CN112563298A - 一种低暗电流的图像传感器像素结构 - Google Patents

一种低暗电流的图像传感器像素结构 Download PDF

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CN112563298A
CN112563298A CN202011431902.2A CN202011431902A CN112563298A CN 112563298 A CN112563298 A CN 112563298A CN 202011431902 A CN202011431902 A CN 202011431902A CN 112563298 A CN112563298 A CN 112563298A
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image sensor
oxide layer
pixel structure
interface
negative charge
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陈多金
旷章曲
王菁
张帅
孙伟
刘志碧
陈杰
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Will Semiconductor Ltd
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Will Semiconductor Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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    • H01L27/14643Photodiode arrays; MOS imagers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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    • HELECTRICITY
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    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
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Abstract

本发明公开了一种低暗电流的图像传感器像素结构,包括置于半导体基体中的感光二极管、负电荷固定介质层、悬浮漏区、传输管栅极及其侧墙。负电荷固定层由一种高介电常数(k)的氧化层组成,高k值的氧化层可以是Al2O3、HfO2及其Ta02等材料,高k值氧化层将淀积于PD硅表面及其传输栅下面的硅表面,直接与硅表面接触形成Si‑O界面。高k值氧化层将在Si‑O界面产生束缚电子的界面能,界面能有效地束缚了光电二极管表面及其传输管沟道的不饱和悬挂键及其缺陷所产生的电子,从而有效的减低了暗电流。

Description

一种低暗电流的图像传感器像素结构
技术领域
本发明涉及一种图像传感器像素结构,尤其涉及一种低暗电流的图像传感器像素结构。
背景技术
图像传感器像素是目前常用的半导体器件,能将感光面上的光像转换为与光像成相应比例关系的电信号,在各个行业都有广泛应用。
现有技术中,图像传感器像素结构如图1所示,包括:硅基底Silicon101、光电二极管PD(photodiode)102、栅氧化层(oxide)103、悬浮漏区FD(Floating Drain)104、传输管栅极(TX Gate)105及其侧墙(spacer)106。
上述现有技术至少存在以下缺点:
栅氧化层(oxide)难以有效地束缚了光电二极管表面及其传输管沟道的不饱和悬挂键及其缺陷所产生的电子,从而导致暗电流的产生。
发明内容
本发明的目的是提供一种低暗电流的图像传感器像素结构。
本发明的目的是通过以下技术方案实现的:
包括置于半导体基体中的感光二极管和悬浮漏区,所述半导体基体的表面设有负电荷固定介质层,所述负电荷固定介质层的上面设有传输管栅极及其侧墙。
由上述本发明提供的技术方案可以看出,本发明实施例提供的低暗电流的图像传感器像素结构,能有效地束缚了光电二极管表面及其传输管沟道的不饱和悬挂键及其缺陷所产生的电子,从而有效的减低了暗电流。
附图说明
图1为现有技术中的图像传感器像素结构示意图。
图2为本发明实施例提供的低暗电流的图像传感器像素结构示意图。
101:硅基底Silicon,102:光电二极管PD(photodiode),103:栅氧化层(oxide),104:悬浮漏区FD(Floating Drain),105:传输管栅极(TX Gate),106:侧墙(spacer);
201:硅基底Silicon,202:光电二极管PD(photodiode),203:负电荷固定介质层(Negative charge Fix Layer(NCFL)),204:悬浮漏区FD(Floating Drain),205:传输管栅极(TX gate),206:侧墙(spacer)。
具体实施方式
下面将对本发明实施例作进一步地详细描述。本发明实施例中未作详细描述的内容属于本领域专业技术人员公知的现有技术。
本发明的低暗电流的图像传感器像素结构,其较佳的具体实施方式是:
包括置于半导体基体中的感光二极管和悬浮漏区,所述半导体基体的表面设有负电荷固定介质层,所述负电荷固定介质层的上面设有传输管栅极及其侧墙。
所述负电荷固定层由高k值的氧化层组成,所述高k值的氧化层采用Al2O3、HfO2和/或Ta02材料。
所述半导体基体采用硅基底,所述高k值氧化层淀积于硅基底表面,直接与硅基底表面接触形成Si-O界面。
所述高k值氧化层将在所述Si-O界面产生束缚电子的界面能,所述界面能有效地束缚了光电二极管表面及其传输管沟道的不饱和悬挂键及其缺陷所产生的电子,从而有效的减低了暗电流。
本发明的低暗电流的图像传感器像素结构,所述像素结构至少包括置于半导体基体中的感光二极管,负电荷固定介质层,悬浮漏区,传输管栅极及其侧墙。所述负电荷固定层由一种高介电常数(k)的氧化层组成,所述高k值的氧化层可以是Al2O3、HfO2及其Ta02等材料,所述高k值氧化层将淀积于PD硅表面及其传输栅下面的硅表面,直接与硅表面接触形成Si-O界面。
所述高k值氧化层将在所述Si-O界面产生束缚电子的界面能,所述界面能有效地束缚了光电二极管表面及其传输管沟道的不饱和悬挂键及其缺陷所产生的电子,从而有效的减低了暗电流。
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明披露的技术范围内,可轻易想到的变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应该以权利要求书的保护范围为准。

Claims (4)

1.一种低暗电流的图像传感器像素结构,其特征在于,包括置于半导体基体中的感光二极管和悬浮漏区,所述半导体基体的表面设有负电荷固定介质层,所述负电荷固定介质层的上面设有传输管栅极及其侧墙。
2.根据权利要求1所述的低暗电流的图像传感器像素结构,其特征在于,所述负电荷固定层由高k值的氧化层组成,所述高k值的氧化层采用Al2O3、HfO2和/或Ta02材料。
3.根据权利要求2所述的低暗电流的图像传感器像素结构,其特征在于,所述半导体基体采用硅基底,所述高k值氧化层淀积于硅基底表面,直接与硅基底表面接触形成Si-O界面。
4.根据权利要求1、2或3所述的低暗电流的图像传感器像素结构,其特征在于,所述高k值氧化层将在所述Si-O界面产生束缚电子的界面能,所述界面能有效地束缚了光电二极管表面及其传输管沟道的不饱和悬挂键及其缺陷所产生的电子,从而有效的减低了暗电流。
CN202011431902.2A 2020-12-07 2020-12-07 一种低暗电流的图像传感器像素结构 Pending CN112563298A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114335045A (zh) * 2022-03-10 2022-04-12 合肥晶合集成电路股份有限公司 一种降低cmos图像传感器暗电流的方法
CN115132771A (zh) * 2022-09-01 2022-09-30 合肥晶合集成电路股份有限公司 图像传感器及其制作方法

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CN101371361A (zh) * 2006-01-09 2009-02-18 美光科技公司 具有改进的表面耗尽的图像传感器
CN101409301A (zh) * 2007-10-11 2009-04-15 索尼株式会社 固态成像装置及其制造方法和成像装置
CN101673749A (zh) * 2008-09-10 2010-03-17 索尼株式会社 固态成像器件和制造固态成像器件的方法
US20150279892A1 (en) * 2011-12-14 2015-10-01 Sony Corporation Solid-state imaging element and electronic device
CN108428712A (zh) * 2018-05-14 2018-08-21 德淮半导体有限公司 图像传感器及其制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101371361A (zh) * 2006-01-09 2009-02-18 美光科技公司 具有改进的表面耗尽的图像传感器
CN101409301A (zh) * 2007-10-11 2009-04-15 索尼株式会社 固态成像装置及其制造方法和成像装置
CN101673749A (zh) * 2008-09-10 2010-03-17 索尼株式会社 固态成像器件和制造固态成像器件的方法
US20150279892A1 (en) * 2011-12-14 2015-10-01 Sony Corporation Solid-state imaging element and electronic device
CN108428712A (zh) * 2018-05-14 2018-08-21 德淮半导体有限公司 图像传感器及其制造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114335045A (zh) * 2022-03-10 2022-04-12 合肥晶合集成电路股份有限公司 一种降低cmos图像传感器暗电流的方法
CN115132771A (zh) * 2022-09-01 2022-09-30 合肥晶合集成电路股份有限公司 图像传感器及其制作方法

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