CN112525385A - Thermal resistance measuring instrument calibration system - Google Patents
Thermal resistance measuring instrument calibration system Download PDFInfo
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- CN112525385A CN112525385A CN202011134908.3A CN202011134908A CN112525385A CN 112525385 A CN112525385 A CN 112525385A CN 202011134908 A CN202011134908 A CN 202011134908A CN 112525385 A CN112525385 A CN 112525385A
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- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K15/00—Testing or calibrating of thermometers
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Abstract
The invention is suitable for the technical field of semiconductors, and provides a thermal resistance measuring instrument calibration system, which comprises: the temperature calibration device, the temperature measurement device, the upper computer and the thermal resistance standard component are arranged on the heat insulation plate; the temperature correcting device is used for controlling the thermal resistance standard component to be at a preset temperature, inputting a preset test current to the thermal resistance standard component, and measuring a first junction voltage of the thermal resistance standard component; the temperature measuring device is used for inputting a preset working current to the thermal resistance standard component and measuring a second junction voltage of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stable; the upper computer is used for determining a standard thermal resistance value of the thermal resistance standard component according to the preset temperature, the first junction voltage and the second junction voltage, and the standard thermal resistance value is used for calibrating the thermal resistance measuring instrument. The invention utilizes the thermal resistance standard component with calibrated accurate thermal resistance value to calibrate the thermal resistance measuring instrument, and can solve the problems of low accuracy and poor consistency of the measuring result of the thermal resistance measuring instrument in the prior art.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a thermal resistance measuring instrument calibration system.
Background
The thermal resistance parameter is an important parameter for representing the heat dissipation performance of the semiconductor device, is directly related to the service life and the reliability of the semiconductor device, and is continuously promoted along with the development of the semiconductor device towards the miniaturization, high-power and high-integration directions.
At present, most of thermal resistance measuring instruments on the market measure the junction temperature of a semiconductor device by a low-current K coefficient method based on an electrical method measuring principle, and then calculate the thermal resistance of the semiconductor device. However, in the method, due to the switching between the working current and the test current in the temperature measurement process, the junction voltage of the semiconductor device has a peak at the moment of current switching, and finally the accuracy of the measurement result of the thermal resistance measurement instrument is reduced. Although instrument manufacturers also provide some correction methods for respective thermal resistance measurement instruments, the application effect of the correction methods on a part of semiconductor devices is limited on one hand, and on the other hand, the consistency of measurement results of different thermal resistance measurement instruments is poor due to different correction methods adopted by different manufacturers.
Disclosure of Invention
In view of this, the embodiment of the present invention provides a calibration system for a thermal resistance measurement instrument, so as to solve the problems of low accuracy and poor consistency of measurement results of the thermal resistance measurement instrument in the prior art.
The embodiment of the invention provides a thermal resistance measuring instrument calibration system, which comprises:
the temperature calibration device, the temperature measurement device, the upper computer and the thermal resistance standard component are arranged on the heat insulation plate;
the temperature correcting device is used for controlling the thermal resistance standard component to be at a preset temperature, inputting a preset test current to the thermal resistance standard component, measuring a first junction voltage of the thermal resistance standard component, and transmitting the first junction voltage to the upper computer;
the temperature measuring device is used for inputting a preset working current to the thermal resistance standard component, measuring a second junction voltage of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stable, and transmitting the second junction voltage to the upper computer;
the upper computer is used for determining a standard thermal resistance value of the thermal resistance standard component according to the preset temperature, the first junction voltage and the second junction voltage, and the standard thermal resistance value is used for calibrating the thermal resistance measuring instrument.
Optionally, the preset test current is a pulse current, the preset working current is a direct current, and a current peak value of the preset test current is the same as a current value of the preset working current.
Optionally, the temperature calibration device includes a temperature control platform and a pulse source measurement unit;
the temperature control platform is used for controlling the thermal resistance standard component to be at a preset temperature;
the pulse source testing unit is used for inputting preset testing current to the thermal resistance standard component, measuring a first junction voltage of the thermal resistance standard component and transmitting the first junction voltage to the upper computer.
Optionally, the temperature measuring device includes a direct current source and a voltmeter;
the direct current source is used for inputting a preset working current to the thermal resistance standard component;
the voltmeter is used for measuring the second junction voltage of the thermal resistance standard part after the junction temperature of the thermal resistance standard part is stabilized, and transmitting the second junction voltage to the upper computer.
Optionally, determining a standard thermal resistance value of the thermal resistance standard component according to the preset temperature, the first junction voltage and the second junction voltage includes:
determining a temperature calibration curve of the thermal resistance standard component according to the preset temperature and the first junction voltage;
determining the junction temperature of the thermal resistance standard component according to the temperature calibration curve and the second junction voltage;
and determining a standard thermal resistance value of the thermal resistance standard component based on the junction temperature.
Optionally, determining a standard thermal resistance value of the thermal resistance standard component based on the junction temperature includes:
in the formula, RθjxIs a standard thermal resistance value, TjTo junction temperature, TxAs standard component of thermal resistanceShell temperature of (P)HThe power dissipated to cause a thermal resistance standard junction temperature rise.
Optionally, the standard thermal resistance value is used for calibrating a thermal resistance measuring instrument, and includes:
measuring the thermal resistance of a thermal resistance standard component by using a thermal resistance measuring instrument;
and calculating the difference value of the thermal resistance and the standard thermal resistance value, and calibrating the thermal resistance measuring instrument according to the difference value.
Optionally, the thermal resistance standard component includes a semiconductor chip, a housing, a first group of pins and a second group of pins;
the semiconductor chip is positioned inside the shell;
the first group of pins comprises a first pin and a second pin, the first pin penetrates through the shell to be connected with the anode of the semiconductor chip, and the second pin penetrates through the shell to be connected with the cathode of the semiconductor chip;
the second group of pins comprises a third pin and a fourth pin, wherein the third pin penetrates through the shell to be connected with the anode of the semiconductor chip, and the fourth pin penetrates through the shell to be connected with the cathode of the semiconductor chip.
Optionally, the first group of pins is used as an input port for presetting test current, and the second group of pins is used as a measurement port for a first junction voltage;
or the first group of pins are used as input ports of preset working current, and the second group of pins are used as measurement ports of second junction voltage.
Optionally, the semiconductor chip is a schottky diode chip made of silicon carbide.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
according to the calibration system for the thermal resistance measuring instrument, after the preset working current is input into the thermal resistance standard component and the junction temperature of the thermal resistance standard component is stable, the preset working current is directly used as the testing current to measure the second junction voltage of the thermal resistance standard component, so that the junction voltage spike phenomenon caused when the working current is switched to the testing current in the measuring process can be avoided, and the thermal resistance value of the thermal resistance standard component can be accurately measured; the thermal resistance measuring instrument is calibrated by using the thermal resistance standard component with the calibrated accurate thermal resistance value, and the problems of low accuracy and poor consistency of the measuring result of the thermal resistance measuring instrument in the prior art can be solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of a calibration system for a thermal resistance measurement instrument according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a temperature calibration device according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a temperature measuring device according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a temperature calibration curve provided by an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a thermal resistance standard according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a semiconductor device provided by an embodiment of the present invention;
fig. 7 is a schematic longitudinal sectional view of a thermal resistance standard according to an embodiment of the present invention.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
In order to explain the technical means of the present invention, the following description will be given by way of specific examples.
An embodiment of the present invention provides a thermal resistance measurement instrument calibration system, as shown in fig. 1, the thermal resistance measurement instrument calibration system 10 includes:
a thermal resistance standard component 11, a temperature correcting device 12, a temperature measuring device 13 and an upper computer 14.
The temperature correcting device 12 is used for controlling the thermal resistance standard component 11 to be at a preset temperature, inputting a preset test current to the thermal resistance standard component 11, measuring a first junction voltage of the thermal resistance standard component 11, and transmitting the first junction voltage to the upper computer 14.
The temperature measuring device 13 is used for inputting a preset working current to the thermal resistance standard component 11, measuring a second junction voltage of the thermal resistance standard component 11 after the junction temperature of the thermal resistance standard component 11 is stable, and transmitting the second junction voltage to the upper computer 14.
The upper computer 14 is used for determining a standard thermal resistance value of the thermal resistance standard component 11 according to the preset temperature, the first junction voltage and the second junction voltage, and the standard thermal resistance value is used for calibrating the thermal resistance measuring instrument.
Optionally, as a specific implementation manner of the thermal resistance measurement instrument calibration system provided by the embodiment of the present invention, the preset test current is a pulse current, the preset working current is a direct current, and a current peak value of the preset test current is the same as a current value of the preset working current.
In this embodiment, the preset test current is set as the pulse current, and the pulse width of the pulse current is smaller than the preset pulse width, so that the thermal resistance standard component 11 can be prevented from generating self-heating to influence the measurement accuracy of the first junction voltage under the condition that the pulse width of the pulse current is sufficiently narrow. And, the accuracy of the standard thermal resistance value calculation result can be ensured by setting the current peak value of the preset test current to be the same as the current value of the preset working current.
Optionally, as a specific implementation of the calibration system for a thermal resistance measurement instrument provided in the embodiment of the present invention, as shown in fig. 2, the temperature calibration device 12 may include a temperature control platform 121 and a pulse source measurement unit 122;
the temperature control platform 121 is used for controlling the thermal resistance standard component 11 to be at a preset temperature;
the pulse source measurement unit 122 is configured to input a preset test current to the thermal resistance standard component 11, measure a first junction voltage of the thermal resistance standard component 11, and transmit the first junction voltage to the upper computer 14.
In an embodiment of the present invention, the pulse source unit 122 may be a semiconductor tester capable of inputting a pulse current with a narrow pulse width to the thermal resistance standard 11 and synchronously measuring the first junction voltage of the thermal resistance standard 11 during the pulse.
Optionally, as a specific implementation of the thermal resistance measurement instrument calibration system provided in the embodiment of the present invention, as shown in fig. 3, the temperature measurement device 13 may include a direct current source 131 and a voltmeter 132;
the direct current source 131 is used for inputting a preset working current to the thermal resistance standard component 11;
the voltmeter 132 is used for measuring the second junction voltage of the thermal resistance standard component 11 after the junction temperature of the thermal resistance standard component 11 is stabilized, and transmitting the second junction voltage to the upper computer 14.
When the junction voltage of a semiconductor device is measured by a traditional low-current K coefficient method, because the current value of the test current is far smaller than the working current, after the semiconductor device is heated by the working current, the junction voltage of the semiconductor device is switched to the test current in the moment, and the junction voltage of the semiconductor device is subjected to instant peak due to rapid discharge, so that the measurement result of the junction voltage is inaccurate.
In the embodiment of the invention, the preset working current is input into the thermal resistance standard component 11 for heating, and after the junction temperature of the thermal resistance standard component 11 is stabilized, the preset working current is directly used as the test current to measure the second junction voltage of the thermal resistance standard component 11, so that the switching of the current can be avoided, and the measurement precision of the junction voltage can be improved. In addition, it should be noted that, in the process of inputting the preset working current to the thermal resistance standard component 11 and measuring the second junction voltage of the thermal resistance standard component 11, the thermal resistance standard component 11 may be at the preset temperature of the temperature control device 121, or may not be at the preset temperature of the temperature control device 121, and the ambient temperature of the thermal resistance standard component 11 does not affect the final calculation result of the standard thermal resistance value.
Optionally, as a specific implementation manner of the calibration system for a thermal resistance measurement instrument provided in the embodiment of the present invention, determining the standard thermal resistance value of the thermal resistance standard component 11 according to the preset temperature, the first junction voltage, and the second junction voltage includes:
determining a temperature calibration curve of the thermal resistance standard component 11 according to a preset temperature and the first junction voltage;
determining the junction temperature of the thermal resistance standard component 11 according to the temperature calibration curve and the second junction voltage;
a standard thermal resistance value of the thermal resistance standard 11 is determined based on the junction temperature.
Optionally, as a specific implementation of the calibration system for a thermal resistance measurement instrument provided in the embodiment of the present invention, determining a standard thermal resistance value of the thermal resistance standard component 11 based on the junction temperature includes:
in the formula, RθjxIs a standard thermal resistance value, TjTo junction temperature, TxIs the shell temperature, P, of a thermal resistance standardHThe power dissipated to cause a thermal resistance standard junction temperature rise.
In the embodiment of the present invention, the above calculation process may be implemented in the upper computer 14, specifically, the preset temperature is changed to perform a plurality of tests, so as to determine the temperature calibration curve of the thermal resistance standard component 11, further, the upper computer 14 determines the junction temperature of the thermal resistance standard component 11 according to the temperature calibration curve and the second junction voltage, and determines the standard thermal resistance value of the thermal resistance standard component 11 based on the junction temperature. The temperature calibration curve of the thermal resistance standard 11 is shown in FIG. 4, in which V istspIs the junction voltage, T, of the thermal resistance standard 11jAs shown in FIG. 2, the junction voltage variation Δ V of the thermal resistance standard 11 is the junction temperature of the thermal resistance standard 11tspJunction temperature delta T with thermal resistance standard 11jIn a multiple relationship, i.e. Δ Vtsp＝KΔTjAnd K is the temperature correction coefficient.
In addition, it should be noted that the shell temperature TxThe case temperature when the junction temperature of the thermal resistance standard component 11 is stable is used as the reference position temperature of the thermal resistance standard component 11, and in practical application, other positions of the thermal resistance standard component 11 can be selected as the reference position, which is not set by the invention.
Optionally, as a specific implementation manner of the thermal resistance measurement instrument calibration system provided in the embodiment of the present invention, the calibration of the thermal resistance measurement instrument with the standard thermal resistance value includes:
measuring the thermal resistance of the thermal resistance standard part 11 by using a thermal resistance measuring instrument;
and calculating the difference value of the thermal resistance and the standard thermal resistance value, and calibrating the thermal resistance measuring instrument according to the difference value.
In the embodiment of the present invention, after the thermal resistance measuring instrument to be calibrated is used to measure the thermal resistance of the thermal resistance standard component 11, the thermal resistance measuring instrument may be calibrated according to a difference between a measured value of the thermal resistance and a standard thermal resistance value, and other calibration methods may also be adopted, which is not limited in this invention. If the difference value between the measured value of the thermal resistance and the standard thermal resistance value is adopted to calibrate the thermal resistance measuring instrument, the thermal resistance measuring instrument can be adjusted, and the difference value can be added to the measurement result of each time of the thermal resistance measuring instrument to be used as the accurate value of the thermal resistance.
Optionally, as a specific implementation of the thermal resistance measurement instrument calibration system provided in the embodiment of the present invention, as shown in fig. 5, the thermal resistance standard component 11 includes a semiconductor chip 111, a housing 112, a first group of pins, and a second group of pins;
the semiconductor chip 111 is located inside the case 112;
the first group of pins includes a first pin 113 and a second pin 114, the first pin 113 is connected to the anode of the semiconductor chip 111 through the case 112, and the second pin 114 is connected to the cathode of the semiconductor chip 111 through the case 112;
the second group of pins includes a third pin 115 and a fourth pin 116, the third pin 115 is connected to the anode of the semiconductor chip 111 through the case 112, and the second pin 116 is connected to the cathode of the semiconductor chip 111 through the case 112.
Optionally, as a specific implementation manner of the thermal resistance measurement instrument calibration system provided in the embodiment of the present invention, the first group of pins is used as an input port for a preset test current, and the second group of pins is used as a measurement port for a first junction voltage;
or the first group of pins are used as input ports of preset working current, and the second group of pins are used as measurement ports of second junction voltage.
In general, a junction voltage measured from a pin outside a semiconductor device includes, in addition to a junction voltage of a diode chip, an interference voltage generated by a part of pin resistance, lead resistance, contact resistance and the like inside the semiconductor device, and in the case of a small test current, the interference voltage can be ignored, but in the embodiment of the present invention, since the test current is large, the interference voltage may have a large influence on a measurement result. As shown in FIG. 6, the junction voltage (V) measured from the pins 62, 63 outside the semiconductor device 60 is equivalent to R62, R63 with the partial pin resistance, lead resistance and contact resistance inside the semiconductor device 60 equivalent to R62, R63tsp) The voltages of R62 and R63 are included in addition to the junction voltage of the diode chip 61.
In order to eliminate the influence of interference voltage on the measurement result, the invention designs the thermal resistance standard component 11 with two groups of pins, wherein one group of pins is used for inputting current, the other group of pins is used for testing voltage, and the influence of the interference voltage in the thermal resistance standard component 11 on the measurement result of the junction voltage is avoided by separating the power-up loop and the measurement loop.
Optionally, as a specific implementation manner of the thermal resistance measurement instrument calibration system provided in the embodiment of the present invention, the semiconductor chip 111 is a schottky diode chip made of silicon carbide.
In the embodiment of the invention, the thermal resistance standard component 11 made of the Schottky diode chip is selected, the circuit structure is simple, the electrical stability is good, and the Schottky structure is high in switching speed and is more suitable for measuring the pulse current. The silicon carbide belongs to a wide bandgap material, and can improve the heat resistance and the thermal stability of the thermal resistance standard component 11. It should be noted that, in practical applications, the device chip with MOSFET, IGBT or other PN junction structure may also be used to implement the technical solution of the present invention without considering the advantages of the schottky diode chip, and the present invention is not limited herein.
In addition, since each thermal resistance standard 11 can only have one standard thermal resistance value, in order to cover the calibration range of the thermal resistance parameters, the embodiment of the invention designs and manufactures a series of thermal resistance standard 11 with different standard thermal resistance values. The standard thermal resistance value of the thermal resistance standard 11 can be changed by adjusting the size of the semiconductor chip 111 or changing the structure of the housing 112, which is not limited in the present invention.
Specifically, as shown in fig. 7, which is a cross-sectional view of the thermal resistance standard 11 shown in fig. 5 in this embodiment, the casing 112 of the thermal resistance standard 11 may be composed of a cover plate, a side wall, and a bottom plate (a substrate layer, an insulating layer, and a conductive layer from bottom to top), the semiconductor chip 111 is soldered on the conductive layer of the bottom plate, the cathode of the semiconductor chip 111 contacts the conductive layer, the first pin 113 and the third pin 115 are connected to the anode of the semiconductor chip 111, the second pin 114 is connected to the cathode of the semiconductor chip 111, and the fourth pin 116 may be connected to the conductive layer and connected to the cathode of the semiconductor chip 111 through the conductive layer.
Since the side length of the semiconductor chip 11 has a significant influence on the thermal resistance, the standard thermal resistance value of the thermal resistance standard 11 can be changed by adjusting the size of the semiconductor chip 111; since the structure of the housing 112 affects the heat dissipation effect of the thermal resistance standard 11, the standard thermal resistance value of the thermal resistance standard 11 can be changed by adjusting the materials and the thicknesses of the conductive layer, the insulating layer and the substrate layer of the housing 112.
As can be seen from the above, in the calibration system for a thermal resistance measurement instrument provided in the embodiment of the present invention, after the preset working current is input to the thermal resistance standard component and the junction temperature of the thermal resistance standard component is stabilized, the preset working current is directly used as the test current to measure the second junction voltage of the thermal resistance standard component, so that a junction voltage spike phenomenon caused when the working current is switched to the test current in the measurement process can be avoided, and the thermal resistance value of the thermal resistance standard component can be accurately measured; the thermal resistance measuring instrument is calibrated by using the thermal resistance standard component with the calibrated accurate thermal resistance value, and the problems of low accuracy and poor consistency of the measuring result of the thermal resistance measuring instrument in the prior art can be solved.
It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A thermal resistance measurement instrument calibration system, comprising:
the temperature calibration device, the temperature measurement device, the upper computer and the thermal resistance standard component are arranged on the heat insulation plate;
the temperature correcting device is used for controlling the thermal resistance standard component to be at a preset temperature, inputting a preset test current to the thermal resistance standard component, measuring a first junction voltage of the thermal resistance standard component, and transmitting the first junction voltage to the upper computer;
the temperature measuring device is used for inputting a preset working current to the thermal resistance standard part, measuring a second junction voltage of the thermal resistance standard part after the junction temperature of the thermal resistance standard part is stable, and transmitting the second junction voltage to the upper computer;
the upper computer is used for determining a standard thermal resistance value of the thermal resistance standard component according to the preset temperature, the first junction voltage and the second junction voltage, and the standard thermal resistance value is used for calibrating a thermal resistance measuring instrument.
2. The thermal resistance measuring instrument calibration system according to claim 1, wherein the preset test current is a pulse current, the preset operating current is a direct current, and a current peak value of the preset test current is the same as a current value of the preset operating current.
3. The thermal resistance measurement instrument calibration system of claim 2, wherein the temperature calibration device comprises a temperature control platform and a pulse source measurement unit;
the temperature control platform is used for controlling the thermal resistance standard component to be at a preset temperature;
the pulse source testing unit is used for inputting a preset testing current to the thermal resistance standard component, measuring a first junction voltage of the thermal resistance standard component and transmitting the first junction voltage to the upper computer.
4. The thermal resistance measurement instrument calibration system according to claim 2, wherein the temperature measuring device comprises a direct current source and a voltmeter;
the direct current source is used for inputting a preset working current to the thermal resistance standard component;
the voltmeter is used for measuring a second junction voltage of the thermal resistance standard part after the junction temperature of the thermal resistance standard part is stabilized, and transmitting the second junction voltage to the upper computer.
5. The thermal resistance measurement instrument calibration system of claim 2, wherein the determining the standard thermal resistance value of the thermal resistance standard according to the preset temperature, the first junction voltage, and the second junction voltage comprises:
determining a temperature calibration curve of the thermal resistance standard component according to the preset temperature and the first junction voltage;
determining the junction temperature of the thermal resistance standard component according to the temperature calibration curve and the second junction voltage;
and determining a standard thermal resistance value of the thermal resistance standard component based on the junction temperature.
6. The thermal resistance measurement instrument calibration system of claim 5, wherein said determining a standard thermal resistance value for the thermal resistance standard based on the junction temperature comprises:
in the formula, RθjxIs a standard thermal resistance value, TjTo junction temperature, TxIs the shell temperature, P, of a thermal resistance standardHThe power dissipated to cause a thermal resistance standard junction temperature rise.
7. The thermal resistance measurement instrument calibration system of claim 2, wherein the standard thermal resistance value is used to calibrate the thermal resistance measurement instrument, comprising:
measuring the thermal resistance of the thermal resistance standard component by using a thermal resistance measuring instrument;
and calculating the difference value of the thermal resistance and the standard thermal resistance value, and calibrating the thermal resistance measuring instrument according to the difference value.
8. The thermal resistance measurement instrument calibration system of claim 1, wherein the thermal resistance standard comprises a semiconductor chip, a housing, a first set of pins, and a second set of pins;
the semiconductor chip is positioned inside the shell;
the first group of pins comprises a first pin and a second pin, the first pin penetrates through the shell to be connected with the anode of the semiconductor chip, and the second pin penetrates through the shell to be connected with the cathode of the semiconductor chip;
the second group of pins comprises a third pin and a fourth pin, the third pin penetrates through the shell to be connected with the anode of the semiconductor chip, and the fourth pin penetrates through the shell to be connected with the cathode of the semiconductor chip.
9. The thermal resistance measurement instrument calibration system of claim 8, wherein the first set of pins is configured to be an input port for the predetermined test current and the second set of pins is configured to be a measurement port for the first junction voltage;
or, the first group of pins is used as an input port of the preset working current, and the second group of pins is used as a measurement port of the second junction voltage.
10. The thermal resistance measurement instrument calibration system of claim 8, wherein the semiconductor chip is a silicon carbide schottky diode chip.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114112113A (en) * | 2021-10-08 | 2022-03-01 | 中国电子科技集团公司第十三研究所 | Thermal resistance transfer standard component and thermal resistance measuring instrument calibration method |
| CN114112117A (en) * | 2021-12-20 | 2022-03-01 | 江西洪都航空工业集团有限责任公司 | On-spot measurement calibrating device of temperature instrument |
| CN114295954A (en) * | 2021-12-31 | 2022-04-08 | 中国电子科技集团公司第十三研究所 | Method and device for measuring thermal resistance of diode pulse current and terminal equipment |
| CN115629297A (en) * | 2022-12-07 | 2023-01-20 | 北京紫光芯能科技有限公司 | Method, device, equipment and medium for detecting accuracy of thermal resistance value of MCU chip |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103630820A (en) * | 2013-12-03 | 2014-03-12 | 黑龙江省计量科学研究院 | High-power LED heat resistance measuring device and method of measuring high-power LED heat resistance thereby |
| CN103792476A (en) * | 2014-01-17 | 2014-05-14 | 中国空间技术研究院 | Thermal resistance measuring method for semiconductor device |
| DE102013211038B3 (en) * | 2013-06-13 | 2014-10-16 | Siemens Aktiengesellschaft | Providing information about an aging state of a semiconductor device |
| CN104849682A (en) * | 2015-04-09 | 2015-08-19 | 中国船舶重工集团公司第七0九研究所 | Device and method for measuring characteristic parameter of standard integrated circuit sample |
| CN106054052A (en) * | 2016-06-09 | 2016-10-26 | 北京工业大学 | Semiconductor device temperature-voltage-current three-dimensional temperature-adjusting curve surface establishment method |
| CN107024648A (en) * | 2017-04-17 | 2017-08-08 | 东南大学 | LED junction temperature measurement device and method based on impulse method |
| CN206638779U (en) * | 2017-04-17 | 2017-11-14 | 东南大学 | The gentle illumination photometry device of LED junction based on impulse method |
| CN111781480A (en) * | 2020-05-28 | 2020-10-16 | 南方电网科学研究院有限责任公司 | Junction temperature monitoring method, device and system of IGBT |
-
2020
- 2020-10-21 CN CN202011134908.3A patent/CN112525385B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013211038B3 (en) * | 2013-06-13 | 2014-10-16 | Siemens Aktiengesellschaft | Providing information about an aging state of a semiconductor device |
| CN103630820A (en) * | 2013-12-03 | 2014-03-12 | 黑龙江省计量科学研究院 | High-power LED heat resistance measuring device and method of measuring high-power LED heat resistance thereby |
| CN103792476A (en) * | 2014-01-17 | 2014-05-14 | 中国空间技术研究院 | Thermal resistance measuring method for semiconductor device |
| CN104849682A (en) * | 2015-04-09 | 2015-08-19 | 中国船舶重工集团公司第七0九研究所 | Device and method for measuring characteristic parameter of standard integrated circuit sample |
| CN106054052A (en) * | 2016-06-09 | 2016-10-26 | 北京工业大学 | Semiconductor device temperature-voltage-current three-dimensional temperature-adjusting curve surface establishment method |
| CN107024648A (en) * | 2017-04-17 | 2017-08-08 | 东南大学 | LED junction temperature measurement device and method based on impulse method |
| CN206638779U (en) * | 2017-04-17 | 2017-11-14 | 东南大学 | The gentle illumination photometry device of LED junction based on impulse method |
| CN111781480A (en) * | 2020-05-28 | 2020-10-16 | 南方电网科学研究院有限责任公司 | Junction temperature monitoring method, device and system of IGBT |
Non-Patent Citations (2)
| Title |
|---|
| 翟玉卫等: "电学法热阻测试仪校准方法研究", 《计算机与数字工程》 * |
| 董晨曦等: "功率VDMOS 稳态热阻测试的关键影响因素", 《电子器件》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114112113A (en) * | 2021-10-08 | 2022-03-01 | 中国电子科技集团公司第十三研究所 | Thermal resistance transfer standard component and thermal resistance measuring instrument calibration method |
| CN114112117A (en) * | 2021-12-20 | 2022-03-01 | 江西洪都航空工业集团有限责任公司 | On-spot measurement calibrating device of temperature instrument |
| CN114295954A (en) * | 2021-12-31 | 2022-04-08 | 中国电子科技集团公司第十三研究所 | Method and device for measuring thermal resistance of diode pulse current and terminal equipment |
| CN115629297A (en) * | 2022-12-07 | 2023-01-20 | 北京紫光芯能科技有限公司 | Method, device, equipment and medium for detecting accuracy of thermal resistance value of MCU chip |
| CN115629297B (en) * | 2022-12-07 | 2023-03-21 | 北京紫光芯能科技有限公司 | Method, device, equipment and medium for detecting accuracy of thermal resistance value of MCU chip |
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