CN112531032A - Photoelectric sensor packaging structure - Google Patents
Photoelectric sensor packaging structure Download PDFInfo
- Publication number
- CN112531032A CN112531032A CN202011390560.4A CN202011390560A CN112531032A CN 112531032 A CN112531032 A CN 112531032A CN 202011390560 A CN202011390560 A CN 202011390560A CN 112531032 A CN112531032 A CN 112531032A
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- photoelectric sensor
- groove
- plate
- frame body
- substrate
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000011521 glass Substances 0.000 claims abstract description 12
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 230000000694 effects Effects 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000002265 prevention Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02016—Circuit arrangements of general character for the devices
- H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
Abstract
The invention relates to the technical field of sensor packaging, and discloses a photoelectric sensor packaging structure which comprises a substrate and a packaging plate, wherein the upper surface of the substrate is attached to the lower surface of the packaging plate, the upper surface of the substrate is fixedly connected with a frame body, the lower surface of the packaging plate is provided with a groove corresponding to the frame body, the frame body is clamped with the groove, a matched sealing strip is arranged at the joint of the frame body and the groove, a matched control processing chip is arranged in the frame body and electrically connected with the substrate, the bottom of the groove is provided with a matched photoelectric sensor chip, the lower surface of the photoelectric sensor chip is attached to the top of the frame body, the bottom of the groove is provided with an opening, and matched glass is fixedly arranged in the opening. The invention not only can effectively ensure the packaging effect of the photoelectric sensor, but also is convenient to maintain the packaged photoelectric sensor according to the requirement and effectively ensures the maintenance efficiency.
Description
Technical Field
The invention relates to the technical field of sensor packaging, in particular to a photoelectric sensor packaging structure.
Background
A photosensor is a device that converts an optical signal into an electrical signal. The working principle is based on the photoelectric effect. The photoelectric effect refers to the phenomenon that when light irradiates on some substances, electrons of the substances absorb the energy of photons, and the corresponding electric effect occurs.
In the prior art, the photoelectric sensor is of an integral structure which can not be disassembled after packaging, and when an internal chip breaks down and needs to be maintained, the disassembly and the replacement are time-consuming and labor-consuming, so that the maintenance efficiency of the photoelectric sensor is greatly influenced.
Disclosure of Invention
The present invention is directed to a package structure of a photo sensor, which solves the above problems in the related art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a photoelectric sensor packaging structure comprises a substrate and a packaging plate, wherein the upper surface of the substrate is attached to the lower surface of the packaging plate, the upper surface of the substrate is fixedly connected with a frame body, the lower surface of the packaging plate is provided with a groove corresponding to the frame body, the frame body is clamped with the groove, a matched sealing strip is arranged at the joint of the frame body and the groove, a matched control processing chip is arranged in the frame body and is electrically connected with the substrate, the bottom of the groove is provided with a matched photoelectric sensor chip, the lower surface of the photoelectric sensor chip is attached to the top of the frame body, the bottom of the groove is provided with an opening, matched glass is fixedly arranged in the opening, the lower surface of the glass is attached to the upper surface of the photoelectric sensor chip, and the lower surface of the substrate, which is close to two ends, is symmetrically provided with a ring, the lower surface of the packaging plate is symmetrically and fixedly connected with inserting plates, the bottom of the annular groove is provided with a through groove matched with the inserting plates, the inserting plates penetrate through the through groove, the center of the bottom of the inserting plates is rotatably connected with a rotating pin through a bearing, the other end of the rotating pin is fixedly connected with a deflection plate, the deflection plate is connected with the annular groove through a loosening prevention mechanism, and the upper surface of the deflection plate is attached to the bottom of the annular groove;
locking mechanism sets up the rectangular channel on the ring channel lateral wall including the symmetry, sliding connection has the fixture block of matching in the rectangular channel, and fixedly connected with spring between fixture block and the rectangular channel tank bottom, the notch of rectangular channel is passed to the one end that the spring was kept away from to the fixture block, and the tip of fixture block is the setting of hemispherical structure, the arc wall that suits with the fixture block tip is all seted up at the both ends of deflector, and the tip and the arc wall block setting that the spring was kept away from to the fixture block.
Preferably, the lower surface symmetry fixedly connected with positive electrode and negative electrode of photoelectric sensor chip, the constant head tank corresponding with positive electrode and negative electrode is seted up at the top of framework, and the tank bottom fixed mounting of constant head tank has the conducting block, the lower surface of positive electrode and negative electrode is laminated with the upper surface of two conducting blocks respectively mutually, the through wires hole has been seted up to the tank bottom of constant head tank, and installs the wire in the through wires hole, the both ends of wire respectively with base plate and conducting block fixed connection.
Preferably, the lower surface of the photoelectric sensor chip is symmetrically provided with an insulating rod, and the bottom end of the insulating rod is abutted to the upper surface of the control processing chip.
Preferably, the transverse cross-section of the insert plate is the same as the transverse cross-section of the deflector plate.
Preferably, a rotating handle is fixedly arranged at the center of the lower surface of the deflection plate.
Preferably, the upper surface of the glass is covered with a matching filter film.
Compared with the prior art, the invention provides a photoelectric sensor packaging structure, which has the following beneficial effects:
the photoelectric sensor packaging structure is characterized in that a substrate, a packaging plate, a frame body, a sealing strip, a control processing chip, a photoelectric sensor chip, an annular groove, an inserting plate, a through groove, a rotating pin, a deflection plate and an anti-loosening mechanism are arranged, the control processing chip is arranged in the frame body and is attached to the substrate, so that the photoelectric sensor chip is directly and electrically connected with the substrate conveniently, the photoelectric sensor chip is arranged at the top of the frame body, the inserting plate at the bottom end of the packaging plate penetrates through the through groove, a groove on the lower surface of the packaging plate is matched with the frame body for clamping, the sealing strip can effectively ensure the sealing performance of packaging, the deflection plate connected with the rotating pin is rotated to be vertical to the inserting plate, the connection between the packaging plate and the substrate can be completed, the deflection plate is not easy to rotate through the anti-loosening mechanism, so that the connection stability, the packaging plate can be separated from the substrate, so that the chip can be maintained quickly as required.
The parts which are not involved in the device are the same as or can be realized by adopting the prior art, the invention not only can effectively ensure the packaging effect of the photoelectric sensor, but also is convenient to maintain the packaged photoelectric sensor according to the requirement, and effectively ensures the maintenance efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a package structure of a photosensor according to the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1;
fig. 3 is an enlarged view of a portion B in fig. 1.
In the figure: the packaging structure comprises a substrate 1, a packaging plate 2, a frame 3, a sealing strip 4, a control processing chip 5, a photoelectric sensor chip 6, glass 7, an annular groove 8, an inserting plate 9, a through groove 10, a rotating pin 11, a deflection plate 12, a rectangular groove 13, a clamping block 14, a spring 15, a positive electrode 16, a negative electrode 17, a conductive block 18, an insulating rod 19 and a rotating handle 20.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1-3, a photoelectric sensor packaging structure comprises a substrate 1 and a packaging plate 2, wherein the upper surface of the substrate 1 is attached to the lower surface of the packaging plate 2, the upper surface of the substrate 1 is fixedly connected with a frame 3, the lower surface of the packaging plate 2 is provided with a groove corresponding to the frame 3, the frame 3 is clamped with the groove, a matched sealing strip 4 is arranged at the joint of the frame 3 and the groove, a matched control processing chip 5 is arranged in the frame 3, the control processing chip 5 is electrically connected with the substrate 1, a matched photoelectric sensor chip 6 is arranged at the bottom of the groove, the lower surface of the photoelectric sensor chip 6 is attached to the top of the frame 3, an opening is arranged at the bottom of the groove, matched glass 7 is fixedly arranged in the opening, the lower surface of the glass 7 is attached to the upper surface of the photoelectric sensor chip 6, and annular grooves 8 are symmetrically arranged on the lower surfaces of the, the lower surface of the packaging plate 2 is symmetrically and fixedly connected with inserting plates 9, the bottom of the annular groove 8 is provided with a through groove 10 matched with the inserting plates 9, the inserting plates 9 penetrate through the through groove 10, the center of the bottom of the inserting plates 9 is rotatably connected with a rotating pin 11 through a bearing, the other end of the rotating pin 11 is fixedly connected with a deflection plate 12, the deflection plate 12 is connected with the annular groove 8 through a loosening prevention mechanism, and the upper surface of the deflection plate 12 is attached to the bottom of the annular groove 8;
the anti-loosening mechanism comprises rectangular grooves 13 symmetrically formed in the side wall of the annular groove 8, matched clamping blocks 14 are connected in the rectangular grooves 13 in a sliding mode, springs 15 are fixedly connected between the clamping blocks 14 and the bottoms of the rectangular grooves 13, one ends, far away from the springs 15, of the clamping blocks 14 penetrate through notches of the rectangular grooves 13, the end portions of the clamping blocks 14 are arranged in a hemispherical structure, arc-shaped grooves matched with the end portions of the clamping blocks 14 are formed in two ends of a deflection plate 12, the end portions, far away from the springs 15, of the clamping blocks 14 are clamped with the arc-shaped grooves, a control processing chip 5 is arranged in a frame body 3 and is attached to a base plate 1, the photoelectric sensor chip 6 is directly and electrically connected with the base plate 1 conveniently, the photoelectric sensor chip 6 is arranged at the top of the frame body 3, then an inserting plate 9 at the bottom end of a packaging plate 2 penetrates through the through, the deflector 12 connected with the rotating pin 11 is rotated to be perpendicular to the inserting plate 9, so that the connection between the packaging plate 2 and the substrate 1 can be completed, meanwhile, the arc-shaped groove at the end part of the deflector 12 is clamped with the end part of the clamping block 14, so that the deflector 12 is not easy to rotate, the connection stability of the packaging plate 2 and the substrate 1 is effectively ensured, the deflector 12 is controlled to rotate, the clamping block 14 slides towards the direction of the groove bottom of the rectangular groove 13 under the action of the arc-shaped groove and compresses the spring 15, when the deflector 12 rotates to be parallel to the inserting plate 9, the packaging plate 2 can be separated from the substrate 1, and the chip can be conveniently and rapidly maintained as required.
The lower surface symmetry fixedly connected with positive electrode 16 and negative electrode 17 of photoelectric sensor chip 6, the constant head tank corresponding with positive electrode 16 and negative electrode 17 is seted up at the top of framework 3, and the tank bottom fixed mounting of constant head tank has conducting block 18, the lower surface of positive electrode 16 and negative electrode 17 is laminated with the upper surface of two conducting blocks 18 respectively, the through wires hole has been seted up to the tank bottom of constant head tank, and install the wire in the through wires hole, the both ends of wire respectively with base plate 1 and conducting block 18 fixed connection, make things convenient for photoelectric sensor chip 6 and base plate 1 electric connection, framework 3 conveniently keeps apart photoelectric sensor chip 6 and control processing chip 5.
The insulating rod 19 is symmetrically installed on the lower surface of the photoelectric sensor chip 6, and the bottom end of the insulating rod 19 is abutted to the upper surface of the control processing chip 5, so that the control processing chip 5 is conveniently pressed, and the stability of the attachment of the control processing chip and the substrate 1 is ensured.
The transverse section of the insertion plate 9 is the same as that of the deflection plate 12, so that the package plate 2 can be separated from the substrate 1 when the insertion plate 9 is parallel to the deflection plate 12.
The center of the lower surface of the deflector 12 is fixedly provided with a rotating handle 20, which is convenient for controlling the rotation of the deflector 12.
The upper surface of the glass 7 is covered with a matching filter film, so that the glass 7 has a filtering function.
In the invention, a control processing chip 5 is arranged in a frame body 3 to be attached to a substrate 1 so as to be convenient for being directly and electrically connected with the substrate 1, a photoelectric sensor chip 6 is arranged at the top of the frame body 3, an inserting plate 9 at the bottom end of a packaging plate 2 penetrates through a through groove 10, a groove on the lower surface of the packaging plate 2 is matched with the frame body 3 for clamping, a sealing strip 4 can effectively ensure the sealing property of packaging, a deflection plate 12 connected with a rotating pin 11 is rotated to be vertical to the inserting plate 9, so that the packaging plate 2 is connected with the substrate 1, meanwhile, an arc-shaped groove at the end part of the deflection plate 12 is clamped with the end part of a clamping block 14, so that the deflection plate 12 is not easy to rotate, the stability of the connection between the packaging plate 2 and the substrate 1 is effectively ensured, the deflection plate 12 is controlled to rotate, the clamping block 14 slides towards the bottom direction of a, when the deflection plate 12 rotates to be parallel to the insertion plate 9, the packaging plate 2 can be separated from the substrate 1, so that the chip can be maintained quickly as required.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. A photoelectric sensor packaging structure comprises a substrate (1) and a packaging plate (2), and is characterized in that the upper surface of the substrate (1) is attached to the lower surface of the packaging plate (2), a frame body (3) is fixedly connected to the upper surface of the substrate (1), a groove corresponding to the frame body (3) is formed in the lower surface of the packaging plate (2), the frame body (3) is clamped with the groove, a matched sealing strip (4) is installed at the joint of the frame body (3) and the groove, a matched control processing chip (5) is arranged in the frame body (3), the control processing chip (5) is electrically connected with the substrate (1), a matched photoelectric sensor chip (6) is arranged at the bottom of the groove, the lower surface of the photoelectric sensor chip (6) is attached to the top of the frame body (3), an opening is formed in the bottom of the groove, the matched glass (7) is fixedly installed in the opening, the lower surface of the glass (7) is attached to the upper surface of the photoelectric sensor chip (6), the lower surface of the substrate (1) close to the two ends is symmetrically provided with annular grooves (8), the lower surface of the packaging plate (2) is symmetrically and fixedly connected with inserting plates (9), the bottom of each annular groove (8) is provided with a through groove (10) matched with the inserting plate (9), the inserting plates (9) penetrate through the through grooves (10), the center of the bottom of each inserting plate (9) is rotatably connected with a rotating pin (11) through a bearing, the other end of each rotating pin (11) is fixedly connected with a deflecting plate (12), each deflecting plate (12) is connected with the corresponding annular groove (8) through an anti-loosening mechanism, and the upper surface of each deflecting plate (12) is attached to the bottom of the corresponding annular groove (8);
locking mechanism sets up rectangular channel (13) on ring channel (8) lateral wall including the symmetry, sliding connection has the fixture block (14) of matching in rectangular channel (13), and fixedly connected with spring (15) between fixture block (14) and rectangular channel (13) tank bottom, the notch of rectangular channel (13) is passed to the one end that spring (15) were kept away from in fixture block (14), and the tip of fixture block (14) is the setting of hemispherical structure, the arc wall that suits with fixture block (14) tip is all seted up at the both ends of deflector (12), and the tip that spring (15) were kept away from in fixture block (14) sets up with the arc wall block.
2. The photoelectric sensor packaging structure according to claim 1, wherein a positive electrode (16) and a negative electrode (17) are symmetrically and fixedly connected to the lower surface of the photoelectric sensor chip (6), a positioning groove corresponding to the positive electrode (16) and the negative electrode (17) is formed in the top of the frame body (3), a conductive block (18) is fixedly mounted at the bottom of the positioning groove, the lower surfaces of the positive electrode (16) and the negative electrode (17) are respectively attached to the upper surfaces of the two conductive blocks (18), a threading hole is formed in the bottom of the positioning groove, a lead is mounted in the threading hole, and two ends of the lead are respectively and fixedly connected to the substrate (1) and the conductive block (18).
3. The photoelectric sensor packaging structure according to claim 1, wherein the insulating rods (19) are symmetrically mounted on the lower surface of the photoelectric sensor chip (6), and the bottom ends of the insulating rods (19) are abutted against the upper surface of the control processing chip (5).
4. A photosensor package according to claim 1, characterized in that the lateral cross-section of the interposer (9) is the same as the lateral cross-section of the deflector plate (12).
5. The photosensor package of claim 1, wherein a stem (20) is fixedly mounted to the center of the lower surface of the deflector plate (12).
6. A photosensor package according to claim 1, characterized in that the upper surface of the glass (7) is covered with a matching filter film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011390560.4A CN112531032A (en) | 2020-12-02 | 2020-12-02 | Photoelectric sensor packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011390560.4A CN112531032A (en) | 2020-12-02 | 2020-12-02 | Photoelectric sensor packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112531032A true CN112531032A (en) | 2021-03-19 |
Family
ID=74996230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011390560.4A Withdrawn CN112531032A (en) | 2020-12-02 | 2020-12-02 | Photoelectric sensor packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112531032A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113066765A (en) * | 2021-03-22 | 2021-07-02 | 合肥鑫晟光电科技有限公司 | Semiconductor packaging structure |
| CN113347791A (en) * | 2021-08-09 | 2021-09-03 | 四川英创力电子科技股份有限公司 | PCB with sink groove and working method thereof |
-
2020
- 2020-12-02 CN CN202011390560.4A patent/CN112531032A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113066765A (en) * | 2021-03-22 | 2021-07-02 | 合肥鑫晟光电科技有限公司 | Semiconductor packaging structure |
| CN113347791A (en) * | 2021-08-09 | 2021-09-03 | 四川英创力电子科技股份有限公司 | PCB with sink groove and working method thereof |
| CN113347791B (en) * | 2021-08-09 | 2021-10-08 | 四川英创力电子科技股份有限公司 | PCB with sink groove and working method thereof |
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Legal Events
| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210319 |