CN112563694B - Multimode dielectric filter without metal shielding cavity and manufacturing method thereof - Google Patents
Multimode dielectric filter without metal shielding cavity and manufacturing method thereof Download PDFInfo
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- CN112563694B CN112563694B CN202011278775.7A CN202011278775A CN112563694B CN 112563694 B CN112563694 B CN 112563694B CN 202011278775 A CN202011278775 A CN 202011278775A CN 112563694 B CN112563694 B CN 112563694B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2002—Dielectric waveguide filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/007—Manufacturing frequency-selective devices
Abstract
The invention discloses a multimode dielectric filter without a metal shielding cavity and a manufacturing method thereof, wherein the multimode dielectric filter comprises a dielectric substrate, an earth plate, a dielectric unit and a microstrip structure, the earth plate covers the first surface of the dielectric substrate, a plurality of gaps are arranged on the earth plate, the dielectric unit is arranged on the first surface of the dielectric substrate, the dielectric unit covers the gaps, and the microstrip structure is arranged on the second surface of the dielectric substrate. The multimode dielectric filter can keep smaller insertion loss under the condition of no metal cavity shielding, namely, the multimode dielectric filter can normally realize the functions of multimode filtering and the like without being placed in a closed metal cavity, and obtains higher Q value; the multimode dielectric filter has larger bandwidth and larger selectivity of the filter passband, and the size of the multimode dielectric filter is easily processed to 1/3 of the common level in the prior art under the condition of equivalent filter performance. The invention is widely applied to the technical field of medium circuits.
Description
Technical Field
The invention relates to the technical field of dielectric circuits, in particular to a multimode dielectric filter without a metal shielding cavity and a manufacturing method thereof.
Background
Dielectric resonators have excellent characteristics such as high Q value, high stability, good heat resistance, and small size, and are therefore widely used to realize different components. The dielectric resonator filter manufactured by using the dielectric resonator has the characteristics of low loss and small volume and has important research value. The existing dielectric resonator filter is usually required to be placed in a closed metal cavity to reduce radiation loss and obtain smaller insertion loss, but the metal cavity also occupies extra space, and has certain difficulty in integrating and manufacturing with other planar circuits. However, in the prior art, there are also research attempts on a dielectric filter without a cavity, but at present, only a single-mode characteristic can be realized, the selectivity is poor, and the applicable range is small.
Disclosure of Invention
In view of at least one of the above technical problems, an object of the present invention is to provide a multimode dielectric filter that does not require a metal shielding cavity and a method of manufacturing the same.
In one aspect, an embodiment of the present invention provides a multimode dielectric filter without a metal shielding cavity, including:
a dielectric substrate;
a ground plate; the grounding plate covers the first surface of the medium substrate, and a plurality of gaps are formed in the grounding plate;
a media unit; the medium unit is arranged on the first surface of the medium substrate and covers the gap;
a microstrip structure; the microstrip structure is arranged on the second surface of the dielectric substrate.
Further, the dielectric unit is a rectangular ceramic dielectric block, and the dielectric unit is fixed on the first surface of the dielectric substrate through an adhesive.
Further, the microstrip structure comprises a first part and a second part, the first part comprises a first microstrip line and a first stub, the projection of the first microstrip line on the dielectric substrate starts from the broadside edge of the dielectric substrate and extends into the overlapping area of the dielectric unit and the dielectric substrate along the central axis of the dielectric substrate, and one end of the first microstrip line on the broadside edge of the dielectric substrate is used for connecting a metal probe of an external SMA connector;
one end of the first stub is electrically connected with the first microstrip line;
the shape and position distribution of the second part are centrosymmetric with the first part, and the second part is not directly electrically connected with the first part.
Further, the first stub extends along the projection edge of the medium unit on the medium substrate and surrounds one vertex angle of the projection of the medium unit on the medium substrate.
Further, the other end of the first stub is open-circuited.
Furthermore, the shape of the gap is rectangular, the long side of the gap is parallel to the wide side of the dielectric substrate, the gaps are symmetrically distributed according to the symmetry axis of the dielectric substrate, and the connecting line of the center points of the gaps is below the center line of the dielectric substrate.
Further, the dielectric substrate is made of Rogers RT/Duroid materials, the thickness of the dielectric substrate is 0.813mm, and the dielectric constant of the dielectric substrate is 3.38.
Further, the number of the slits is 4.
Furthermore, the grounding plate and the microstrip structure are both made of metal materials; the gap is formed by the loss of partial metal materials on the grounding plate.
On the other hand, the embodiment of the invention also comprises a manufacturing method of the multi-mode dielectric filter, which comprises the following steps:
obtaining the medium substrate;
manufacturing the grounding plate and a plurality of gaps on the first surface of the dielectric substrate;
manufacturing the microstrip structure on the second surface of the dielectric substrate; the size of the microstrip structure is determined by the center frequency, cut-off frequency and resonant mode of the multimode dielectric filter.
The invention has the beneficial effects that: the multimode dielectric filter in the embodiment can keep smaller insertion loss under the condition of no metal cavity shielding, namely, the multimode dielectric filter can normally realize the functions of multimode filtering and the like without being placed in a closed metal cavity, and obtains a higher Q value; the multimode dielectric filter has larger bandwidth and larger selectivity of the filter passband, and under the condition of equivalent filtering performance, the multimode dielectric filter in the embodiment has smaller size, for example, the size is easy to be processed to 1/3 of the common level in the prior art.
Drawings
Fig. 1 is a schematic transmission diagram of the structure of a multimode dielectric filter in an embodiment;
fig. 2 is a schematic side-exploded view of a multimode dielectric filter in an embodiment;
FIG. 3 is a top perspective view of FIG. 1;
fig. 4 is a structural view of a metal ground plate in the embodiment;
fig. 5 is a simulated and measured S-parameter diagram of the multimode dielectric filter in the example.
Detailed Description
In this embodiment, referring to fig. 1, the multi-mode dielectric filter includes a dielectric substrate, a ground plate, a dielectric unit, and a microstrip structure. The grounding plate covers the first surface of the dielectric substrate, and a plurality of gaps are formed in the grounding plate; a dielectric unit mounted on the first surface of the dielectric substrate, the dielectric unit covering the gap, the gap not being visible when viewed from the first surface side; the microstrip structure is arranged on the second surface of the dielectric substrate.
In this embodiment, the dielectric substrate is made of Rogers RT/Duroid material, the thickness of the dielectric substrate is 0.813mm, and the dielectric constant of the dielectric substrate is 3.38.
In this embodiment, the ground plate and the microstrip structure are made of metal, and may be fabricated on both surfaces of the dielectric substrate by using electroplating, deposition, or PCB printing techniques, and in particular, may be fabricated by using gold, silver, or copper or other good conductors. After the grounding plate is manufactured, partial metal materials on the grounding plate can be removed through processes of etching and the like, namely partial metal materials on the grounding plate are lost, and gaps are formed on the parts of the grounding plate where the metal materials are lost.
In this embodiment, the dielectric element is a rectangular parallelepiped ceramic dielectric block, and the dielectric constant of the dielectric element is 28. The medium unit is fixed on the first surface of the medium substrate through an adhesive, specifically, the side of the medium unit opposite to the medium substrate is called a bottom surface of the medium unit, the other side of the medium unit adjacent to the bottom surface is called a side surface of the medium unit, the adhesive is distributed on only a very small part of the edge of the intersection of the side surface of the medium unit and the ground surface of the medium substrate, and the inner part of the bottom of the medium unit is not bonded with the medium substrate through the adhesive. The relative positional relationship among the dielectric unit, the ground plate, the dielectric substrate and the microstrip structure is shown in fig. 2.
In this embodiment, when the first surface of the dielectric substrate in the multimode dielectric filter faces upward, the perspective result when viewed from the side of the first surface of the dielectric substrate is as shown in fig. 3, and fig. 3 is equivalent to an effect of projecting the dielectric element, the ground plate, the dielectric substrate, and the microstrip structure onto the same plane.
In this embodiment, the hatched portion in fig. 3 is a microstrip structure, where the hatched portion includes two portions with the same shape and central symmetry position, i.e. the first portion and the second portion in this embodiment, and their symmetry point is the center point of the first surface or the second surface of the dielectric substrate.
In this embodiment, referring to fig. 3, the first portion includes a first microstrip line and a first stub, a projection of the first microstrip line on the dielectric substrate extends from a broadside edge of the dielectric substrate along a central axis of the dielectric substrate to an overlapping region of the dielectric unit and the dielectric substrate, and an end of the first microstrip line on the broadside edge of the dielectric substrate is used for a metal probe of an external SMA connector to connect. One end of the first stub is electrically connected with the first microstrip line, the first stub extends in a bent shape, specifically, the first stub extends along a projection edge of the dielectric unit on the dielectric substrate and surrounds one vertex angle of the projection of the dielectric unit on the dielectric substrate, and the other end of the first stub is open-circuited. The total length of the first stub is equal to 1/4 of the center wavelength of the signal input to the multimode dielectric filter.
In this embodiment, the second portion has a shape and a positional distribution that are centrosymmetric to the first portion. The second part comprises a second microstrip line and a second stub line, the projection of the second microstrip line on the dielectric substrate starts from the broadside edge of the dielectric substrate and extends to the overlapping area of the dielectric unit and the dielectric substrate along the central axis of the dielectric substrate, and one end of the second microstrip line on the broadside edge of the dielectric substrate is used for being connected with a metal probe of an external SMA connector. One end of the second stub is electrically connected with the second microstrip line, the second stub extends in a bending shape, and specifically, the second stub extends along a projection edge of the dielectric unit on the dielectric substrate and surrounds a vertex angle of the projection of the dielectric unit on the dielectric substrate, wherein the vertex angle surrounded by the second stub and the vertex angle surrounded by the first stub are opposite angles, and the other end of the second stub is open-circuited. The total length of the second stub is equal to 1/4 of the center wavelength of the signal input to the multimode dielectric filter.
In this embodiment, referring to fig. 3, no direct electrical connection is provided between the first portion and the second portion of the microstrip structure.
In this embodiment, a schematic diagram of the positions of the ground plate and the slots on the ground plate is shown in fig. 4. Referring to fig. 4, the slits have a rectangular shape, the long sides of the slits are parallel to the wide sides of the dielectric substrate, and the slits are symmetrically distributed about the axis of symmetry of the dielectric substrate. In this embodiment, a connection line of the center points of the slits is below the center line of the dielectric substrate, specifically, the connection line of the center points of the slits is parallel to the center line of the dielectric substrate, and a plane where the connection line of the center points of the slits and the center line of the dielectric substrate are located is perpendicular to the first surface or the second surface of the dielectric substrate. In this embodiment, the number of the slits is 4, and 2 slits are respectively distributed on the left side and the right side of the symmetry axis of the dielectric substrate by taking the symmetry axis of the dielectric substrate as a center. In this embodiment, the 4 slots serve as a path for feeding the microstrip structure to the dielectric element, and the positions of the 4 slots are located at the maximum field intensities of the excited multiple modes, so as to obtain the maximum output energy of the microstrip structure to the dielectric element.
In this embodiment, referring to fig. 2, 3 and 4, the length, width and height of the medium unit are a, b and h, respectively; of the 4 slits, two slits located on the outer side (i.e., the leftmost and rightmost sides) have a length l 1 The length of the two gaps at the inner side is l 2 The width of the two gaps at the outer side is w 1 The width of the two gaps at the inner side is w 2 (ii) a A gap far from the center point of the ground plate and arranged in the ground plateDistance of the centre points d 1 A gap close to the center point of the ground plate and having a distance d from the center point of the ground plate 2 (ii) a The length of the first microstrip line is l f Width is w f The length of the microstrip line part exceeding the outer slot is d f The length of the first stub is l s The width of the first stub is w s The size of the second microstrip line is the same as that of the first microstrip line, and the size of the second stub line is the same as that of the first stub line.
When the multimode dielectric filter in this embodiment is manufactured, the size of the dielectric unit, the number and size of the metal ground plate slots, and the size of the microstrip structure, that is, the parameters a and b, are calculated according to the center frequency, the cutoff frequency, and the resonance mode of the filter to be realized, and then the dielectric unit having the corresponding size, the number and size of the metal ground plate slots, and the size of the microstrip structure are respectively disposed on the upper surface and the lower surface of the dielectric substrate according to the calculated parameters.
In this embodiment, the design process of the dimensions of the coplanar waveguide structure and the like specifically includes: firstly, determining required central frequency and cut-off frequency, wherein the central frequency in the embodiment is 3.5GHz, and the cut-off frequency is 3.16GHz and 4.24GHz; determining the relative dielectric constant of the dielectric substrate, which is 3.38 in the embodiment, calculating the size of the microstrip structure, and designing the size of the dielectric unit and the size and the position of the slot, so as to obtain the band-pass characteristic of the filter; and finally, by adjusting the length of the part, exceeding the gap, of the microstrip line in the microstrip structure, obtaining better impedance matching, adjusting the length of the stub line, introducing and controlling the position of the transmission zero point of the low-frequency stop band, obtaining better selectivity, and simultaneously carrying out fine adjustment and optimization on specific parameters.
Through the above analysis process, the parameters a and b are set to the following values in this embodiment:
a＝17.2mm,b＝9.4mm,h＝5.8mm,l 1 ＝8.6mm,l 2 ＝8.6mm,d 1 ＝2.6mm,d 2 ＝6.2mm,w 1 ＝w 2 ＝0.5mm,d f ＝4.7mm,l f ＝15mm,w f ＝1.85mm,l s ＝18.3mm,w s ＝0.4mm。
in this embodiment, the operating principle of the multimode dielectric filter is as follows:
the position of the gap of the grounding plate is positioned at the position with the maximum field intensity of a plurality of modes, so that larger energy coupling and larger working bandwidth can be obtained; meanwhile, the length of the gap prolongs the path of the resonant mode transmission current, so that the longer the length of the gap is, the lower the working frequency of the resonant mode is, the center frequency can be flexibly controlled, and a plurality of suitable resonant modes can be excited;
the microstrip structure comprises a microstrip line and a stub line, the microstrip line is respectively connected with the input port and the output port, energy is coupled into the medium unit through a gap, and the impedance matching of the filter is adjusted by adjusting the length of the microstrip line exceeding the gap; one end of the stub is electrically connected with the microstrip line, the other end of the stub is open, the stub can generate a transmission zero at the low-frequency stop band of the filter, and the position of the zero is controlled by changing the length of the stub, so that the selectivity of the pass band of the filter is increased.
The method for manufacturing the multimode dielectric filter in the embodiment comprises the following steps:
s1, obtaining a medium substrate;
s2, manufacturing a grounding plate and a plurality of gaps on the first surface of the medium substrate;
and S3, manufacturing a micro-strip structure on the first surface of the dielectric substrate, wherein the size of the micro-strip structure is determined by the central frequency, the cut-off frequency and the resonant mode of the multi-mode dielectric filter.
The multimode dielectric filter in the present embodiment can be manufactured by performing steps S1 to S3.
And manufacturing a dielectric unit, a grounding plate, a dielectric substrate and a microstrip structure with corresponding sizes according to the numerical values, simulating the numerical values, and actually measuring the manufactured multimode dielectric filter. The results of the simulation and the actual measurement are shown in fig. 5. As can be seen from fig. 5, the multimode dielectric filter in this embodiment is a three-mode filter, the center frequency is 3.74GHz, and there is a certain frequency shift compared with the simulated operating frequency of 3.5 GHz; the bandwidth is 17%, the inter-passband suppression is greater than 30dB, the minimum insertion loss in the passband is 1.75dB, and the minimum insertion loss in the passband obtained through simulation is 0.34dB; the filter has three transmission zeros outside the passband, which improves the frequency selectivity of the filter.
All the results are measured by a vector network analyzer in a real environment with a substrate material of Rogers RT/Duroid 4003, a dielectric constant of 3.38 and a substrate thickness of 0.813 mm. Through the simulation and the test comparison graph, it can be found that the simulation and the actual measurement curves are basically consistent, and the difference between the frequency shift and the insertion loss is mainly caused by the air gap generated when the dielectric unit is fixed on the metal grounding plate and the roughness of the metal grounding plate, so that the actual measurement result of the filter can be improved through a higher-precision processing technology, which shows that the scheme of the dielectric multimode filter in the embodiment is feasible.
In this embodiment, the multimode dielectric filter has advantages including:
when the dielectric constant is large enough and a low-loss resonance mode is excited, the multimode dielectric filter can keep smaller insertion loss under the condition of no metal cavity shielding, namely, the multimode dielectric filter can normally realize the functions of multimode filtering and the like without being placed in a closed metal cavity and obtain a higher Q value; the multimode dielectric filter has larger bandwidth and larger selectivity of the filter passband, and the size of the multimode dielectric filter in the embodiment can be easily processed to 1/3 of the common level in the prior art under the condition of equivalent filtering performance.
It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. Furthermore, the descriptions of up, down, left, right, etc. used in the present disclosure are only relative to the mutual positional relationship of the components of the present disclosure in the drawings. As used in this disclosure, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. In addition, unless defined otherwise, all technical and scientific terms used in this example have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the description of the embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this embodiment, the term "and/or" includes any combination of one or more of the associated listed items.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one type of element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. The use of any and all examples, or exemplary language ("e.g.," such as "etc.), provided with the present embodiment is intended merely to better illuminate embodiments of the invention and does not pose a limitation on the scope of the invention unless otherwise claimed.
It should be recognized that embodiments of the present invention can be realized and implemented in computer hardware, a combination of hardware and software, or by computer instructions stored in a non-transitory computer readable memory. The methods may be implemented in a computer program using standard programming techniques, including a non-transitory computer-readable storage medium configured with the computer program, where the storage medium so configured causes a computer to operate in a specific and predefined manner, according to the methods and figures described in the detailed description. Each program may be implemented in a high level procedural or object oriented programming language to communicate with a computer system. However, the program(s) can be implemented in assembly or machine language, if desired. In any case, the language may be a compiled or interpreted language. Furthermore, the program can be run on a programmed application specific integrated circuit for this purpose.
Further, operations of processes described in this embodiment can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The processes described by the present embodiments (or variations and/or combinations thereof) may be performed under the control of one or more computer systems configured with executable instructions and may be implemented as code (e.g., executable instructions, one or more computer programs, or one or more applications) collectively executed on one or more processors, by hardware, or combinations thereof. The computer program includes a plurality of instructions executable by one or more processors.
Further, the method may be implemented in any type of computing platform operatively connected to a suitable connection, including but not limited to a personal computer, mini computer, mainframe, workstation, networked or distributed computing environment, separate or integrated computer platform, or in communication with a charged particle tool or other imaging device, or the like. Aspects of the invention may be implemented in machine-readable code stored on a non-transitory storage medium or device, whether removable or integrated onto a computing platform, such as a hard disk, optically read and/or write storage media, RAM, ROM, etc., so that it is readable by a programmable computer, which when read by the computer can be used to configure and operate the computer to perform the procedures described herein. Further, the machine-readable code, or portions thereof, may be transmitted over a wired or wireless network. The invention described in this embodiment includes these and other different types of non-transitory computer-readable storage media when such media include instructions or programs that implement the steps described above in conjunction with a microprocessor or other data processor. The invention also includes the computer itself when programmed according to the methods and techniques described herein.
A computer program can be applied to input data to perform the functions described in this embodiment to convert the input data to generate output data that is stored to non-volatile memory. The output information may also be applied to one or more output devices, such as a display. In a preferred embodiment of the invention, the transformed data represents physical and tangible objects, including particular visual depictions of physical and tangible objects produced on a display.
The present invention is not limited to the above embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention as long as the technical effects of the present invention are achieved by the same means. The invention is capable of other modifications and variations in its technical solution and/or its implementation, within the scope of protection of the invention.
Claims (9)
1. A multimode dielectric filter without a metallic shielded cavity, comprising:
a dielectric substrate;
a ground plate; the grounding plate covers the first surface of the dielectric substrate, a plurality of gaps are formed in the grounding plate, the gaps are rectangular, and long sides of the gaps are parallel to wide sides of the dielectric substrate;
a media unit; the medium unit is arranged on the first surface of the medium substrate and covers the gap;
a microstrip structure; the microstrip structure is arranged on the second surface of the dielectric substrate;
the microstrip structure comprises a first part and a second part, the first part comprises a first microstrip line and a first stub line, the projection of the first microstrip line on the dielectric substrate is started from the broadside edge of the dielectric substrate and extends to the overlapping area of the dielectric unit and the dielectric substrate along the central axis of the dielectric substrate, and the shape and the position distribution of the second part are in central symmetry with the first part;
the projection of the medium unit on the medium substrate is rectangular; the first stub line extends along the projection edge of the medium unit on the medium substrate and surrounds one top corner of the projection of the medium unit on the medium substrate; the vertex angle surrounded by the second stub and the vertex angle surrounded by the first stub are opposite angles.
2. The multimode dielectric filter of claim 1 wherein the dielectric elements are rectangular parallelepiped ceramic dielectric blocks, the dielectric elements being secured to the first surface of the dielectric substrate by an adhesive.
3. The multimode dielectric filter of claim 1, wherein:
one end of the first microstrip line, which is positioned at the broadside edge of the dielectric substrate, is used for connecting a metal probe of an external SMA connector;
one end of the first stub is electrically connected with the first microstrip line;
there is no direct electrical connection between the second portion and the first portion.
4. The multimode dielectric filter of claim 1, wherein the other end of the first stub is open-circuited.
5. The multimode dielectric filter of claim 1, wherein each of the slots is symmetrically distributed about a symmetry axis of the dielectric substrate, and a line connecting center points of the slots is below a center line of the dielectric substrate.
6. The multimode dielectric filter of claim 1, wherein the dielectric substrate is Rogers RT/Duroid material, the dielectric substrate has a thickness of 0.813mm, and the dielectric substrate has a dielectric constant of 3.38.
7. The multimode dielectric filter of claim 1, wherein the number of slots is 4.
8. The multimode dielectric filter as in any of claims 1-7, wherein said ground plane and microstrip structure are both metal; the gap is formed by the loss of partial metal materials on the grounding plate.
9. A manufacturing method for manufacturing the multimode dielectric filter according to any one of claims 1 to 8, the manufacturing method comprising the steps of:
obtaining the medium substrate;
manufacturing the grounding plate and a plurality of gaps on the first surface of the dielectric substrate;
manufacturing the microstrip structure on the second surface of the dielectric substrate; the size of the microstrip structure is determined by the center frequency, the cut-off frequency and the resonant mode of the multimode dielectric filter.
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