CN112563386A - Manufacturing process of LED chip array film - Google Patents
Manufacturing process of LED chip array film Download PDFInfo
- Publication number
- CN112563386A CN112563386A CN202011416870.9A CN202011416870A CN112563386A CN 112563386 A CN112563386 A CN 112563386A CN 202011416870 A CN202011416870 A CN 202011416870A CN 112563386 A CN112563386 A CN 112563386A
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- China
- Prior art keywords
- film
- chip array
- flexible film
- colloid
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000084 colloidal system Substances 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 21
- 235000015110 jellies Nutrition 0.000 claims abstract description 18
- 239000008274 jelly Substances 0.000 claims abstract description 18
- 230000007704 transition Effects 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- -1 polydimethylsiloxane Polymers 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 239000000499 gel Substances 0.000 claims 3
- 238000003825 pressing Methods 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 36
- 238000005516 engineering process Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a manufacturing process of an LED chip array film, which relates to the technical field of LEDs and comprises the following specific steps: arranging a plurality of LED chips in an array form according to a pre-designed arrangement rule on the top surface of a flexible film for temporary transition which is horizontally placed; manufacturing a colloid frame surrounding the chip array at the periphery of the chip array; injecting liquid jelly into the colloid frame, standing for a period of time until the liquid jelly naturally levels, and then solidifying the liquid jelly to form a flat colloidal film; and separating the colloidal film with the chip array from the flexible film and taking away to obtain the required chip array film. The invention has simple process, greatly reduces the cost, avoids the occurrence of bubble phenomenon and effectively improves the yield compared with the traditional film pressing process.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a manufacturing process of an LED chip array film.
Background
The current Mini LED technology is rapidly developed, various families develop the Mini LED die bonding technology, and the current widely used technology mainly adopts chip die bonding to form an array, and then mould pressing is carried out to manufacture a protective film so as to form a required chip array film.
The conventional chip array film manufacturing process mainly depends on an injection molding and film pressing process, a high-precision mold needs to be manufactured in the process to ensure that the thickness of an adhesive film is uniform, and the problem of the mode is that: the cost of the die is high, and the loss is great once the die is damaged; in addition, the manufacturing method can enable the chip after die bonding to bear great pressure, so that the chip is easy to break and the like, and is difficult to repair subsequently; in addition, when the mold is used for the film pressing process, bubbles are easily generated in the obtained chip array film, and are difficult to eliminate, so that the light emitting uniformity and efficiency of the display module are influenced.
Disclosure of Invention
The invention aims to overcome the defects of the technology and provide the manufacturing process of the LED chip array film, which is simple, greatly reduces the cost, avoids the occurrence of bubble phenomenon and effectively improves the yield.
In order to achieve the purpose, the invention adopts the technical scheme that:
a manufacturing process of an LED chip array film is characterized by comprising the following specific steps:
step 1, arranging a plurality of LED chips on the top surface of a horizontally placed flexible film for temporary transition into an array form according to a pre-designed arrangement rule, wherein the top surface of the flexible film in contact with the LED chips has certain viscosity so that the LED chips are attached to the surface of the flexible film, thereby forming a complete chip array;
step 2, manufacturing a colloid frame surrounding the chip array at the periphery of the chip array, wherein the thickness of the colloid frame is controlled to be 0.05-1 mm;
step 3, injecting liquid jelly into the colloid frame, standing for a period of time until the liquid jelly naturally levels, and then solidifying the liquid jelly to form a flat colloid film, wherein the chip array is embedded into the bottom surface of the colloid film;
and 4, separating the colloidal film with the chip array from the flexible film, and taking away the colloidal film with the chip array to obtain the required chip array film.
A further improvement of the invention is that the flexible film in step 1 is a PET or PI film.
The invention has the further improvement that in the step 1, before the LED chips are arranged, the flexible film is firstly pressed on the operating platform through the hard frame, so that the flexible film is kept stable in the subsequent operation process.
The invention is further improved in that the manufacturing process of the colloid frame in the step 2 comprises the following steps: preparing a colloid frame still with flow property at the periphery of the chip array by a printing, coating or spraying process; and curing and molding the colloid frame by using an ultraviolet irradiation or heating mode.
The invention is further improved in that the liquid jelly in the step 3 is a transparent material after being cured, and comprises silica gel, epoxy resin, polyimide or polydimethylsiloxane.
A further improvement of the invention is that the viscosity of the liquid gum in step 3 is from 0.1PaS to 50 PaS.
The invention is further improved in that the curing mode of the liquid jelly in the step 3 is a UV light irradiation or heating mode.
The invention has the beneficial effects that:
(1) according to the invention, through the combination of the colloid frame limiting and the self-leveling solidification of the liquid colloid, the chip is prevented from being damaged by the conventional film pressing process, and the yield of the chip manufacturing process is improved.
(2) The invention prepares the flat colloidal film in a low-cost mode, does not need a complex machining die, has simple process and greatly reduces the cost.
(3) The invention can realize the arrangement of single-color chips or various chips, and can transfer a large amount of chips to a circuit board after the chips are manufactured into a regular array, thereby simplifying the process.
(4) The method of the invention can also be used for manufacturing processes such as chip scale packaging and the like, and can greatly simplify the manufacturing process and reduce the cost.
Detailed Description
The following examples are included to further illustrate the present invention.
A manufacturing process of an LED chip array film is characterized by comprising the following specific steps:
step 1, firstly, a flexible film made of a PET or PI film is pressed on an operation platform through a hard frame so as to keep the flexible film stable in the subsequent operation process;
then, arranging a plurality of LED chips on the top surface of the flexible film for temporary transition horizontally arranged in an array form according to a pre-designed arrangement rule, wherein the top surface of the flexible film in contact with the LED chips has certain viscosity so that the LED chips are attached to the surface of the flexible film, thereby forming a complete chip array;
step 2, manufacturing a colloid frame surrounding the chip array at the periphery of the chip array, wherein the thickness of the colloid frame is controlled to be 0.05-1 mm;
the manufacturing process of the colloid frame comprises the following steps: preparing a colloid frame still with flow property at the periphery of the chip array by a printing, coating or spraying process; and curing and molding the colloid frame by using an ultraviolet irradiation or heating mode.
Step 3, injecting a liquid jelly into the colloid frame, wherein the liquid jelly is a transparent material after being cured and comprises silica gel, epoxy resin, polyimide or polydimethylsiloxane, the viscosity of the liquid jelly is 0.1 to 50PaS, the liquid jelly is kept stand for a period of time until the liquid jelly naturally levels, then the liquid jelly is cured, the curing mode is UV light irradiation or heating, so that a flat jelly-like thin film is formed, and at the moment, the chip array is embedded into the bottom surface of the jelly-like thin film;
and 4, separating the colloidal film with the chip array from the flexible film, and taking away the colloidal film with the chip array to obtain the required chip array film.
The described embodiments are only some embodiments of the invention, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Claims (7)
1. A manufacturing process of an LED chip array film is characterized by comprising the following specific steps:
step 1, arranging a plurality of LED chips on the top surface of a horizontally placed flexible film for temporary transition into an array form according to a pre-designed arrangement rule, wherein the top surface of the flexible film in contact with the LED chips has certain viscosity so that the LED chips are attached to the surface of the flexible film, thereby forming a complete chip array;
step 2, manufacturing a colloid frame surrounding the chip array at the periphery of the chip array, wherein the thickness of the colloid frame is controlled to be 0.05-1 mm;
step 3, injecting liquid jelly into the colloid frame, standing for a period of time until the liquid jelly naturally levels, and then solidifying the liquid jelly to form a flat colloid film, wherein the chip array is embedded into the bottom surface of the colloid film;
and 4, separating the colloidal film with the chip array from the flexible film, and taking away the colloidal film with the chip array to obtain the required chip array film.
2. The process of claim 1, wherein the flexible film in step 1 is a PET or PI film.
3. The process according to claim 1, wherein in step 1, before the LED chips are arranged, the flexible film is pressed on the operating platform through the rigid frame, so that the flexible film is kept stable in the subsequent operation process.
4. The process of claim 1, wherein the step of fabricating the gel frame in step 2 comprises: preparing a colloid frame still with flow property at the periphery of the chip array by a printing, coating or spraying process; and curing and molding the colloid frame by using an ultraviolet irradiation or heating mode.
5. The process according to claim 1, wherein the liquid gel in step 3 is a transparent material after curing, and comprises silica gel, epoxy resin, polyimide or polydimethylsiloxane.
6. The process of claim 1, wherein the viscosity of the liquid jelly in the step 3 is 0.1PaS to 50 PaS.
7. The process according to claim 1, wherein the curing of the liquid gel in step 3 is by UV light irradiation or heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011416870.9A CN112563386A (en) | 2020-12-07 | 2020-12-07 | Manufacturing process of LED chip array film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011416870.9A CN112563386A (en) | 2020-12-07 | 2020-12-07 | Manufacturing process of LED chip array film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112563386A true CN112563386A (en) | 2021-03-26 |
Family
ID=75059073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011416870.9A Pending CN112563386A (en) | 2020-12-07 | 2020-12-07 | Manufacturing process of LED chip array film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112563386A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104851961A (en) * | 2015-03-24 | 2015-08-19 | 湘能华磊光电股份有限公司 | Chip scale packaging method and structure for light-emitting device |
| CN105895785A (en) * | 2016-04-25 | 2016-08-24 | 湘能华磊光电股份有限公司 | Optical source assembly structure of flip LED chip integrated package and manufacturing method thereof |
| CN106449945A (en) * | 2016-12-07 | 2017-02-22 | 湘能华磊光电股份有限公司 | Mold injection method for manufacturing CSP chip |
-
2020
- 2020-12-07 CN CN202011416870.9A patent/CN112563386A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104851961A (en) * | 2015-03-24 | 2015-08-19 | 湘能华磊光电股份有限公司 | Chip scale packaging method and structure for light-emitting device |
| CN105895785A (en) * | 2016-04-25 | 2016-08-24 | 湘能华磊光电股份有限公司 | Optical source assembly structure of flip LED chip integrated package and manufacturing method thereof |
| CN106449945A (en) * | 2016-12-07 | 2017-02-22 | 湘能华磊光电股份有限公司 | Mold injection method for manufacturing CSP chip |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210326 |