CN112527061A - Electronic equipment - Google Patents
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- CN112527061A CN112527061A CN202011432166.2A CN202011432166A CN112527061A CN 112527061 A CN112527061 A CN 112527061A CN 202011432166 A CN202011432166 A CN 202011432166A CN 112527061 A CN112527061 A CN 112527061A
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Abstract
The application discloses electronic equipment includes: a housing; the display module and the shell are enclosed to form an accommodating cavity; the pickup module is positioned in the accommodating cavity, is arranged on the inner side surface of the display module and is in fit connection with the inner side surface of the display module; under the condition that the display module receives a vibration signal, the sound pickup module outputs an electric signal according to the vibration signal; the signal processing unit is located hold the intracavity, just the signal processing unit with the pickup module electricity is connected. The embodiment of this application sets up the pickup module at electronic equipment's display module medial surface, and the pickup module gathers the vibration signal of display module transmission and converts the signal of telecommunication output to signal processing unit and handles to realize pickup under the screen, electronic equipment can cancel the pickup hole, avoids the feed liquor of pickup hole, advances dirt scheduling problem influence pickup function.
Description
Technical Field
The present application relates to the field of communications technologies, and in particular, to an electronic device.
Background
With the development of communication technology, the variety of electronic products is increasing, the functions are more and more concentrated, and the requirements for the reliability of electronic equipment are more and more stringent. For example: the waterproof requirement of the intelligent terminal is higher and higher, so a series of non-porous technologies are promoted. In the prior art, the pickup function of electronic equipment such as intelligent terminal relies on the sound pickup hole of design on the outward appearance face to transmit sound to built-in microphone usually, and the design of sound pickup hole brings the problem in the aspect of feed liquor, dust feeding easily, influences the pickup effect, leads to the product to lose the pickup function even.
Disclosure of Invention
The application aims at providing an electronic device for solve the problem that the design of picking up the sound hole easily leads to the pickup performance to reduce.
In a first aspect, an embodiment of the present application provides an electronic device, including:
a housing;
the display module and the shell are enclosed to form an accommodating cavity;
the pickup module is positioned in the accommodating cavity, is arranged on the inner side surface of the display module and is in fit connection with the inner side surface of the display module; under the condition that the display module receives a vibration signal, the sound pickup module outputs an electric signal according to the vibration signal;
the signal processing unit is located hold the intracavity, just the signal processing unit with the pickup module electricity is connected.
Like this, the above-mentioned scheme of this application sets up the pickup module at electronic equipment's display module medial surface, and the pickup module gathers the vibration signal of display module transmission and converts the signal of telecommunication output to signal processing unit and handles to realize the pickup under the screen, electronic equipment can cancel the pickup hole, avoids the feed liquor of pickup hole, advances dirt scheduling problem influence pickup function.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 2 is a second schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 3 shows one of the schematic structural diagrams of a piezoelectric sensor according to an embodiment of the present application;
FIG. 4 is a schematic view of the arrangement of the first electrode according to an embodiment of the present application;
FIG. 5 is a schematic diagram of an embodiment of the present application showing a piezoelectric transducer picking up an acoustic signal;
FIG. 6 is a schematic view illustrating an arrangement position of a piezoelectric sensor and a display module according to an embodiment of the disclosure;
FIG. 7 is a schematic diagram of an arrangement of piezoelectric sensors according to an embodiment of the present application;
FIG. 8 is a second schematic diagram of an embodiment of the present application showing a piezoelectric transducer picking up an acoustic signal;
fig. 9 is a third schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 10 is a schematic diagram illustrating a touch detection operation according to an embodiment of the present disclosure;
fig. 11 is a second schematic diagram illustrating a touch detection operation according to an embodiment of the present application;
fig. 12 is a third schematic diagram illustrating a touch detection operation according to an embodiment of the present application;
FIG. 13 is a second schematic structural view of a piezoelectric sensor according to an embodiment of the present application;
FIG. 14 shows a schematic view of a piezoelectric sensor for fingerprint recognition according to an embodiment of the present application;
FIG. 15 is a schematic view showing the configuration of the operation mode of the piezoelectric sensor according to the embodiment of the present application;
FIG. 16 is a schematic diagram of a piezoelectric sensor according to an embodiment of the present disclosure;
fig. 17 is a schematic diagram illustrating a piezoelectric sensor implementing touch detection according to an embodiment of the present disclosure.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be considered as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
An electronic device according to an embodiment of the invention is described below in conjunction with the following.
As shown in fig. 1 and 2, an embodiment of the present application provides an electronic device including:
a housing 1;
the display module 2 and the shell 1 enclose to form an accommodating cavity;
the pickup module 3 is positioned in the accommodating cavity, and the pickup module 3 is arranged on the inner side surface of the display module 2 and is in fit connection with the inner side surface of the display module 2; under the condition that the display module 2 receives a vibration signal, the pickup module 3 outputs an electric signal according to the vibration signal;
and the signal processing unit 4 is positioned in the accommodating cavity, and the signal processing unit is electrically connected with the pickup module 3.
The display module assembly 2 that shows can be the display screen of electronic equipment, pickup module assembly 3 sets up inside electronic equipment, with the medial surface laminating of display module assembly 2 is connected, specifically, with the display module assembly is the display screen as an example, pickup module assembly 3 can be through mode settings such as pasting in the below of display screen, can pick up the sound signal of display screen top. The thickness of the OLED display screen is smaller, usually less than 1mm, and the thinned display screen has smaller sound blocking capacity, so that the sound pickup module 3 positioned below the display screen can pick up sound such as a user making a call; on the other hand, the thickness of adapterization module 3 itself can be accomplished very thinly, reaches the thickness below 0.3mm, is excited by outside sound source more easily and produces the vibration, can guarantee the sensitivity of adapterization.
The embodiment of this application sets up the pickup module at electronic equipment's display module medial surface, and the pickup module gathers the vibration signal of display module transmission and converts the signal of telecommunication output to signal processing unit and handles to realize pickup under the screen, electronic equipment can cancel the pickup hole, avoids the feed liquor of pickup hole, advances dirt scheduling problem influence pickup function.
Specifically, the sound pickup module 2 includes at least one piezoelectric sensor 31; the piezoelectric sensor 31 comprises a piezoelectric layer, a second electrode and at least two first electrodes, wherein the at least two first electrodes are arranged on a first surface of the piezoelectric layer, the at least two first electrodes are arranged at intervals to form an electrode array, the second electrode is arranged on a second surface of the piezoelectric layer, and the polarities of the first electrode and the second electrode are opposite;
the first surface is a surface of the piezoelectric layer facing the display module 2, and the second surface is a surface of the piezoelectric layer facing away from the display module 2, or the first surface is a surface of the piezoelectric layer facing away from the display module, and the second surface is a surface of the piezoelectric layer facing toward the display module.
The piezoelectric sensor 31 is shown in fig. 3, wherein a plurality of the first electrodes are arranged in an array on a first surface of a piezoelectric layer of the piezoelectric sensor 31, and the second electrodes are a common electrode arranged on a second surface of the piezoelectric layer of the piezoelectric sensor. The piezoelectric sensor 31 layer is made of a piezoelectric material, such as a piezoelectric ceramic. The piezoelectric material has a remarkable piezoelectric property, and when the piezoelectric material deforms due to vibration under the action of an external force (for example, vibration under the action of a sound signal outside the display module), the first surface and the second surface generate different charges to form a potential difference, namely, a piezoelectric effect.
The second electrode on the second surface is a common electrode, has good conductive property, and can be formed on the second surface (e.g., the lower surface) of the piezoelectric material through a coating process. For example: a silver film may be plated on the lower surface of the piezoelectric material. The piezoelectric sensor is shown in fig. 3.
The first electrodes disposed on the first surface of the piezoelectric layer of the piezoelectric sensor 31 form an electrode array, the electrode array is composed of a plurality of electrodes, and the electrodes have good conductive properties and can be formed on the first surface (e.g., the upper surface) of the piezoelectric material through a coating process. As shown in fig. 4, for convenience of description, a 3 × 3 array is taken as an example, and 9 electrodes, which are the first electrodes, are arranged on the upper surface of the piezoelectric layer of the piezoelectric sensor 31 to form an electrode array.
When the piezoelectric sensor 31 vibrates under an external force (e.g., a person talking aloud, a speaker playing music nearby), the piezoelectric layer generates a potential difference between the first surface and the second surface due to the piezoelectric effect. As shown in fig. 3, for convenience of description, it is assumed that the common electrode (i.e., the second electrode) gathers negative charges, and the electrode array (i.e., the first electrode) gathers positive charges, i.e., the electrode array has a higher potential than the common electrode. The 3 x 3 array of electrodes and the common electrode constitute 9 small signal sources. The electric signal of the signal source can be collected by a voltage collecting circuit and output to the signal processing unit 4 for processing.
Optionally, the pickup module further includes: a preprocessing module; one end of the preprocessing module is connected with the piezoelectric sensor, and the other end of the preprocessing module is connected with the signal processing unit. The preprocessing module can perform noise reduction processing on the electric signal formed by conversion of the piezoelectric sensor and then input the electric signal to the signal processing unit, so that the signal-to-noise ratio of the electric signal is improved. The preprocessing module can be a noise reduction module and is used for removing partial noise of the electric signal; the preprocessing module can also be a filtering module and can be used for filtering the electric signals; the preprocessing module can also be other processing modules capable of improving the sensitivity and the signal-to-noise ratio of the pickup.
The principle of the piezoelectric sensor 31 picking up the sound signal will be described by taking fig. 5 as an example. When an external sound source excites a piezoelectric layer of the piezoelectric sensor to generate vibration, the signal processing unit 4 collects voltage values of each channel (one electrode corresponds to one channel) of the 3 × 3 electrode array on one hand, and accumulates the voltage values of each channel in various ways on the other hand. Therefore, weak single-channel signals can be accumulated to obtain stronger signals. By way of example, signals of the electrodes (1, 1), (2, 1) and (3, 1) can be digitized and then accumulated to obtain a first-stage accumulated signal. In the process, a noise reduction module can be added to remove part of noise of the electric signals of all the channels and then accumulate the noise, so that the accumulation of the noise is avoided, and the signal-to-noise ratio of the first accumulated signal is improved. By analogy, signals of the electrodes (1, 2), the electrodes (2, 2) and the electrodes (3, 2) are accumulated to obtain a second accumulated signal, and signals of the electrodes (1, 3), the electrodes (2, 3) and the electrodes (3, 3) are accumulated to obtain a third accumulated signal. And further accumulating the first accumulated signal, the second accumulated signal and the third accumulated signal to obtain a fourth accumulated signal. In the process, a noise reduction module can be added to remove part of noise from the three accumulated signals and then accumulate the noise, so that the accumulation of the noise is avoided, and the signal-to-noise ratio of the fourth accumulated signal is further improved. Therefore, the conversion from the sound signal to the electric signal can be realized by the signal accumulation of a plurality of channels, and certain pickup sensitivity and signal to noise ratio can be ensured.
As shown in fig. 6, the piezoelectric sensor 31 may be disposed below the display module 2 of the electronic device by means of pasting or the like, i.e. a sound signal above a portion of the display screen may be picked up. The piezoelectric sensor 31 includes a piezoelectric layer, the piezoelectric layer is made of a piezoelectric material, the first electrode is disposed on a first surface of the piezoelectric layer, the common electrode, that is, the second electrode, is disposed on a second surface of the piezoelectric layer, and the sound wave outside the display module 2 can be transmitted to the piezoelectric sensor 31 through the display module 2.
Optionally, the pickup module 3 may include at least two piezoelectric sensors, where the at least two piezoelectric sensors are distributed at intervals, and an operating frequency band of each of the at least two piezoelectric sensors is different. As shown in fig. 7, a plurality of piezoelectric sensors 31 may be disposed below the display module 2, and the sound wave outside the display module 2 is transmitted to the plurality of piezoelectric sensors through the display module 2, and the piezoelectric sensors convert the sound signal into an electrical signal and transmit the electrical signal to the signal processing unit 4 for processing. As an example, a high-frequency piezoelectric sensor 311, a medium-frequency piezoelectric sensor 312, and a low-frequency piezoelectric sensor 313 may be provided, and the three types of piezoelectric sensors have different resonance frequencies, and the resonance frequencies are distributed in a high frequency band, a medium frequency band, and a low frequency band in an audio frequency domain. For example: the resonant frequency of the high-frequency piezoelectric sensor is about 15KHz, the resonant frequency of the medium-frequency piezoelectric sensor is about 5KHz, and the resonant frequency of the low-frequency piezoelectric sensor is about 500 Hz. The high-frequency piezoelectric sensors may also be multiple, and the resonant frequencies may be different from each other, for example, one high-frequency piezoelectric sensor may be respectively disposed at 15KHz, 13KHz, and 10KHz, so as to improve the signal-to-noise ratio and loudness of the picked-up audio signal as much as possible, and reduce the distortion rate.
Specifically, the at least two piezoelectric sensors are arranged at intervals to form an n × m sensor matrix; the projection of the sensor matrix on the display module is positioned in a target area on the display module; wherein n and m are positive integers. The target area can be set according to the habit of a user, for example, the target area is set at the position where the display module is close to the bottom end of the electronic equipment, and the sensor matrix is arranged below the display module and is close to the position of the bottom end of the electronic equipment, so that the user can pick up sound better when talking.
Further, the sensor matrix may include: a high frequency sensor region, a medium frequency sensor region, and a low frequency sensor region;
the signal processing unit comprises a first synthesis unit, a second synthesis unit, a third synthesis unit and a fourth synthesis unit; the input end of the first synthesis unit is respectively connected with at least two high-frequency sensors in the high-frequency sensor area; the input end of the second synthesis unit is respectively connected with at least two intermediate frequency sensors in the intermediate frequency sensor area; the input end of the third synthesis unit is respectively connected with at least two low-frequency sensors in the low-frequency sensor area; and the input end of the fourth synthesis unit is respectively connected with the output end of the first synthesis unit, the output end of the second synthesis unit and the output end of the third synthesis unit.
Taking fig. 8 as an example to illustrate the principle of picking up sound signals when a plurality of piezoelectric sensors 31 are arranged, a 3 × 3 piezoelectric sensor matrix is arranged below the display screen (i.e. the display module 2), and the 3 piezoelectric sensors 31 in the first column from left to right are High-frequency piezoelectric sensors and are responsible for responding to High-frequency components in sound and sending the High-frequency components to a first synthesis unit 41 in the signal processing unit, which may be a High Band, HB. Similarly, the second column is an intermediate frequency piezoelectric sensor, and the signal is sent to the second synthesizing unit 42, which may be an intermediate frequency synthesizing unit (Middle Band, MB); the third column is a Low frequency piezoelectric sensor, and the signal is sent to a third synthesis unit 42, which may be a Low frequency synthesis unit (Low Band, LB'). The fourth synthesizing unit 44 in the signal processing unit 4 secondarily synthesizes the synthesized signals of the HB, MB, and LB synthesizing units into a Full Band signal (FB), which is the picked-up complete audio signal.
The utility model provides a pickup module that piezoelectric sensor constitutes sets up in electronic equipment's display module group below, and electronic equipment can cancel traditional electret, the micro-electromechanical microphone pickup device, and replaces with above-mentioned piezoelectric sensor, realizes the design of sclausura pickup.
When the piezoelectric layer of the piezoelectric sensor deforms under the action of an external force (for example, a local part is pressed and knocked by a finger), deformation amounts of all areas of the piezoelectric layer are usually different, and as shown in fig. 3-4, a 3 × 3 electrode array and a common electrode form a significant difference in potential difference acquired by 9 small signal sources. The signal processing unit can judge the central area of the external force action through amplitude distribution. For example: when the potential difference between the electrode (2, 2) and the second electrode is found to be the largest, it is explained that the center of the external force action is in the corresponding area of the electrode (2, 2). By utilizing the characteristic, the piezoelectric sensor 31 in the sound pickup module can be further utilized to be used as a pressure sensor, and the identification of the pressure center position is possible to realize, so that better experience is provided for the man-machine interaction of the electronic equipment.
In particular, the electrode array may comprise at least two electrode areas, each of which has a different operating frequency band. In this embodiment, the target area of the at least two electrode areas is a pickup electrode area, and can convert the vibration signal transmitted by the display module into an electrical signal. For example: the electrode array comprises two electrode areas, wherein the first electrode area is a pickup electrode area, the second electrode area is a touch detection electrode area, and electrodes in the pickup electrode area are used for picking up vibration signals transmitted by the display module; the touch detection area is used for detecting operation signals such as knocking and pressing of a user acting on the display module (such as a display screen), so that a plurality of different functions are realized. The first electrode region and the second electrode region may be different electrode regions of the same piezoelectric sensor, or may be different electrode regions of different piezoelectric sensors.
The signal processing unit may include: the processing subunit is correspondingly connected with the electrode area; and each electrode area is correspondingly connected with one processing subunit. Each electrode area is correspondingly connected with a processing subunit, and the processing subunit is used for processing the electric signals transmitted by the electrode areas connected with the processing subunit, such as: the electrode array comprises two electrode areas, wherein a first electrode area is a pickup electrode area, a second electrode area is a touch detection electrode area, and the signal processing unit comprises a first processing subunit and a second processing subunit, wherein the first processing subunit is connected with the first electrode area and is used for processing an electric signal which is transmitted by the first electrode area and corresponds to a sound signal (namely a vibration signal transmitted by the display module); the second processing subunit is connected with the second electrode area and is used for processing the electric signal which is transmitted by the second electrode area and corresponds to the user operation signal.
In the electronic device shown in fig. 9, taking the two electrode areas as an example, a piezoelectric sensor (a single large-area sensor) or a piezoelectric sensor matrix (a large-area array formed by multiple piezoelectric sensors) is arranged under the display module 2 (e.g., a display screen) in a hidden manner. On the one hand, the first electrode area 12 of the piezoelectric sensor 31 (or matrix) can pick up sound signals on the other side of the display screen. On the other hand, when a finger presses or taps on the display screen, the weak deformation of the display screen is transmitted to the second electrode area 13 of the underlying piezoelectric sensor (or matrix) and received by the second electrode area 13. The internal signal processing unit includes a first processing subunit corresponding to the first electrode region 12 and a second processing subunit corresponding to the second electrode region 13, so that the signal processing unit can acquire a piezoelectric signal picked up by each piezoelectric sensor, even by each electrode of each piezoelectric sensor, and can identify a region pressed and tapped by a finger by judging the strength of the piezoelectric signal of each piezoelectric sensor and each electrode.
The relative positions of the first electrode area and the second electrode area can be set according to actual operation requirements, such as left-right arrangement, up-down arrangement and the like.
For the second electrode area for touch detection, as shown in fig. 10 and 11, a new experience of man-machine interaction can be provided according to the area identification of finger pressing and tapping. For example: the second electrode region 13 can be further divided into two regions, only the second electrode region 13 is shown in fig. 10 and 11, and the first electrode region can be disposed below the second electrode region. When the user taps the lower left area of the display screen corresponding to the second electrode area 13 through a finger, the electronic device executes a volume reduction action; when the lower right area of the display screen corresponding to the second electrode area 13 is tapped, the electronic device will perform a volume increasing action. Alternatively, as shown in fig. 12, taking the first electrode area 12 and the second electrode area 13 arranged in the left-right row as an example, when the electronic device is off standby, the user taps the area near the second electrode area 13 of the pressure sensor with a finger, and the electronic device wakes up the display function. The user can conveniently realize double-click awakening of the electronic equipment to check the contents such as time, short messages and the like.
In this embodiment, utilize piezoelectric sensor, on the one hand can realize the pickup function, and on the other hand can also be used for touch-control to detect and realize the pressure interaction function.
Optionally, the electrode array may include: the device comprises a pickup electrode area, a fingerprint identification electrode area and a touch detection electrode area. Pickup electrode area is used for picking up the acoustic signal of display module assembly transmission, fingerprint identification electrode area is used for carrying out fingerprint identification, touch-control detection area is used for carrying out touch-control detection to realize that a piezoelectric sensor or piezoelectric sensor matrix realize three kinds of different functions.
As an alternative embodiment of the present application, said piezoelectric layer comprises at least two functional areas, the piezoelectric parameter of each of said functional areas being different. The difference in piezoelectric parameters may be a difference in parameters of a piezoelectric material constituting the piezoelectric layer.
Taking the piezoelectric layer as an example, the piezoelectric layer includes three functional areas, the piezoelectric layer is made of a piezoelectric material, the piezoelectric layer includes a pickup area, a fingerprint identification area and a touch detection area, the material parameters of the three areas are different, and in the embodiment, different functional modules are distinguished on the piezoelectric material. As shown in fig. 13, the piezoelectric sensor is composed of a plurality of pixels, a single pixel structure includes piezoelectric materials of a plurality of specifications, at least one of the thickness, area, and material of the piezoelectric materials may have a difference, which results in a difference in sensitivity and resonance frequency band for each specification, a first electrode is disposed on a first surface of a piezoelectric layer, a second electrode, i.e., the common electrode, is disposed on a second surface of the piezoelectric layer, and a piezoelectric sensor 31 composed of a piezoelectric material is attached to an inner side surface of the display module 2 by an adhesive. For example, the piezoelectric material (1, 1) has lower sensitivity and can only pick up stronger signals (such as a finger knocking the screen), so that the area can be used for touch detection; the piezoelectric materials (1, 2) are high in sensitivity but only sensitive to signals in a frequency band of 20 Hz-20 KHz, and can pick up audio signals, and the partial area is used for picking up sound; the piezoelectric materials (1, 3) have high resonance frequency (such as 10MHz), are insensitive to low-frequency signals, are only used for transmitting ultrasonic signals and receiving ultrasonic echoes, namely fingerprint identification, and then the partial area is used for fingerprint identification. Therefore, when the electronic equipment needs different functions, the electrode voltage at the position of the base body corresponding to the piezoelectric material is collected, and therefore the multifunctional simultaneous working is achieved.
Optionally, the electronic device further includes a detection module and a control module connected to the detection module; the detection module is used for detecting the working state of the electronic equipment; the control module is connected with the piezoelectric sensor and used for controlling the working mode of the piezoelectric sensor according to the working state. The operation mode may include: the device comprises a pickup mode, a fingerprint identification mode and a touch control detection mode.
The piezoelectric sensor may be integrated with a fingerprint sensor of the electronic device, or the fingerprint sensor may be multiplexed as the piezoelectric sensor.
As shown in fig. 14, the substrate (i.e. the piezoelectric material) of the piezoelectric sensor 31 is coated with electrodes on both sides, the electrode on the second surface opposite to the display module 2 is usually a whole piece of common electrode, and the electrode near the first surface of the display module is an electrode array. The piezoelectric sensor 31 is attached to the display module 2 by an adhesive so as to exhaust air between the piezoelectric material and the display module 1. When modulated voltage is applied to the two surfaces of the piezoelectric layer through the electrodes, the piezoelectric material can be excited to vibrate ultrasonic waves, and the ultrasonic waves reach fingerprints on the surface of the finger 14 through the adhesive and the display module 2. The fingerprint ridges on the surface of the finger are skin, the acoustic impedance of the skin is close to and in direct contact with the display module, ultrasonic waves can be transmitted into the skin and absorbed by the skin, and the emitted ultrasonic waves are extremely low in energy; air is left between the finger surface fingerprint valley and the display module, the acoustic impedance of the air is obviously larger than that of the display module, the ultrasonic waves are in sound production and total reflection on the display module 2 and the air interface, the transmission energy is extremely low, and the reflected ultrasonic energy is higher. When the ultrasonic wave that reflects back sees through display module 2, adhesive and reaches piezoelectric material (the voltage signal that the electrode was applyed at this moment cancels, becomes voltage acquisition electrode), the piezoelectric material in the fingerprint valley corresponding region produces electric charge under the piezoelectric effect and forms the voltage, can form the fingerprint pattern through the voltage signal on gathering the electrode array, at this moment piezoelectric sensor makes the fingerprint identification effect, promptly works in the fingerprint identification mode.
The piezoelectric sensor can also be used for pickup and touch detection. Optionally, the ultrasonic fingerprint recognition function, the sound pickup function and the touch detection function can be separated through a scene. As shown in fig. 15, the working state of the electronic device is determined, and when the detection module of the electronic device detects that the electronic device is in the fingerprint acquisition state (e.g., the screen locking state and the fingerprint payment state), the piezoelectric sensor is configured in the fingerprint identification mode to perform ultrasonic transceiving, that is, the electronic device can drive the piezoelectric sensor to transmit ultrasonic waves and then receive echo signals of the ultrasonic waves. Generally, in the fingerprint identification mode, the working frequency of the piezoelectric material is high (for example, more than 1MHz, even dozens of MHz), and the transmission and the reception of the ultrasonic wave are realized in time division (namely, the transmission is performed first and then the reception is performed, and the transmission and the reception are not performed at the same time).
When the detection module of the electronic equipment detects that the electronic equipment is in a sound collecting state (such as during a call), the piezoelectric sensor is configured to be in a sound pickup mode for audio reception. In this mode, the piezoelectric material will respond to vibration in and out of the audio frequency range, and noise beyond the audio frequency range (e.g. f1, f3 of fig. 16) can be filtered out by adding a filter to the signal processing circuit, so as to retain the signal in the range of 20Hz to 20KHz (e.g. f2 of fig. 16), thereby realizing sound pickup.
When the detection module of the electronic device detects that the electronic device is in a state of collecting touch actions (such as listening to music, taking a picture and playing a video), the piezoelectric controller is configured to be in a touch detection mode for low-frequency receiving. In this mode, on one hand, signals received by the piezoelectric material of the piezoelectric sensor are amplified and then compared with reference voltage, so that weak signals with low amplitude are filtered out (the problem of false touch can be well solved); on the other hand, the compared signals are subjected to interaction type judgment so as to identify interaction actions like single click and double click. Referring to fig. 17, f1 is a weak signal (e.g., the voice of a person speaking), f2 is a signal of a person tapping the screen (e.g., double-tapping the screen with a finger), f3 is a strong signal (e.g., the vibration of a motor in the terminal), and f1 is filtered by the comparator 15. After the waveform determining module 16 determines the duration of the high amplitude signal (the waveforms of single click, double click, long press, etc. can be determined by multiple time delay sampling), the f3 can be filtered, and the required f2 signal can be obtained. Since the waveform judging module belongs to a digital circuit, f2 can be automatically shaped into a regular square wave signal for subsequent circuits to use after passing through the module.
According to the embodiment, the piezoelectric sensor is multiplexed into a plurality of functions such as fingerprint identification, pickup and touch detection, the working mode of the piezoelectric sensor is controlled according to the current working state of the electronic equipment, the piezoelectric sensor can work in different scenes such as a pickup mode, a fingerprint identification mode and a touch detection mode according to requirements, the piezoelectric sensor can realize a plurality of functions such as fingerprint identification, pickup and touch interaction, and the structural space of the electronic equipment is saved.
The embodiment of this application sets up the pickup module at electronic equipment's display module medial surface, and the pickup module gathers the vibration signal of display module transmission and converts the signal of telecommunication output to signal processing unit and handles to realize pickup under the screen, electronic equipment can cancel the pickup hole, avoids the feed liquor of pickup hole, advances dirt scheduling problem influence pickup function.
Other configurations, such as display modules, housings, etc., and operations of electronic devices according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. An electronic device, comprising:
a housing;
the display module and the shell are enclosed to form an accommodating cavity;
the pickup module is positioned in the accommodating cavity, is arranged on the inner side surface of the display module and is in fit connection with the inner side surface of the display module; under the condition that the display module receives a vibration signal, the sound pickup module outputs an electric signal according to the vibration signal;
the signal processing unit is located hold the intracavity, just the signal processing unit with the pickup module electricity is connected.
2. The electronic device of claim 1, wherein the pickup module comprises at least one piezoelectric sensor;
the piezoelectric sensor comprises a piezoelectric layer, a second electrode and at least two first electrodes, wherein the at least two first electrodes are arranged on the first surface of the piezoelectric layer, the at least two first electrodes are arranged at intervals to form an electrode array, the second electrode is arranged on the second surface of the piezoelectric layer, and the polarities of the first electrodes and the second electrodes are opposite;
the first surface is a surface of the piezoelectric layer facing the display module, and the second surface is a surface of the piezoelectric layer facing away from the display module, or the first surface is a surface of the piezoelectric layer facing away from the display module, and the second surface is a surface of the piezoelectric layer facing toward the display module.
3. The electronic device of claim 2, wherein the pickup module comprises at least two piezoelectric sensors, the at least two piezoelectric sensors are spaced apart, and an operating frequency band of each of the at least two piezoelectric sensors is different.
4. The electronic device of claim 2, wherein the pickup module further comprises: a preprocessing module;
one end of the preprocessing module is connected with the piezoelectric sensor, and the other end of the preprocessing module is connected with the signal processing unit.
5. The electronic device of claim 2, wherein the electrode array comprises at least two electrode regions, each of the electrode regions having a different operating frequency band.
6. The electronic device according to claim 5, wherein the signal processing unit includes: the processing subunit is correspondingly connected with the electrode area;
and each electrode area is correspondingly connected with one processing subunit.
7. The electronic device of claim 2,
the piezoelectric layer comprises at least two functional areas, each of which has a different piezoelectric parameter.
8. The electronic device according to claim 2, further comprising a detection module and a control module connected to the detection module, wherein the detection module is configured to detect an operating state of the electronic device;
the control module is connected with the piezoelectric sensor and used for controlling the working mode of the piezoelectric sensor according to the working state.
9. The electronic device of claim 3, wherein the at least two piezoelectric sensors are spaced apart to form an n x m sensor matrix;
the projection of the sensor matrix on the display module is positioned in a target area on the display module;
wherein n and m are positive integers.
10. The electronic device of claim 9, wherein the sensor matrix comprises: a high frequency sensor region, a medium frequency sensor region, and a low frequency sensor region;
the signal processing unit comprises a first synthesis unit, a second synthesis unit, a third synthesis unit and a fourth synthesis unit;
the input end of the first synthesis unit is respectively connected with at least two high-frequency sensors in the high-frequency sensor area;
the input end of the second synthesis unit is respectively connected with at least two intermediate frequency sensors in the intermediate frequency sensor area;
the input end of the third synthesis unit is respectively connected with at least two low-frequency sensors in the low-frequency sensor area;
and the input end of the fourth synthesis unit is respectively connected with the output end of the first synthesis unit, the output end of the second synthesis unit and the output end of the third synthesis unit.
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| WO2022121729A1 (en) | 2022-06-16 |
| CN112527061B (en) | 2024-08-02 |
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