CN117423967A - Microstrip feed-based dielectric filter annular coupler - Google Patents
Microstrip feed-based dielectric filter annular coupler Download PDFInfo
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- 239000000758 substrate Substances 0.000 claims abstract description 42
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
- H01P5/188—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being dielectric waveguides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2002—Dielectric waveguide filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/10—Dielectric resonators
Abstract
The invention discloses a microstrip feed-based dielectric filter annular coupler which comprises a dielectric substrate, a dielectric resonator and a microstrip line structure. The invention realizes a multimode dielectric resonator by the position arrangement of the dielectric resonator and the microstrip line structure; by taking the multimode dielectric resonator as a resonance main body and taking the single-layer microstrip line as a feed structure, the coupler obtains an extremely low profile due to low height requirement on the dielectric resonator, and an ultrathin dielectric filter annular coupler is formed, so that the coupler can be easily integrated with other planar circuits while good filter performance and low loss are maintained, and the size of the coupler is reduced. The invention is widely applied to the technical field of medium circuits.
Description
Technical Field
The invention relates to the technical field of medium circuits, in particular to a microstrip feed-based medium filtering annular coupler.
Background
With the rapid development of wireless communication technology, the miniaturization of key components is being demanded by communication systems. The integration of passive devices and filters is one of the most efficient methods. For example, a filter power divider, a filter antenna and a filter coupler are proposed successively. Among them, the ring coupler is one of the key components in modern communication systems, and it can provide two different power distribution characteristics, i.e., in-phase and differential. To suppress unwanted noise, it is often necessary to add two bandpass filters at the front or back end of the ring coupler, which can result in bulky circuitry and increased overall insertion loss.
Disclosure of Invention
Aiming at the technical problems that the performances such as noise suppression, insertion loss and volume are difficult to balance in the existing annular coupler, the invention aims to provide a microstrip feed-based dielectric filter annular coupler.
The embodiment of the invention comprises a microstrip feed-based dielectric filter annular coupler, which comprises:
a dielectric substrate; the dielectric substrate comprises an upper surface and a lower surface;
a dielectric resonator; the dielectric resonator is arranged on the upper surface, the dielectric resonator is attached to the upper surface to form a contact surface, the cross section of the dielectric resonator is hexagonal, the second side surface, the fourth side surface and the sixth side surface of the dielectric resonator are metallized layers, the cross section is a cross section parallel to the dielectric substrate, and the second side surface, the fourth side surface and the sixth side surface are non-adjacent side surfaces;
a microstrip line structure; the microstrip line structure is arranged on the upper surface of the dielectric substrate, the microstrip line structure extends from the edge of the upper surface to the position where the dielectric resonator is located, and one part of the tail end of the microstrip line structure extends into the contact surface between the dielectric resonator and the upper surface from the corresponding position of the first side surface of the dielectric resonator, wherein the first side surface is a side surface between the second side surface and the sixth side surface, and the other part of the tail end of the microstrip line structure is respectively flush with the second side surface, the fourth side surface and the sixth side surface.
Further, the microstrip line structure comprises a first part of microstrip line, a second part of microstrip line, a third part of microstrip line and a fourth part of microstrip line;
one end of the first part microstrip line is positioned at the edge of the upper surface, and the other end of the first part microstrip line extends into the contact surface between the dielectric resonator and the upper surface from the corresponding position of the first side surface of the dielectric resonator;
one end of the second part microstrip line is positioned at the edge of the upper surface, and the other end of the second part microstrip line is flush with the second side surface;
one end of the third part microstrip line is positioned at the edge of the upper surface, and the other end of the third part microstrip line is flush with the sixth side surface;
one end of the fourth part microstrip line is positioned at the edge of the upper surface, and the other end of the fourth part microstrip line is flush with the fourth side surface.
Further, the first portion microstrip line includes a wider rectangular front section and a narrower rectangular rear section, wherein the front section and the rear section extend along a straight line, the front section extends from an edge of the upper surface to the first side surface, and the rear section is located at a contact surface between the dielectric resonator and the upper surface;
the second part microstrip line comprises a wider rectangular front section and a narrower rectangular rear section, wherein an included angle between the front section and the rear section is an obtuse angle, the front section extends from the edge of the upper surface to a vertex between the second side surface and the third side surface, and the rear section extends to a vertex between the second side surface and the first side surface along a direction parallel to the second side surface;
the third microstrip line comprises a wider rectangular front section and a narrower rectangular rear section, wherein an included angle between the front section and the rear section is an obtuse angle, the front section extends from the edge of the upper surface to a vertex between the sixth side surface and the fifth side surface, and the rear section extends to a vertex between the sixth side surface and the first side surface along a direction parallel to the sixth side surface;
the fourth part microstrip line comprises a narrower rectangular front section, a rectangular middle section which is the same as the front section in width and a widest rectangular rear section, wherein an included angle between the front section and the middle section is a right angle, the middle section and the rear section extend along a straight line, the front section extends from the edge of the upper surface to the inside of the upper surface to be connected with the middle section, the middle section extends to the vertex between the fourth side surface and the fifth side surface to be connected with the rear section, and the rear section extends to the vertex between the fourth side surface and the third side surface along the direction parallel to the fourth side surface.
Further, the microstrip feed based dielectric filter ring coupler further comprises:
a first SMA connector; the first SMA connector is connected with one end of the edge of the first part of microstrip line, which is positioned on the upper surface;
a second SMA connector; the second SMA connector is connected with one end of the edge of the second part of microstrip line, which is positioned on the upper surface;
a third SMA connector; the third SMA connector is connected with one end of the edge of the third part of microstrip line, which is positioned on the upper surface;
a fourth SMA connector; the fourth SMA connector is connected with one end of the edge of the fourth part of microstrip line, which is positioned on the upper surface;
wherein the second SMA connector and the third SMA connector are used as the output ends of the dielectric filter annular coupler.
Further, the dielectric substrate and the dielectric resonator are respectively provided with through holes at corresponding positions, and the microstrip feed-based dielectric filter annular coupler further comprises plastic screws, wherein the plastic screws penetrate through the through holes of the dielectric substrate and the dielectric resonator, so that the dielectric resonator is fixed on the dielectric substrate.
Further, the lower surface is entirely covered with a metal material as a ground plate.
Further, gaps are reserved between contact surfaces of the second side surface, the fourth side surface and the sixth side surface, which are attached to the upper surface, of the dielectric resonator.
Further, the grounding plate is made of copper, and the metal layer is made of silver or copper.
Further, the microstrip feed based dielectric filter ring coupler further comprises:
an upper cover; the upper cover is used for covering the dielectric substrate on one side of the upper surface, and forms a shielding cavity with the dielectric substrate, so that the dielectric resonator and the microstrip line structure are positioned in the shielding cavity.
Further, the upper cover is made of copper.
The beneficial effects of the invention are as follows: the microstrip feed-based dielectric filter annular coupler in the embodiment realizes a multimode dielectric resonator through the size and shape design of the dielectric resonator and the position arrangement of the side metal layers; by taking the multimode dielectric resonator as a resonance main body and taking the single-layer microstrip line as a feed structure, the coupler obtains an extremely low profile due to low height requirement on the dielectric resonator, and an ultrathin dielectric filter annular coupler is formed, so that the coupler can be easily integrated with other planar circuits while good filter performance and low loss are maintained, and the size of the coupler is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a dielectric filter ring coupler based on microstrip feeding in an embodiment;
FIG. 2 is a cross-sectional view of a microstrip feed based dielectric filter ring coupler in an embodiment;
FIG. 3 is a top view of a microstrip feed based dielectric filter ring coupler in an embodiment;
fig. 4 is a schematic structural diagram of microstrip lines of each part in the embodiment;
FIG. 5 is a schematic view of the mounting locations of the SMA connectors in an embodiment;
FIG. 6 is a schematic diagram of simulation and actual measurement results performed on a dielectric filter ring coupler in an in-phase output mode in the embodiment;
FIG. 7 is a schematic diagram of simulation and actual measurement results performed on a dielectric filter ring coupler in a differential output mode in an embodiment;
FIG. 8 is a schematic diagram of the return loss and isolation of two output ports and the isolation simulation and actual measurement results of two input ports of the dielectric filter ring coupler according to the embodiment;
FIG. 9 is a schematic diagram of simulation and actual measurement results of phase differences of two output ports of the dielectric filter ring coupler in the in-phase output mode and the differential output mode according to the embodiment;
reference numerals: 100-dielectric substrate, 101-ground plate, 200-microstrip line structure, 201-first part microstrip line, 202-second part microstrip line, 203-third part microstrip line, 204-fourth part microstrip line, 300-dielectric resonator, 301-first side, 302-second side, 303-third side, 304-fourth side, 305-fifth side, 306-sixth side, 401-first SMA connector, 402-second SMA connector, 403-third SMA connector, 404-fourth SMA connector, 500-upper cover.
Detailed Description
Aiming at the problems that the performances such as noise suppression, insertion loss and volume are difficult to balance in the annular coupler, the problems can be solved by integrating the filtering function in the annular coupler, and the coupler manufactured based on the dielectric resonator 300 has the characteristics of higher quality factor, small volume and high temperature stability, meets the development requirements of future wireless communication systems, and has wide application prospects. However, if the dielectric resonator 300 of a high profile is fed using a coaxial probe to realize a ring coupler based on the dielectric resonator 300, there is a problem in that integration is difficult. The microstrip feed method can make the circuit easier to integrate with other circuits than the coaxial probe.
Based on the above principle, in this embodiment, a microstrip feed-based dielectric filter ring coupler is provided.
In this embodiment, the structure of the microstrip-fed dielectric filter ring coupler is shown in fig. 1, the cross-sectional view of the microstrip-fed dielectric filter ring coupler is shown in fig. 2, and the top view of the microstrip-fed dielectric filter ring coupler is shown in fig. 3.
Referring to fig. 1, the microstrip feed based dielectric filter loop coupler includes a dielectric substrate 100, a dielectric resonator 300, and a microstrip line structure 200.
The dielectric substrate 100 is a rectangular thin plate, the dielectric substrate 100 is made of Rogers RT/Duroid material with a thickness of 0.508mm, and the dielectric constant of the dielectric substrate 100 is 3.38. The "upper surface" and "lower surface" of the dielectric substrate 100 are only used to distinguish between the two surfaces of the dielectric substrate 100, and do not mean that the "upper surface" must be upward or the "lower surface" must be downward when the dielectric filter ring coupler of the present invention is in operation.
In this embodiment, the dielectric resonator 300 may be made of a high dielectric ceramic material, and the dielectric resonator 300 may be formed by cutting a blank and sintering at a high temperature, or may be made by using a ceramic 3D printing technology. Referring to fig. 1, 2 and 3, the dielectric resonator 300 has a regular hexagonal block shape, that is, the dielectric resonator 300 has a hexagonal cross section (a cross section parallel to the dielectric substrate 100), the dielectric resonator 300 is mounted on the upper surface, and the dielectric resonator 300 is bonded to the upper surface to form a contact surface. Referring to fig. 1 and 2, the dielectric substrate 100 and the dielectric resonator 300 each have a through hole in the middle thereof, and the dielectric resonator 300 may be mounted on the upper surface of the dielectric substrate 100 using a screw made of an insulating material such as plastic through the through hole.
Referring to fig. 1 and 3, the dielectric resonator 300 includes a first side 301, a second side 302, a third side 303, a fourth side 304, a fifth side 305, and a sixth side 306 that are sequentially adjacent, i.e., the second side 302, the fourth side 304, and the sixth side 306 are not adjacent to each other.
A metal layer such as silver or copper is applied to the second side 302, the fourth side 304 and the sixth side 306, respectively. A gap is left between the contact surface of the metal layer on each side and the dielectric resonator 300 and the upper surface, so that the metal layer is prevented from communicating with the upper surface.
In this embodiment, the microstrip line structure 200 may be fabricated on the upper surface of the dielectric substrate 100 by using a printed circuit technology, and the entire lower surface of the dielectric substrate 100 may be metallized as the ground plane 101. The microstrip line structure 200 and the ground plate 101 are both made of metal, for example, the microstrip line structure 200 and the ground plate 101 may be made of copper.
Referring to fig. 1 and 3, the microstrip line structure 200 is disposed on the upper surface of the dielectric substrate 100, specifically, the microstrip line structure 200 extends from an edge of the upper surface to a position where the dielectric resonator 300 is located, and a part of an end of the microstrip line structure 200 extends into a contact surface between the dielectric resonator 300 and the upper surface from a position corresponding to a first side 301 of the dielectric resonator 300, where the first side 301 is a side between the second side 302 and the sixth side 306, and another part of an end of the microstrip line structure 200 is respectively flush with the second side 302, the fourth side 304, and the sixth side 306.
Specifically, referring to fig. 1 and 3, the microstrip line structure 200 includes four portions of a first portion microstrip line 201, a second portion microstrip line 202, a third portion microstrip line 203, and a fourth portion microstrip line 204. One end of the first microstrip line 201 is located at the edge of the upper surface, and the other end extends into the contact surface between the dielectric resonator 300 and the upper surface from the corresponding position of the first side 301 of the dielectric resonator 300; one end of the second microstrip line 202 is located at the edge of the upper surface, and the other end is flush with the second side 302; one end of the third microstrip line 203 is located at the edge of the upper surface, and the other end is flush with the sixth side 306; one end of the fourth microstrip line 204 is located at the edge of the upper surface, and the other end is flush with the fourth side 304. The first part of microstrip line 201, the second part of microstrip line 202, the third part of microstrip line 203 and the fourth part of microstrip line 204 are located at the end of the edge of the upper surface, aligned with the edge of the upper surface.
In the present embodiment, the structures of the first partial microstrip line 201, the second partial microstrip line 202, the third partial microstrip line 203, and the fourth partial microstrip line 204 are as shown in fig. 4. Referring to fig. 4, the first portion microstrip line 201 includes a wider rectangular front section and a narrower rectangular rear section, wherein the front section and the rear section extend along a straight line, the front section extends from an edge of the upper surface to the first side 301, and the rear section is located at a contact surface between the dielectric resonator 300 and the upper surface; the second portion microstrip line 202 comprises a wider rectangular front section and a narrower rectangular rear section, wherein the angle between the front section and the rear section is an obtuse angle, thereby forming a "v" -shaped structure, the front section extends from the edge of the upper surface to the apex between the second side 302 and the third side 303, and the rear section extends in a direction flush with the second side 302 to the apex between the second side 302 and the first side 301; the third portion microstrip line 203 comprises a wider rectangular front section and a narrower rectangular rear section, wherein an included angle between the front section and the rear section is an obtuse angle, thereby forming a%v-shaped structure, the front section extends from an edge of the upper surface to an apex between the sixth side 306 and the fifth side 305, and the rear section extends along a direction flush with the sixth side 306 to an apex between the sixth side 306 and the first side 301, so that the structure of the third portion microstrip line 203 is identical to the structure of the second portion microstrip line 202, and the position of the third portion microstrip line 203 is symmetrical to the position of the second portion microstrip line 202; the fourth microstrip line 204 includes a narrower rectangular front section, a wider rectangular middle section, and a widest rectangular rear section, wherein an included angle between the front section and the middle section is a right angle, so as to form an "L" shaped structure, the middle section and the rear section extend along a straight line, the front section extends from an edge of the upper surface to an inside of the upper surface to be connected with the middle section, the middle section extends to a vertex between the fourth side 304 and the fifth side 305 to be connected with the rear section, and the rear section extends to a vertex between the fourth side 304 and the third side 303 along a direction flush with the fourth side 304.
In this embodiment, when using a microstrip feed based dielectric filter ring coupler, referring to fig. 5, a first SMA connector 401, a second SMA connector 402, a third SMA connector 403, and a fourth SMA connector 404 may be installed at corresponding positions of the dielectric substrate 100. Referring to fig. 5, a first SMA connector 401 is connected to one end of the edge of the first portion of microstrip line 201 located on the upper surface, a second SMA connector 402 is connected to one end of the edge of the second portion of microstrip line 202 located on the upper surface, a third SMA connector 403 is connected to one end of the edge of the third portion of microstrip line 203 located on the upper surface, and a fourth SMA connector 404 is connected to one end of the edge of the fourth portion of microstrip line 204 located on the upper surface.
The first SMA connector 401, the second SMA connector 402, the third SMA connector 403 and the fourth SMA connector 404 each comprise a metal probe connected to one end of a respective microstrip line. The metal probe may be connected to an external signal source and/or signal receiver such that the signal source and/or signal receiver may be coupled to the dielectric filter ring coupler via the metal probe to transceive signals.
In this embodiment, the working principle of the filtering annular coupler is as follows: by carrying out metallization treatment on part of the side surface of the hexagonal dielectric resonator 300, a three-mode dielectric resonator 300 is obtained, and the three-mode dielectric resonator 300 can work in three modes named as M1, M2, M3 and the like respectively; the positions of the microstrip lines of the parts are adapted to the electromagnetic field distribution characteristics of the modes, so that the first microstrip line 201 (the first SMA connector 401) of the first part can excite the mode M1, the second microstrip line 202 (the second SMA connector 402) of the second part is taken as an output end, thereby realizing the required 0-degree phase difference, and the microstrip line 203 of the third part is taken as a common output end, thereby realizing the required 180-degree phase difference; exciting the modes M2 and M3 by using the fourth partial microstrip line 204 (the fourth SMA connector 404); by introducing the coupling between the source and the load, transmission zero points are obtained at both sides of the in-phase passband and the differential passband, and good filtering performance of the coupler is realized.
In this embodiment, referring to fig. 1 and 2, the microstrip feed-based dielectric filter ring coupler is further provided with an upper cover 500, where the upper cover 500 may be made of copper, and the side wall and bottom of the metal shielding cavity may be provided with a plurality of threaded holes, so as to fix the dielectric substrate 100 and the SMA joint.
Referring to fig. 2, when the upper surface of the dielectric substrate 100 is upward, the dielectric filter is an upper cover 500, a dielectric resonator 300, a microstrip line structure 200, the dielectric substrate 100, and a ground plate 101 in this order from top to bottom. Referring to fig. 1, the upper cover 500 covers the dielectric substrate 100 at the upper surface side, thereby forming a shielding cavity with the dielectric substrate 100, and the dielectric resonator 300 and the microstrip line structure 200 are positioned in the shielding cavity, thereby further improving the filtering performance of the coupler.
In the present embodiment, referring to fig. 1, 2 and 3, the length and width of the dielectric substrate 100 are A, B, the height of the dielectric resonator 300 is h, and the side length is l 23 The gap height between the side metal layer and the bottom of the dielectric resonator 300 is h 0 The length and width of the first microstrip line 201 are l 41 、l 42 And w 41 、w 42 A second part of microstripThe length and width of the line 202 are l respectively 21 、l 22 、 l23 And w 21 、w 22 The third microstrip line 203 has the same size as the second microstrip line 202, and the fourth microstrip line 204 has a length/width of l 11 、l 12 、l 13 And w 11 、w 12 The distance between the center of the positioning through hole and the center of the dielectric resonator 300 is d, and the radius of the positioning through hole is r 1 。
In this embodiment, the design process of the dimensions of the above parameters specifically includes: first, according to the required center frequency (5.8 GHz in this embodiment) and the 3dB relative bandwidth (6.2% in this embodiment), the parameters related to the dielectric substrate 100 (3.38 in this embodiment, 0.508mm in thickness) simulate to make the frequencies of the three modes of the dielectric resonator 300 distributed in the same passband, the height h and the side length l of the dielectric resonator 300 23 And using the side metal layer bottom gap height h 0 Tuning is carried out; then, by adjusting the width w of the portion of the microstrip line structure 200 in contact with the dielectric resonator 300 11 、w 12 、w 22 、w 42 Impedance matching is performed by adjusting the length l of the microstrip line of the corresponding part 13 、l 22 、l 42 To control the magnitude of the input/output coupling coefficient. Selecting proper microstrip line length l according to the length of a metal probe of an external SMA connector 11 、l 21 、l 41 Thereby determining the length A and width B of the dielectric substrate 100, and then determining the width w of a part of microstrip line according to the requirement of 50 ohm impedance matching of the input and output end at the center frequency 11 、w 21 、w 41 . Finally, according to the influence degree of the through hole on the performance of the coupler, selecting proper through hole position d and radius r 1 。
Through the above analysis procedure, the above parameters were set to the following values in this example: a=26 mm, b=26 mm, h=1.7mm, h 0 ＝0.1mm，l 11 ＝4.3mm,l 12 ＝4.5mm,l 13 ＝8.8mm,w 11 ＝1mm,w 12 ＝1.1mm,l 21 ＝4.4mm,l 22 ＝1.4mm,l 23 ＝7.5mm,w 21 ＝1.2mm,w 22 ＝0.3mm,l 41 ＝5.1mm,l 42 ＝6.8mm,w 41 ＝1.2mm,w 42 ＝1mm,d＝1mm,r 1 ＝0.6mm。
And manufacturing a dielectric substrate, a dielectric resonator and a microstrip line structure with corresponding dimensions according to the values, simulating the values, and performing actual measurement on the manufactured dielectric filter annular coupler. The results of the simulation and the actual measurement are shown in fig. 6 to 9.
Simulation and actual measurement results in the in-phase output mode for the dielectric filter ring coupler are shown in fig. 6. In the figure, the solid line represents measured data, and the broken line represents simulation data. In the embodiment, the actual measurement center frequency of the in-phase output mode of the coupler is 5.82GHz; the simulated 3dB bandwidth is 6%, and the actually measured 3dB bandwidth is 6.5%; the simulated minimum loss is 0.45dB, and the measured minimum loss is 0.7dB; the return loss in the pass band of the simulation and the actual measurement is 20dB. The simulation and the actual measurement have a transmission zero point at the left and the right of the passband.
Simulation and actual measurement results in the differential output mode for the dielectric filter ring coupler are shown in fig. 7. In the figure, the solid line represents measured data, and the broken line represents simulation data. In the embodiment, the actual measurement center frequency of the differential output mode of the coupler is 5.82GHz; the simulated 3dB bandwidth is 6%, and the actually measured 3dB bandwidth is 6.2%; the simulated minimum loss is 0.75dB, and the measured minimum loss is 0.92dB; the simulated passband return loss was 20dB and the measured passband return loss was 22dB. The simulation and the actual measurement have a transmission zero point at the left and the right of the passband.
The return loss and isolation of the two output ports of the dielectric filter ring coupler and the isolation simulation and actual measurement results of the two input ports in this example are shown in fig. 8. In the figure, the solid line represents measured data, and the broken line represents simulation data. In the embodiment, the return loss in the pass band of the actual measurement and simulation of the two output ports of the coupler is 20dB; the simulated passband isolation of the two output ports is 15dB, and the actually measured passband isolation is 21dB; the simulated passband isolation of the two input ports is 25dB, and the actually measured passband isolation is 30dB.
In the in-phase output mode and the differential output mode of the dielectric filter annular coupler in this example, simulation and actual measurement results of the phase difference of the two output ports are shown in fig. 9. The actual measured phase difference between the two output ports in the in-phase output mode is +/-2.5 degrees, and the actual measured phase difference between the two output ports in the differential output mode is +/-3 degrees.
All the results were measured by a vector network analyzer. The simulation and actual measurement curves are basically identical according to the simulation and test comparison diagrams, so that the scheme of the invention is feasible. The offset is mainly due to factors such as relative permittivity deviation of the processed dielectric resonator material, and mounting position deviation. With the improvement of processing technology and mounting alignment precision, simulation and actual measurement results can be further approximate.
It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly or indirectly fixed or connected to the other feature. Further, the descriptions of the upper, lower, left, right, etc. used in this disclosure are merely with respect to the mutual positional relationship of the various components of this disclosure in the drawings. As used in this disclosure, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. In addition, unless defined otherwise, all technical and scientific terms used in this example have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the description of the embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used in this embodiment includes any combination of one or more of the associated listed items.
It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element of the same type from another. For example, a first element could also be termed a second element, and, similarly, a second element could also be termed a first element, without departing from the scope of the present disclosure. The use of any and all examples, or exemplary language (e.g., "such as") provided herein, is intended merely to better illuminate embodiments of the invention and does not pose a limitation on the scope of the invention unless otherwise claimed.
The present invention is not limited to the above embodiments, but can be modified, equivalent, improved, etc. by the same means to achieve the technical effects of the present invention without departing from the spirit and principle of the present invention. Various modifications and variations are possible in the technical solution and/or in the embodiments within the scope of the invention.
Claims (10)
1. A microstrip feed based dielectric filter ring coupler, the microstrip feed based dielectric filter ring coupler comprising:
a dielectric substrate; the dielectric substrate comprises an upper surface and a lower surface;
a dielectric resonator; the dielectric resonator is arranged on the upper surface, the dielectric resonator is attached to the upper surface to form a contact surface, the cross section of the dielectric resonator is hexagonal, the second side surface, the fourth side surface and the sixth side surface of the dielectric resonator are metallized layers, the cross section is a cross section parallel to the dielectric substrate, and the second side surface, the fourth side surface and the sixth side surface are non-adjacent side surfaces;
a microstrip line structure; the microstrip line structure is arranged on the upper surface of the dielectric substrate, the microstrip line structure extends from the edge of the upper surface to the position where the dielectric resonator is located, and one part of the tail end of the microstrip line structure extends into the contact surface between the dielectric resonator and the upper surface from the corresponding position of the first side surface of the dielectric resonator, wherein the first side surface is a side surface between the second side surface and the sixth side surface, and the other part of the tail end of the microstrip line structure is respectively flush with the second side surface, the fourth side surface and the sixth side surface.
2. The microstrip feed based dielectric filter loop coupler according to claim 1, wherein:
the microstrip line structure comprises a first part of microstrip line, a second part of microstrip line, a third part of microstrip line and a fourth part of microstrip line;
one end of the first part microstrip line is positioned at the edge of the upper surface, and the other end of the first part microstrip line extends into the contact surface between the dielectric resonator and the upper surface from the corresponding position of the first side surface of the dielectric resonator;
one end of the second part microstrip line is positioned at the edge of the upper surface, and the other end of the second part microstrip line is flush with the second side surface;
one end of the third part microstrip line is positioned at the edge of the upper surface, and the other end of the third part microstrip line is flush with the sixth side surface;
one end of the fourth part microstrip line is positioned at the edge of the upper surface, and the other end of the fourth part microstrip line is flush with the fourth side surface.
3. The microstrip feed based dielectric filter loop coupler according to claim 2, wherein:
the first part of microstrip line comprises a wider rectangular front section and a narrower rectangular rear section, wherein the front section and the rear section extend along a straight line, the front section extends from the edge of the upper surface to the first side surface, and the rear section is positioned at the contact surface between the dielectric resonator and the upper surface;
the second part microstrip line comprises a wider rectangular front section and a narrower rectangular rear section, wherein an included angle between the front section and the rear section is an obtuse angle, the front section extends from the edge of the upper surface to a vertex between the second side surface and the third side surface, and the rear section extends to a vertex between the second side surface and the first side surface along a direction parallel to the second side surface;
the third microstrip line comprises a wider rectangular front section and a narrower rectangular rear section, wherein an included angle between the front section and the rear section is an obtuse angle, the front section extends from the edge of the upper surface to a vertex between the sixth side surface and the fifth side surface, and the rear section extends to a vertex between the sixth side surface and the first side surface along a direction parallel to the sixth side surface;
the fourth part microstrip line comprises a narrower rectangular front section, a rectangular middle section which is the same as the front section in width and a widest rectangular rear section, wherein an included angle between the front section and the middle section is a right angle, the middle section and the rear section extend along a straight line, the front section extends from the edge of the upper surface to the inside of the upper surface to be connected with the middle section, the middle section extends to the vertex between the fourth side surface and the fifth side surface to be connected with the rear section, and the rear section extends to the vertex between the fourth side surface and the third side surface along the direction parallel to the fourth side surface.
4. The microstrip feed based dielectric filter loop coupler according to claim 1, further comprising:
a first SMA connector; the first SMA connector is connected with one end of the edge of the first part of microstrip line, which is positioned on the upper surface;
a second SMA connector; the second SMA connector is connected with one end of the edge of the second part of microstrip line, which is positioned on the upper surface;
a third SMA connector; the third SMA connector is connected with one end of the edge of the third part of microstrip line, which is positioned on the upper surface;
a fourth SMA connector; the fourth SMA connector is connected with one end of the edge of the fourth part of microstrip line, which is positioned on the upper surface;
wherein the second SMA connector and the third SMA connector are used as the output ends of the dielectric filter annular coupler.
5. The microstrip feed based dielectric filter loop coupler according to claim 1, wherein the dielectric substrate and the dielectric resonator are respectively provided with through holes corresponding in position, and the microstrip feed based dielectric filter loop coupler further comprises plastic screws passing through the respective through holes of the dielectric substrate and the dielectric resonator, thereby fixing the dielectric resonator to the dielectric substrate.
6. The microstrip feed based dielectric filter loop coupler according to claim 1, wherein said lower surface is entirely covered with a metal material as a ground plate.
7. The microstrip feed based dielectric filter loop coupler according to claim 6, wherein a gap is left between the contact surfaces of said second side, said fourth side and said sixth side, and said contact surfaces of said dielectric resonator and said upper surface.
8. The microstrip feed based dielectric filter loop coupler according to claim 7, wherein said ground plate is made of copper and said metal layer is made of silver or copper.
9. The microstrip feed based dielectric filter loop coupler according to any one of claims 1 to 8, further comprising:
an upper cover; the upper cover is used for covering the dielectric substrate on one side of the upper surface, and forms a shielding cavity with the dielectric substrate, so that the dielectric resonator and the microstrip line structure are positioned in the shielding cavity.
10. The microstrip feed based dielectric filter loop coupler according to claim 9, wherein said upper cover is copper.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311650511.3A CN117423967A (en) | 2023-12-04 | 2023-12-04 | Microstrip feed-based dielectric filter annular coupler |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311650511.3A CN117423967A (en) | 2023-12-04 | 2023-12-04 | Microstrip feed-based dielectric filter annular coupler |
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| CN202311650511.3A Pending CN117423967A (en) | 2023-12-04 | 2023-12-04 | Microstrip feed-based dielectric filter annular coupler |
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