CN112563166A - Vacuum defoaming device and method - Google Patents
Vacuum defoaming device and method Download PDFInfo
- Publication number
- CN112563166A CN112563166A CN202011389707.8A CN202011389707A CN112563166A CN 112563166 A CN112563166 A CN 112563166A CN 202011389707 A CN202011389707 A CN 202011389707A CN 112563166 A CN112563166 A CN 112563166A
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- China
- Prior art keywords
- hydraulic cylinder
- rectangular cavity
- vacuum defoaming
- guide rail
- double
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 60
- 238000007789 sealing Methods 0.000 claims abstract description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 15
- 239000010703 silicon Substances 0.000 claims abstract description 15
- 229920000742 Cotton Polymers 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Abstract
The invention discloses a vacuum defoaming device and a vacuum defoaming method, and the vacuum defoaming device comprises a feeding device, a defoaming device and a temperature display instrument, wherein the feeding device comprises a horizontal guide rail, a vertical guide rail, a side panel, a driving hydraulic cylinder, a lifting hydraulic cylinder, a double-layer circular sealing plate, a material conveying frame, a material containing container, a sliding plate and a pressure sensor, the defoaming device comprises a rectangular cavity, a material loading platform, a base, a heater, a shell, an air inlet flange and an air outlet flange, the driving hydraulic cylinder is fixed on the side panel of the horizontal guide rail, the lifting hydraulic cylinder is fixed on the horizontal panel of the vertical guide rail, a jointed silicon wafer is placed in the material containing container, and bubbles are removed in a vacuum and high. The whole defoaming process is efficient and orderly, the operation is simple and convenient, and the practicability is high.
Description
Technical Field
The invention relates to the technical field of bubble removal of a semiconductor material silicon wafer, in particular to a vacuum defoaming device and a vacuum defoaming method.
Background
Silicon is an important semiconductor material, when a semiconductor electronic device is prepared, a silicon wafer is often required to be bonded, and a bonding material mainly adopted during bonding is glue or a film, so that bubbles are generated during bonding, and the performance of the semiconductor product is reduced or even unqualified due to the bubbles. Therefore, timely removing bubbles generated in the bonding process of the silicon wafer is an important step in the process of preparing a semiconductor, and has great significance for preparing high-performance semiconductor products. At present, bubbles are generally removed in a high-temperature environment, but the bubble removal efficiency is low only in the high-temperature environment, the existing equipment has complex process and high manufacturing cost, and the requirement of enterprises cannot be met.
Disclosure of Invention
Aiming at the defects of the existing bubble removing technology for the semiconductor material silicon wafer, the invention aims to provide a vacuum defoaming device and a vacuum defoaming method, and solves the problems of low efficiency, high equipment cost and complex process of the existing bubble removing method.
The object of the invention is achieved by:
the invention discloses a vacuum defoaming device and a vacuum defoaming method, and the vacuum defoaming device comprises a feeding device, a defoaming device and a temperature display instrument, wherein the feeding device comprises a horizontal guide rail, a vertical guide rail, a driving hydraulic cylinder, a lifting hydraulic cylinder, a double-layer circular sealing plate, a material conveying frame, a material containing container, a sliding plate and a pressure sensor, the defoaming device comprises a rectangular cavity, a material loading platform, a base, a heater, a shell, an air inlet flange and an air outlet flange, the driving hydraulic cylinder is fixed on a side panel of the horizontal guide rail, the lifting hydraulic cylinder is fixed on a horizontal panel of the vertical guide rail, and bubbles generated in a bonded silicon wafer are removed in a vacuum and high-temperature environment.
Furthermore, a thermocouple is arranged on the upper surface of the material loading platform, so that the working temperature in the rectangular cavity can be mastered in real time.
Furthermore, the side surface and the upper end surface of the rectangular cavity are respectively provided with a heater and a shell from inside to outside, and heat insulation cotton is filled between the heater and the shell, so that heat can be prevented from being dissipated.
Furthermore, when the sliding plate is in the initial position, the material containing container is arranged on the material conveying frame, the distance between the side surface of the sliding plate and the inlet end surface of the rectangular cavity is equal to the horizontal distance between the center of the material containing container and the center of the material loading platform, the sliding plate is slightly higher than the material loading platform when the sliding plate is in the initial position, and the sliding plate is provided with a pressure sensor. The pressure sensor can control the driving hydraulic cylinder, and the material containing container can be accurately placed on the material loading platform.
Furthermore, a double-layer circular sealing plate and a material conveying frame are fixed on the side face of the sliding plate, and the material conveying frame is located on the lower portion of the double-layer circular sealing plate.
Furthermore, the stroke of the driving hydraulic cylinder is equal to the horizontal distance between the end face of the double-layer circular sealing plate at the initial position and the end face of the inlet of the rectangular cavity, so that the double-layer circular sealing plate can seal the rectangular cavity.
Furthermore, when the lifting hydraulic cylinder is at the highest position, the vertical distance between the center of the double-layer circular sealing plate and the center of the circular feeding port of the rectangular cavity is equal to the stroke of the lifting hydraulic cylinder and slightly larger than the distance between the upper end surface of the material containing container and the lower end surface of the rectangular cavity, so that the accurate positioning of the double-layer circular sealing plate and the circular feeding port of the rectangular cavity is ensured, and the interference between the material containing container and the rectangular cavity is avoided.
Furthermore, the interior of the rectangular cavity is firstly vacuumized, then inert gas is filled in the rectangular cavity, and finally the rectangular cavity is heated to remove bubbles.
Furthermore, the temperature display instrument is fixed on the side face of the rectangular cavity, so that the temperature inside the rectangular cavity can be observed conveniently.
Furthermore, the air inlet flange and the air outlet flange are both arranged on the lower end face of the rectangular cavity.
Compared with the prior art, the invention has the following beneficial effects: the vacuum defoaming device and the method have the advantages of compact structure, simpler manufacturing process and better practicability. The bonded silicon wafer is placed in a material containing container, the silicon wafer can be fed onto a material carrying platform in a rectangular cavity by using a feeding device, an air inlet flange and an air outlet flange are respectively and externally connected with a steel cylinder and a vacuum pump, the silicon wafer is firstly vacuumized and then filled with inert gas, the rectangular cavity is heated by using a heater, heat insulation cotton can prevent heat dissipation, bubbles in the bonded silicon wafer are finally removed, the material containing container can be taken out by using the feeding device after the bubbles are removed, and the whole process is efficient and orderly.
Drawings
FIG. 1 is a schematic view of the initial position structure of the present invention;
FIG. 2 is an overall view of the present invention during defoaming;
FIG. 3 is a view showing the structure of a defoaming apparatus according to the present invention;
FIG. 4 is a view showing the construction of a feeding apparatus according to the present invention;
FIG. 5 is a view showing a structure of a heater;
in the figure: 1. the device comprises a feeding device, 11, a horizontal guide rail, 12, a vertical guide rail, 13, a driving hydraulic cylinder, 14, a lifting hydraulic cylinder, 15, a double-layer circular sealing plate, 16, a material conveying frame, 17, a material containing container, 18, a sliding plate, 19, a pressure sensor, 2, a defoaming device, 21, a rectangular cavity, 22, a material carrying platform, 23, a base, 24, a heater, 25, a shell, 26, an air inlet flange, 27, an air outlet flange, 3, heat preservation cotton, 4, a thermocouple, 5, a temperature display instrument, 6 and a circular feeding port.
Detailed Description
Embodiments of the present invention will be described in further detail with reference to the accompanying drawings.
The invention discloses a vacuum defoaming device and a vacuum defoaming method, and the vacuum defoaming device comprises a feeding device 1, a defoaming device 2 and a temperature display instrument 3, wherein the feeding device 1 comprises a horizontal guide rail 11, a vertical guide rail 12, a driving hydraulic cylinder 13, a lifting hydraulic cylinder 14, a double-layer circular sealing plate 15, a material conveying frame 16, a material containing container 17, a sliding plate 18 and a pressure sensor 19, the defoaming device 2 comprises a rectangular cavity 21, a material loading table 22, a base 23, a heater 24, a shell 25, an air inlet flange 26 and an air outlet flange 27, the driving hydraulic cylinder 13 is fixed on a side panel of the horizontal guide rail 11, the lifting hydraulic cylinder 14 is fixed on a horizontal panel of the vertical guide rail 12, and bubbles generated in a bonded silicon wafer are removed under vacuum and high-temperature environments.
The thermocouple 4 is arranged on the upper surface of the material loading platform 22, and the working temperature inside the rectangular cavity 21 can be mastered in real time.
The side surface and the upper end surface of the rectangular cavity 21 are respectively provided with a heater 24 and a shell 25 from inside to outside, and heat insulation cotton 3 is filled between the heater 24 and the shell 25, so that heat can be prevented from being dissipated.
In the initial position, the material container 17 is placed on the material conveying frame 16, the distance between the side surface of the sliding plate 18 and the inlet end surface of the rectangular cavity 21 is equal to the horizontal distance between the center of the material container 17 and the center of the material loading platform 22, in addition, the sliding plate 18 is slightly higher than the material loading platform 22 in the initial position, and the sliding plate 18 is provided with a pressure sensor 19. The pressure sensor 19 can control and drive the hydraulic cylinder 13, and ensure that the material containing container can be accurately placed on the material loading platform 22.
A double-layer circular sealing plate 15 and a material conveying frame 16 are fixed on the side surface of the sliding plate 18, and the material conveying frame 16 is positioned at the lower part of the double-layer circular sealing plate 15.
The stroke of the driving hydraulic cylinder 13 is equal to the horizontal distance between the end surface of the double-layer circular sealing plate 15 at the initial position and the end surface of the inlet of the rectangular cavity 21, so that the double-layer circular sealing plate 15 can seal the rectangular cavity 21.
When the lifting hydraulic cylinder 14 is located at the highest position, the vertical distance between the center of the double-layer circular sealing plate 15 and the center of the circular feeding opening 6 of the rectangular cavity 21 is equal to the stroke of the lifting hydraulic cylinder 14 and is slightly larger than the distance between the upper end surface of the material containing container 17 and the lower end surface of the rectangular cavity 21, so that the double-layer circular sealing plate 15 and the circular feeding opening 6 of the rectangular cavity 21 are accurately positioned, and the material containing container 17 is prevented from interfering with the rectangular cavity 21.
The rectangular cavity 21 is first evacuated, then filled with inert gas, and finally heated to remove bubbles.
The temperature display instrument 5 is fixed on the side face of the rectangular cavity 21, so that the internal temperature of the rectangular cavity 21 can be observed conveniently.
The air inlet flange 26 and the air outlet flange 27 are both arranged on the lower end face of the rectangular cavity.
At the initial position, the attached silicon wafer is placed in a material container 17, then the material container 17 is conveyed to a material loading platform 22 in a rectangular cavity 21 by using a driving hydraulic cylinder 13, when a sliding plate 18 contacts the inlet end face of the rectangular cavity 21, a pressure sensor 19 controls the driving hydraulic cylinder 13 to stop moving, then a lifting hydraulic cylinder 14 is started to move downwards for a small distance, the material container 17 is placed on the material loading platform 22, the driving hydraulic cylinder 13 contracts to move a material conveying frame 16 out, then the lifting hydraulic cylinder 14 is started, a double-layer circular sealing plate 15 is opposite to a circular material inlet 6 of the rectangular cavity 21, then the driving hydraulic cylinder 13 is started to enable the double-layer circular sealing plate 15 to seal the rectangular cavity 21, as shown in figure 2, then an air outlet flange 27 is used for vacuumizing, then an inert gas is filled by using an air inlet flange 26, finally a heater 24 is started to heat the rectangular cavity 21 to remove bubbles on the silicon, after the air bubbles are removed, the vessel is taken out by the drive hydraulic cylinder 13 and the lift hydraulic cylinder 14.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. The invention discloses a vacuum defoaming device and a vacuum defoaming method, which are characterized by comprising a feeding device, a defoaming device and a temperature display instrument, wherein the feeding device comprises a horizontal guide rail, a vertical guide rail, a driving hydraulic cylinder, a lifting hydraulic cylinder, a double-layer circular sealing plate, a conveying frame, a material containing container, a sliding plate and a pressure sensor, the defoaming device comprises a rectangular cavity, a material carrying table, a base, a heater, a shell, an air inlet flange and an air outlet flange, the driving hydraulic cylinder is fixed on a side panel of the horizontal guide rail, the lifting hydraulic cylinder is fixed on a horizontal panel of the vertical guide rail, and bubbles generated in a bonded silicon wafer are removed under vacuum and high-temperature environments.
2. The vacuum defoaming apparatus and method as claimed in claim 1, wherein: the upper surface of the material loading platform is provided with a thermocouple.
3. The vacuum defoaming apparatus and method as claimed in claim 1, wherein: the side face and the upper end face of the rectangular cavity are respectively provided with a heater and a shell from inside to outside, and heat insulation cotton is filled between the heater and the shell.
4. The vacuum defoaming apparatus and method as claimed in claim 1, wherein: and in the initial position, the distance between the side surface of the sliding plate and the inlet end surface of the rectangular cavity is equal to the horizontal distance between the center of the material containing container and the center of the material loading platform, the sliding plate is slightly higher than the material loading platform in the initial position, and the sliding plate is provided with a pressure sensor.
5. The vacuum defoaming apparatus and method as claimed in claim 1, wherein: the side surface of the sliding plate is fixed with a double-layer circular sealing plate and a material conveying frame, and the material conveying frame is positioned at the lower part of the double-layer circular sealing plate.
6. The vacuum defoaming apparatus and method as claimed in claim 1, wherein: the stroke of the driving hydraulic cylinder is equal to the horizontal distance between the end surface of the double-layer circular sealing plate at the initial position and the end surface of the inlet of the rectangular cavity.
7. The vacuum defoaming apparatus and method as claimed in claim 1, wherein: when the lifting hydraulic cylinder is in the initial position, the lifting hydraulic cylinder is located at the highest position, the vertical distance between the center of the double-layer circular sealing plate and the center of the circular feeding hole of the rectangular cavity is equal to the stroke of the lifting hydraulic cylinder, and is slightly larger than the distance between the upper end surface of the material containing container and the lower end surface of the rectangular cavity.
8. The vacuum defoaming apparatus and method as claimed in claim 1, wherein: the interior of the rectangular cavity is firstly vacuumized, then inert gas is filled in the rectangular cavity, and finally the rectangular cavity is heated to remove bubbles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011389707.8A CN112563166A (en) | 2020-12-01 | 2020-12-01 | Vacuum defoaming device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011389707.8A CN112563166A (en) | 2020-12-01 | 2020-12-01 | Vacuum defoaming device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112563166A true CN112563166A (en) | 2021-03-26 |
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ID=75047637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011389707.8A Pending CN112563166A (en) | 2020-12-01 | 2020-12-01 | Vacuum defoaming device and method |
Country Status (1)
| Country | Link |
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| CN (1) | CN112563166A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06151265A (en) * | 1992-11-12 | 1994-05-31 | Nec Corp | Specimen bonding method and vacuum hot press device |
| JP2002158193A (en) * | 2000-11-21 | 2002-05-31 | Sharp Corp | Method for manufacturing semiconductor light emitting element, shaped transparent substrate used for the same and semiconductor laser element manufactured by the same method |
| CN1867865A (en) * | 2003-04-11 | 2006-11-22 | 株式会社尼康 | Cleanup method for optics in immersion lithography |
| JP2007129077A (en) * | 2005-11-04 | 2007-05-24 | Casio Comput Co Ltd | Manufacturing method of semiconductor device, and defoaming apparatus |
| CN202304265U (en) * | 2011-09-30 | 2012-07-04 | 深圳市腾达工业自动设备有限公司 | Automatic vacuum furnace |
| CN204564463U (en) * | 2015-04-08 | 2015-08-19 | 上海为彪汽配制造有限公司 | The online glue-pouring device of TPMS sensor vacuum |
| CN204659145U (en) * | 2015-05-18 | 2015-09-23 | 深圳市卓耀科技有限公司 | A kind of full-automatic high-pressure defoamer for the deaeration of touch-control product |
| CN211412548U (en) * | 2019-09-20 | 2020-09-04 | 江苏鑫世丰技术产权交易有限公司 | POSS machine touch screen dispenser capable of avoiding bubbles |
-
2020
- 2020-12-01 CN CN202011389707.8A patent/CN112563166A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06151265A (en) * | 1992-11-12 | 1994-05-31 | Nec Corp | Specimen bonding method and vacuum hot press device |
| JP2002158193A (en) * | 2000-11-21 | 2002-05-31 | Sharp Corp | Method for manufacturing semiconductor light emitting element, shaped transparent substrate used for the same and semiconductor laser element manufactured by the same method |
| CN1867865A (en) * | 2003-04-11 | 2006-11-22 | 株式会社尼康 | Cleanup method for optics in immersion lithography |
| JP2007129077A (en) * | 2005-11-04 | 2007-05-24 | Casio Comput Co Ltd | Manufacturing method of semiconductor device, and defoaming apparatus |
| CN202304265U (en) * | 2011-09-30 | 2012-07-04 | 深圳市腾达工业自动设备有限公司 | Automatic vacuum furnace |
| CN204564463U (en) * | 2015-04-08 | 2015-08-19 | 上海为彪汽配制造有限公司 | The online glue-pouring device of TPMS sensor vacuum |
| CN204659145U (en) * | 2015-05-18 | 2015-09-23 | 深圳市卓耀科技有限公司 | A kind of full-automatic high-pressure defoamer for the deaeration of touch-control product |
| CN211412548U (en) * | 2019-09-20 | 2020-09-04 | 江苏鑫世丰技术产权交易有限公司 | POSS machine touch screen dispenser capable of avoiding bubbles |
Non-Patent Citations (3)
| Title |
|---|
| 刘传军, 赵权, 刘春香, 杨洪星: "硅片清洗原理与方法综述", 半导体情报, no. 02, 28 April 2000 (2000-04-28) * |
| 舒福璋;: "半导体硅片清洗工艺的发展研究", 中国高新技术企业, no. 12, 15 June 2007 (2007-06-15) * |
| 钱学君;曹欣: "一种提高熔融玻璃液澄清质量的减压脱泡方法", 无机化工（工程科技Ⅰ辑）, 31 December 2019 (2019-12-31) * |
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