CN112530841A - Etching device of meticulous circuit - Google Patents
Etching device of meticulous circuit Download PDFInfo
- Publication number
- CN112530841A CN112530841A CN202011342434.1A CN202011342434A CN112530841A CN 112530841 A CN112530841 A CN 112530841A CN 202011342434 A CN202011342434 A CN 202011342434A CN 112530841 A CN112530841 A CN 112530841A
- Authority
- CN
- China
- Prior art keywords
- etching
- product
- baffle
- spoiler
- dish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 title claims abstract description 79
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 239000007921 spray Substances 0.000 claims abstract description 18
- 239000003814 drug Substances 0.000 claims abstract description 17
- 238000007664 blowing Methods 0.000 claims description 3
- 239000007779 soft material Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000004544 sputter deposition Methods 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000003595 mist Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
Abstract
The invention relates to an etching device for a fine circuit, and belongs to the technical field of circuit board manufacturing. Including etching spray tray and loading board, the loading board bears the product in the product below, the top at the product is spouted in the etching, the etching spray tray comprises multirow etching nozzle, the nozzle that the dish was spouted in the etching lasts and etches on the product of below with certain pressure blowout etching solution, be equipped with the baffle in the direction of travel front end top of product, the baffle setting is at the front end that the dish was spouted in the etching, the bottom of baffle is equipped with the spoiler, the baffle prevents to spray the preliminary treatment face that the liquid medicine splashes the product, the spoiler prevents that the liquid medicine from flowing back the preliminary treatment face of product. The invention has the beneficial effects that: the etching solution can be effectively prevented from prematurely contacting the pretreatment surface of the product due to sputtering and backflow, and the surface state of the product is changed, so that the etching precision of the circuit is ensured; the influence of the water pool effect on the line precision can be effectively reduced, and the waste of the etching solution and the pollution of the next treatment tank liquid medicine are avoided.
Description
Technical Field
The invention relates to an etching device for a fine circuit, and belongs to the technical field of circuit board manufacturing.
Background
In recent years, electronic products are gradually miniaturized and thinned, and based on this trend, the structures of electronic components and their carriers have to be further refined and refined, which directly makes the precision requirements for bonded ICs higher and higher. The COF manufacturing process is similar to the traditional circuit board process, generally, a layer of photoresist is coated on a base material, the photoresist is developed after exposure, a copper surface to be removed is exposed, the exposed copper is etched and removed through special etching liquid medicine treatment, and finally the residual photoresist is stripped, so that the required circuit is finally obtained. However, the wiring required for COF is finer than that of the conventional wiring board, so that the production per process is stricter.
In the existing etching mode, due to the problem of equipment structure, a product is delivered in a section from the time when the product enters an etching tank to the time when spray etching is started, and the product cannot be treated in the section. However, since the etching solution is sprayed out at a certain pressure by a spraying mode, salt mist is generated while the etching solution is sprayed out, the components of the salt mist are the same as those of the etching solution, and the salt mist is diffused to an empty conveying area to contact with a product in advance; in addition, because the product is etched horizontally, the etching solution sprayed on the product can flow back, the product can be contacted with the etching solution in an idle conveying area, salt mist of the etching solution or the etching solution contacted with the product before the product is etched by spraying can affect the surface state of the product, and subsequent etching abnormality is caused.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the etching device for the fine circuit, which can reduce the retention time of the etching solution on the product, prevent the etching solution from contacting the pre-etched surface of the product too early to form a pool effect, and prevent the liquid medicine from flowing back or being brought out of other processing tanks to cause liquid medicine pollution.
The invention is realized by the following technical scheme: an etching apparatus for fine wiring, characterized in that: including etching spray tray and loading board, the loading board bears the product in the product below, the top at the product is spouted in the etching, the etching spray tray comprises multirow etching nozzle, the nozzle that the dish was spouted in the etching lasts and etches on the product of below with certain pressure blowout etching solution, be equipped with the baffle in the direction of travel front end top of product, the baffle setting is at the front end that the dish was spouted in the etching, the bottom of baffle is equipped with the spoiler, the baffle prevents to spray the preliminary treatment face that the liquid medicine splashes the product, the spoiler prevents that the liquid medicine from flowing back the preliminary treatment face of product.
An air knife is arranged above the rear end of the product in the advancing direction and is arranged at the rear end of the etching spray disc, the air blowing direction of the air knife is opposite to the product advancing direction, and the air knife is arranged at an angle theta degrees, wherein theta is more than 0 degree and less than 90 degrees.
The distance between the baffle and the first nozzle of the etching spray disk is 3-10 cm.
The spoiler is made of soft materials, contacts the product, is bent and connected with the product and the baffle plate, and prevents liquid medicine from flowing back.
The invention has the beneficial effects that: the front end of the etching device is provided with a baffle plate and a flow blocking sheet, so that the etching liquid can be effectively prevented from prematurely contacting a product pretreatment surface due to sputtering and backflow, the surface state of a product is changed, and the etching precision of a circuit is guaranteed; the air knife is arranged at the tail end of the spray plate, so that after etching is finished, timely river etching liquid is removed from the surface of a product, the influence of the water pool effect on the line precision can be effectively reduced, meanwhile, the etching liquid can be prevented from being brought out of a next treatment tank by the product, and the waste of the etching liquid and the liquid medicine in the next treatment tank are avoided.
Drawings
The invention is further illustrated below with reference to the figures and examples.
Fig. 1 is a schematic structural view of the present invention.
In the figure: 1. etching the spray disk; 2. a carrier plate; 3. producing a product; 4. a baffle plate; 5. a spoiler; 6. and (4) an air knife.
Detailed Description
An etching apparatus for fine lines as shown in fig. 1, characterized in that: spout dish 1 and loading board 2 including the etching, loading board 2 bears product 3 in 3 below of product, dish 1 sets up in the top of product 3 is spouted in the etching, dish 1 is spouted by the etching and comprises multirow etching nozzle to the etching, the nozzle that dish 1 was spouted in the etching lasts and etches on product 3 with certain pressure blowout etching solution to the below, be equipped with baffle 4 in the direction of travel front end top of product 3, baffle 4 sets up the front end of spouting dish 1 in the etching, the bottom of baffle 4 is equipped with spoiler 5, baffle 4 prevents to spray the preliminary treatment face that the liquid medicine splashes product 3, influence circuit etching precision, spoiler 5 prevents that the liquid medicine from flowing back to product 3's preliminary treatment face.
An air knife 6 is arranged above the rear end of the product 3 in the advancing direction, the air knife 6 is arranged at the rear end of the etching spray disk 1, the blowing direction of the air knife 6 is opposite to the product advancing direction, and the air knife is arranged at an angle theta DEG, wherein theta is more than 0 DEG and less than 90 deg.
The distance between the baffle 4 and the first nozzle of the etching spray disk 1 is 3-10 cm.
The spoiler 5 is made of soft materials, the spoiler 5 contacts the product 3, and the spoiler is connected to the product 3 and the baffle 4 in a bending mode to prevent liquid medicine from flowing back.
The front end of the etching device is provided with a baffle plate and a flow blocking plate, so that the etching liquid can be effectively prevented from prematurely contacting a product pretreatment surface due to sputtering and backflow, the surface state of a product is changed, and the etching precision of a circuit is guaranteed; the air knife is arranged at the tail end of the spray plate, so that after etching is finished, timely river etching liquid is removed from the surface of a product, the influence of the water pool effect on the line precision can be effectively reduced, meanwhile, the etching liquid can be prevented from being brought out of a next treatment tank by the product, and the waste of the etching liquid and the liquid medicine in the next treatment tank are avoided.
Claims (4)
1. An etching apparatus for fine wiring, characterized in that: spout dish (1) and loading board (2) including the etching, loading board (2) bear product (3) in product (3) below, dish (1) setting is spouted in the etching in the top of product (3), dish (1) is spouted in the etching comprises multirow etching nozzle, the nozzle that dish (1) was spouted in the etching lasts and etches to product (3) of below with certain pressure blowout etching solution, be equipped with baffle (4) in the advancing direction front end top of product (3), baffle (4) set up the front end of spouting dish (1) in the etching, the bottom of baffle (4) is equipped with spoiler (5), baffle (4) prevent to spray the preliminary treatment face that the liquid medicine spattered product (3), spoiler (5) prevent that the liquid medicine from flowing back the preliminary treatment face of product (3).
2. The fine line etching apparatus according to claim 1, wherein: an air knife (6) is arranged above the rear end of the product (3) in the advancing direction, the air knife (6) is arranged at the rear end of the etching spray disc (1), the blowing direction of the air knife (6) is opposite to the product advancing direction, and the air knife is arranged at an angle theta DEG, wherein theta is larger than 0 degree and smaller than 90 degrees.
3. The fine line etching apparatus according to claim 1, wherein: the distance between the baffle (4) and a first nozzle of the etching spray disk (1) is 3-10 cm.
4. The fine line etching apparatus according to claim 1, wherein: the spoiler (5) is made of soft materials, the spoiler (5) is in contact with the product (3), and the spoiler is bent and connected with the product (3) and the baffle (4) to prevent liquid medicine from flowing back.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011342434.1A CN112530841A (en) | 2020-11-26 | 2020-11-26 | Etching device of meticulous circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011342434.1A CN112530841A (en) | 2020-11-26 | 2020-11-26 | Etching device of meticulous circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112530841A true CN112530841A (en) | 2021-03-19 |
Family
ID=74993749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011342434.1A Pending CN112530841A (en) | 2020-11-26 | 2020-11-26 | Etching device of meticulous circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112530841A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114566449A (en) * | 2022-02-25 | 2022-05-31 | 江苏韦达半导体有限公司 | Anti-pollution schottky diode manufacturing and etching device convenient for liquid injection |
| CN114574862A (en) * | 2022-03-03 | 2022-06-03 | 东莞赛诺高德蚀刻科技有限公司 | Wind-assisted etching device and method for non-equal-depth structure |
-
2020
- 2020-11-26 CN CN202011342434.1A patent/CN112530841A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114566449A (en) * | 2022-02-25 | 2022-05-31 | 江苏韦达半导体有限公司 | Anti-pollution schottky diode manufacturing and etching device convenient for liquid injection |
| CN114574862A (en) * | 2022-03-03 | 2022-06-03 | 东莞赛诺高德蚀刻科技有限公司 | Wind-assisted etching device and method for non-equal-depth structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20240122 Address after: 221300 north of Liaohe Road and west of Huashan Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Applicant after: Jiangsu SHANGDA Semiconductor Co.,Ltd. Guo jiahuodiqu after: Zhong Guo Address before: 518100 floors 1-4, 2-3, building a, Huangpu Runhe Industrial Park, South Ring Road, Huangpu Community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: LEADER-TECH ELECTRONICS (SHENZHEN) Inc. Guo jiahuodiqu before: Zhong Guo |