CN112496073A - Method for producing copper-aluminum-copper composite board by powder solid deposition-rolling-heat treatment - Google Patents
Method for producing copper-aluminum-copper composite board by powder solid deposition-rolling-heat treatment Download PDFInfo
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- CN112496073A CN112496073A CN201910871353.1A CN201910871353A CN112496073A CN 112496073 A CN112496073 A CN 112496073A CN 201910871353 A CN201910871353 A CN 201910871353A CN 112496073 A CN112496073 A CN 112496073A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
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Abstract
The invention belongs to the field of composite plate strip manufacturing, and particularly relates to a method for manufacturing a copper-aluminum-copper composite plate through metal powder solid deposition, rolling and heat treatment. Preparing a copper or copper alloy deposition layer on the upper surface and the lower surface of an aluminum or aluminum alloy substrate respectively by using a powder solid deposition process, and performing heat preservation annealing, rolling and post-heat treatment to obtain the copper (or copper alloy)/aluminum (or aluminum alloy)/copper (or copper alloy) composite plate. The tensile strength of the whole copper (or copper alloy)/aluminum (or aluminum alloy)/copper (or copper alloy) composite plate prepared by the method reaches 200MPa, the elongation reaches 26%, the shearing strength of the copper or copper alloy/aluminum or aluminum alloy interface reaches 95MPa, and the electric conductivity reaches 95% IACS. The invention can improve the manufacturing efficiency of the copper-aluminum-copper composite plate strip and manufacture the copper-aluminum-copper composite plate with any thickness and good mechanical property and electric conductivity.
Description
The technical field is as follows:
the invention belongs to the field of composite board production, particularly relates to the field of copper-aluminum-copper composite board production, and particularly relates to a method for producing a copper-aluminum-copper composite board through powder solid deposition-rolling-heat treatment.
Background art:
the copper-aluminum-copper composite board has the advantages of copper alloy and aluminum alloy, has excellent heat conduction, electric conduction, machinability and corrosion resistance, is low in price, can save copper resources, reduces the weight of materials, and is widely applied to the fields of power contacts, conductive bars, architectural decorations, heat dissipation devices and the like. At present, the technologies adopted for producing the copper-aluminum-copper composite board are direct rolling, high-temperature rolling, bonding by a transition layer and the like, and the composite board produced by the technologies has low bonding strength and limited production size.
Disclosure of Invention
The invention aims to provide a method for producing a copper-aluminum-copper composite plate by powder solid deposition-rolling-heat treatment, which can improve the manufacturing efficiency of the copper-aluminum-copper composite plate strip and manufacture the copper-aluminum-copper composite plate with any thickness and good mechanical property and electrical conductivity.
The technical scheme of the invention is as follows:
a method for producing a copper-aluminum-copper composite plate by powder solid deposition-rolling-heat treatment comprises the following steps:
(1) pretreating the surface of an aluminum or aluminum alloy substrate, removing oil and rust and removing an oxide film;
(2) preheating copper or copper alloy powder in a muffle furnace;
(3) depositing the preheated copper or copper alloy powder in the step (2) on the surface of the aluminum or aluminum alloy substrate by adopting a cold spraying powder solid deposition technology to form a deposition layer;
(4) placing the plate obtained in the step (3) in a heating furnace for stress relief annealing;
(5) rolling the plate obtained in the step (4);
(6) and (5) carrying out heat treatment on the copper-aluminum-copper composite board obtained in the step (5).
In the method for producing the copper-aluminum-copper composite plate by powder solid deposition-rolling-heat treatment, the substrate material in the step (1) is commercial pure aluminum or 1 series, 2 series, 3 series, 4 series, 5 series, 6 series and 7 series aluminum alloy.
The method for producing the copper-aluminum-copper composite board through powder solid deposition-rolling-heat treatment comprises the following steps of (2) adopting commercial pure copper or bronze, brass and cupronickel as copper or copper alloy powder, preheating at the temperature of 150-650 ℃, and preserving heat for 30-120 min.
The method for producing the copper-aluminum-copper composite board by powder solid deposition-rolling-heat treatment comprises the following steps of (3): the accelerating gas is compressed air, nitrogen or helium, the gas pressure is 1.0-5.0 MPa, the gas heating temperature is 150-650 ℃, the powder feeding speed is 5-100 g/min, the distance between the spray gun and the workpiece is 5-35 mm, and the thickness of the deposition layer is 0.1-50 mm.
The method for producing the copper-aluminum-copper composite board through powder solid deposition-rolling-heat treatment comprises the step (4), wherein the heat preservation temperature of stress relief annealing is 150-650 ℃, and the heat preservation time is 30-120 min.
The method for producing the copper-aluminum-copper composite plate through powder solid deposition-rolling-heat treatment comprises the step (5) that the heating temperature for rolling the plate is room temperature-650 ℃, and the rolling reduction rate is 20-90%.
The method for producing the copper-aluminum-copper composite plate by powder solid deposition-rolling-heat treatment comprises the following heat treatment in the step (6): preserving the heat for 30-120 min at 250-550 ℃, and cooling along with the furnace.
The design idea of the invention is as follows:
the method comprises the steps of cleaning the surface of an aluminum (alloy) substrate, preheating copper (alloy) powder, and spraying the copper (alloy) powder on the surface of the aluminum (alloy) substrate by adopting a powder solid deposition technology to form a deposition layer. And (3) keeping the temperature of the obtained substrate with the deposition layer for a period of time, heating to high temperature, rolling, and then carrying out heat treatment on the obtained composite plate. The copper-aluminum-copper composite board with excellent performance is obtained.
The invention has the advantages and beneficial effects that:
1. the invention can produce copper-aluminum-copper composite boards/belts with different components by changing metal powder.
2. The invention can rapidly produce the deposition layer with any thickness by the powder solid deposition technology, thereby obtaining the copper-aluminum-copper composite plates/belts with different thicknesses.
3. The invention realizes the pre-combination of two metal components by a powder solid deposition technology, and avoids the problems of oxidation and cracking caused by a heating process.
4. The invention has simple process and low cost, and can produce large-size copper-aluminum-copper composite boards/belts.
5. The invention can prepare copper-aluminum-copper composite boards/belts with very thin copper layers, and saves copper resources.
Drawings
Fig. 1 is a schematic process flow diagram of a powder solid deposition-rolling-heat treatment copper-aluminum-copper composite plate. In the figure, the surface of an aluminum alloy plate is cleaned, copper powder is deposited, annealing treatment is performed, IV rolling is performed to form a copper-aluminum-copper composite plate, and V heat treatment is performed.
Detailed Description
In the specific implementation process, as shown in fig. 1, the method for producing the copper-aluminum-copper composite plate through powder solid deposition-rolling-heat treatment of the invention utilizes the powder solid deposition process to prepare a copper or copper alloy deposition layer on each of the upper and lower surfaces of an aluminum or aluminum alloy substrate, and obtains the copper (or copper alloy)/aluminum (or aluminum alloy)/copper (or copper alloy) composite plate through heat preservation annealing, rolling and post-heat treatment. The tensile strength of the whole copper (or copper alloy)/aluminum (or aluminum alloy)/copper (or copper alloy) composite plate prepared by the method reaches 200MPa, the elongation reaches 26%, the shearing strength of the copper or copper alloy/aluminum or aluminum alloy interface reaches 95MPa, and the electric conductivity reaches 95% IACS.
The following examples are given for the detailed description of the embodiments of the present invention, and the detailed implementation and specific operation procedures are given on the premise of the technical scheme of the present invention, but the scope of the present invention is not limited to the following examples.
Example 1: production of pure copper aluminum copper conductive composite board
In the embodiment, the pure aluminum substrate is subjected to acid cleaning and rust removal, then is washed and dried by acetone and alcohol, and finally is subjected to sand blasting. Commercial pure copper powder was heated to 200 ℃ in a muffle furnace and held for 60 min. And spraying heated pure copper powder (the granularity is 20-50 mu m) on the surfaces of two sides of a pure aluminum substrate by using a powder solid deposition technology, selecting compressed air as accelerating gas, wherein the gas pressure is 2.0MPa, the heating temperature is 200 ℃, the powder feeding speed is 50 g/min, the distance between a spray gun and the substrate is 20mm, and the thickness of pure copper deposition layers on two sides of an aluminum plate is 300 mu m. And (3) placing the plate with the pure copper deposition layer in a heating furnace, heating to 400 ℃, and preserving heat for 120 min. Heating the copper-aluminum-copper composite plate subjected to stress relief annealing to 200 ℃, and then rolling, wherein the rolling reduction rate is 40%. And heating the rolled copper-aluminum-copper composite plate to 350 ℃, preserving the heat for 30min, and cooling along with the furnace to obtain the copper-aluminum-copper composite plate for electric conduction.
In the embodiment, the tensile strength of the whole copper-aluminum-copper composite plate reaches 200MPa, the elongation reaches 26%, the shearing strength of a copper/aluminum interface reaches 95MPa, and the electric conductivity reaches 95% IACS.
Example 2: production of brass/6061 aluminum alloy/brass composite board
In this embodiment, a 6061 aluminum alloy substrate is subjected to acid washing and rust removal, then washed and dried with acetone and alcohol, and finally subjected to sand blasting. And (3) placing brass H62 powder (the granularity is 20-50 mu m) in a muffle furnace, heating to 200 ℃, and preserving heat for 60 min. By utilizing a powder solid deposition technology, the heated brass H62 powder is sprayed on the two side surfaces of an aluminum alloy substrate, compressed air is selected as accelerating gas, the gas pressure is 2.0MPa, the heating temperature is 200 ℃, the powder feeding speed is 20g/min, the distance between a spray gun and the substrate is 30mm, and the thickness of a deposition layer for producing brass H62 is 100 mu m. The plate with the brass H62 deposition layer is placed in a heating furnace to be heated to 400 ℃ and kept for 120 min. And heating the composite plate subjected to stress relief annealing to 200 ℃, and then rolling the composite plate, wherein the rolling reduction rate is 30%. And heating the rolled composite plate to 450 ℃, preserving heat for 30min, and cooling along with the furnace to obtain the brass H62/6061 aluminum alloy/brass H62 composite plate.
In the embodiment, the tensile strength of the whole brass H62/6061 aluminum alloy/brass H62 composite plate reaches 230 MPa, the elongation reaches 18%, the shearing strength of the copper H62/6061 aluminum alloy interface reaches 90MPa, and the electric conductivity reaches 80% IACS.
Example 3:
in this embodiment, the 2011 aluminum alloy substrate is subjected to acid cleaning and rust removal, then washed and dried by acetone and alcohol, and finally subjected to sand blasting. Putting the aluminum bronze QAL7 powder (the granularity is 20-50 mu m) into a muffle furnace, heating to 500 ℃, and preserving heat for 30 min. By utilizing a powder solid deposition technology, the heated aluminum bronze QAL7 powder is sprayed on the two side surfaces of the aluminum alloy substrate, and the volume ratio is selected from 1: 1, the compressed air and the nitrogen are used as accelerating gases, the gas pressure is 3.0MPa, the heating temperature is 300 ℃, the powder feeding speed is 80g/min, the distance between a spray gun and a substrate is 10mm, and the thickness of a QAL7 deposition layer for producing the aluminum bronze is 500 mu m. The plate with the aluminum bronze QAL7 deposition layer is placed in a heating furnace to be heated to 600 ℃ and kept for 60 min. And heating the composite plate subjected to stress relief annealing to 300 ℃, and then rolling, wherein the rolling reduction rate is 50%. And heating the rolled composite plate to 300 ℃, preserving heat for 120min, and cooling along with the furnace to obtain the aluminum bronze QAL7/2011 aluminum alloy/aluminum bronze QAL7 composite plate.
In the embodiment, the tensile strength of the whole aluminum bronze QAL7/2011 aluminum alloy/aluminum bronze QAL7 composite plate reaches 245MPa, the elongation reaches 26%, the shearing strength of the aluminum bronze QAL7/2011 aluminum alloy interface reaches 102 MPa, and the electric conductivity reaches 85% IACS.
The embodiment result shows that the aluminum/copper interface of the copper-aluminum-copper composite board produced by the method is straight and has high bonding strength. The method has simple operation, easy control and strong adaptability, can produce the copper-aluminum-copper composite board with large size and various components, and has no report at home and abroad.
Claims (7)
1. A method for producing a copper-aluminum-copper composite plate by powder solid deposition-rolling-heat treatment is characterized by comprising the following steps:
(1) pretreating the surface of an aluminum or aluminum alloy substrate, removing oil and rust and removing an oxide film;
(2) preheating copper or copper alloy powder in a muffle furnace;
(3) depositing the preheated copper or copper alloy powder in the step (2) on the surface of the aluminum or aluminum alloy substrate by adopting a cold spraying powder solid deposition technology to form a deposition layer;
(4) placing the plate obtained in the step (3) in a heating furnace for stress relief annealing;
(5) rolling the plate obtained in the step (4);
(6) and (5) carrying out heat treatment on the copper-aluminum-copper composite board obtained in the step (5).
2. The method for producing a copper-aluminum-copper composite plate according to claim 1, wherein the substrate in the step (1) is commercially pure aluminum or 1 series, 2 series, 3 series, 4 series, 5 series, 6 series, 7 series aluminum alloy.
3. The method for producing the copper-aluminum-copper composite plate by the powder solid deposition-rolling-heat treatment according to claim 1, wherein the copper or copper alloy powder adopted in the step (2) is commercial pure copper or bronze, brass or cupronickel, the preheating temperature is 150-650 ℃, and the temperature is kept for 30-120 min.
4. The method for producing a copper-aluminum-copper composite panel by powder solid state deposition-rolling-heat treatment according to claim 1, wherein the powder solid state deposition conditions in the step (3) are as follows: the accelerating gas is compressed air, nitrogen or helium, the gas pressure is 1.0-5.0 MPa, the gas heating temperature is 150-650 ℃, the powder feeding speed is 5-100 g/min, the distance between the spray gun and the workpiece is 5-35 mm, and the thickness of the deposition layer is 0.1-50 mm.
5. The method for producing the copper-aluminum-copper composite plate by powder solid deposition-rolling-heat treatment according to claim 1, wherein the stress relief annealing in the step (4) is carried out at a holding temperature of 150-650 ℃ for 30-120 min.
6. The method for producing copper-aluminum-copper composite plates by powder solid deposition-rolling-heat treatment according to claim 1, wherein the heating temperature for rolling the plate in the step (5) is between room temperature and 650 ℃, and the rolling reduction rate is 20 to 90%.
7. The method for producing a copper-aluminum-copper composite plate by powder solid state deposition-rolling-heat treatment according to claim 1, wherein the heat treatment in the step (6) is: preserving the heat for 30-120 min at 250-550 ℃, and cooling along with the furnace.
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Citations (6)
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| JPH01312005A (en) * | 1988-06-11 | 1989-12-15 | Nkk Corp | Apparatus for producing metallic sheet |
| CN102568698A (en) * | 2011-12-22 | 2012-07-11 | 沈阳工业大学 | Heat treatment method of copper-aluminum-copper cold rolling composite plate for conducting |
| CN105018923A (en) * | 2014-04-29 | 2015-11-04 | 宝山钢铁股份有限公司 | Method for preparing titanium-coated low-carbon steel composite plate |
| CN105018879A (en) * | 2014-04-29 | 2015-11-04 | 宝山钢铁股份有限公司 | Method for preparing titanium-coated stainless steel composite plate |
| CN108796314A (en) * | 2018-07-16 | 2018-11-13 | 中南大学 | A kind of preparation method of alusil alloy used for electronic packaging |
| CN109435371A (en) * | 2018-10-10 | 2019-03-08 | 北京科技大学 | A kind of high-strength Cu-Al-Cu Cladding Plate and preparation process |
-
2019
- 2019-09-16 CN CN201910871353.1A patent/CN112496073A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01312005A (en) * | 1988-06-11 | 1989-12-15 | Nkk Corp | Apparatus for producing metallic sheet |
| CN102568698A (en) * | 2011-12-22 | 2012-07-11 | 沈阳工业大学 | Heat treatment method of copper-aluminum-copper cold rolling composite plate for conducting |
| CN105018923A (en) * | 2014-04-29 | 2015-11-04 | 宝山钢铁股份有限公司 | Method for preparing titanium-coated low-carbon steel composite plate |
| CN105018879A (en) * | 2014-04-29 | 2015-11-04 | 宝山钢铁股份有限公司 | Method for preparing titanium-coated stainless steel composite plate |
| CN108796314A (en) * | 2018-07-16 | 2018-11-13 | 中南大学 | A kind of preparation method of alusil alloy used for electronic packaging |
| CN109435371A (en) * | 2018-10-10 | 2019-03-08 | 北京科技大学 | A kind of high-strength Cu-Al-Cu Cladding Plate and preparation process |
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