CN112533386A - Manufacturing method of conductive circuit board - Google Patents
Manufacturing method of conductive circuit board Download PDFInfo
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- CN112533386A CN112533386A CN202011550473.0A CN202011550473A CN112533386A CN 112533386 A CN112533386 A CN 112533386A CN 202011550473 A CN202011550473 A CN 202011550473A CN 112533386 A CN112533386 A CN 112533386A
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- organic film
- film layer
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- resin
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Abstract
The invention discloses a method for manufacturing a conductive circuit board, which comprises the steps of covering an organic adhesive film and a strippable layer on the surface of a glass or ceramic substrate, etching a precise circuit pattern, filling a high-temperature sintering type conductive material in a groove of the pattern, stripping the strippable layer, and finally burning off the organic adhesive film through high-temperature sintering treatment, and simultaneously densifying the conductive material to form a precise conductive circuit. The method of the invention can manufacture a circuit with the resolution of 20 mu m or even more precision on the surface of the glass or ceramic substrate, and can manufacture a three-dimensional or thicker circuit through multiple overlapping.
Description
Technical Field
The invention relates to the technical field of conductive patterns, in particular to a manufacturing method of a conductive circuit board.
Background
At present, inorganic materials are mostly manufactured by methods such as sputtering, vapor deposition, hot-pressing metal foil and the like as a conducting circuit substrate, the former two methods are mainly used for a plating seed layer of a semi-additive circuit board, equipment is expensive, and particularly, the flowing operation can not be realized for large substrates. The latter method directly manufactures the thick copper substrate, and adopts the etching process to manufacture the circuit, so that the circuit precision is slightly poor, and the material utilization rate is low.
In addition, in the field of FPDs with advanced functional development, further high definition is required for the conductive pattern in the conductive pattern forming substrate. A conductive pattern such as an electrode pattern is required to have a low resistance, and in order to suppress the resistance of a conductive pattern having a narrow pattern width with a high definition, the thickness of the conductive pattern needs to be constant. However, in sputtering or vacuum deposition, since a metal film to be a conductive pattern cannot be formed too thick, it is required that the conductive pattern can be formed to a certain thickness and to have high definition. Even if the metal film can be formed thick, it is difficult to remove unnecessary portions from the thick metal film by laser irradiation or the like. That is, in order to prevent short-circuiting between the conductive patterns, it is necessary to remove a sufficient unnecessary portion, and it is necessary to suppress damage to the removed conductive patterns or the transparent substrate as much as possible.
Therefore, there is still a need for a method for manufacturing a conductive circuit board, which is not only effectively suitable for streamlined operations, but also can improve the accuracy of circuit patterns, and at the same time, simplifies the process of removing unnecessary portions, and avoids damage to the circuit board.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a method for manufacturing a conductive circuit board, which can manufacture a circuit with the resolution of 20 mu m or more on the surface of a glass or ceramic substrate; and a three-dimensional or thicker circuit can be manufactured through multiple times of superposition, and meanwhile, the process for removing unnecessary parts is simple and efficient.
In order to achieve the purpose, the invention adopts the following technical scheme:
a manufacturing method of a conductive circuit board comprises the following steps:
s1, covering at least one organic film layer on the surface of the substrate;
s2, applying at least one strippable glue layer on the surface of the organic film layer;
s3, forming a circuit pattern on the organic film layer and the strippable glue layer;
s4, coating conductive paste on the surface of the peelable glue layer and the circuit pattern groove in a scraping mode, and fully filling the circuit pattern groove;
s5, peeling the peelable glue layer and taking away the redundant conductive paste on the surface;
and S6, carrying out heat treatment on the substrate with the conductive paste with the circuit pattern and the organic film layer to obtain the conductive circuit board.
In a specific embodiment, the organic film layer in S1 is prepared by a printing, coating or spraying process using a fluid slurry, and then cured by baking to obtain a solid organic film layer with uniform thickness; or
The organic film layer is prepared by printing, coating or spraying the flowing slurry, and then is cured by ultraviolet light to obtain a solid organic film layer with uniform thickness; or
The organic film layer is a semi-solid or solid adhesive film and is bonded on the surface of the substrate through a hot pressing process.
In a specific embodiment, the peelable glue layer in S2 is in a solid or semi-solid state and can be peeled twice at normal temperature or at a temperature of 50-200 ℃.
In a specific embodiment, in S3, a circuit pattern is formed on the organic film layer and the peelable glue layer by laser engraving.
In a specific embodiment, the conductive paste in S4 is a composition containing silver paste, copper, aluminum, nickel, gold or platinum conductive particle filler, glass frit, solvent, polymer resin and auxiliaries.
In a preferred embodiment, a pre-baking step is further included before step S5, wherein the pre-baking temperature is 50-120 ℃ and the baking time is 2-60 min.
In a preferred embodiment, the method further comprises repeating steps S1-S5 before step S6 to prepare a three-dimensional graphic circuit having a structure with a small top and a large bottom.
In a specific embodiment, the heat treatment process in S6 comprises the steps of firstly baking at 250 ℃ for 10-60min at 100-; preferably, the sintering needs to be performed under a reducing atmosphere.
In a specific embodiment, the substrate in S1 is an inorganic non-metallic substrate, preferably glass or ceramic.
In a specific embodiment, the organic film layer in S1 is a high molecular polymer film material, preferably a photo-curable or thermal-curable resin, more preferably at least any one of epoxy resin, polyester resin, phenolic resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, acrylate resin, polyurethane resin, silicone resin, and polybutadiene resin; the peelable glue layer in S2 is a thermoplastic resin material selected from at least one of polyethylene, polypropylene, polyvinyl chloride, thermoplastic acrylic resin, polyethylene terephthalate, polycarbonate, polyethylene naphthalate, and polyimide, and is preferably polyethylene terephthalate.
Compared with the prior art, the invention has the advantages that:
(1) according to the invention, the organic film layer and the strippable glue layer are coated on the substrate, then the circuit pattern is formed, the conductive slurry is coated in the groove of the circuit pattern by scraping, then the strippable glue layer is stripped, and the sintering and curing slurry is sintered to form a compact conductive circuit, so that a circuit with the resolution of 20 mu m or even more precise can be obtained on the surface of the substrate.
(2) According to the invention, the strippable glue layer is arranged, the lead sizing material is coated on the strippable glue layer in a scraping manner, and the excess sizing material can be removed very conveniently by stripping the strippable glue layer to obtain a precise circuit pattern, so that the process is simple and efficient, and the process for removing the excess part can not damage the circuit board.
(3) The method of the present invention can also prepare a three-dimensional graphic circuit having a structure of a small top and a large bottom by repeating the steps of S1-S5 a plurality of times.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a conductive circuit board according to the present invention.
Fig. 2 is a flow chart illustrating another method for manufacturing a conductive circuit board according to the present invention.
Fig. 3 is a flow chart illustrating a method for manufacturing a conductive circuit board according to another embodiment of the present invention.
Fig. 4 is a flow chart illustrating a method for manufacturing a conductive circuit board according to another embodiment of the present invention.
Fig. 5 is a schematic view of a method for manufacturing a conductive circuit board according to an embodiment of the present invention.
The circuit board comprises a substrate 101, an organic film layer 102, a strippable glue layer 103, a circuit pattern groove 104 and conductive paste 105.
Detailed Description
The present invention will be further described with reference to more specific embodiments, but it should be noted that the method for manufacturing a conductive circuit board of the present invention is not limited to this specific component or step. It will be apparent to those skilled in the art that the following description may be applied directly to other similar components or process steps not specified herein, without any adjustment or modification.
As shown in fig. 1 and 5, the method for manufacturing a conductive circuit board of the present invention includes the steps of:
step S1: at least one organic film layer 102 is covered on the surface of the substrate 101.
The substrate 101 may be any substrate commonly used in the art without any limitation, and is preferably an inorganic non-metallic substrate, and more preferably a glass substrate or a ceramic substrate. The organic film layer 102 may be one layer, two layers or more, preferably one layer. In general, the thickness of the organic film layer 102 is selectable from 8 μm to 100 μm, without particular limitation.
In one embodiment, the organic film layer 102 may be a fluid slurry prepared by a printing, coating or spraying process, and then cured by baking to obtain a solid organic film layer with uniform thickness. Specifically, for example, the organic film layer 102 is selected from thermosetting unsaturated polyester resin materials, such as thermosetting polyimide.
In one embodiment, the organic film layer 102 may be a fluid slurry prepared by a printing, coating or spraying process, and then cured by uv light to obtain a solid organic film layer with uniform thickness. Specifically, for example, the organic film layer 102 is selected from acrylate resin materials.
In one embodiment, the organic film layer 102 may be a semi-solid or solid adhesive film, and is bonded to the substrate surface through a thermal compression process. Specifically, for example, the organic film layer 102 is selected from epoxy resin materials.
S2: at least one strippable glue layer 103 is applied on the surface of the organic film layer 102.
The glass-based adhesive layer 103 may be one layer, two layers or more, preferably one layer. The peelable glue layer 103 is solid or semi-solid and can be peeled off for the second time at normal temperature or 50-200 ℃. For example, the peelable layer 103 is selected from polyethylene terephthalate.
The peelable glue layer 103 may be applied to the surface of the organic film layer 102 by conventional printing, coating, spraying or thermal pressing processes.
S3: a wiring pattern groove 104 is formed in the organic film layer 102 and the peelable glue layer 103.
In the present invention, the method for forming the circuit pattern on the organic film layer 102 and the peelable glue layer 103 is not limited at all, and may be a method commonly used in the art, for example, a method of laser engraving, so as to form a precise circuit pattern groove 104 on the surface of the substrate 101 through the organic film layer 102 and the peelable glue layer 103.
In one embodiment, when the organic film layer has alkali solubility and the peelable glue layer does not have alkali solubility, the pattern is etched on the organic film layer by using an alkali solution, and then the peelable glue layer is attached, and then the peelable glue is engraved by using a laser.
And S4, coating conductive paste 105 on the surface of the strippable glue layer and the circuit pattern groove 104 in a scraping mode, and fully filling the circuit pattern groove 104.
The conductive paste 105 is a composition containing silver paste, copper, aluminum, nickel, gold or platinum conductive particle filler, glass frit, a solvent, polymer resin and an auxiliary agent. Specifically, the selection of an appropriate slurry may be tailored to the downstream application requirements of the art, as is well known to those skilled in the art.
In the invention, the conductive paste 105 is filled into the circuit pattern groove 104 in a blade coating mode, and the surface of the conductive paste is protected by the strippable glue layer 103, so that the conductive paste filling step can be easily and conveniently completed, and even if a plurality of conductive pastes are coated on the surface of the strippable glue layer 103, the problems of short circuit and the like of conductive circuits caused by inaccurate filling are not needed to be worried about.
And S5, peeling the peelable glue layer 103 and carrying away the redundant conductive paste on the surface.
In the step, secondary stripping of the peelable glue layer can be realized at normal temperature or 50-200 ℃ according to the property of the peelable glue layer 103, and the redundant conductive paste on the surface is taken away, so that a precise conductive circuit layer which is not sintered is obtained.
And S6, carrying out heat treatment on the substrate with the conductive paste with the circuit pattern and the organic film layer to obtain the conductive circuit board.
In the step, through sintering heat treatment, on one hand, the organic film layer is removed, and on the other hand, the conductive slurry is densified to form the circuit board with a precise and densified conductive circuit. Wherein the heat treatment process comprises the steps of baking at the temperature of 100-250 ℃ for 10-60min to remove the solvent in the conductive material; degreasing at the temperature of 250 ℃ and 600 ℃ for 10-90min, and decomposing and removing the polymer and the organic film in the conductive material; finally sintering at 400-1200 ℃ for 10-60 min; preferably, the sintering is performed in a reducing atmosphere, and the conductive material such as copper or aluminum is sintered in a reducing atmosphere. The reducing atmosphere is, for example, H2An atmosphere. In this step, the conductive material is densified by sintering to form a low-resistance wiring.
As shown in fig. 2, another embodiment of the present invention further includes a pre-baking step before step S5, where the pre-baking step is used to primarily cure the conductive paste, so that the conductive paste has a certain strength, and the peelable glue layer is peeled off to prevent the conductive material in the groove of the organic film from being removed by the peelable tape, thereby further ensuring that no influence is caused on the conductive circuit, so that the peelable glue layer and the conductive paste filled in the groove can be very easily separated without any adhesion or dragging, the peeling glue only takes away the excess conductive paste, and it is ensured that no conductive material exists between the precision lines, thereby ensuring the insulation of the precision circuits. Specifically, the pre-baking temperature is 50-120 ℃, and the baking time is 2-60min, preferably 15-60 min.
As shown in fig. 3, a further embodiment of the present invention, which further includes steps of repeating S1-S5 before step S6, can prepare a three-dimensional pattern circuit having a small-top-large-bottom structure by printing and filling conductive paste a plurality of times. The size structure of the specific three-dimensional figure can be designed according to needs, and the times of repeated printing are reasonably arranged.
The method can manufacture a three-dimensional or thicker circuit through simple repeated operation and repeated superposition, and is suitable for diversified design and personalized design of circuit graphs.
As shown in fig. 4, another embodiment of the present invention, on the basis that the pre-baking process shown in fig. 2 ensures complete and effective peeling, further comprises repeating the steps from S1 to S5 before step S6, and preparing a three-dimensional pattern circuit having a structure with a small top and a large bottom by printing and filling conductive paste for a plurality of times.
The innovation of the invention lies in the reconstruction of the process flow, particularly the introduction of the strippable film layer, which greatly reduces the difficulty of filling the conductive paste and removing the redundant conductive paste, so that the process is simple and efficient, and is suitable for large-scale batch production. Processes or components not specifically specified in the present invention can be referred to in the art, such as components and formulations of conductive pastes, and etching to form wiring patterns, etc., which are well known to those skilled in the art.
In addition, although not illustrated in the above embodiments, the surface of the substrate 101 may be treated to improve the cleanliness of the surface of the substrate 101 and the bonding force with the organic film 101 before the step of covering the organic film 101 on the substrate 101, which is also a conventional operation in the art.
Example 1:
s1, covering a layer of epoxy resin organic film layer on the surface of the ceramic substrate in a printing mode, wherein the thickness of the film layer is 80 microns;
s2, applying a polycarbonate peelable glue layer with the thickness of 8 mu m on the surface of the organic film layer in a printing mode;
s3, forming a preset circuit pattern on the organic film layer and the peelable glue layer in a laser engraving mode;
s4, coating conductive paste on the surface of the peelable glue layer and the circuit pattern groove in a scraping mode, and fully filling the circuit pattern groove, wherein the conductive paste comprises 65% of copper powder, 3% of bismuth-containing glass frit, 12% of acrylate resin, 10% of butyl carbitol acetate and 10% of a dispersing agent;
s5, peeling the peelable glue layer by a manual method, and taking away redundant conductive paste on the surface;
and S6, carrying out heat treatment on the substrate with the conductive paste with the circuit pattern and the organic film layer to obtain the conductive circuit board, wherein the heat treatment process comprises the steps of baking at 250 ℃ for 10min, baking at 600 ℃ for 10min, and finally treating at 1200 ℃ for 10min in a reducing atmosphere.
Example 2:
s1, covering a UV-cured acrylate resin organic film layer on the surface of the ceramic substrate in a printing mode, wherein the thickness of the film layer is 15 microns;
s2, applying a thermoplastic acrylic resin strippable glue layer with the thickness of 2.5 mu m on the surface of the organic film layer in a printing mode;
s3, forming a preset circuit pattern on the organic film layer and the peelable glue layer in a laser engraving mode;
s4, coating conductive paste on the surface of the peelable glue layer and the circuit pattern groove in a scraping mode, and fully filling the circuit pattern groove, wherein the conductive paste comprises 65% of copper powder, 3% of bismuth-containing glass frit, 12% of acrylate resin, 10% of butyl carbitol acetate and 10% of a dispersing agent;
s4, pre-baking the conductive circuit substrate filled with the conductive paste obtained in the previous step at 150 ℃ for 10 min;
s5, peeling the peelable glue layer by a manual method, and taking away redundant conductive paste on the surface;
and S6, carrying out heat treatment on the substrate with the conductive paste with the circuit pattern and the organic film layer to obtain the conductive circuit board, wherein the heat treatment process is to transfer the substrate to a reducing atmosphere at 450 ℃/30min under the air condition and at 850 ℃/15 min.
Example 3:
s1, covering a layer of thermosetting epoxy resin organic film layer on the surface of the ceramic substrate in a hot pressing mode, wherein the thickness of the film layer is 25 microns;
s2, applying a polyethylene terephthalate peelable glue layer with the thickness of 4 mu m on the surface of the organic film layer in a printing mode;
s3, forming a preset circuit pattern on the organic film layer and the peelable glue layer in a laser engraving mode;
s4, coating conductive paste on the surface of the peelable glue layer and the circuit pattern groove in a scraping mode, and fully filling the circuit pattern groove, wherein the conductive paste comprises 60% of silver powder, 5% of lead-containing glass frit, 10% of N-4 ethyl cellulose, 15% of butyl carbitol and 10% of a dispersing agent;
s4, pre-baking the conductive circuit substrate filled with the conductive paste obtained in the previous step at 120 ℃ for 30 min;
s5, peeling the peelable glue layer by a manual method, and taking away redundant conductive paste on the surface;
s5 additional steps, repeating the foregoing steps S1 to S5 1 time;
and S6, carrying out heat treatment on the substrate with the conductive paste with the circuit pattern and the organic film layer to obtain the conductive circuit board with the circuit width size of 35 mu m and the single-layer structure, wherein the heat treatment process is to change the speed from 400 ℃/30min to 800 ℃/20min under the air condition.
Although particular embodiments of the invention have been described and illustrated in detail, it should be understood that various equivalent changes and modifications could be made to the above-described embodiments in accordance with the spirit of the invention, and the resulting functional effects would still fall within the scope of the invention, without departing from the spirit of the description and the accompanying drawings.
Claims (10)
1. A manufacturing method of a conductive circuit board is characterized by comprising the following steps:
s1, covering at least one organic film layer on the surface of the substrate;
s2, applying at least one strippable glue layer on the surface of the organic film layer;
s3, forming a circuit pattern on the organic film layer and the strippable glue layer;
s4, coating conductive paste on the surface of the peelable glue layer and the circuit pattern groove in a scraping mode, and fully filling the circuit pattern groove;
s5, peeling the peelable glue layer and taking away the redundant conductive paste on the surface;
and S6, carrying out heat treatment on the substrate with the conductive paste with the circuit pattern and the organic film layer to obtain the conductive circuit board.
2. The method of claim 1, wherein the organic film layer in S1 is prepared by printing, coating or spraying a fluid slurry, and then baked and cured to obtain a solid organic film layer with uniform thickness; or
The organic film layer is prepared by printing, coating or spraying the flowing slurry, and then is cured by ultraviolet light to obtain a solid organic film layer with uniform thickness; or
The organic film layer is a semi-solid or solid adhesive film and is bonded on the surface of the substrate through a hot pressing process.
3. The method for manufacturing the conductive circuit board according to claim 1, wherein the peelable glue layer in S2 is solid or semi-solid and can be peeled off twice at normal temperature or at a temperature of 50-200 ℃.
4. The method of manufacturing a conductive circuit board according to claim 1, wherein a wiring pattern is formed in the organic film layer and the peelable glue layer by laser engraving in S3.
5. The method of claim 1, wherein the conductive paste in S4 is a composition containing silver paste, copper, aluminum, nickel, gold or platinum conductive particle filler, glass frit, solvent, polymer resin, and additives.
6. The method of claim 1, further comprising a pre-baking step before step S5, wherein the pre-baking temperature is 50-120 ℃ and the baking time is 2-60 min.
7. The method of claim 1 or 6, further comprising repeating steps S1-S5 before step S6 to obtain a three-dimensional pattern circuit with a structure having a small top and a large bottom.
8. The method as claimed in claim 7, wherein the heat treatment process in S6 comprises baking at 250 ℃ for 10-60min at 100-; preferably, the sintering needs to be performed under a reducing atmosphere.
9. The method for manufacturing a conductive circuit board according to claim 1, wherein the substrate in S1 is an inorganic non-metallic substrate, preferably glass or ceramic.
10. The method for manufacturing a conductive circuit board according to claim 1, wherein the organic film layer in S1 is a high molecular polymer film material, preferably a photo-curable or thermosetting resin, more preferably at least one of epoxy resin, polyester resin, phenolic resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, acrylate resin, polyurethane resin, silicone resin, and polybutadiene resin; the peelable glue layer in S2 is a thermoplastic resin material selected from at least one of polyethylene, polypropylene, polyvinyl chloride, thermoplastic acrylic resin, polyethylene terephthalate, polycarbonate, polyethylene naphthalate, and polyimide, and is preferably polyethylene terephthalate.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114190004A (en) * | 2021-11-17 | 2022-03-15 | 深圳市百柔新材料技术有限公司 | PCB (printed circuit board) repairing method |
| CN114449771A (en) * | 2021-09-27 | 2022-05-06 | 深圳市百柔新材料技术有限公司 | Preparation method of double-sided via hole ceramic copper-clad plate and circuit board |
| CN116514406A (en) * | 2023-04-26 | 2023-08-01 | 深圳市志凌伟业技术股份有限公司 | Preparation method of glass-based transparent conductive sheet |
| CN114190004B (en) * | 2021-11-17 | 2024-04-23 | 深圳市百柔新材料技术有限公司 | PCB (printed circuit board) repairing method |
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