CN112552882A - Single-component muddy interface heat conduction material and application thereof - Google Patents
Single-component muddy interface heat conduction material and application thereof Download PDFInfo
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- CN112552882A CN112552882A CN202011398343.XA CN202011398343A CN112552882A CN 112552882 A CN112552882 A CN 112552882A CN 202011398343 A CN202011398343 A CN 202011398343A CN 112552882 A CN112552882 A CN 112552882A
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
Abstract
The invention relates to the field of heat conduction materials, in particular to a single-component muddy interface heat conduction material and application thereof, wherein the raw materials for preparing the single-component muddy interface heat conduction material comprise, by weight, 4-11 parts of a silicone oil matrix, 0.01-0.05 part of a catalyst, and heat conduction filler with the particle size of 0.5-150 mu m, which is supplemented to 100 parts. The single-component mud interface heat conduction material provided by the invention has a heat conduction coefficient of 4W/mK when the filling amount is 92 wt%, and the density is 1.2g/cm3And 2.72g/cm3When the material has thermal conductivity of 2W/mK and 4W/mK respectively; meanwhile, on the basis of keeping the filling amount of the high-heat-conduction filler, the lower abrasion loss can be kept.
Description
Technical Field
The invention relates to the field of heat conduction materials, in particular to a single-component mud-like interface heat conduction material and application thereof.
Background
The heat-conducting silicon material has good heat-conducting property and good high-low temperature resistance, chemical corrosion resistance and other properties of the organic silicon material, so that the heat-conducting silicon material is the most common heat-conducting high polymer material at present and is widely applied to the fields of LED illumination, consumer electronics, new energy automobiles, communication equipment and the like.
At present, the heat conductivity of the heat conducting silicon material is generally improved by adding heat conducting powder, when the filling amount of the heat conducting powder is small, filler particles are dispersed in a matrix and are not in contact with each other, at the moment, the heat conductivity of the composite material is not obviously improved, when the filling amount of the heat conducting powder is increased to a certain value, the filler particles can be in contact with each other to form a heat conducting chain or a heat conducting net, the heat conductivity of the composite material can be obviously improved, however, a large amount of heat conducting powder is filled, high abrasion loss can be caused during dispensing, and high filling amount and low abrasion loss cannot be simultaneously met.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a single-component pasty interface heat conduction material which is prepared from 4-11 parts by weight of silicone oil matrix, 0.01-0.05 part by weight of catalyst and heat conduction filler with the particle size of 0.5-150 μm, wherein the balance is 100 parts by weight.
In a preferred embodiment of the present invention, the heat conductive material is one or more selected from the group consisting of aluminum oxide, magnesium oxide, aluminum nitride, zinc oxide, boron nitride, silicon carbide, aluminum hydroxide, and silicon dioxide.
In a preferred embodiment of the present invention, the alumina is spherical alumina.
As a preferred embodiment of the present invention, the heat conductive material includes (a) spherical alumina and (b) one or more of magnesium oxide, aluminum nitride, zinc oxide, boron nitride, silicon carbide, aluminum hydroxide, and silicon dioxide.
As a preferable technical scheme of the invention, the single-component pasty interface material also comprises 0.2-0.8 part by weight of a coupling agent.
As a preferable technical scheme of the invention, the raw material for preparing the single-component pasty interfacial heat conduction material also comprises 0.01-0.05 part by weight of methyl vinyl cyclosiloxane.
As a preferable technical scheme of the invention, the silicone oil matrix comprises 1-10 parts by weight of vinyl silicone oil, and the balance of hydrogen-containing silicone oil.
As a preferred technical scheme of the invention, the catalyst is a platinum catalyst, and the platinum content of the platinum catalyst is 500-50000 ppm.
As a preferable technical scheme of the invention, the vinyl silicone oil is terminal vinyl silicone oil, the viscosity of the vinyl silicone oil at 25 ℃ is 50-1000 mPa.s, and the vinyl content is 0.3-2 wt%.
The invention provides a use of the single-component pasty interface heat conduction material in an electronic integrated board in a second aspect.
Compared with the prior art, the invention has the following beneficial effects:
the single-component mud interface heat conduction material provided by the invention has a heat conduction coefficient of 4W/mK when the filling amount is 92 wt%, and the density is 1.2g/cm3And 2.72g/cm3When the material has thermal conductivity of 2W/mK and 4W/mK respectively; meanwhile, on the basis of keeping the filling amount of the high-heat-conduction filler, the lower abrasion loss can be kept.
Detailed Description
The invention provides a single-component muddy interface heat conduction material, which comprises the following raw materials in parts by weight of 4-11 parts of silicone oil matrix, 0.01-0.05 part of catalyst and heat conduction filler with the particle size of 0.5-150 mu m, wherein the balance is 100 parts.
In one embodiment, the raw material for preparing the single-component pasty interface heat conduction material further comprises 0.2-0.8 part by weight of a coupling agent.
In one embodiment, the raw material for preparing the single-component pasty interface heat conduction material further comprises 0.01-0.05 weight part of methyl vinyl cyclosiloxane.
In one embodiment, the raw material for preparing the one-component pasty interface heat conduction material comprises, by weight, 7.5 parts of a silicone oil matrix, 0.03 part of a catalyst, 0.5 part of a coupling agent, 0.03 part of methyl vinyl cyclosiloxane, and heat conduction filler with a particle size of 0.5-150 μm, wherein the balance is 100 parts.
Silicone oil matrix
In one embodiment, the silicone oil matrix comprises 1 to 10 parts by weight of vinyl silicone oil, the balance being hydrogen-containing silicone oil.
Preferably, the silicone oil matrix comprises 7 parts by weight of vinyl silicone oil, and the balance is hydrogen-containing silicone oil.
In one embodiment, the vinyl silicone oil is a terminal vinyl silicone oil having a viscosity of 50 to 1000mPa · s at 25 ℃ and a vinyl content of 0.3 to 2 wt%.
Preferably, the viscosity of the vinyl-terminated silicone oil at 25 ℃ is 285-315 mPas, and the vinyl content is 0.57 wt%.
In one embodiment, the hydrogen-containing silicone oil is methyl hydrogen-containing silicone oil having a viscosity of 50 to 200cSt at 25 ℃ and a hydrogen content of 0.80 to 1.20 mmoles/gm.
Preferably, the methyl hydrogen silicone oil has the viscosity of 55-65cSt at 25 ℃ and the hydrogen content of 1.15-1.25 mmoles/gm.
Catalyst and process for preparing same
In one embodiment, the catalyst is a platinum catalyst having a platinum content of 500-50000 ppm. Preferably, the platinum content in the platinum catalyst is 10000 ppm.
Coupling agent
The coupling agent of the present invention is not particularly limited and may be conventionally selected by those skilled in the art.
In one embodiment, the coupling agent is a silane coupling agent.
Preferably, the silane coupling agent is KH 550.
Methyl vinyl cyclosiloxane
The methylvinylcyclosiloxane is colorless transparent liquid and has a little special odor. Can be dissolved in benzene, ether and alcohol, and is insoluble in water. The product has stable chemical property, can not react with other compounds under a general state, and can be hydrolyzed to open a ring when meeting strong acid or strong base to form a linear substance.
In one embodiment, the methylvinylcyclosiloxane is tetramethyltetravinylcyclotetrasiloxane.
Heat conductive filler
In one embodiment, the thermally conductive filler has a particle size of 0.5 to 150 μm.
Preferably, the particle size of the heat-conducting filler is 70-120 μm; more preferably, the thermally conductive filler has a particle size of 90 μm.
In one embodiment, the thermally conductive material is selected from one or more of alumina, magnesia, aluminum nitride, zinc oxide, boron nitride, silicon carbide, aluminum hydroxide, silicon dioxide.
Preferably, the alumina is spherical alumina.
Preferably, the heat conductive material comprises (a) spherical alumina and (b) one or more of magnesium oxide, aluminum nitride, zinc oxide, boron nitride, silicon carbide, aluminum hydroxide, and silicon dioxide.
The ratio of (a) to (b) is not particularly limited and may be routinely selected by those skilled in the art according to the actual loading requirements.
In the experimental process, in order to obtain a higher heat conductivity coefficient, the more the heat conductive filler is added, although the heat conductivity coefficient is improved, in the dispensing process, the heat conductive material seriously abrades the valve of the automatic dispenser. The present inventors have unexpectedly found that when the heat conductive filler comprises (a) spherical alumina and (b) one or more of magnesia, aluminum nitride, zinc oxide, boron nitride, silicon carbide, aluminum hydroxide, and silica, and the particle diameter of the heat conductive filler is 0.5 to 150. mu.m, particularly 70 to 120. mu.m, the abrasion amount thereof can be reduced, and further, the present inventors have unexpectedly found that when methylvinylcyclosiloxane is further included in the raw material for the preparation of the heat conductive material, the abrasion amount is further reduced, and the applicant has considered that a possible reason is that while regulating the reaction speed of methylvinylcyclosiloxane at 25 ℃ of 50 to 1000 mPas, a vinyl silicone oil having a vinyl content of 0.3 to 2 wt%, and a methyl hydrogen silicone oil having a viscosity at 25 ℃ of 50 to 200cSt and a hydrogen content of 0.80 to 1.20mmoles/gm, the coupling agent modified spherical alumina (a) with the grain diameter of 70-120 mu m and one or more of magnesium oxide, aluminum nitride, zinc oxide, boron nitride, silicon carbide, aluminum hydroxide and silicon dioxide (b) can be uniformly distributed in the preparation system during the silicon-hydrogen reaction, and the heat conduction material with a smoother surface can be obtained at the same time.
In one embodiment, the method for preparing the one-component pasty interface thermal conductive material comprises the following steps:
(1) diluting a coupling agent into alcohol, adding a heat-conducting filler into a high-speed dispersion machine, stirring and drying;
(2) and (2) mixing the material obtained in the step (1) with a silicone oil matrix, a catalyst and methyl vinyl cyclosiloxane, stirring, and heating and curing to obtain the catalyst.
Preferably, the preparation method of the single-component pasty interface heat conduction material comprises the following steps:
(1) diluting a coupling agent into alcohol, adding a heat-conducting filler into a high-speed dispersion machine, stirring and drying;
(2) and (2) adding the material obtained in the step (1), a silicone oil matrix, a catalyst and methyl vinyl cyclosiloxane into a planetary stirrer, mixing, stirring in vacuum, and heating and curing at the temperature of 100-150 ℃ for 30-120min to obtain the silicon-containing epoxy resin.
More preferably, the preparation method of the single-component pasty interface heat conduction material comprises the following steps:
(1) diluting a coupling agent into alcohol, adding a heat-conducting filler into a high-speed dispersion machine, stirring and drying;
(2) and (2) adding the material obtained in the step (1), a silicone oil matrix, a catalyst and methyl vinyl cyclosiloxane into a planetary stirrer at 25 ℃, mixing, stirring in vacuum, and heating and curing at 125 ℃ for 120min to obtain the catalyst.
The invention provides a use of the single-component pasty interface heat conduction material in an electronic integrated board in a second aspect.
Examples
Hereinafter, the present invention will be described in more detail by way of examples, but it should be understood that these examples are merely illustrative and not restrictive. The starting materials used in the examples which follow are all commercially available unless otherwise stated.
Example 1
The embodiment 1 of the invention provides a single-component muddy interface heat conduction material, which is prepared from 4 parts of silicone oil matrix, 0.01 part of catalyst, 0.2 part of coupling agent, 0.01 part of methyl vinyl cyclosiloxane and the balance of heat conduction filler accounting for 100 parts by weight.
The silicone oil matrix is 1 part by weight of vinyl silicone oil, and the balance is hydrogen-containing silicone oil.
The vinyl silicone oil is terminal vinyl silicone oil, the viscosity at 25 ℃ is 285-315 mPas, and the vinyl content is 0.57 wt%.
The hydrogen-containing silicone oil is methyl hydrogen-containing silicone oil, the viscosity at 25 ℃ is 55-65cSt, and the hydrogen content is 1.15-1.25 mmoles/gm.
The catalyst was a platinum catalyst having a platinum content of 3000 ppm.
The coupling agent is KH 550.
The methylvinylcyclosiloxane is tetramethyltetravinylcyclotetrasiloxane.
The grain diameter of the heat-conducting filler is 70 mu m, the heat-conducting filler is formed by compounding spherical aluminum oxide and silicon nitride, and the weight ratio of the heat-conducting filler to the spherical aluminum oxide is 3: 1.
the preparation method of the single-component muddy interface heat conduction material comprises the following steps:
(1) diluting a coupling agent into alcohol, adding a heat-conducting filler into a high-speed dispersion machine, stirring and drying;
(2) and (2) adding the material obtained in the step (1), a silicone oil matrix, a catalyst and methyl vinyl cyclosiloxane into a planetary stirrer at 25 ℃, mixing, stirring in vacuum, and heating and curing at 125 ℃ for 120min to obtain the catalyst.
The single-component muddy interface heat conducting material is applied to an electronic integrated board.
Example 2
The embodiment 2 of the invention provides a single-component muddy interface heat conduction material, which comprises the following raw materials, by weight, 11 parts of a silicone oil matrix, 0.05 part of a catalyst, 0.8 part of a coupling agent, 0.05 part of methyl vinyl cyclosiloxane and the balance of heat conduction filler accounting for 100 parts.
The silicone oil matrix is 10 parts by weight of vinyl silicone oil, and the balance is hydrogen-containing silicone oil.
The vinyl silicone oil is terminal vinyl silicone oil, the viscosity at 25 ℃ is 475-525 mPa.s, and the vinyl content is 0.43 wt%.
The hydrogen-containing silicone oil is methyl hydrogen-containing silicone oil, the viscosity at 25 ℃ is 55-65cSt, and the hydrogen content is 1.15-1.25 mmoles/gm.
The catalyst was a platinum catalyst with a platinum content of 30000 ppm.
The coupling agent is KH 550.
The methylvinylcyclosiloxane is tetramethyltetravinylcyclotetrasiloxane.
The grain diameter of the heat-conducting filler is 120 mu m, the heat-conducting filler is formed by compounding spherical aluminum oxide and silicon nitride, and the weight ratio of the heat-conducting filler to the spherical aluminum oxide is 10: 1.
the preparation method of the single-component muddy interface heat conduction material comprises the following steps:
(1) diluting a coupling agent into alcohol, adding a heat-conducting filler into a high-speed dispersion machine, stirring and drying;
(2) and (2) adding the material obtained in the step (1), a silicone oil matrix, a catalyst and methyl vinyl cyclosiloxane into a planetary stirrer at 25 ℃, mixing, stirring in vacuum, and heating and curing at 125 ℃ for 120min to obtain the catalyst.
The single-component muddy interface heat conducting material is applied to an electronic integrated board.
Example 3
Embodiment 3 of the present invention provides a single-component pasty interfacial thermal conductive material, which is prepared from, by weight, 7.5 parts of a silicone oil matrix, 0.03 part of a catalyst, 0.5 part of a coupling agent, 0.03 part of methyl vinyl cyclosiloxane, and a thermal conductive filler in an amount of 100 parts.
The silicone oil matrix is 7 parts by weight of vinyl silicone oil, and the balance is hydrogen-containing silicone oil.
The vinyl silicone oil is terminal vinyl silicone oil, the viscosity at 25 ℃ is 360-400 mPa.s, and the vinyl content is 0.49 wt%.
The hydrogen-containing silicone oil is methyl hydrogen-containing silicone oil, the viscosity at 25 ℃ is 55-65cSt, and the hydrogen content is 1.15-1.25 mmoles/gm.
The catalyst was a platinum catalyst having a platinum content of 10000 ppm.
The coupling agent is KH 550.
The methylvinylcyclosiloxane is tetramethyltetravinylcyclotetrasiloxane.
The grain diameter of the heat-conducting filler is 90 mu m, the heat-conducting filler is formed by compounding spherical aluminum oxide and silicon nitride, and the weight ratio of the spherical aluminum oxide to the silicon nitride is 5: 1.
the preparation method of the single-component muddy interface heat conduction material comprises the following steps:
(1) diluting a coupling agent into alcohol, adding a heat-conducting filler into a high-speed dispersion machine, stirring and drying;
(2) and (2) adding the material obtained in the step (1), a silicone oil matrix, a catalyst and methyl vinyl cyclosiloxane into a planetary stirrer at 25 ℃, mixing, stirring in vacuum, and heating and curing at 125 ℃ for 120min to obtain the catalyst.
The single-component muddy interface heat conducting material is applied to an electronic integrated board.
Example 4
Embodiment 4 of the present invention provides a single-component pasty interface thermal conductive material, which is different from embodiment 3 in that the thermal conductive filler has a particle size of 90 μm and is spherical alumina.
The specific implementation mode of the preparation method of the single-component pasty interface material is the same as that of example 3.
The single-component muddy interface heat conducting material is applied to an electronic integrated board.
Example 5
Embodiment 5 of the present invention provides a single-component pasty interface thermal conductive material, which is different from embodiment 3 in that the thermal conductive filler has a particle size of 90 μm and is silicon nitride.
The specific implementation mode of the preparation method of the single-component pasty interface material is the same as that of example 3.
The single-component muddy interface heat conducting material is applied to an electronic integrated board.
Example 6
Embodiment 6 of the present invention provides a single-component mud interface thermal conductive material, and a specific embodiment thereof is the same as that in embodiment 3, except that the methylvinylcyclosiloxane is replaced with 1-acetylene-1-cyclohexanol.
The specific implementation mode of the preparation method of the single-component pasty interface material is the same as that of example 3.
The single-component muddy interface heat conducting material is applied to an electronic integrated board.
Example 7
Embodiment 7 of the present invention provides a one-component paste interface thermal conductive material, and the specific embodiment thereof is the same as embodiment 3, except that the vinyl silicone oil is a terminal vinyl silicone oil, the viscosity thereof is 85 to 135mPa · s at 25 ℃, and the vinyl content thereof is 1.06 wt%.
The specific implementation mode of the preparation method of the single-component pasty interface material is the same as that of example 3.
The single-component muddy interface heat conducting material is applied to an electronic integrated board.
Performance evaluation
And (3) abrasion loss test: the single-component clay-like interface materials of examples 1 to 7 were dispensed by automatic dispensing machines, respectively, and when the valve opening and closing interval was less than 3 seconds, it was worn out and could not be used, and the weight of the dispensing valve from the start of the experiment to the time was recorded. The greater the sizing weight, the lower the amount of abrasion, i.e., the less abrasive the product. Conversely, greater wear is indicated.
TABLE 1
| Sizing weight | Amount of wear | |
| Example 1 | 570kg | Low abrasion loss |
| Example 2 | 520kg | Low abrasion loss |
| Example 3 | 480kg | Low abrasion loss |
| Example 4 | 70kg | High abrasion loss |
| Example 5 | 110kg | High abrasion loss |
| Example 6 | 430kg | Moderate wear amount |
| Example 7 | 370kg | Moderate wear amount |
The foregoing examples are merely illustrative and serve to explain some of the features of the method of the present invention. The appended claims are intended to claim as broad a scope as is contemplated, and the examples presented herein are merely illustrative of selected implementations in accordance with all possible combinations of examples. Accordingly, it is applicants' intention that the appended claims are not to be limited by the choice of examples illustrating features of the invention. Also, where numerical ranges are used in the claims, subranges therein are included, and variations in these ranges are also to be construed as possible being covered by the appended claims.
Claims (10)
1. The single-component muddy interface heat conducting material is characterized in that the preparation raw materials comprise, by weight, 4-11 parts of silicone oil matrix, 0.01-0.05 part of catalyst and heat conducting filler with the particle size of 0.5-150 mu m, wherein the balance is 100 parts.
2. The single-component pasty interface thermal conductive material of claim 1, wherein the thermal conductive material is selected from one or more of aluminum oxide, magnesium oxide, aluminum nitride, zinc oxide, boron nitride, silicon carbide, aluminum hydroxide, and silicon dioxide.
3. The single component, paste-like interfacial thermal conductive material of claim 2, wherein said alumina is spherical alumina.
4. The single component, paste-like interfacial thermal conductive material of claim 3, wherein said thermal conductive material comprises (a) spherical alumina and (b) one or more of magnesium oxide, aluminum nitride, zinc oxide, boron nitride, silicon carbide, aluminum hydroxide, silicon dioxide.
5. The single-component mud interface material according to any of claims 1-4, wherein the raw material for preparing the single-component mud interface material further comprises 0.2-0.8 parts by weight of a coupling agent.
6. The single-component mud interface thermal conduction material of claim 5, wherein the raw material for preparing the single-component mud interface thermal conduction material further comprises 0.01-0.05 parts by weight of methyl vinyl cyclosiloxane.
7. The single-component pasty interface thermal conduction material of claim 6, wherein the silicone oil matrix comprises 1-10 parts by weight of vinyl silicone oil, and the balance of hydrogen-containing silicone oil.
8. The single component mud interface thermally conductive material of claim 7, wherein the catalyst is a platinum catalyst having a platinum content of 500-50000 ppm.
9. The one-component pasty interfacial thermal conductive material of claim 8, wherein the vinyl silicone oil is a terminal vinyl silicone oil having a viscosity of 50 to 1000 mPa-s at 25 ℃ and a vinyl content of 0.3 to 2 wt%.
10. Use of a one-component, paste-like interface thermally conductive material according to any of claims 1 to 9 in an electronics board.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101643582A (en) * | 2009-08-25 | 2010-02-10 | 合肥凯蒙新材料有限公司 | Dual composition addition type room temperature solidified silicon rubber used for recording left-behind tracks |
| CN106633914A (en) * | 2016-12-14 | 2017-05-10 | 平湖阿莱德实业有限公司 | Muddy heat-conducting interface shimming material and preparation method thereof |
| CN107987536A (en) * | 2018-01-04 | 2018-05-04 | 楼旭娟 | A kind of high heat conductive insulating silica gel piece and preparation method thereof |
| CN108504108A (en) * | 2018-06-07 | 2018-09-07 | 苏州佰旻电子材料科技有限公司 | A kind of add-on type bi-component organic silicon thermally conductive gel and preparation method thereof |
| CN110317581A (en) * | 2019-06-06 | 2019-10-11 | 东莞市盛元新材料科技有限公司 | A kind of pureed thermostable heat-conductive composite material and preparation method |
| CN110511728A (en) * | 2019-07-17 | 2019-11-29 | 平湖阿莱德实业有限公司 | A kind of pureed two-component high thermal conductivity coefficient interface sealant and preparation method thereof |
| CN111808571A (en) * | 2020-06-22 | 2020-10-23 | 广州回天新材料有限公司 | High-heat-conductivity organic silicon pouring sealant for photovoltaic inverter |
-
2020
- 2020-12-02 CN CN202011398343.XA patent/CN112552882B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101643582A (en) * | 2009-08-25 | 2010-02-10 | 合肥凯蒙新材料有限公司 | Dual composition addition type room temperature solidified silicon rubber used for recording left-behind tracks |
| CN106633914A (en) * | 2016-12-14 | 2017-05-10 | 平湖阿莱德实业有限公司 | Muddy heat-conducting interface shimming material and preparation method thereof |
| CN107987536A (en) * | 2018-01-04 | 2018-05-04 | 楼旭娟 | A kind of high heat conductive insulating silica gel piece and preparation method thereof |
| CN108504108A (en) * | 2018-06-07 | 2018-09-07 | 苏州佰旻电子材料科技有限公司 | A kind of add-on type bi-component organic silicon thermally conductive gel and preparation method thereof |
| CN110317581A (en) * | 2019-06-06 | 2019-10-11 | 东莞市盛元新材料科技有限公司 | A kind of pureed thermostable heat-conductive composite material and preparation method |
| CN110511728A (en) * | 2019-07-17 | 2019-11-29 | 平湖阿莱德实业有限公司 | A kind of pureed two-component high thermal conductivity coefficient interface sealant and preparation method thereof |
| CN111808571A (en) * | 2020-06-22 | 2020-10-23 | 广州回天新材料有限公司 | High-heat-conductivity organic silicon pouring sealant for photovoltaic inverter |
Non-Patent Citations (1)
| Title |
|---|
| 周文英等著: "《聚合物基导热复合材料》", 30 September 2017, 国防工业出版社 * |
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