CN112509968A - Silicon wafer holding device for cleaning silicon wafer, liquid cleaning equipment and cleaning system - Google Patents
Silicon wafer holding device for cleaning silicon wafer, liquid cleaning equipment and cleaning system Download PDFInfo
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- CN112509968A CN112509968A CN202011284939.7A CN202011284939A CN112509968A CN 112509968 A CN112509968 A CN 112509968A CN 202011284939 A CN202011284939 A CN 202011284939A CN 112509968 A CN112509968 A CN 112509968A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 122
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 109
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 109
- 239000010703 silicon Substances 0.000 title claims abstract description 109
- 239000007788 liquid Substances 0.000 title claims abstract description 62
- 235000012431 wafers Nutrition 0.000 claims description 145
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 238000005507 spraying Methods 0.000 claims description 6
- 239000000356 contaminant Substances 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 230000001680 brushing effect Effects 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 230000002378 acidificating effect Effects 0.000 claims 1
- 238000007517 polishing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 11
- 239000000243 solution Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The embodiment of the invention discloses a silicon wafer holding device, liquid cleaning equipment and a cleaning system for cleaning a silicon wafer, wherein the silicon wafer holding device comprises: a rotatable chuck for supporting a silicon wafer; and a plurality of first chuck pins and a plurality of second chuck pins arranged along a circumferential direction of the chuck, the plurality of first chuck pins and the plurality of second chuck pins being configured to move between a first position in which the plurality of first chuck pins and the plurality of second chuck pins are in contact with the circumferential edge of the silicon wafer to respectively fix the silicon wafer to the chuck and a second position in which the plurality of first chuck pins and the plurality of second chuck pins are away from the circumferential edge of the silicon wafer to respectively release the silicon wafer from the chuck, wherein the plurality of second chuck pins are movable from the first position to the second position with the plurality of first chuck pins in the first position, and the plurality of first chuck pins are movable from the first position to the second position with the plurality of second chuck pins in the first position.
Description
Technical Field
The invention relates to the technical field of semiconductor production, in particular to a silicon wafer holding device, liquid cleaning equipment and a cleaning system for cleaning a silicon wafer.
Background
Silicon wafers often need to be cleaned during the production process of the silicon wafers. For example, after a silicon wafer is polished, polishing solution remains on the surface of the silicon wafer, which causes contamination and corrosion to the surface of the silicon wafer, and may scratch the surface of the silicon wafer, thereby causing adverse effects on the subsequent processing and use of the silicon wafer.
Referring to FIG. 1, there is shown a conventional apparatus 100A for holding wafers W during the individual piece cleaning of the wafers W. As shown in fig. 1, the apparatus 100A may include: a rotatable chuck 110A for supporting a wafer W; six chuck pins 120A arrayed along a circumferential direction of the chuck 110A, the six chuck pins 120A being configured to move relative to a peripheral edge of the wafer W between a first position in which the six chuck pins 120A are in contact with the peripheral edge of the wafer W to fix the wafer W to the chuck 110A as shown in fig. 1 and a second position in which the six chuck pins 120A are away from the peripheral edge of the wafer W to release the wafer W from the chuck 110A as shown in fig. 1, are shown by solid lines in fig. 1, and the six chuck pins 120A are shown by broken lines in the second position.
In the single wafer cleaning process using the apparatus 100A described above, first, the six chuck pins 120A are in the second position to be able to support the wafer on the chuck 110A. Subsequently, the six chuck pins 120A are moved from the second position to the first position to fix the wafer W to the chuck 110A, whereby the cleaning operation of the wafer can be started. After the cleaning operation is completed, the six chuck pins 120A are moved from the first position to the second position to release the wafer W from the chuck 110A so that the wafer W can be removed from the chuck 110A.
In the process, the positions of the six chuck pins contacting the periphery of the silicon wafer are fixed, and various cleaning liquids for cleaning the silicon wafer are easy to remain at the positions of the silicon wafer contacting the chuck pins and are not easy to remove, so that the cleaning liquid used later may have chemical reaction with the cleaning liquid used earlier which remains at the positions of the silicon wafer contacting, and adverse effects are generated on the cleaning process and the silicon wafer; also, chemicals and particles in the cleaning solution may remain at the positions of the silicon wafer where the silicon wafer contacts the chuck pins after the cleaning operation is completed to remove the silicon wafer from the chuck. On the other hand, in the conventional cleaning method, the residue can be reduced by increasing the cleaning time or the cleaning step, but the work efficiency is reduced.
Disclosure of Invention
In order to solve the above technical problems, embodiments of the present invention desirably provide a silicon wafer holding device, a liquid cleaning apparatus, and a cleaning system for cleaning a silicon wafer, so that no chemicals and particles in a cleaning liquid remain at a position of the silicon wafer, which is in contact with a chuck pin, during a process of cleaning the silicon wafer, thereby obtaining a fully-cleaned silicon wafer, effectively improving the quality of the silicon wafer, and simultaneously effectively reducing the subsequent process pressure, and without increasing the cleaning time or cleaning steps, thereby not causing a reduction in the operation efficiency.
The technical scheme of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a silicon wafer holding apparatus for cleaning a silicon wafer, where the silicon wafer holding apparatus includes:
a rotatable chuck for supporting the silicon wafer;
a plurality of first chuck pins and a plurality of second chuck pins arranged in a circumferential direction of the chuck, the plurality of first chuck pins and the plurality of second chuck pins configured to move relative to a peripheral edge of the silicon wafer between a first position in which the plurality of first chuck pins and the plurality of second chuck pins contact the peripheral edge of the silicon wafer to respectively fix the silicon wafer to the chuck and a second position in which the plurality of first chuck pins and the plurality of second chuck pins are away from the peripheral edge of the silicon wafer to respectively loosen the silicon wafer from the chuck;
wherein the plurality of second chuck pins are movable from the first position to the second position with the plurality of first chuck pins in the first position, and the plurality of first chuck pins are movable from the first position to the second position with the plurality of second chuck pins in the first position.
In a second aspect, an embodiment of the present invention provides a liquid cleaning apparatus for cleaning a silicon wafer, including:
the wafer holding apparatus according to the first aspect;
a cleaning liquid supply means for supplying a cleaning liquid;
a cleaning liquid spraying means for spraying the cleaning liquid supplied from the cleaning liquid supplying means to the silicon wafer held by the silicon wafer holding means.
In a third aspect, an embodiment of the present invention provides a cleaning system for cleaning a silicon wafer, where the cleaning system includes:
the liquid cleaning apparatus according to the second aspect;
a brush cleaning device for brushing off a large amount of contaminants attached to the surface of the silicon wafer by using a brush;
the first mechanical arm is used for conveying the silicon wafer to be cleaned to the brush cleaning equipment;
a second robotic arm for transferring the silicon wafer from the brush cleaning apparatus to the liquid cleaning apparatus.
The embodiment of the invention provides a silicon wafer holding device, liquid cleaning equipment and a cleaning system for cleaning a silicon wafer; the plurality of first chuck pins and the plurality of second chuck pins can be alternately contacted with the periphery of the silicon wafer in the process of cleaning the silicon wafer to fix the silicon wafer to the chuck, and on the other hand, the plurality of first chuck pins and the plurality of second chuck pins are contacted with different positions of the periphery of the silicon wafer, so that the residues of chemicals and particles in a cleaning solution caused by the contact with the chuck pins can be avoided, the silicon wafer which is cleaned completely is obtained, the quality of the silicon wafer is effectively improved, the subsequent process pressure is effectively reduced, the cleaning time is not increased or the cleaning step is not increased, and the reduction of the operation efficiency is avoided.
Drawings
FIG. 1 is a schematic view of a prior art apparatus for holding a wafer during a single wafer cleaning process;
FIG. 2 is a schematic top view of a wafer holding apparatus for cleaning a silicon wafer according to an embodiment of the present invention;
FIG. 3 is a schematic front view of a wafer holding apparatus for cleaning a silicon wafer according to an embodiment of the present invention;
FIG. 4 is a schematic view showing the first and second plurality of chuck pins in a different position than in FIG. 1;
FIG. 5 is a schematic view of a liquid cleaning apparatus for cleaning silicon wafers according to an embodiment of the present invention;
FIG. 6 is a schematic view of a liquid cleaning apparatus for cleaning silicon wafers according to another embodiment of the present invention;
FIG. 7 is a schematic diagram of a cleaning system for cleaning silicon wafers according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to FIGS. 2 and 3, an embodiment of the present invention provides a wafer holding apparatus 100 for cleaning a wafer W, the wafer holding apparatus 100 may include:
a rotatable chuck 110 for supporting the wafer W, as shown in FIG. 3, the chuck 110 being rotatable about a central axis X;
a plurality of first chuck pins 120-1 and a plurality of second chuck pins 120-2 arranged along a circumferential direction of the chuck 110, wherein the plurality of first chuck pins 120-1 are schematically shown by black squares in fig. 2 and 3, and the plurality of second chuck pins 120-2 are schematically shown by white squares, the plurality of first chuck pins 120-1 and the plurality of second chuck pins 120-2 are configured to move between a first position and a second position with respect to a circumferential edge of the silicon wafer W, in the first position, the plurality of first chuck pins 120-1 and the plurality of second chuck pins 120-2 are in contact with the circumferential edge of the silicon wafer W to fix the silicon wafer W to the chuck 110, respectively, wherein the plurality of second chuck pins 120-2 are shown in the first position in fig. 2, in the second position, the plurality of first chuck pins 120-1 and the plurality of second chuck pins 120-2 are spaced apart from the periphery of the wafer W to release the wafer W from the chuck 110, respectively, wherein the plurality of first chuck pins 120-1 are shown in the second position in FIG. 2;
wherein the plurality of second chuck pins 120-2 are movable from the first position to the second position with the plurality of first chuck pins 120-1 in the first position, and the plurality of first chuck pins 120-1 are movable from the first position to the second position with the plurality of second chuck pins 120-2 in the first position.
In this way, the plurality of first chuck pins 120-1 and the plurality of second chuck pins 120-2 may be alternately brought into contact with the periphery of the wafer W to fix the wafer W to the chuck 110 during the process of cleaning the wafer W, and on the other hand, the plurality of first chuck pins 120-1 and the plurality of second chuck pins 120-2 are brought into contact with different positions of the periphery of the wafer W, whereby the residue of chemicals and particles in the cleaning solution due to the contact with the chuck pins can be prevented, thereby obtaining a fully cleaned wafer, effectively improving the quality of the wafer, and simultaneously effectively reducing the subsequent process pressure, and without increasing the cleaning time or cleaning steps, thereby not causing a reduction in the work efficiency.
Specifically, for example, when it is necessary to remove the residue caused by the contact of the plurality of first chuck pins 120-1 with the peripheral edge of the wafer W, as shown in fig. 1, the plurality of second chuck pins 120-2 may be brought into the first position to fix the wafer W to the chuck 110, and the plurality of first chuck pins 120-1 may be moved from the first position to the second position, thereby causing the plurality of first chuck pins 120-1 to no longer contact the peripheral edge of the wafer W, so that the residue caused by the contact of the plurality of first chuck pins 120-1 with the peripheral edge of the wafer W can be removed. Also, for example, when it is necessary to remove the residue caused by the contact of the plurality of second chuck pins 120-2 with the peripheral edge of the wafer W, as shown in fig. 4, the plurality of first chuck pins 120-1 may be brought into a first position to fix the wafer W to the chuck 110, and the plurality of second chuck pins 120-2 may be moved from the first position to a second position, thereby causing the plurality of second chuck pins 120-2 to no longer contact the peripheral edge of the wafer W, so that the residue caused by the contact of the plurality of second chuck pins 120-2 with the peripheral edge of the wafer W can be removed.
Although not shown in the drawings, it is to be understood that the apparatus 100 according to the present invention is configured such that the plurality of second chuck pins 120-2 can be moved from the first position to the second position with the plurality of first chuck pins 120-1 in the second position, so that the plurality of first chuck pins 120-1 and the plurality of second chuck pins 120-2 release the silicon wafer W from the chuck 110 to remove the silicon wafer W from the wafer holding apparatus.
The number of the plurality of first chuck pins 120-1 and the number of the plurality of second chuck pins 120-2 are not limited as long as the silicon wafer W can be stably fixed to the chuck 110, respectively. However, in a preferred embodiment of the present invention, the number of the plurality of first chuck pins 120-1 is equal to the number of the plurality of second chuck pins 120-2. Thus, it is possible to obtain the same stable fixing effect when the silicon wafer W is fixed by the plurality of first chuck pins 120-1 and the silicon wafer W is fixed by the plurality of second chuck pins 120-2, respectively.
In a preferred embodiment of the present invention, referring to fig. 2, the plurality of first chuck pins 120-1 are uniformly distributed along the circumferential direction of the chuck 110, and the plurality of second chuck pins 120-2 are uniformly distributed along the circumferential direction of the chuck 110. Such an arrangement enables a more stable fixing effect to be obtained when the silicon wafer W is fixed by the plurality of first chuck pins 120-1 and the silicon wafer W is fixed by the plurality of second chuck pins 120-2, respectively. In the case where the number of the first chuck pins 120-1 is six as shown in fig. 2, an included angle of two adjacent first chuck pins 120-1 in the circumferential direction is 60 degrees; in the case where the number of the second chuck pins 120-2 is six as shown in fig. 2, the angle of two adjacent second chuck pins 120-2 in the circumferential direction is 60 degrees.
In a preferred embodiment of the present invention, referring to fig. 2, the plurality of first chuck pins 120-1 and the plurality of second chuck pins 120-2 are uniformly distributed together along the circumferential direction of the chuck 110. This can prevent interference between the first chuck pin 120-1 and the second chuck pin 120-2 to the maximum possible extent. In the case where the number of the first chuck pins 120-1 is six and the number of the second chuck pins 120-2 is six as shown in fig. 2, an included angle of two adjacent first chuck pins 120-1 and second chuck pins 120-2 in the circumferential direction is 30 degrees.
The silicon wafer W is stably fixed to the chuck 110 using six chuck pins in general, and thus, in a preferred embodiment of the present invention, referring to fig. 2, the number of the plurality of first chuck pins 120-1 is six, and the number of the plurality of second chuck pins 120-2 is also six.
Referring to fig. 5, an embodiment of the present invention also provides a liquid cleaning apparatus 10 for cleaning a silicon wafer W, where the liquid cleaning apparatus 10 may include:
a silicon wafer holding apparatus 100 according to an embodiment of the present invention;
a cleaning liquid supply means 200 for supplying a cleaning liquid;
a cleaning liquid spraying means 300 for spraying the cleaning liquid supplied from the cleaning liquid supplying means 200 onto the wafers W held by the wafer holding means 100.
Referring to FIG. 6, in a preferred embodiment of the present invention, the cleaning liquid spray device 300 includes a first cleaning liquid nozzle 310 and a second cleaning liquid nozzle 320, the first cleaning liquid nozzle 310 being disposed at a position opposite to a first circular main surface of the silicon wafer W to spray a cleaning liquid onto the first circular main surface of the silicon wafer W, and the second cleaning liquid nozzle 320 being disposed at a position opposite to a second circular main surface of the silicon wafer W to spray a cleaning liquid onto the second circular main surface of the silicon wafer W.
In a preferred embodiment of the present invention, the cleaning liquid comprises a strong oxidizing liquid such as ozone water, a cleaning liquid such as SC-2 type (H)2O2And HCl) acidic solution, such as SC-1 type cleaning solution (NH)4OH and H2O2Solution of (d) alkaline liquid, such as a rinse solution of deionized water.
Referring to fig. 7, an embodiment of the present invention further provides a cleaning system 1 for cleaning a silicon wafer, where the cleaning system 1 may include:
the liquid cleaning apparatus 10 provided by the embodiment of the present invention;
a brush cleaning device 20, wherein the brush cleaning device 20 is used for brushing off a large amount of pollutants attached to the surface of the silicon wafer by using a brush;
a first robot 30, wherein the first robot 30 is used for conveying the silicon wafer to be cleaned to the brush cleaning device 20;
a second robot arm 40, wherein the second robot arm 40 is used for transferring the silicon wafer from the brush cleaning apparatus 20 to the liquid cleaning apparatus 10.
In a preferred embodiment of the present invention, the silicon wafer to be cleaned is a silicon wafer subjected to polishing treatment, and the contaminant is a polishing liquid.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A wafer holding apparatus for cleaning a wafer, comprising:
a rotatable chuck for supporting the silicon wafer;
a plurality of first chuck pins and a plurality of second chuck pins arranged in a circumferential direction of the chuck, the plurality of first chuck pins and the plurality of second chuck pins configured to move relative to a peripheral edge of the silicon wafer between a first position in which the plurality of first chuck pins and the plurality of second chuck pins contact the peripheral edge of the silicon wafer to respectively fix the silicon wafer to the chuck and a second position in which the plurality of first chuck pins and the plurality of second chuck pins are away from the peripheral edge of the silicon wafer to respectively loosen the silicon wafer from the chuck;
wherein the plurality of second chuck pins are movable from the first position to the second position with the plurality of first chuck pins in the first position, and the plurality of first chuck pins are movable from the first position to the second position with the plurality of second chuck pins in the first position.
2. The silicon wafer holding device according to claim 1, wherein the number of the plurality of first chuck pins is equal to the number of the plurality of second chuck pins.
3. The wafer holding apparatus according to claim 2, wherein the plurality of first chuck pins are uniformly distributed along a circumferential direction of the chuck, and the plurality of second chuck pins are uniformly distributed along the circumferential direction of the chuck.
4. The wafer holding apparatus according to claim 3, wherein the plurality of first chuck pins and the plurality of second chuck pins are uniformly distributed together along a circumferential direction of the chuck.
5. The silicon wafer holding apparatus according to claim 4, wherein the number of the plurality of first chuck pins is six, and the number of the plurality of second chuck pins is also six.
6. A liquid cleaning apparatus for cleaning a silicon wafer, characterized by comprising:
the silicon wafer holding device according to any one of claims 1 to 5;
a cleaning liquid supply means for supplying a cleaning liquid;
a cleaning liquid spraying means for spraying the cleaning liquid supplied from the cleaning liquid supplying means to the silicon wafer held by the silicon wafer holding means.
7. The liquid cleaning apparatus according to claim 6, wherein the cleaning liquid ejecting device includes a first cleaning liquid nozzle provided at a position opposite to a first circular main surface of the silicon wafer to eject the cleaning liquid to the first circular main surface of the silicon wafer, and a second cleaning liquid nozzle provided at a position opposite to a second circular main surface of the silicon wafer to eject the cleaning liquid to the second circular main surface of the silicon wafer.
8. The liquid cleaning apparatus according to claim 6 or 7, wherein the cleaning liquid includes a strong oxidizing liquid, an acidic liquid, an alkaline liquid, and a rinsing liquid.
9. A cleaning system for cleaning silicon wafers, the cleaning system comprising:
liquid cleaning apparatus according to any one of claims 6 to 8;
a brush cleaning device for brushing off a large amount of contaminants attached to the surface of the silicon wafer by using a brush;
the first mechanical arm is used for conveying the silicon wafer to be cleaned to the brush cleaning equipment;
a second robotic arm for transferring the silicon wafer from the brush cleaning apparatus to the liquid cleaning apparatus.
10. The cleaning system of claim 9, wherein the silicon wafer to be cleaned is a silicon wafer subjected to a polishing process, and the contaminant is a polishing liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011284939.7A CN112509968A (en) | 2020-11-17 | 2020-11-17 | Silicon wafer holding device for cleaning silicon wafer, liquid cleaning equipment and cleaning system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011284939.7A CN112509968A (en) | 2020-11-17 | 2020-11-17 | Silicon wafer holding device for cleaning silicon wafer, liquid cleaning equipment and cleaning system |
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| CN112509968A true CN112509968A (en) | 2021-03-16 |
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| CN202011284939.7A Pending CN112509968A (en) | 2020-11-17 | 2020-11-17 | Silicon wafer holding device for cleaning silicon wafer, liquid cleaning equipment and cleaning system |
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