substrate 100. When the substrate 100 is not processed, the brush is positioned at a position (escape position) away from the substrate 100. The treatment unit 40 may have a plurality of brushes, and may have a function of selecting a desired brush to use.

For example, in the case of a substrate processing apparatus that processes only the front surface 100a of the substrate 100, the processing unit 40 can be omitted. For example, in the case of a substrate processing apparatus that processes only the rear surface 100b of the substrate 100, the processing unit 30 can be omitted.

Here, the configuration of the processing unit 40 can be substantially the same as the configuration of the processing unit 30, except that the top and bottom are reversed. Therefore, the structure and operation of the processing unit 30 will be described below, and the structure and operation of the processing unit 40 will not be described.

Fig. 3 is a schematic sectional view illustrating the processing unit 30.

As shown in fig. 3, the treatment unit 30 may include a brush 31 (corresponding to an example of the 2 nd brush), a brush holder 31a, a brush moving unit 31b (corresponding to a part of the moving unit), a brush 32 (corresponding to an example of the 1 st brush), a brush holder 32a, a brush moving unit 32b (corresponding to a part of the moving unit), a base 33, a cover 33a, a rotary joint 35, a brush selecting unit 36, a rotating mechanism 37, a cover 37a, an arm 38, and an arm driving unit 39.

The brush 31 can be disposed to be opposed to the surface 100a of the substrate 100. The brush 31 may be, for example, a block-shaped brush containing resin. The brush 31 has, for example, a columnar shape (e.g., a cylindrical shape), and may be formed of a porous material that is easily elastically deformed. The brush 31 may be formed of, for example, a sponge containing resin. The brush 31 may be, for example, a so-called sponge brush. Examples of the resin include PVA (polyvinyl alcohol resin), P P (polypropylene resin), PFA (perfluoroalkoxy resin), and PTFE (polytetrafluoroethylene resin).

The resistance to drugs such as PP, PFA, PTFE, etc. is high. Therefore, when PP, PFA, PTFE, or the like is used, the treatment can be performed with the brush 31 while supplying the chemical solution 101 to the surface 100a of the substrate 100. For example, the foreign matter containing the organic matter can be physically removed by the brush 31 while dissolving the foreign matter with ozone water.

On the other hand, the resistance of PVA is low. Therefore, when the PVA is used, first, the chemical liquid 101 such as ozone water is supplied to the surface 100a of the substrate 100 to dissolve at least a part of the foreign matters attached to the surface 100a of the substrate 100, and after the adhesion force of the foreign matters is reduced, pure water may be supplied to the surface 100a of the substrate 100 and the substrate may be treated with the brush 31. Thus, even if the brush 31 made of a material having a low chemical resistance is used, the effect of supplying the chemical liquid 101 to the front surface 100a of the substrate 100 can be benefited.

Here, the PVA sponge has: a substrate part having a three-dimensional mesh structure; and a space surrounded by the substrate portion. Since the PVA sponge has a high volume ratio of space to the entire volume, the treatment liquid is easily held. In addition, PVA sponges tend to have increased flexibility and elasticity. Therefore, if the brush 31 is made of a PVA sponge, the end face of the brush 31 is easily brought into close contact with the surface 100a of the substrate 100. If the end of the brush 31 on the substrate 100 side can be brought into close contact with the surface 100a of the substrate 100, small foreign substances can be removed efficiently. Further, since the PVA sponge is made of a resin having low hardness and rigidity, it is possible to suppress the occurrence of damage on the surface 100a of the substrate 100.

The brush holder 31a may have a plate shape, for example. The brush 31 can be connected to one surface of the brush holder 31 a. The brush moving portion 31b can be connected to the other surface of the brush holder 31 a.

The brush moving unit 31b changes the position of the brush 31 in the direction intersecting the surface 100a of the substrate 100 via the brush holder 31 a. The brush moving unit 31b may be, for example, an air cylinder, a spiral tube, or the like. The brush moving portion 31b illustrated in fig. 3 is an air cylinder. When the brush moving part 31b is an air cylinder, the brush holder 31a is connected to an air cylinder shaft.

The brush 32 may have a cylindrical shape (e.g., a cylindrical shape), for example. The brush 31 can be disposed inside the brush 32. The brush 32 can be disposed opposite to the surface 100a of the substrate 100 and on the same axis as the brush 31. The brush 32 may be a brush having bristles, a so-called brush, for example. The bristles may contain a resin. The resin may be the same as in the case of the brush 31, for example. The relationship between the type of resin and the type of treatment liquid may be the same as in the case of the brush 31, for example.

The classification of the

brushes

31 and 32 is based on the relationship between the material of the

brushes

31 and 32 and the composition of the treatment liquid. However, the sorting use of the

brushes

31, 32 is not limited thereto. The use of the

brush

31, 32 in classification can also be based on the structure of the brush 31, 32 (sponge or brush), for example.

For example, when the size of the foreign matter is large (the size of the foreign matter is 50 μm or more), the foreign matter is less likely to enter between the bristles, and therefore, the bristles are likely to hit the foreign matter. If the brush bristles can be made to hit against foreign matter, a large force is applied to the foreign matter, and therefore the foreign matter can be removed efficiently. Therefore, when the size of the foreign matter is large, it is preferable to use a brush 32, which is a brush.

On the other hand, when the size of the foreign matter is small (the size of the foreign matter is less than 50 μm), it is difficult to apply a large force to the foreign matter since the foreign matter easily enters between the bristles. At this time, if foreign matter enters between the brush staples and gets caught on the foreign matter, the foreign matter can be removed. That is, if the foreign matter is in a size that is difficult to get caught by the brush bristles even if the foreign matter enters between the brush bristles, the foreign matter is difficult to be caught by the brush bristles.

At this time, if the brush 31, which is a sponge brush, is used, small foreign substances can be removed in a wiping manner.

Also, the brush 31 provided at the center side may have a columnar shape. Therefore, the area of the surface (end) contacting the front surface 100a of the substrate 100 is easily increased as compared with the case of a cylinder or the like. Since the sponge brush removes small foreign matter in a wiping manner, if the area of the tip end face is large, the foreign matter is easily captured accordingly. Therefore, if the sponge brush, i.e., the brush 31 is disposed on the center side, small foreign substances can be effectively removed.

For example, if the size of the foreign matter is 50 μm or more, it is preferable to use a brush 32 as a brush. If the size of the foreign matter is 20 μm or less, the brush 31, which is a sponge brush, is used, and if the size of the foreign matter is 20 μm to 50 μm, the foreign matter can be removed even by using the brush 31 or the brush 32.

The brush holder 32a may have a cylindrical shape, for example. One end of the brush holder 32a is opened, and the brush 32 can be disposed inside the opening. For example, a base (channel) or the like can be fixed to the inner wall of the brush holder 32a, and the brush is bound and fixed to the base (channel) or the like. A plate member is provided at the other end of the brush holder 32a, and the brush holder 32a can be connected to the brush moving portion 32 b.

The brush moving unit 32b changes the position of the brush 32 in the direction intersecting the front surface 100a of the substrate 100 via the brush holder 32 a. The brush moving unit 32b may be, for example, an air cylinder, a spiral tube, or the like. The brush moving portion 32b illustrated in fig. 3 is an air cylinder. When the brush moving part 32b is an air cylinder, the brush holder 32a is connected to an air cylinder shaft.

As described above, at least one of the brush 31 and the brush 32 can be moved in the direction intersecting the front surface 100a of the substrate 100 by using the moving portions of the brush moving portion 32a and the brush moving portion 32 b.

The brush 33 may have a plate shape, for example. The

brush moving portions

31b and 32b can be provided on one surface of the base 33. The rotating portion 35a of the rotary joint 35 can be connected to the other surface of the base 33.

The cover 33a may have a cylindrical shape, for example. One end of the cover 33a is opened, and the brush 31, the brush holder 31a, the brush moving portion 31b, the brush 32, the brush holder 32a, the brush moving portion 32b, and the base 33 can be provided therein. The other end of the cover 33a can be sealed by the plate material.

The rotary joint 35 may have a rotary portion 35a and a fixed portion 35 b. The rotating portion 35a and the fixed portion 35b are provided with flow passages, respectively, and the flow passage on the rotating portion 35a side and the flow passage on the fixed portion 35b side can be connected by a connecting surface. The pressurized air supplied to the

brush moving portions

31b and 32b can be sealed while sliding on the connection surface between the rotating portion 35a and the fixed portion 35 b.

The brush selector 36 can select at least one of the brush 31 and the brush 32 according to the processing conditions (for example, the composition of the processing liquid, the size of the foreign matter, and the like). Since the

brush moving portions

31b and 32b illustrated in fig. 3 are air cylinders, the brush selecting portion 36 may include 3-

way solenoid valves

36a and 36b, for example. For example, the cylinder ports of the 3-way

electromagnetic valves

36a and 36b may be connected to the fixing portion 35b of the rotary joint 35, and the supply ports of the 3-way

electromagnetic valves

36a and 36b may be connected to the pressurized air supply source 36 c.

Further, although the above description is made of the case where the

brush moving portions

31b and 32b are air cylinders, when the

brush moving portions

31b and 32b are electrical components such as a solenoid, for example, the rotary joint 35 may be formed as a slip ring or the like, and the brush selecting portion 36 may be formed as a switch circuit having a transistor or the like.

The rotation mechanism 37 may be provided to the arm 38, for example. The rotating mechanism 37 can rotate the brush 32 and the brush 31 provided coaxially with the brush 32 around the shaft. The rotation mechanism 37 can control the rotation speed and the rotation direction. The rotation mechanism 37 may be provided with a control motor such as a servo motor.

The cover 37a is cylindrical and covers the rotating mechanism 37. One end of the cover 37a may be provided to the arm 38. The other end of the cover 37a can be provided with a fixing portion 35b of the rotary joint 35.

The arm 38 holds the brush 31, the brush holder 31a, the brush moving portion 31b, the brush 32, the brush holder 32a, the brush moving portion 32b, the base 33, the cover 33a, the rotary joint 35, the rotating mechanism 37, and the cover 37a at one end portion side, and can change the positions of these elements to be held. The arm 38 can rotate around an axis parallel to an axis substantially perpendicular to the surface 100a of the substrate 100 as a rotation center, for example. That is, the arm 38 can change the positions of the

brushes

31 and 32 in the direction substantially parallel to the surface 100a of the substrate 100. For example, when the surface 100a of the substrate 100 is processed, the arm 38 can change the positions of the

brushes

31, 32 so that the

brushes

31, 32 are positioned above the surface 100a of the substrate 100. When the substrate 100 is transferred to and from the support portion 11a of the plurality of rollers 11, the arm 38 can retract the

brushes

31 and 32 to the outside of the region where the plurality of rotation holding portions 10 are provided.

The arm driving unit 39 may include a control motor such as an air cylinder or a servomotor.

Next, selection of the

brushes

31 and 32 will be further described.

Fig. 4(a) to 7(b) are schematic views illustrating selection of the

brushes

31 and 32. As shown in fig. 4(a) and (b), when the

brushes

31 and 32 are not used, the

brushes

31 and 32 can be housed inside the cover 33 a. This can prevent the

brushes

31 and 32 from being soiled or damaged.

As shown in fig. 5(a) and (b), when the brush 31 is used and the brush 32 is not used, the brush 31 can be projected toward the substrate 100. In this way, the substrate 100 can be processed only by the brush 31. The brush selection unit 36 can select the projecting operation of the brush moving unit 31b to project the brush 31.

As shown in fig. 6(a) and (b), when the brush 32 is used and the brush 31 is not used, the brush 32 can be protruded toward the substrate 100. In this way, the substrate 100 can be processed only by the brush 32. The brush selection unit 36 can select the projecting operation of the brush moving unit 32b to project the brush 32.

As shown in fig. 7(a) and (b), when the

brushes

31 and 32 are used, the

brushes

31 and 32 can be projected toward the substrate 100. In this way, the substrate 100 can be processed by the

brushes

31 and 32. The brush selection unit 36 can select the projecting operation of the

brush moving units

31b and 32b to project the

brushes

31 and 32.

The

brushes

31 and 32 may be further pressed from the position contacting the surface 100a of the substrate 100. If the amount of pushing in the

brushes

31 and 32 is increased, the tips of the

brushes

31 and 32 easily hit foreign matter adhering to the surface 100a of the substrate 100, and therefore the foreign matter can be effectively removed. On the other hand, if the amount of pushing in the

brushes

31 and 32 is reduced, the friction between the tips of the

brushes

31 and 32 and the surface 100a of the substrate 100 is reduced, and therefore, the surface 100a of the substrate 100 can be prevented from being damaged.

For example, the amount of pushing in the

brushes

31 and 32 can be adjusted by adjusting the amount of protrusion of the

brush moving portions

31b and 32 b. Further, the arm 38 may be provided with a lifting mechanism, and the amount of pushing in the

brushes

31 and 32 may be adjusted by the lifting operation of the arm 38. For example, the amount of pressing the

brushes

31 and 32 can be appropriately changed according to the material of the surface 100a of the substrate 100, the size and composition of the foreign matter, and the material and configuration of the

brushes

31 and 32. For example, the amount of pressing the

brushes

31 and 32 may be determined in advance by experiments and simulations based on these conditions.

In the above description, the used brush is projected toward the substrate 100, but the unused brush may be retracted in a direction away from the substrate 100. That is, when only the brush 31 is used, the brush 31 may be in a state of being relatively protruded with respect to the brush 32, and when only the brush 32 is used, the brush 32 may be in a state of being relatively protruded with respect to the brush 31.

The controller 50 may include an arithmetic unit such as a cpu (central Processing unit) and a storage unit such as a memory. The controller 50 may be, for example, a computer or the like.

The controller 50 can control the operations of the elements provided in the substrate processing apparatus 1, for example, according to a control program stored in the storage unit.

Here, the composition, size, and the like of the foreign matter adhering to the front surface 100a and the back surface 100b of the substrate 100 may be known in advance. In this case, information on the composition, size, and the like of the foreign matter may be input to the controller 50, and the front surface 100a and the back surface 100b of the substrate 100 may be processed using an appropriate brush.

On the other hand, the components, sizes, and the like of the foreign substances adhering to the front surface 100a and the back surface 100b of the substrate 100 are not always the same. For example, the material of the substrate 100 subjected to the CMP process (e.g., whether or not a metal film is formed), the conditions of the CMP process (e.g., the amount of polishing), and the like may change, such as the composition and size of the foreign matter adhering to the front surface 100a and the back surface 100b of the substrate 100. Therefore, for example, when the material of the substrate 100, the CMP processing conditions, or the like change, it is preferable to measure the components, sizes, and the like of foreign substances adhering to the front surface 100a and the back surface 100b of the substrate 100 using a particle inspection apparatus or the like, and to input the measured data to the controller 50 again.

Next, the operation of the substrate processing apparatus 1 will be exemplified.

Hereinafter, a case where the brush 31 and the brush 32 are selected will be described.

At this time, the brush 32 (brush) is first selected to remove the large foreign matter existing on the substrate 100 after the CMP process. Thereafter, the brush 31 (sponge brush) is selected to remove the aforementioned small foreign substances present on the substrate 100. When the brush 31 is selected from the brush 32, the replacement work (the brush projecting operation) of the

brushes

31 and 32 is performed on the front surface 100a of the substrate 100. In this way, the replacement operation of the

brushes

31 and 32 can be performed without moving the

brushes

31 and 32 to the retracted position outside the substrate 100. Therefore, according to the substrate processing apparatus 1, since the

brushes

32 and 31 can be replaced on the substrate 100, the replacement time of the

brushes

31 and 32 can be shortened, and the production efficiency of the substrate 100 can be improved.

Fig. 8 is a flowchart illustrating the operation of the substrate processing apparatus 1.

As shown in fig. 8, the substrate 100 before processing is first carried into the substrate processing apparatus 1 by a not-shown carrying apparatus or the like (step St 1).

The substrate 100 carried in is placed on the support portions 11a of the plurality of rollers 11 (step St 2).

Next, the plurality of rollers 11 are moved in the direction of approaching the substrate 100, and the substrate 100 is held by the plurality of holding portions 11b (step St 3).

Next, the plurality of rollers 11 are rotated to rotate the substrate 100 (step St 4).

Next, the processing liquid is supplied to the front surface 100a and the back surface 100b of the substrate 100 (step St 5).

The treatment liquid can be appropriately selected according to the composition, size, and the like of the foreign matter. The selected processing liquid can be supplied to the front surface 100a and the back surface 100b of the substrate 100 by the processing liquid supply unit 23 or the processing liquid supply unit 24.

Next, a brush to be used is selected, and the selected brush is relatively projected (step St 6).

Next, the front surface 100a and the back surface 100b of the substrate 100 are processed with the selected brush (step St 7).

For example, the rotating mechanism 37 rotates the brush, and the rotating brush is pressed against the front surface 100a and the back surface 100b of the substrate 100. Thereafter, the brush is moved so as to traverse the front surface 100a and the back surface 100b of the substrate 100, for example, by rotating the arm 38.

In this case, as described above, the amount of the brush to be pushed in can be appropriately changed according to the material of the front surface 100a and the back surface 100b of the substrate 100, the size and composition of the foreign matter, and the material and configuration of the brush.

The rotation speed of the brush can be appropriately changed according to the structure of the brush and the like.

For example, if the brush 31 is a sponge brush, if the rotation speed of the brush 31 is set to 500 to 1000rp m, the treatment liquid is likely to be caught between the surface of the brush 31 contacting the substrate 100 and the front and

back surfaces

100a and 100b of the substrate 100, and therefore, the contact between the brush 31 and the front and

back surfaces

100a and 100b of the substrate 100 is inhibited, and the contact between the brush 31 and the foreign matter may be inhibited, and the foreign matter removal effect may be reduced.

When the brush 31 is a sponge brush, if the rotation speed of the brush 31 is set to 500 to 1000rpm, the treatment liquid enters between the brush 31 and the substrate 100 to form a thick liquid film. Although the brush 31 moves to slide on the thick liquid film, the liquid film formed on the substrate 100 is thick, and therefore the brush 31 is hard to contact foreign substances on the substrate 100, and thus it is difficult to remove the foreign substances.

On the other hand, when the brush 32 is a fur brush, the treatment liquid is not caught between the tip end surfaces of the fur bristles and the front and

back surfaces

100a and 100b of the substrate 100 even when the rotation speed of the brush 32 is set to 500 to 1000 rpm. Further, if the rotational speed of the brush 32 is set to be higher than that of the brush 31, the brush bristles hit against foreign matter as if they hit against them, and therefore the foreign matter removal effect can be improved. Therefore, the rotation speed of the brush 32 is preferably larger than that of the brush 31.

As illustrated in fig. 3 and the like, the brush 31 is provided on the center side, and the brush 32 is provided on the outer side of the brush 31 substantially coaxially with the brush 31. When the brushes 31, 32 are used simultaneously, the circumferential speed of the brush 31 is smaller than the circumferential speed of the brush 32, although the rotational speeds of the

brushes

31, 32 are the same. Therefore, foreign matter can be removed effectively.

If the brush 31 is provided on the center side, the circumferential speed of the brush 31 is smaller than the circumferential speed of the brush 32, and the above-described entanglement of the treatment liquid and increase in the thickness of the liquid film can be suppressed. Therefore, foreign matter can be removed effectively.

Further, the circumferential speed of the brush 31 is also smaller than the circumferential speed of the brush 32 as described above when the

brushes

31 and 32 are coaxial, not limited to the case where the

brushes

31 and 32 are used at the same time. Thus, considering the properties of the sponge brush described above, if the sponge brush, i.e., the brush 31, is provided on the center side, the circumferential speed of the brush 31 is less likely to be increased, which is preferable. When the brush 31 or the brush 32 is used, the circumferential speeds may be set to appropriate values.

The rotation speed of the brush may be changed according to the positions of the front surface 100a and the back surface 100b of the substrate 100. For example, the rotation speed of the brush may be slowed in the central region of the front and

back surfaces

100a and 100b of the substrate 100, and increased in the peripheral region.

The number of times the brush moves so as to traverse the brush on the front surface 100a and the back surface 100b of the substrate 100 may be appropriately changed according to the composition, size, number, and the like of the foreign matter, the material, configuration, and the like of the brush, and the like. For example, the number of times of moving the brush on the front surface 100a and the back surface 100b of the substrate 100 may be one, more preferably, the brush may reciprocate several times, more preferably.

The moving speed of the brush on the front surface 100a and the back surface 100b of the substrate 100 may be changed according to the position of the front surface 100a and the back surface 100b of the substrate 100. As described above, the center area of the front surface 100a and the back surface 100b of the substrate 100 has a small processing area, and the peripheral area has a large processing area. Therefore, the moving speed of the brush may be increased in the center area of the front and

rear surfaces

100a and 100b of the substrate 100, and decreased in the peripheral area. If the moving speed of the brush in the peripheral region is reduced, the staying time of the brush can be prolonged, and therefore, the adhered foreign matters can be effectively removed even if the treatment area is large.

When the front surface 100a and the back surface 100b of the substrate 100 are further processed by changing the type of the processing liquid or the type of the brush, the processing may be performed in the same order as in steps St5 to St 7.

Further, the order of the order illustrated in step St4 to step St7 may be changed as appropriate. For example, the selected brush may be projected and rotated before the treatment liquid is supplied. For example, the treatment liquid may be supplied after the rotating brush is pressed against the front surface 100a and the back surface 100b of the substrate 100.

Next, the processed substrate 100 is carried out of the substrate processing apparatus 1 (step St 8).

For example, the brush is retracted by the rotating arm 38 to the outside of the region where the plurality of rotation holding portions 10 are provided, and the rotation of the substrate 100 is stopped. Thereafter, the plurality of rollers 11 are moved in a direction away from the substrate 100, and the plurality of holding portions 11b release the holding of the substrate 100. The unillustrated transport device takes out the substrate 100 placed on the support portions 11a of the plurality of rollers 11 and transports the substrate to the outside of the substrate processing apparatus 1.

Fig. 9 is a schematic view illustrating brushes 131 to 134 according to another embodiment.

Fig. 4 and the like illustrate the case where 2 brushes 31 and 32 are provided, but 3 or more brushes may be provided.

For example, 4 brushes (brushes 131 to 134) may be provided as shown in FIG. 9. In this case, the material and the structure of the brush may be different from each other or the same. If the number and the type of the brush are increased, it is easy to appropriately cope with different components and sizes of the foreign matter. It is also possible to use the 1 st brush as 134, the 2 nd brush as 131, the 3 rd brush as 133 and the 4 th brush as 132.

Although fig. 9 illustrates the case where the thicknesses T of the brushes 132 to 134 are made substantially the same, the thicknesses of the brushes 132 to 134 may be made different. At this time, the circumferential length of the brush disposed on the inner side is smaller than the circumferential length of the brush disposed on the outer side. Therefore, if the thickness of the brush provided on the inner side is made larger than the thickness of the brush provided on the outer side, the difference in the cross-sectional area, that is, the contact area can be reduced. This can reduce the difference in foreign matter removal capability due to the difference in contact area between the brush and the front and

back surfaces

100a and 100b of the substrate 100.

The thickness of the brush may be appropriately determined according to, for example, the treatment conditions, the removal performance required for the brush, the frequency of use of the brush, and the like.

Fig. 10 is a schematic diagram illustrating brushes 135 and 136 according to another embodiment. Although fig. 4 and the like illustrate the case where 2 types of

brushes

31 and 32 having different materials and different structures are provided, a plurality of brushes having the same material and the same structure may be provided.

For example, as shown in fig. 10, 2 brushes (brushes 135, 136) or 2 sponge brushes (brushes 135, 136) may be provided.

Here, if the operator of the substrate processing apparatus wants to replace the brush, the brush replacement time becomes long. Further, even if the brush is moved to the outside of the area where the substrate is processed, if the brush is to be automatically replaced outside the area where the substrate is processed, the replacement time of the brush becomes long at least for the portion moved between the processing position and the replacement place of the brush.

In this case, for example, when the material and the configuration of the brush are changed to different ones depending on the composition and the size of the foreign matter, the composition of the treatment liquid, and the like, the brush is replaced.

Alternatively, for example, when the tip of the brush is deformed or worn with the use of the brush and changed to a new brush of the same type, the brush is replaced.

The substrate processing apparatus 1 according to the present embodiment includes a plurality of brushes and has a function of selecting a desired brush to use. Therefore, in the area where the substrate is processed, the brush can be easily replaced. In this case, the brush can be replaced with a different type of brush or a new brush of the same type. Therefore, the replacement time of the brush can be shortened, so that the productivity can be improved.

The embodiments are exemplified above. However, the present invention is not limited to the above description.

In the above-described embodiments, a technique of appropriately adding, removing, or changing the design of the components by those skilled in the art is also included in the scope of the present invention as long as the features of the present invention are provided.

For example, the shape, size, material, arrangement, and the like of the elements provided in the substrate processing apparatus 1 are not limited to those exemplified, and can be appropriately changed.

Further, each element included in each of the above embodiments may be combined as long as the technique is technically feasible, and the technique in which these are combined is also included in the scope of the present invention as long as the feature of the present invention is included.

Claims

1. A substrate processing apparatus is characterized in that,

the disclosed device is provided with: a rotation holding unit capable of rotating the substrate held;

a 1 st brush disposed to be opposite to one surface of the substrate;

a 2 nd brush disposed opposite to one surface of the substrate and on a same axis as the 1 st brush;

a moving unit configured to move the 1 st brush and the 2 nd brush in a direction intersecting one surface of the substrate;

and an arm capable of changing positions of the 1 st brush and the 2 nd brush in a direction substantially parallel to one surface of the substrate.

2. The substrate processing apparatus according to claim 1,

the first brush 1 is in a cylindrical shape,

the 2 nd brush is disposed inside the 1 st brush.

3. The substrate processing apparatus according to claim 1 or 2, wherein an area of the substrate-side end portion of the 2 nd brush is larger than an area of the substrate-side end portion of the 1 st brush.

4. The substrate processing apparatus according to any one of claims 1 to 3,

the 1 st brush is a brush,

the 2 nd brush is a block-shaped brush containing resin.

5. The substrate processing apparatus according to claim 4, wherein the moving unit presses the 1 st brush against the surface of the substrate to remove the foreign matter, and then lifts the 1 st brush and presses the 2 nd brush against the surface of the substrate to remove the foreign matter.

6. The substrate processing apparatus according to claim 1,

further provided with: a 3 rd brush disposed to be opposite to one surface of the substrate and on a same axis as the 1 st brush;

and a 4 th brush disposed to be opposed to one surface of the substrate and coaxially with the 1 st brush,

the 1 st brush, the 3 rd brush and the 4 th brush are cylindrical,

the 3 rd brush is disposed inside the 1 st brush,

the 4 th brush is disposed inside the 3 rd brush,

the 2 nd brush is disposed inside the 4 th brush.