CN112575298A - Machining process for preventing point discharge during vacuum sputtering - Google Patents
Machining process for preventing point discharge during vacuum sputtering Download PDFInfo
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- CN112575298A CN112575298A CN202011412846.8A CN202011412846A CN112575298A CN 112575298 A CN112575298 A CN 112575298A CN 202011412846 A CN202011412846 A CN 202011412846A CN 112575298 A CN112575298 A CN 112575298A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/028—Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M3/00—Investigating fluid-tightness of structures
- G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to the field of vacuum sputtering of blades, in particular to a processing technology for preventing point discharge during vacuum sputtering, which comprises blade surface treatment, vacuum sputtering equipment detection and blade vacuum sputtering processing, wherein the blade vacuum sputtering comprises the following steps: s1, placing: opening a vacuum sputtering equipment door, placing the blade with the surface treated in the vacuum sputtering equipment, clamping and fixing the blade through an included angle in the vacuum sputtering equipment, and then closing the vacuum sputtering equipment door; s2, starting a vacuum pump: starting a vacuum pump, pumping out air in the vacuum sputtering equipment, and reducing the pressure intensity in the vacuum sputtering equipment; s3, starting the vacuum sputtering equipment: when a specified pressure is reached. The invention has the advantages of preventing the point discharge when the blade is sputtered in vacuum, not only improving the quality of the blade in vacuum sputtering, but also improving the safety of the blade during vacuum sputtering processing, and avoiding the point discharge when the burr phenomenon occurs on the blade in vacuum sputtering.
Description
Technical Field
The invention relates to the field of vacuum sputtering of blades, in particular to a machining process for preventing point discharge during vacuum sputtering.
Background
Vacuum sputtering mainly uses glow discharge to make argon ions impact on the target material surface. Mainly uses glow discharge to make argon ions impact the surface of the target material, and the atoms of the target material are ejected and accumulated on the surface of the substrate to form a film. The properties and uniformity of the sputtered film are better than those of the evaporated film, but the coating speed is much slower than that of the evaporated film. The novel sputtering equipment almost uses a powerful magnet to enable electrons to move spirally so as to accelerate argon ionization around a target material, so that the collision probability between the target and argon ions is increased, and the sputtering speed is improved. Generally, direct current sputtering is adopted for metal coating, RF alternating current sputtering is adopted for non-conductive ceramic materials, the basic principle is that argon ions are impacted on the surface of a target by glow discharge in vacuum, positive ions in the plasma are accelerated to impact the surface of a negative electrode serving as a sputtered material, and the impact enables substances of the target to fly out to be deposited on a substrate to form a thin film.
Chinese patent No. CN105132872B provides an improved vacuum sputtering surface treatment method, which comprises the following steps: (1) pre-treating the surface of a workpiece to be treated; (2) spraying UV medium paint and ultraviolet curing or medium powder (medium paint) thermal curing; (3) and performing vacuum sputtering chromium plating to obtain a chromium-plated workpiece. The invention provides an improved vacuum sputtering surface treatment method with low reject ratio, low cost and good environmental protection, which does not need to spray varnish for protection.
The existing vacuum sputtering machining process is easy to generate the point discharge phenomenon during the vacuum sputtering of the blade, so that the quality of the blade during the vacuum sputtering is reduced, the safety during the vacuum sputtering machining is influenced, the point discharge phenomenon is easy to generate during the vacuum sputtering when the burr phenomenon occurs on the blade, and the defect is overcome, so that the machining process for preventing the point discharge during the vacuum sputtering is urgently needed to be developed.
Disclosure of Invention
The invention aims to provide a processing technology for preventing the generation of point discharge during vacuum sputtering, which aims to solve the problems that the quality of a blade during vacuum sputtering is reduced and the safety during vacuum sputtering is influenced because the point discharge phenomenon is easy to occur during the vacuum sputtering of the blade, which is proposed in the background technology.
The technical scheme of the invention is as follows: a machining process for preventing point discharge from being generated during vacuum sputtering comprises blade surface treatment, vacuum sputtering equipment detection and blade vacuum sputtering machining, wherein the blade vacuum sputtering comprises the following steps:
s1, placing: opening a vacuum sputtering equipment door, placing the blade with the surface treated in the vacuum sputtering equipment, clamping and fixing the blade through an included angle in the vacuum sputtering equipment, and then closing the vacuum sputtering equipment door;
s2, starting a vacuum pump: starting a vacuum pump, pumping out air in the vacuum sputtering equipment, and reducing the pressure intensity in the vacuum sputtering equipment;
s3, starting the vacuum sputtering equipment: when the pressure reaches the designated pressure, starting vacuum sputtering equipment, and carrying out vacuum sputtering processing on the blade by the vacuum sputtering equipment;
s4, pressure relief: after the blade is subjected to vacuum sputtering processing, opening a valve on the vacuum sputtering equipment, and introducing air into the vacuum sputtering equipment;
s5, taking out: when the air pressure in the vacuum sputtering equipment is consistent with the outside, the door of the vacuum sputtering equipment is opened, the included angle for clamping the blade is loosened, and the blade is taken out.
Further, the blade surface treatment comprises the following steps:
A1. polishing: placing the blade on a grinding machine, and starting the grinding machine to grind two surfaces of the blade;
A2. cleaning: polishing the blade, placing the blade into a cleaning machine for cleaning, and then taking out the blade;
A3. drying: placing the cleaned blade into a drying box, starting the drying box, and drying the moisture on the surface of the blade by the drying box;
A4. and (3) cooling: and taking the dried blade out of the drying box, and then taking the blade out for cooling.
Further, the detection of the vacuum sputtering equipment comprises the following steps:
B1. cleaning: opening a door of the vacuum sputtering equipment, and cleaning the interior of the vacuum sputtering equipment through a dust collector;
B2. and (3) detection: then closing the door of the vacuum sputtering equipment, starting a vacuum pump of the vacuum sputtering equipment, and detecting the sealing effect of the vacuum sputtering equipment;
B3. pasting: and opening the door of the vacuum sputtering equipment after the vacuum sputtering equipment is detected to be qualified, and flatly adhering the insulating film on the inner wall of the vacuum sputtering equipment.
Further, in the step S2, the vacuum pump reduces the internal pressure of the vacuum sputtering device to-6 to-8 Pa, and keeps the vacuum sputtering of the blade to be finished.
Further, in the step a1, the double-end-face grinding device is adopted as the grinding machine, and the double-end-face grinding device simultaneously grinds two faces of the blade.
Further, in the step A2, the water temperature of the cleaning machine is 40-45 ℃, and the cleaning time is 2-3 min.
Further, in the A3, the temperature set in the drying box is 100-120 ℃, and the drying time is 3-4 min.
Further, in the A4, the temperature of the blade cooling space is 25-30 ℃, and the temperature of the blade body is reduced to a specified position.
Further, in B2, the vacuum pump reduces the pressure in the vacuum sputtering equipment to-10 to-11 Pa, and the pressure is kept for 5-6 min.
Further, in the B3, the insulating film is one or more of a polyethylene film, a polyvinylidene fluoride film, a polyimide film and a polytetrafluoroethylene film, and the thickness of the insulating film is set to 2 to 2.5 mm.
The invention provides a processing technology for preventing point discharge from generating in vacuum sputtering through improvement, compared with the prior art, the processing technology has the following improvements and advantages:
(1) the insulating film is adhered to the inner wall detected by the vacuum sputtering equipment, and the insulating film can prevent the inner wall of the vacuum sputtering equipment from generating point discharge when the blade is subjected to vacuum sputtering, so that the point discharge can be prevented when the blade is subjected to vacuum sputtering, the quality of the blade in vacuum sputtering is improved, and the safety of the blade during vacuum sputtering is improved.
(2) The blade surface treatment process is adopted, the blade is polished and cleaned before vacuum sputtering machining, the surface cleanliness of the blade is improved, the quality and the qualification rate of the blade during the subsequent vacuum sputtering machining can be improved, the phenomenon that the blade is speckled on the surface after the vacuum sputtering machining is avoided, and meanwhile, the phenomenon that the blade is burred on the blade and the point discharge occurs during the vacuum sputtering machining can be avoided.
(3) The vacuum sputtering equipment is detected, the inside of the vacuum sputtering equipment is cleaned through the detection process of the vacuum sputtering equipment, the cleanliness of the vacuum sputtering equipment can be guaranteed, the quality of the blade during vacuum sputtering is improved, the occurrence of faults during the vacuum sputtering of the blade can be reduced through the detection of the vacuum sputtering equipment, and the yield of the blade during the vacuum sputtering is improved.
Drawings
The invention is further explained below with reference to the figures and examples:
FIG. 1 is a flow chart of the vacuum sputtering process for a blade of the present invention;
FIG. 2 is a flow chart of the blade surface treatment of the present invention;
FIG. 3 is a flow chart of the vacuum sputtering apparatus of the present invention.
Detailed Description
The present invention will be described in detail with reference to fig. 1 to 3, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a processing technology for preventing point discharge generation during vacuum sputtering by improvement, as shown in figures 1-3, comprising blade surface treatment, vacuum sputtering equipment detection and blade vacuum sputtering processing, wherein the blade vacuum sputtering comprises the following steps:
s1, placing: opening a vacuum sputtering equipment door, placing the blade with the surface treated in the vacuum sputtering equipment, clamping and fixing the blade through an included angle in the vacuum sputtering equipment, and then closing the vacuum sputtering equipment door;
s2, starting a vacuum pump: starting a vacuum pump, pumping out air in the vacuum sputtering equipment, reducing the pressure in the vacuum sputtering equipment, reducing the internal pressure of the vacuum sputtering equipment to-8 Pa by the vacuum pump, and keeping the vacuum sputtering of the blade to be finished all the time;
s3, starting the vacuum sputtering equipment: when the pressure reaches the designated pressure, starting vacuum sputtering equipment, and carrying out vacuum sputtering processing on the blade by the vacuum sputtering equipment;
s4, pressure relief: after the blade is subjected to vacuum sputtering processing, opening a valve on the vacuum sputtering equipment, and introducing air into the vacuum sputtering equipment;
s5, taking out: when the air pressure in the vacuum sputtering equipment is consistent with the outside, the door of the vacuum sputtering equipment is opened, the included angle for clamping the blade is loosened, and the blade is taken out.
Further, the blade surface treatment comprises the following steps:
A1. polishing: placing the blade on a grinding machine, starting the grinding machine to grind two surfaces of the blade, wherein the grinding machine adopts double-end-surface grinding equipment, and the double-end-surface grinding equipment simultaneously grinds two surfaces of the blade;
A2. cleaning: polishing the blade, placing the blade into a cleaning machine for cleaning, wherein the water temperature is 45 ℃ and the cleaning time is 3min, and then taking out the blade;
A3. drying: placing the cleaned blade into a drying box, starting the drying box, wherein the temperature in the drying box is 120 ℃, the drying time is 4min, and the drying box dries the moisture on the surface of the blade;
A4. and (3) cooling: and taking the dried blade out of the drying box, taking the blade out for cooling, wherein the temperature of the blade cooling space is 30 ℃, and reducing the temperature of the blade body to a specified position.
Further, the detection of the vacuum sputtering equipment comprises the following steps:
B1. cleaning: opening a door of the vacuum sputtering equipment, and cleaning the interior of the vacuum sputtering equipment through a dust collector;
B2. and (3) detection: then closing the door of the vacuum sputtering equipment, starting a vacuum pump of the vacuum sputtering equipment, reducing the pressure in the vacuum sputtering equipment to-11 Pa by the vacuum pump, keeping the pressure for 6min, and detecting the sealing effect of the vacuum sputtering equipment;
B3. pasting: and opening the door of the vacuum sputtering equipment after the vacuum sputtering equipment is detected to be qualified, and flatly adhering the insulating film on the inner wall of the vacuum sputtering equipment.
Further, in S2, the vacuum pump reduces the internal pressure of the vacuum sputtering apparatus to-8 Pa and keeps the blade vacuum sputtering to end.
Further, in a1, the polisher is a double-end polishing device, and the double-end polishing device simultaneously polishes both surfaces of the blade.
Further, in A2, the temperature of the water used in the washing machine was 45 ℃ and the washing time was 3 min.
Further, in A3, the temperature set in the drying oven was 120 ℃ and the drying time was 4 min.
Further, in a4, the temperature of the insert cooling space was 30 ℃, and the insert body temperature was lowered to the specified position.
Further, in B2, the vacuum pump reduced the pressure in the vacuum sputtering apparatus to-11 Pa, and the pressure was maintained for 6 min.
Further, in B3, the insulating film used was one or more of a polyethylene film, a polyvinylidene fluoride film, a polyimide film and a polytetrafluoroethylene film, and the thickness of the insulating film was set to 2.5 mm.
The working principle is as follows: placing a blade on a grinding machine, starting the grinding machine to grind two surfaces of the blade, wherein the grinding machine adopts double-end-surface grinding equipment, the double-end-surface grinding equipment simultaneously grinds two surfaces of the blade, the blade after grinding is placed in a cleaning machine to be cleaned, the cleaning machine adopts water temperature of 40-45 ℃ and the cleaning time is 2-3min, then taking out the blade, placing the cleaned blade in a drying box, starting the drying box, the temperature in the drying box is 100-120 ℃, the drying time is 3-4min, the drying box dries the moisture on the surface of the blade, the dried blade is taken out of the drying box, then taking out the blade to be cooled, the temperature of a blade cooling space is 25-30 ℃, the temperature of a blade body is reduced to a designated position, opening a vacuum sputtering equipment door, and cleaning the interior of the vacuum sputtering equipment through a dust collector, then closing the door of the vacuum sputtering equipment, starting a vacuum pump of the vacuum sputtering equipment, reducing the pressure in the vacuum sputtering equipment to-10 to-11 Pa by the vacuum pump, keeping the pressure for 5-6min, detecting the sealing effect of the vacuum sputtering equipment, opening the door of the vacuum sputtering equipment after the vacuum sputtering equipment is detected to be qualified, flatly adhering the insulating film on the inner wall of the vacuum sputtering equipment, opening the door of the vacuum sputtering equipment, placing the blade with the processed surface in the vacuum sputtering equipment, clamping and fixing the blade through an included angle in the vacuum sputtering equipment, then closing the door of the vacuum sputtering equipment, starting the vacuum pump, pumping out the air in the vacuum sputtering equipment, reducing the pressure in the vacuum sputtering equipment to-6 to-8 Pa by the vacuum pump, and keeping the vacuum sputtering of the blade to be finished, when the specified pressure is reached, starting the vacuum sputtering equipment, carrying out vacuum sputtering processing on the blade by the vacuum sputtering equipment, opening a valve on the vacuum sputtering equipment after the vacuum sputtering processing of the blade is completed, introducing air into the vacuum sputtering equipment, opening the door of the vacuum sputtering equipment when the air pressure in the vacuum sputtering equipment is consistent with the outside, loosening an included angle for clamping the blade, and taking out the blade.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A processing technology for preventing point discharge during vacuum sputtering is characterized in that: the method comprises blade surface treatment, vacuum sputtering equipment detection and blade vacuum sputtering processing, wherein the blade vacuum sputtering comprises the following steps:
s1, placing: opening a vacuum sputtering equipment door, placing the blade with the surface treated in the vacuum sputtering equipment, clamping and fixing the blade through an included angle in the vacuum sputtering equipment, and then closing the vacuum sputtering equipment door;
s2, starting a vacuum pump: starting a vacuum pump, pumping out air in the vacuum sputtering equipment, and reducing the pressure intensity in the vacuum sputtering equipment;
s3, starting the vacuum sputtering equipment: when the pressure reaches the designated pressure, starting vacuum sputtering equipment, and carrying out vacuum sputtering processing on the blade by the vacuum sputtering equipment;
s4, pressure relief: after the blade is subjected to vacuum sputtering processing, opening a valve on the vacuum sputtering equipment, and introducing air into the vacuum sputtering equipment;
s5, taking out: when the air pressure in the vacuum sputtering equipment is consistent with the outside, the door of the vacuum sputtering equipment is opened, the included angle for clamping the blade is loosened, and the blade is taken out.
2. The process of claim 1, wherein the step of preventing the occurrence of the point discharge during the vacuum sputtering comprises: the blade surface treatment comprises the following steps:
A1. polishing: placing the blade on a grinding machine, and starting the grinding machine to grind two surfaces of the blade;
A2. cleaning: polishing the blade, placing the blade into a cleaning machine for cleaning, and then taking out the blade;
A3. drying: placing the cleaned blade into a drying box, starting the drying box, and drying the moisture on the surface of the blade by the drying box;
A4. and (3) cooling: and taking the dried blade out of the drying box, and then taking the blade out for cooling.
3. The process of claim 1, wherein the step of preventing the occurrence of the point discharge during the vacuum sputtering comprises: the detection of the vacuum sputtering equipment comprises the following steps:
B1. cleaning: opening a door of the vacuum sputtering equipment, and cleaning the interior of the vacuum sputtering equipment through a dust collector;
B2. and (3) detection: then closing the door of the vacuum sputtering equipment, starting a vacuum pump of the vacuum sputtering equipment, and detecting the sealing effect of the vacuum sputtering equipment;
B3. pasting: and opening the door of the vacuum sputtering equipment after the vacuum sputtering equipment is detected to be qualified, and flatly adhering the insulating film on the inner wall of the vacuum sputtering equipment.
4. The process of claim 1, wherein the step of preventing the occurrence of the point discharge during the vacuum sputtering comprises: in the step S2, the vacuum pump reduces the internal pressure of the vacuum sputtering device to-6 to-8 Pa, and the vacuum sputtering of the blade is kept to be finished.
5. The process of claim 2, wherein the step of preventing the occurrence of the point discharge during the vacuum sputtering comprises: in A1, the polisher adopts double-end-face polishing equipment, and the double-end-face polishing equipment simultaneously polishes two faces of the blade.
6. The process of claim 2, wherein the step of preventing the occurrence of the point discharge during the vacuum sputtering comprises: in the step A2, the water temperature of the cleaning machine is 40-45 ℃, and the cleaning time is 2-3 min.
7. The process of claim 2, wherein the step of preventing the occurrence of the point discharge during the vacuum sputtering comprises: in the A3, the temperature set in the drying box is 100-120 ℃, and the drying time is 3-4 min.
8. The process of claim 1, wherein the step of preventing the occurrence of the point discharge during the vacuum sputtering comprises: in the step A4, the temperature of the blade cooling space is 25-30 ℃, and the temperature of the blade body is reduced to a specified position.
9. The process of claim 3, wherein the step of preventing the occurrence of the point discharge during the sputtering step comprises: in the B2, the vacuum pump reduces the pressure in the vacuum sputtering equipment to-10 to-11 Pa, and the pressure is kept for 5-6 min.
10. The process of claim 3, wherein the step of preventing the occurrence of the point discharge during the sputtering step comprises: in the B3, the insulating film is one or more of a polyethylene film, a polyvinylidene fluoride film, a polyimide film and a polytetrafluoroethylene film, and the thickness of the insulating film is set to be 2-2.5 mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011412846.8A CN112575298A (en) | 2020-12-04 | 2020-12-04 | Machining process for preventing point discharge during vacuum sputtering |
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| CN202011412846.8A CN112575298A (en) | 2020-12-04 | 2020-12-04 | Machining process for preventing point discharge during vacuum sputtering |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114134468A (en) * | 2021-12-03 | 2022-03-04 | 海珀(滁州)材料科技有限公司 | Machining process for preventing point discharge during vacuum sputtering |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114134468A (en) * | 2021-12-03 | 2022-03-04 | 海珀(滁州)材料科技有限公司 | Machining process for preventing point discharge during vacuum sputtering |
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Application publication date: 20210330 |