CN112521886A - Preparation and use methods of novel adhesive capable of being peeled and disassembled as required - Google Patents

Preparation and use methods of novel adhesive capable of being peeled and disassembled as required Download PDF

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Publication number
CN112521886A
CN112521886A CN202011467026.9A CN202011467026A CN112521886A CN 112521886 A CN112521886 A CN 112521886A CN 202011467026 A CN202011467026 A CN 202011467026A CN 112521886 A CN112521886 A CN 112521886A
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China
Prior art keywords
adhesive
peeled
conductive filler
bonded
bonding
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魏勇
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Southwest University of Science and Technology
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Southwest University of Science and Technology
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Priority to CN202011467026.9A priority Critical patent/CN112521886A/en
Publication of CN112521886A publication Critical patent/CN112521886A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/24—Homopolymers or copolymers of amides or imides
    • C09J133/26—Homopolymers or copolymers of acrylamide or methacrylamide
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Abstract

The invention discloses a preparation and use method of a novel adhesive capable of being peeled and disassembled as required, which is characterized by comprising the following steps of: adding the ionic conductive filler and the electronic conductive filler into the bonding precursor simultaneously, and mixing uniformly by a certain process to obtain the novel adhesive which has ionic conductivity and electronic conductivity and can be peeled and disassembled as required; applying an adhesive to a bonded substrate through a sizing process, performing a bonding and fixing effect after curing, and applying voltage to two sides of a bonded object to realize stripping and dismounting as required; the bonded substrate is a metal interface or a conductive surface. The preparation method is simple and effective, solves the problem that the bonded base material is not easy to detach and peel after being bonded by the adhesive at present, and has wide application prospect.

Description

Preparation and use methods of novel adhesive capable of being peeled and disassembled as required
Technical Field
The invention relates to the technical field of preparation of advanced electronic functional materials, in particular to a preparation method of a novel adhesive needing to be peeled and disassembled.
Background
The adhesive is a substance which bonds two substrates together by utilizing the interaction of interfacial adhesion and molecular cohesion, mechanical interlocking, electrostatic adsorption, van der waals force and the like formed with a bonding interface, can also be called as an adhesive, glue or glue, and has very wide application in the fields of aerospace, consumer electronics, automobile construction, bioengineering and the like.
Aiming at the historical research of the adhesive, the key point is mainly focused on forward bonding, namely how to make bonding stronger and more reliable, however, in many fields, particularly consumer electronics, automobiles and the like, which often relate to product repair or bonded parts have higher economic value and relate to recycling, the product is required to be bonded well within the life cycle, and bonding and degumming behaviors cannot occur. However, when the product needs to be repaired or the adhered parts need to be recycled, the adhered system needs to be easily peeled off to complete the disassembly, and the adhered parts cannot be damaged. Although the peeling of the adhesive is realized by using the principle that the thermoplastic polymer is heated to melt or the microcapsule is heated to expand at present, the method is not suitable for the bonding scene which cannot bear temperature heating, and the method for promoting the detachment and peeling by heating is very complicated, so that the method is very not beneficial to practical application.
Disclosure of Invention
The invention aims to develop a novel adhesive capable of being peeled and disassembled as required to realize re-separation and reuse of an adhered object, aiming at the problem that the adhesive in the current industrial field is not easy to peel off during repair and disassembly.
An object of the present invention is to solve at least the above problems and/or disadvantages and to provide at least the advantages described hereinafter.
To achieve these objects and other advantages in accordance with the present invention, there is provided a method for preparing a novel adhesive for peel-on-demand release, comprising the steps of: and adding the ionic conductive filler and the electronic conductive filler into the bonding precursor simultaneously, and uniformly mixing by a certain process to obtain the novel adhesive which has ionic conductivity and electronic conductivity and can be peeled and disassembled as required.
Preferably, the adhesive is a single-component adhesive or a two-component adhesive; the adhesive is any one of liquid, gel and solid; the certain process is any one of high-speed stirring, rolling and open milling, rolling and banburying and screw extrusion.
Preferably, the ionic conductive filler accounts for 0.1-50 wt% of the content of the polymer matrix after the bonding precursor is cured; the ion conductive filler is a compound which can dissociate anions and cations in a molten state or a solution state, can perform ion transmission under the action of an electric field and has an ion conductive effect; the electronic conductive filler accounts for 0.1-90 wt% of the cured polymer matrix of the bonded precursor; the electronic conductive filler is one or more of nano or micron metal particles with electronic conductivity, carbon materials and conductive polymers; the bonding precursor is a single-component curing system or a two-component curing system, and if the bonding precursor is the two-component curing system, the ionic conductive filler or the electronic conductive filler is added into one of the components or is simultaneously added into the two components; the bonding precursor is thermoplastic or thermosetting after being cured; if the bonding precursor is solvent volatile, the solvent is water or volatile organic solvent; the crystallinity of the polymer obtained after the bonding precursor is solidified is less than 30 percent; the glass transition temperature of the polymer obtained after the bonding precursor is solidified is less than 50 ℃; the bonding precursor also comprises one or more of tackifier, anti-aging agent, plasticizer, thickener, accelerator, coupling agent, filler, defoaming agent, colorant, softener, thixotropic agent, flame retardant and heat stabilizer.
Preferably, the anion dissociated from the ion conductive filler is one or more of a negatively charged anion, an inorganic acid radical ion, an organic acid radical ion and an organic anion generated by deprotonating an organic compound, which are formed after the active nonmetal element obtains electrons; the cation dissociated from the ion conductive filler is one or more of positive hydrogen ion, ammonium ion, positive cation formed by losing electrons of active metal, and organic cation.
Preferably, the anion is F-、Cl-、Br-、I-、S2-、O2-、N3-、OH-、SO4 2-、NO2 -、NO3 -、CO3 2-、HS-、CN-、SCN-、HCO3 -、HPO4 2-、H2PO4 -、PO4 3-、PF6 -、BF4 -、SO3 2-、S2O8 2-、MnO4 -、MnO4 2-、ClO4 -、ClO3 -、ClO-、ClO2 -、IO3 -、BO3 3-、SiO3 3-、AlSiO4 -、WO4 2-、SeO4 2-、CrO4 -、Cr2O7 2-、FeO4 2-、FeO2 2-、VO4 3-、TiO3 2-、(FSO2)N-、(CF3SO2)2N-、AsF6-、SbF6 -、FeCl4 -、AlCl3 3-、AlCl4 -、Al2Cl7 -、ZnCl2 -、R1COO-(organic carboxylate ion, R)1Is an organic chemical group), R2SO3 -(organic sulfonate ion, R)2Being an organic chemical group), Lys-(lysine radical ion), Cys-(cysteine radical ion), Gly-(glycinate ion), [ R ]1R2N]-(amino anion, R)1And R2All are organic chemical groups), [ R ]1R2R3C]-(carbanion, R)1、R2、R3All organic chemical groups);
the cation is H+、NH4 +、Li+、Na+、K+、Ag+、Ca2+、Mg2+、Ba2+、Cu2+、Hg2+、Zn2+、Al3+、Fe2+、Fe3+、[R1R2R3R4N]+(Quaternary ammonium ion, R)1、R2、R3、R4All are organic chemical groups), [ R ]1R2R3R4P]+(Quaternary phosphonium ion, R)1、R2、R3、R4All are organic chemical groups), [ R ]1R2IM]+(organic imidazolium cation, R)1、R2All are organic chemical groups), [ R ]1Py]+(organic pyridinium cation, R)1Is an organic chemical group) [ R ]1R2R3C]+(carbocation, R)1、R2、R3All organic chemical groups).
Preferably, the electronic conductive filler is one or more of silver nanoparticles, gold nanoparticles, copper nanoparticles, silver nanowires, gold nanowires, copper nanowires, conductive carbon black, carbon nanotubes, graphene, micron graphite powder, micron silver powder, micron nickel powder, micron copper powder, micron silver-coated copper powder, micron nickel-coated copper powder, doped polyaniline, doped polythiophene and doped polypyrrole.
Preferably, the electronic conductive filler accounts for 0.1-90 wt% of the cured polymer matrix of the bonding precursor; the electronic conductive filler is a hybrid particle with conductive property, which is prepared by chemically or physically modifying non-conductive particles, wherein the non-conductive particles comprise any one of microcrystalline cellulose, carbon fiber, glass fiber, polymer microsphere, inorganic whisker, inorganic nanotube and layered inorganic matter; the modification method comprises any one of loading, coating and wrapping.
Preferably, the bonding precursor is one or more of natural latex, styrene-butadiene latex, acrylate latex, aqueous polyurethane, natural rubber, styrene-butadiene rubber, butyl rubber, butadiene rubber, nitrile rubber, polysulfide rubber, polyurethane prepolymer, modified epoxy resin prepolymer, modified acrylate prepolymer, modified silicone resin prepolymer, modified melamine resin prepolymer, modified phenolic resin prepolymer, polyelectrolyte solution, aqueous solution of water-soluble polymer, and small molecule solution containing mono-functionality and multi-functionality.
The invention also provides a using method of the novel adhesive for stripping and disassembling as required, the adhesive is applied to the bonded base material through a sizing process, the adhesive is cured to play a role in bonding and fixing, and voltage is applied to two sides of the bonded object to realize stripping and disassembling as required; the bonded substrate is a metal interface or a conductive surface.
Preferably, the room-temperature ionic conductivity of the adhesive after curing is 10-1～10-10S/m; the curing mode is one or more of moisture curing, UV curing, heating curing and solvent volatilization drying type curing; the glue applying process is any one of manual glue gun glue dispensing, pneumatic glue dispensing, screw extrusion glue dispensing and jet glue dispensing, the glue dispensing process can be realized by heating, and the heating temperature is less than 140 ℃; the bonded base material is any one of gold, silver, copper, iron, magnesium, zinc, nickel, beryllium, tungsten, stainless steel, metal alloy and polymer conductive composite material; if the surface of the bonded base material is non-conductive, the surface of the bonded base material needs to be subjected to conductive treatment; the applied voltage is direct current voltage or alternating current voltage; the applied voltage is 1-1000V, and the electrifying time is 1-300 s; the tensile shear strength of the adhesive bonded and cured on the bonded substrate is less than 0.1MPa, and the shear strength test method is carried out according to the determination of the tensile shear strength of the adhesive (GB/T7124-2008).
The invention at least comprises the following beneficial effects: the adhesive is adhered and cured on the adhered base material, and can be easily peeled and detached as required by applying voltage on two sides of the adhered object; the preparation method is simple and effective, solves the problem that the current bonded base material is not easy to detach and peel after being bonded by the adhesive, has wide application prospect, and the related peeling effect can be proved by a tensile shear test (GB/T7124 + 2008) before and after the bonding system is electrified, and foresees that the higher the electrified voltage is, the longer the electrified time is, and the lower the corresponding tensile shear strength is.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
The specific implementation mode is as follows:
the present invention is further described in detail below with reference to examples so that those skilled in the art can practice the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
Example 1:
according to parts by weight, 100 parts of N-210 polyether (with the number average molecular mass of 1500), 5 parts of SU-120 tackifying resin, 1 part of dibutyltin dilaurate, 20 parts of 1-butyl-3 methyl-imidazole tetrafluoroborate and 1 part of carbon nano tube are fully and uniformly mixed, vacuum drying is carried out for 48 hours at the temperature of 60 ℃, then 25 parts of isophorone diisocyanate (IPDI) is added, stirring and mixing are carried out for 24 hours at the temperature of 80 ℃ under the protection of nitrogen atmosphere (the stirring speed is 200rpm), and the electrified detachable peeled single-component moisture-cured polyurethane hot-melt adhesive is obtained and packaged in a rubber tube or a rubber cylinder; when in use, the rubber tube is heated to 110 ℃, and the operations of glue dispensing and glue applying are carried out; and (3) taking the copper plate as an adhered object, applying 50V voltage on the copper plate for 20s after the adhesive is completely cured under the normal temperature and the normal humidity, and completely stripping the adhesive system to finish the disassembly.
Example 2:
dissolving 100 parts by weight of acrylamide, 40 parts by weight of lauryl methacrylate, 5 parts by weight of LiCl, 2 parts by weight of silver nanowires (water dispersion with concentration of 2g/mL), 2 parts by weight of benzoin ethyl ether, 1 part by weight of benzophenone, 0.5 part by weight of potassium persulfate and 10 parts by weight of trimethylolpropane triacrylate in 100 parts by weight of deionized water, stirring for 1 hour (stirring speed 200rpm) at normal temperature in a nitrogen atmosphere, then adding 0.5 part by weight of sodium polyacrylate (number average molecular weight 1000000) and stirring for 1 hour again at 200rpm to obtain a single-component ultraviolet curing polyacrylate adhesive, and packaging the single-component ultraviolet curing polyacrylate adhesive in a rubber tube or a rubber cylinder; when in use, the line-marking type glue dispensing technology can be directly adopted for glue dispensing at normal temperature, and crosslinking and curing are carried out through ultraviolet light after glue dispensing; the transparent conductive electrode is used as an object to be bonded, and the bonding can be completed by irradiating the transparent conductive electrode for 1min by a 365nm ultraviolet light source; and applying 10V voltage to the transparent electrode for 10s, completely stripping the bonding system, and completing the disassembly.
Example 3:
according to parts by weight, 100 parts of vinyl silicone oil (industrial grade, number average molecular weight 1000) and 3 parts of hydrogen-containing silicone oil (industrial grade, number average molecular weight 1000) are stirred and mixed uniformly at normal temperature, then 20 parts of 1-butyl-3 methyl-imidazole hexafluorophosphate is added and stirred uniformly, then 1 part of carbon nano tube is added and stirred uniformly, then 0.2 part of platinum catalyst (industrial grade) and 0.05 part of alkynol inhibitor 1-ethynylcyclohexanol are added and stirred uniformly at room temperature, and then the single-component heating curing type silicone adhesive is obtained; and (3) taking a copper plate as an object to be bonded, applying 50V voltage to the copper plate for 20s after the adhesive is heated at 130 ℃ for 2h to be completely cured, and completely stripping the bonding system to finish the disassembly.
Example 4:
adding 30 parts by weight of 1-butyl-3 methyl-imidazole hexafluorophosphate, 2 parts by weight of lithium hexafluorophosphate, 5 parts by weight of micron silver powder and 1 part by weight of defoamer OP-10 (alkylphenol polyoxyethylene ether) into 100 parts by weight of waterborne polyurethane (with the solid content of 30 wt%), and fully and uniformly stirring to obtain the electrified detachable stripped single-component dried and cured waterborne polyurethane adhesive; packaging in a rubber tube or a rubber cylinder; when in use, the marking-off type dispenser is directly used for dispensing and gluing; and (3) taking the stainless steel plate as a bonded substrate, applying 100V voltage on the stainless steel plate for 5s after water is volatilized, and completely stripping the bonding system to finish the disassembly.
Example 5:
according to parts by weight, 100 parts of E51 epoxy resin (industrial grade), 30 parts of E20 epoxy resin (industrial grade) and 10 parts of diisodecyl adipate are added into 30 parts of butanone and toluene mixed solution (the volume ratio of butanone to toluene is 1:1), then 40 parts of 1-butyl-3-methylimidazolium bistrifluoromethylsulfonyl imide salt and 10 parts of micron silver powder are added and stirred for 2 hours, and the component A is obtained after air bubbles are removed; 100 parts of liquid nitrile rubber, 50 parts of hexamethylenediamine and 10 parts of triethylamine are dissolved in 30 parts of butanone and toluene mixed solution (the volume ratio of butanone to toluene is 1:1, air bubbles are removed to obtain a component B, A, B components are respectively packaged in a two-component rubber barrel according to the proportion of 5:1, when the adhesive is used, a spiral mixed rubber tube is adopted to mix and glue the component AB, an aluminum plate is used as a bonded base material, the bonding system is fully cured for 4 hours at 120 ℃, 60V voltage is applied to the aluminum plate for 10s, the bonding system can be completely peeled off, and disassembly is completed.
Example 6:
20g of ammonium acrylate, 20g of isooctyl methacrylate, 30g of polyethylene glycol acrylate, 30g of a urethane acrylate prepolymer (industrial grade, number average molecular weight 1500), 1.5g of vinyl dimethylacrylic acid, 20g of 1-butyl-3-methylimidazolium chloride salt, 2g of lithium chloride and 10g of micron silver powder are stirred in a nitrogen atmosphere at the speed of 200rpm for 4 hours at normal temperature; then adding 0.5g of benzoyl peroxide, stirring at the normal temperature of 200rpm for 0.5h to obtain a thermosetting acrylate adhesive, and packaging in a rubber tube or a rubber cylinder; when in use, the lineation type glue dispensing process can be directly adopted for glue dispensing at normal temperature, and after glue dispensing, the cross-linking and curing are carried out by heating; taking an aluminum sheet as an adherend, and heating and curing at 120 ℃ for 1h to complete adhesion; and applying 30V voltage to the aluminum sheet for 20s, completely stripping the bonding system, and completing the disassembly.
Example 7:
according to parts by weight, 80 parts of E54 epoxy resin (industrial grade), 20 parts of polyethylene glycol diglycidyl ether (number average molecular weight 400), 10 parts of ethylene glycol diglycidyl ether, 1 part of carbon nano tube and 20 parts of 1-butyl-3 methylimidazolium chloride are fully stirred at the speed of 200rpm for 4 hours at the temperature of 60 ℃; then adding 20 parts of a mixed solution of lithium chloride and polyethylene glycol diglycidyl ether (the mixed solution is prepared by 20 parts of lithium chloride and 100 parts of polyethylene glycol diglycidyl ether), and fully stirring at the speed of 200rpm at 60 ℃ for 2 hours; and finally, adding 8 parts of dicyandiamide, fully stirring at the speed of 200rpm for 1h at the temperature of 60 ℃ to obtain the single-component epoxy resin adhesive, cooling to room temperature, and then packaging in a rubber tube or a rubber cylinder. When in use, the scribing type glue dispensing technology can be directly adopted for glue application at normal temperature, the copper sheet is taken as an object to be bonded, and after glue application, the copper sheet is heated for 1 hour at 170 ℃ to be cured to complete bonding; and applying 20V voltage to the two ends of the copper sheet for 15s continuously, and completely stripping the bonding system to finish the disassembly.
While embodiments of the invention have been described above, it is not limited to the applications set forth in the description and the embodiments, which are fully applicable to various fields of endeavor for which the invention may be embodied with additional modifications as would be readily apparent to those skilled in the art, and the invention is therefore not limited to the details given herein and to the examples shown and described without departing from the generic concept as defined by the claims and their equivalents.

Claims (10)

1. A preparation method of a novel adhesive capable of being peeled and disassembled as required is characterized by comprising the following steps: and adding the ionic conductive filler and the electronic conductive filler into the bonding precursor simultaneously, and uniformly mixing by a certain process to obtain the novel adhesive which has ionic conductivity and electronic conductivity and can be peeled and disassembled as required.
2. The method for preparing the novel adhesive capable of being peeled and disassembled as required in claim 1,
the adhesive is a single-component adhesive or a double-component adhesive; the adhesive is any one of liquid, gel and solid;
the certain process is any one of high-speed stirring, rolling and open milling, rolling and banburying and screw extrusion.
3. The method for preparing the novel adhesive capable of being peeled and disassembled as required in claim 1,
the ionic conductive filler accounts for 0.1-50 wt% of the content of the polymer matrix after the bonding precursor is cured; the ion conductive filler is a compound which can dissociate anions and cations in a molten state or a solution state, can perform ion transmission under the action of an electric field and has an ion conductive effect;
the electronic conductive filler accounts for 0.1-90 wt% of the cured polymer matrix of the bonded precursor; the electronic conductive filler is one or more of nano or micron metal particles with electronic conductivity, carbon materials and conductive polymers;
the bonding precursor is a single-component curing system or a two-component curing system, and if the bonding precursor is the two-component curing system, the ionic conductive filler or the electronic conductive filler is added into one of the components or is simultaneously added into the two components;
the bonding precursor is thermoplastic or thermosetting after being cured;
if the bonding precursor is solvent volatile, the solvent is water or volatile organic solvent;
the crystallinity of the polymer obtained after the bonding precursor is solidified is less than 30 percent;
the glass transition temperature of the polymer obtained after the bonding precursor is solidified is less than 50 ℃;
the bonding precursor also comprises one or more of tackifier, anti-aging agent, plasticizer, thickener, accelerator, coupling agent, filler, defoaming agent, colorant, softener, thixotropic agent, flame retardant and heat stabilizer.
4. The method for preparing the novel adhesive capable of being peeled and disassembled as required in claim 3, wherein anions dissociated from the ion conductive filler are one or more of negative anions, inorganic acid radical ions, organic acid radical ions and organic anions generated by deprotonation of organic compounds, which are formed after electrons are obtained from active nonmetal elements; the cation dissociated from the ion conductive filler is one or more of positive hydrogen ion, ammonium ion, positive cation formed by losing electrons of active metal, and organic cation.
5. The method for preparing the novel adhesive capable of being peeled and disassembled as required in claim 4, wherein the anion is F-、Cl-、Br-、I-、S2-、O2-、N3-、OH-、SO4 2-、NO2 -、NO3 -、CO3 2-、HS-、CN-、SCN-、HCO3 -、HPO4 2-、H2PO4 -、PO4 3-、PF6 -、BF4 -、SO3 2-、S2O8 2-、MnO4 -、MnO4 2-、ClO4 -、ClO3 -、ClO-、ClO2 -、IO3 -、BO3 3-、SiO3 3-、AlSiO4 -、WO4 2-、SeO4 2-、CrO4 -、Cr2O7 2-、FeO4 2-、FeO2 2-、VO4 3-、TiO3 2-、(FSO2)N-、(CF3SO2)2N-、AsF6 -、SbF6 -、FeCl4 -、AlCl3 3-、AlCl4 -、Al2Cl7 -、ZnCl2 -、R1COO-、R2SO3 -、Lys-、Cys-、Gly-、[R1R2N]-、[R1R2R3C]-One or more of;
the cation is H+、NH4 +、Li+、Na+、K+、Ag+、Ca2+、Mg2+、Ba2+、Cu2+、Hg2+、Zn2+、Al3+、Fe2+、Fe3+、[R1R2R3R4N]+、[R1R2R3R4P]+、[R1R2IM]+、[R1Py]+、[R1R2R3C]+One or more of (a).
6. The method for preparing the novel adhesive capable of being peeled off and detached as required according to claim 3, wherein the electronic conductive filler is one or more of silver nanoparticles, gold nanoparticles, copper nanoparticles, silver nanowires, gold nanowires, copper nanowires, conductive carbon black, carbon nanotubes, graphene, micron graphite powder, micron silver powder, micron nickel powder, micron copper powder, micron silver-coated copper powder, micron nickel-coated copper powder, doped polyaniline, doped polythiophene and doped polypyrrole.
7. The method for preparing the novel adhesive capable of being peeled and disassembled as required in claim 1, wherein the electronic conductive filler accounts for 0.1-90 wt% of the content of the polymer matrix after the bonding matrix is cured; the electronic conductive filler is a hybrid particle with conductive property, which is prepared by chemically or physically modifying non-conductive particles, wherein the non-conductive particles comprise any one of microcrystalline cellulose, carbon fiber, glass fiber, polymer microsphere, inorganic whisker, inorganic nanotube and layered inorganic matter; the modification method comprises any one of loading, coating and wrapping.
8. The method for preparing the novel adhesive capable of being peeled off and detached as required according to claim 1, wherein the bonding precursor is one or more of natural latex, styrene-butadiene latex, acrylate latex, waterborne polyurethane, natural rubber, styrene-butadiene rubber, butyl rubber, butadiene rubber, nitrile rubber, polysulfide rubber, polyurethane prepolymer, modified epoxy resin prepolymer, modified acrylate prepolymer, modified silicone resin prepolymer, modified melamine resin prepolymer, modified phenolic resin prepolymer, polyelectrolyte solution, aqueous solution of water-soluble polymer, and small molecule solution containing single functionality and multiple functionality.
9. The use method of the novel adhesive according to any one of claims 1 to 8, which is characterized in that the adhesive is applied to a bonded substrate through a sizing process, and after curing, the adhesive plays a role in bonding and fixing, and voltage is applied to two sides of the bonded object to realize the peeling and the detachment as required; the bonded substrate is a metal interface or a conductive surface.
10. The use method of the novel adhesive capable of being peeled off and detached as required in claim 9,
after the adhesive is cured, the room-temperature ionic conductivity of the adhesive is 10-1～10-10S/m；
The curing mode is one or more of moisture curing, UV curing, heating curing and solvent volatilization drying type curing;
the glue applying process is any one of manual glue gun glue dispensing, pneumatic glue dispensing, screw extrusion glue dispensing and jet glue dispensing, the glue dispensing process can be realized by heating, and the heating temperature is less than 140 ℃;
the bonded base material is any one of gold, silver, copper, iron, magnesium, zinc, nickel, beryllium, tungsten, stainless steel, metal alloy and polymer conductive composite material; if the surface of the bonded base material is non-conductive, the surface of the bonded base material needs to be subjected to conductive treatment;
the applied voltage is direct current voltage or alternating current voltage; the applied voltage is 1-1000V, and the electrifying time is 1-300 s; the tensile shear strength of the adhesive bonded and cured on the bonded base material is less than 0.1 MPa.
CN202011467026.9A 2020-12-14 2020-12-14 Preparation and use methods of novel adhesive capable of being peeled and disassembled as required Pending CN112521886A (en)

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