CN112492867A - Wave-absorbing honeycomb with pyramid-like structure and preparation method thereof - Google Patents
Wave-absorbing honeycomb with pyramid-like structure and preparation method thereof Download PDFInfo
- Publication number
- CN112492867A CN112492867A CN202011400714.3A CN202011400714A CN112492867A CN 112492867 A CN112492867 A CN 112492867A CN 202011400714 A CN202011400714 A CN 202011400714A CN 112492867 A CN112492867 A CN 112492867A
- Authority
- CN
- China
- Prior art keywords
- wave
- absorbing
- absorbing honeycomb
- honeycomb
- pyramid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 230000002745 absorbent Effects 0.000 claims description 43
- 239000002250 absorbent Substances 0.000 claims description 43
- 239000002002 slurry Substances 0.000 claims description 40
- 239000000853 adhesive Substances 0.000 claims description 29
- 230000001070 adhesive effect Effects 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 24
- 238000001035 drying Methods 0.000 claims description 14
- 238000005470 impregnation Methods 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000011049 filling Methods 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000011358 absorbing material Substances 0.000 abstract description 3
- 241000264877 Hippospongia communis Species 0.000 description 180
- 239000010410 layer Substances 0.000 description 45
- 239000000463 material Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000007598 dipping method Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000002344 surface layer Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fluid Mechanics (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a wave-absorbing honeycomb with pyramid-like structures and a preparation method thereof, belonging to the technical field of microwave absorbing materials. The wave-absorbing honeycomb has excellent wave-absorbing performance and certain structural bearing capacity. The preparation method is stable and easy to control, and the wave-absorbing honeycomb with excellent wave-absorbing performance can be prepared.
Description
Technical Field
The invention relates to a wave-absorbing honeycomb with a pyramid-like structure and a preparation method thereof, belonging to the technical field of microwave absorbing materials.
Background
The wave-absorbing honeycomb is mainly characterized in that a layer of absorbent is deposited in the wall of a honeycomb hole by impregnating the absorbent, so that the wave-absorbing characteristic is obtained. The honeycomb is processed into a sheet or pyramid shape and then is impregnated with an absorbent so as to meet the application requirements of different fields. The wave-absorbing honeycomb pyramid has excellent wave-absorbing performance and is widely applied to a microwave darkroom or a dark box. The wave-absorbing honeycomb pyramid obtained by a single impregnation method has the advantages that the absorbent is easy to form concentration gradient in the thickness direction of the honeycomb, the stability control of wave-absorbing performance is not facilitated, and the electrical performance can be designed with less variables. The honeycomb pyramid is difficult for processing, and the honeycomb of pyramid form also can not be used for the structure to bear, has restricted the range of application and the field of traditional honeycomb pyramid. For example, utility model CN206344528U discloses a pyramid honeycomb structure absorbing material specifically discloses that the pyramid is inside and outside composite bed structure, and the inlayer is honeycomb base member layer, and honeycomb base member layer is the cellular shape that continuous hexagon formed, has fire-retardant absorbent layer on the honeycomb wall, and the skin of pyramid is polyester panel layer, and the base comprises honeycomb base member layer and its apparent skin layer. The wave-absorbing honeycomb sheet material is prepared by dipping, but has the defects that four wave-absorbing honeycomb sheet materials are bonded to form a single pyramid, the wave-absorbing pyramid in the final stroke is an array formed by the pyramids, and the wave-absorbing honeycomb pyramid cannot be used as a structural bearing member.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a wave-absorbing honeycomb with a pyramid-like structure and excellent wave-absorbing performance and structural bearing performance and a preparation method which is easy to control.
In order to achieve the purpose, the technical scheme of the invention is as follows:
the wave-absorbing honeycomb with the pyramid-like structures comprises a plurality of pyramid-like wave-absorbing structures arranged in an array, wherein each pyramid-like wave-absorbing structure is formed by stacking and bonding a plurality of wave-absorbing honeycomb sheets with different sizes and electromagnetic characteristics from large to small in sequence from bottom to top, a non-wave-absorbing honeycomb sheet is filled in the middle area of each pyramid-like wave-absorbing structure, and the pyramid-like wave-absorbing structures and the non-wave-absorbing honeycomb sheet jointly form a flat overall appearance.
Furthermore, the thickness of the wave-absorbing honeycomb sheet is 5-20 mm, and the length and width (also called as the cell size) is not less than 3.2 mm.
A preparation method of a wave-absorbing honeycomb with a pyramid-like structure comprises the following steps:
1) impregnating a plurality of non-wave-absorbing honeycomb sheets with absorbent slurry, vibrating to remove redundant slurry, drying, and repeating for a plurality of times to obtain wave-absorbing honeycomb sheets with different electromagnetic properties;
2) cutting the wave-absorbing honeycomb sheet and the non-wave-absorbing honeycomb sheet into certain sizes and shapes;
3) layering and stacking wave-absorbing honeycomb sheets and non-wave-absorbing honeycomb sheets, stacking the wave-absorbing honeycomb sheets from large to small in sequence from bottom to top to form a pyramid-like wave-absorbing structure, filling the non-wave-absorbing honeycomb sheets between the wave-absorbing honeycomb sheets on the same layer, and bonding the wave-absorbing honeycomb sheets between the upper surface and the lower surface of each wave-absorbing honeycomb sheet, the non-wave-absorbing honeycomb sheets between the upper surface and the lower surface of each wave-absorbing honeycomb sheet and the side surfaces of the wave-absorbing honeycomb sheets and the non-wave-absorbing honeycomb sheets by using adhesives;
4) pressurizing and heating up the product obtained in the step 3) for curing to obtain the final wave-absorbing honeycomb with the pyramid-like structure.
Further, the absorbent slurry is composed of a powdery absorbent, an adhesive system and a solvent, wherein the weight ratio of the powdery absorbent to the adhesive system is 1: 1-1: 5.
Further, the powdery absorbent comprises one or more of conductive carbon black, graphene, carbonyl iron powder and oxidized metal powder; the adhesive is acrylic acid or polyurethane modified epoxy resin; the solvent is plasma water.
Further, the viscosity value of the absorbent slurry is 10-20 s.
Further, the thickness of the wave-absorbing honeycomb sheet in the step 1) is 5-20 mm, and the length and width (also called as the cell size) is not less than 3.2 mm.
Further, the step 1) is repeated for not less than 3 times.
Furthermore, the same impregnation process or different impregnation processes are adopted for all the wave-absorbing honeycomb sheets.
Further, the cutting size of the wave-absorbing honeycomb sheet in the step 2) is 5mm multiplied by 5mm to 100mm multiplied by 100 mm.
Furthermore, the adhesive is thermosetting resin.
Further, the drying temperature is 80-120 ℃, and the drying time is 1-2 hours.
Further, when stacking is carried out in the step 3), firstly, bonding the wave-absorbing honeycomb sheet and the non-wave-absorbing honeycomb sheet of each layer together, wherein the method comprises the steps of coating an adhesive on the side surface of the wave-absorbing honeycomb sheet, and embedding the wave-absorbing honeycomb sheet into the corresponding position of the non-wave-absorbing honeycomb sheet to realize bonding to obtain an integral layer; and then, uniformly coating the adhesive on the upper surface and the lower surface of each layer of wave-absorbing honeycomb sheets, and stacking and bonding the wave-absorbing honeycomb sheets together according to a preset stacking sequence.
Further, the pressurization in the step 4) is mold pressing or vacuum bag pressing, the curing temperature is between room temperature and 130 ℃, and the time is 2-24 hours.
The invention provides a wave-absorbing honeycomb with a pyramid-like structure and a preparation method thereof by combining the characteristics of a wave-absorbing honeycomb sheet and a honeycomb pyramid structure. The non-wave-absorbing honeycomb sheet is taken as a base material, and different impregnation processes are adopted to obtain the wave-absorbing honeycomb sheet with the serialized electromagnetic properties; according to the electrical property design, the honeycomb sheets with different parameters are stacked to form a pyramid-like wave-absorbing structure array. According to the invention, the wave-absorbing honeycomb sheets with different sizes are stacked and bonded, and the honeycomb sheets with the sizes from bottom to top are gradually reduced to form a pyramid-like wave-absorbing structure, so that the wave-absorbing honeycomb structure has excellent wave-absorbing performance and strong electrical property designability, and can meet the requirements of different application conditions. Meanwhile, non-wave-absorbing honeycomb sheets can be filled in the area between the similar pyramids and are solidified with the wave-absorbing honeycomb to form a multi-layer wave-absorbing honeycomb, and the wave-absorbing honeycomb has a flat physical appearance and a similar pyramid electrical structure and can have wave-absorbing performance and structure bearing capacity.
Compared with the prior art, the invention has the beneficial effects that:
(1) the process is easy to control, the wave-absorbing honeycomb with the pyramid-like structure has high wave-absorbing performance, the pyramid-like structure is formed by stacking honeycomb sheets with different sizes, and the defect that the pyramid of the existing wave-absorbing honeycomb is difficult to process is overcome.
(2) The wave-absorbing honeycomb sheet material with the pyramid-like wave-absorbing structure has strong electrical property designability, can regulate and control the dipping process, designs the wave-absorbing honeycomb sheet materials with different sizes and electromagnetic characteristics, obtains the wave-absorbing honeycomb with the pyramid-like wave-absorbing structure with different wave-absorbing properties, and meets different application requirements.
(3) According to the invention, the wave-absorbing honeycomb with stable performance can be obtained by orthogonally stacking the honeycomb sheets, so that the difference of wave-absorbing performance in two directions of the honeycomb is reduced.
Drawings
FIG. 1 is a schematic view of a pyramid-like wave-absorbing structure of the wave-absorbing honeycomb with a pyramid-like structure according to the present invention;
FIG. 2 is a schematic view of the whole structure of the wave-absorbing honeycomb with pyramid-like structure according to the present invention;
FIG. 3 is a flow chart of the preparation of the wave-absorbing honeycomb with the pyramid-like structure of the invention;
FIG. 4 is a reflectance test curve of example 1 of the present invention;
FIG. 5 is a reflectance test curve of example 2 of the present invention;
FIG. 6 is a reflectance test curve of example 3 of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, the present invention shall be described in further detail with reference to the following detailed description and accompanying drawings.
The invention provides a wave-absorbing honeycomb with a pyramid-like structure, which comprises a plurality of pyramid-like (also called pyramid-shaped) wave-absorbing structures arranged in an array manner, wherein each pyramid-like wave-absorbing structure is formed by stacking and bonding a plurality of wave-absorbing honeycomb sheets with different sizes and electromagnetic characteristics from top to bottom in sequence, a non-wave-absorbing honeycomb sheet is filled in the middle area of each pyramid-like wave-absorbing structure, and the pyramid-like wave-absorbing structures and the non-wave-absorbing honeycomb sheets jointly form a flat overall shape.
The invention also provides a preparation method of the wave-absorbing honeycomb with the pyramid-like structure, which is specifically realized by the following steps as shown in figure 3:
1. honeycomb sheet preparation
The thickness of the non-wave-absorbing honeycomb sheet in the step is determined according to the electrical property design, and is generally 5-20 mm. The size of the honeycomb cells has no special requirement, is generally not less than 3.2mm, and needs to be suitable for soaking absorbent slurry.
2. Preparing absorbent slurry
The absorbent slurry consists of a powdery absorbent, an adhesive system and a solvent, wherein the weight ratio of the powdery absorbent to the adhesive system is 1: 1-1: 5. The adhesive is generally water-soluble and can be acrylic acid or polyurethane modified epoxy resin, and the solvent is plasma water. In the step, the viscosity of the slurry is adjusted by the addition amount of the solvent, so that the absorbent slurry has good manufacturability. In order to enable the absorbent to be more easily and uniformly deposited in the walls of the honeycomb holes, the viscosity of the absorbent slurry is not easy to be too high; in order to ensure that the absorbent is not easy to settle and agglomerate in the slurry, the viscosity of the absorbent slurry is not easy to be too low. The appropriate viscosity of the absorbent slurry is an important parameter for technological implementation. Preferably, the viscosity is measured by using a coating-4 cup, and the viscosity value is 10-20 s.
3. Honeycomb sheet impregnation
And (3) impregnating the honeycomb sheet with the absorbent slurry, vibrating for many times to remove the redundant slurry, and drying.
The impregnation method known in the art is adopted in the step, and the impregnation method and the impregnation process are selected by the person skilled in the art according to actual conditions.
The drying process is carried out at the temperature of 80-120 ℃ for 1-2 h. The temperature cannot be too high, otherwise the honeycomb pyramid is deformed in the drying process; the temperature is too low and the time is too short, so that the adhesive can not be partially cured to play a bonding role, and the adhesive is easy to soak away after being soaked again.
4. Repeating the third step multiple times
In the step, the honeycomb sheet is impregnated with the slurry for multiple times, the viscosity of the slurry can be the same or gradually reduced during each impregnation, and the specific process can refer to the known technology in the field. The repeated dipping times are not less than 3 times to achieve the purpose of high electromagnetic loss, and the method is specifically designed according to the electrical property. The honeycomb sheet can be prepared into the wave-absorbing honeycomb sheet with the same electrical property, and the wave-absorbing honeycomb sheet with the serialized electrical property can also be obtained by soaking the honeycomb sheet for different times. The absorbent slurry is at a lower viscosity level, and through a method of multiple times of impregnation, the content of the absorbent deposited in each impregnation is lower, so that uniform deposition is facilitated.
5. Wave-absorbing honeycomb cutting
According to the electrical property requirement of the wave-absorbing honeycomb, the wave-absorbing honeycomb array structure is designed, and the number of layers of the pyramid-like structures and the size of the wave-absorbing honeycomb sheets in each layer are determined. The wave-absorbing honeycomb sheet is cut into a designed shape and size, generally a square shape, and can also be in other shapes. When the wave-absorbing honeycomb is cut, the wave-absorbing honeycomb needs to be parallel or vertical to the honeycomb stretching direction, and cannot be cut along other directions.
Meanwhile, blanking and cutting are carried out on the non-wave-absorbing honeycomb. And according to the size and the position of the wave-absorbing honeycomb sheet material every time, cutting the honeycomb sheet material with the same size at the corresponding position of the non-wave-absorbing honeycomb sheet material to obtain the base material embedded with the wave-absorbing honeycomb sheet material. The size of the wave-absorbing honeycomb sheet is slightly larger than that of a square hole on the non-wave-absorbing honeycomb sheet, so that the wave-absorbing honeycomb can be completely fixed in the honeycomb sheet.
6. Wave-absorbing honeycomb stacking and bonding
And stacking and bonding the wave-absorbing honeycombs according to the array structure design. And selecting thermosetting resin as an adhesive between the wave-absorbing honeycomb layers. Firstly, coating an adhesive on the side surface of a wave-absorbing honeycomb sheet, embedding each layer of wave-absorbing honeycomb sheet into a corresponding position of a non-wave-absorbing honeycomb sheet, then uniformly coating the adhesive on the upper surface and the lower surface of the honeycomb sheet, and finally, stacking the honeycomb sheets together according to a designed stacking sequence.
7. And (5) solidifying the wave-absorbing honeycomb.
And heating and curing the stacked multilayer wave-absorbing honeycomb by adopting a corresponding process to obtain the wave-absorbing honeycomb with the pyramid-like wave-absorbing structure.
And determining the curing process of the wave-absorbing honeycomb according to the curing conditions of the thermosetting resin. A vacuum bag pressing or mould pressing process can be adopted, the curing temperature is between room temperature and 130 ℃, and the curing time is 2-24 hours.
The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.
Example 1
Step 1: selecting the density of 48kg/m3A honeycomb block having a cell size of 3.2mm was cut into a honeycomb sheet having a size of 300mm by 5mm by a cutter.
Step 2: weighing a certain mass of conductive carbon black, water-soluble honeycomb modified epoxy resin, a curing agent and deionized water, wherein the total mass of the conductive carbon black and the resin (containing the curing agent) is 500g, the weight ratio of the conductive carbon black to the resin (containing the curing agent) is 1:1, and 5000g of plasma water. And (2) placing the conductive carbon black, the resin, the curing agent and a small amount of plasma water into a container, mechanically stirring at a high speed for 10min, gradually adding the rest plasma water into the container, and uniformly stirring to obtain the absorbent slurry. And after the foam on the surface of the slurry is eliminated, monitoring the viscosity of the absorbent slurry by using a coating-4 cup, wherein the viscosity value is 12-13 s. And pouring the prepared absorbent slurry into a plastic groove with a certain size.
And step 3: and (3) placing the honeycomb sheet into the absorbent slurry, and carrying out shaking and dipping for multiple times to enable the honeycomb sheet to be fully soaked in the slurry. And taking the honeycomb sheet out of the absorbent slurry, carrying out vibration treatment, discharging redundant slurry in the holes of the honeycomb sheet, airing the honeycomb sheet on a metal mesh, and drying the honeycomb sheet at 100 ℃ for 1 hour to completely volatilize water and completely solidify the absorbent slurry.
And 4, step 4: and (5) repeating the step (3) to perform honeycomb pyramid impregnation and drying for 5 times in total.
And 5: the wave-absorbing honeycomb array structure is designed according to the electrical property requirement, the number of wave-absorbing honeycombs is determined to be 10, the number of pyramid-like structures is 6 multiplied by 6, the side length of the pyramid on the 1 st layer (bottom layer) is 50mm, the side length of the pyramid on the 2 nd layer is 45mm, and the like, the side length of each layer of the pyramid is decreased by 5mm, and the side length of the pyramid on the 10 th layer (surface layer) is 5 mm. And cutting the wave-absorbing honeycomb sheet and the non-wave-absorbing honeycomb sheet according to the design parameters of the pyramid structure.
Step 6: and (3) smearing epoxy resin adhesive on the side surface of the wave-absorbing honeycomb sheet, and placing the wave-absorbing honeycomb sheet in a corresponding position of each layer of non-wave-absorbing honeycomb sheet to obtain 10 layers of honeycomb sheets. And then uniformly coating the epoxy resin adhesive on the upper surface and the lower surface of the 10 layers of honeycomb sheets, wherein the adhesive is coated only on the upper surface of the 1 st layer (bottom layer), and the adhesive is coated only on the lower surface of the 10 th layer (surface layer). Finally, 10 layers of honeycombs were sequentially superimposed.
And 7: and curing by adopting a vacuum bag pressing process. And (3) respectively filling an aluminum plate with the thickness of 5mm on the upper surface and the lower surface of the laid multilayer wave-absorbing honeycomb, fixing, then integrally placing the honeycomb in a vacuum bag, vacuumizing, placing the honeycomb in an oven, heating to 80 ℃, keeping the temperature for 4 hours, and then closing the oven to cool. And opening the vacuum bag after the temperature is reduced to the room temperature, and demolding to obtain the wave-absorbing honeycomb with the pyramid-like wave-absorbing structure. The reflectivity test curve of the wave-absorbing honeycomb is shown in figure 4.
Example 2
Selecting the density of 48kg/m3Honeycomb block having a cell size of 4.8mm was used as a substrate. And (3) carrying out honeycomb pyramid dipping and drying for 8 times in total, and obtaining the wave-absorbing honeycomb with the pyramid-like wave-absorbing structure in the same way as in the embodiment 1. The reflectivity test curve of the wave-absorbing honeycomb is shown in figure 5.
Example 3
Step 1: selecting the material with the density of 80kg/m3A honeycomb block having a cell size of 3.2mm was cut into a honeycomb sheet having a size of 500mm by 10mm by a cutter.
Step 2: weighing a certain mass of conductive carbon black, water-soluble honeycomb modified epoxy resin, a curing agent and deionized water, wherein the total mass of the conductive carbon black and the resin (containing the curing agent) is 1200g, and the weight ratio of the conductive carbon black to the resin (containing the curing agent) is 1: 3, 6000g of plasma water. And (2) placing the conductive carbon black, the resin, the curing agent and a small amount of plasma water into a container, mechanically stirring at a high speed for 10min, gradually adding the rest plasma water into the container, and uniformly stirring to obtain the absorbent slurry. And after the foam on the surface of the slurry is eliminated, monitoring the viscosity of the absorbent slurry by using a coating-4 cup, wherein the viscosity value is 10-11 s. And pouring the prepared absorbent slurry into a plastic groove with a certain size.
And step 3: and (3) placing the honeycomb sheet into the absorbent slurry, and carrying out shaking and dipping for multiple times to enable the honeycomb sheet to be fully soaked in the slurry. And taking the honeycomb sheet out of the absorbent slurry, carrying out vibration treatment, discharging redundant slurry in the honeycomb angular cone hole, airing the honeycomb angular cone hole on a metal mesh, and drying the honeycomb angular cone hole for 1 hour at the temperature of 100 ℃ to completely volatilize water and completely solidify the absorbent slurry.
And 4, step 4: and (3) repeating the step (3), and respectively dipping and drying the honeycomb sheets for 1-10 times to obtain 10 wave-absorbing honeycomb sheets with different dielectric properties, namely wave-absorbing honeycombs with the specification of 1-10.
And 5: the wave-absorbing honeycomb array structure is designed according to the electrical property requirement, the number of the wave-absorbing honeycomb layers is determined to be 10, the number of the pyramid-like structures is 5 multiplied by 5, the side length of the pyramid of the 1 st layer (bottom layer) is 100mm, the side length of the pyramid of the 2 nd layer is 90mm, and the like, the side length of each layer of the pyramid is decreased by 10mm, the side length of the pyramid of the 10 th layer (surface layer) is 10mm, and the size of the wave-absorbing honeycomb is 500mm multiplied by 100 mm. According to the size of pyramid structural design, the wave-absorbing honeycomb sheet and the non-wave-absorbing honeycomb sheet are cut, the 1 st layer (bottom layer) selects the wave-absorbing honeycomb with the specification of 10, the 2 nd layer selects the wave-absorbing honeycomb with the specification of 9, and the rest is done by analogy, and the 10 th layer (surface layer) selects the wave-absorbing honeycomb with the specification of 1.
Step 6: and smearing epoxy resin adhesives on the side surfaces of the wave-absorbing honeycomb sheets, and respectively placing the wave-absorbing honeycomb sheets in corresponding positions of each layer of non-wave-absorbing honeycomb sheets to obtain 10 layers of honeycomb sheets. And then uniformly coating the epoxy resin adhesive on the upper surface and the lower surface of the 10 layers of honeycomb sheets, wherein the adhesive is coated only on the upper surface of the 1 st layer (bottom layer), and the adhesive is coated only on the lower surface of the 10 th layer (surface layer). Finally, 10 layers of honeycombs were sequentially superimposed.
And 7: and curing by adopting a mould pressing process. And placing the laid multilayer wave-absorbing honeycomb in a cavity of a flat plate die, wherein the thickness of a limiting edge strip is 100mm, and placing an upper cover plate. And (3) after the die is closed, placing the die on a press platform, heating to 130 ℃, pressurizing to 1.5Mpa, preserving heat for 2 hours, and then closing the press. And (4) relieving pressure after the temperature is reduced to the room temperature, demolding, and removing burrs to obtain the wave-absorbing honeycomb with the pyramid-like wave-absorbing structure. The reflectivity test curve of the wave-absorbing honeycomb is shown in figure 6.
The invention has not been described in detail and is in part known to those of skill in the art.
The foregoing disclosure of the specific embodiments of the present invention and the accompanying drawings is directed to an understanding of the present invention and its implementation, and it will be appreciated by those skilled in the art that various alternatives, modifications, and variations may be made without departing from the spirit and scope of the invention. The present invention should not be limited to the disclosure of the embodiments and drawings in the specification, and the scope of the present invention is defined by the scope of the claims.
Claims (10)
1. The wave-absorbing honeycomb with the pyramid-like structures is characterized by comprising a plurality of pyramid-like wave-absorbing structures arranged in an array, wherein each pyramid-like wave-absorbing structure is formed by stacking and bonding a plurality of wave-absorbing honeycomb sheets with different sizes and electromagnetic characteristics from large to small in sequence from bottom to top, a non-wave-absorbing honeycomb sheet is filled in the middle area of each pyramid-like wave-absorbing structure, and the pyramid-like wave-absorbing structures and the non-wave-absorbing honeycomb sheets jointly form a flat overall appearance.
2. The wave-absorbing honeycomb with the pyramid-like structure of claim 1, wherein the wave-absorbing honeycomb sheet is 5-20 mm thick and not less than 3.2mm long and wide.
3. A preparation method of a wave-absorbing honeycomb with a pyramid-like structure is characterized by comprising the following steps:
1) impregnating a plurality of non-wave-absorbing honeycomb sheets with absorbent slurry, vibrating to remove redundant slurry, drying, and repeating for a plurality of times to obtain wave-absorbing honeycomb sheets with different electromagnetic properties;
2) cutting the wave-absorbing honeycomb sheet and the non-wave-absorbing honeycomb sheet into certain sizes and shapes;
3) layering and stacking wave-absorbing honeycomb sheets and non-wave-absorbing honeycomb sheets, stacking the wave-absorbing honeycomb sheets from large to small in sequence from bottom to top to form a pyramid-like wave-absorbing structure, filling the non-wave-absorbing honeycomb sheets between the wave-absorbing honeycomb sheets on the same layer, and bonding the wave-absorbing honeycomb sheets between the upper surface and the lower surface of each wave-absorbing honeycomb sheet, the non-wave-absorbing honeycomb sheets between the upper surface and the lower surface of each wave-absorbing honeycomb sheet and the side surfaces of the wave-absorbing honeycomb sheets and the non-wave-absorbing honeycomb sheets by using adhesives;
4) pressurizing and heating up the product obtained in the step 3) for curing to obtain the final wave-absorbing honeycomb with the pyramid-like structure.
4. The preparation method according to claim 3, wherein the absorbent slurry comprises a powdery absorbent, an adhesive system and a solvent, wherein the weight ratio of the powdery absorbent to the adhesive system is 1: 1-1: 5; the powdery absorbent comprises one or more of conductive carbon black, graphene, carbonyl iron powder and oxidized metal powder; the adhesive is acrylic acid or polyurethane modified epoxy resin; the solvent is plasma water; the viscosity value of the absorbent slurry is 10-20 s.
5. The preparation method according to claim 3, wherein the wave-absorbing honeycomb sheet in the step 1) has a thickness of 5-20 mm and a length and width of not less than 3.2 mm; the cutting size of the wave-absorbing honeycomb sheet in the step 2) is 5mm multiplied by 5 mm-100 mm multiplied by 100 mm.
6. The method of claim 3, wherein step 1) is repeated no less than 3 times.
7. The preparation method according to claim 3, wherein the same impregnation process or different impregnation processes are adopted for each wave-absorbing honeycomb sheet.
8. The preparation method according to claim 3, wherein the drying temperature is 80-120 ℃ and the drying time is 1-2 h.
9. The preparation method according to claim 3, wherein in the stacking in step 3), the wave-absorbing honeycomb sheet and the non-wave-absorbing honeycomb sheet of each layer are firstly bonded together, and the method comprises the steps of coating the adhesive on the side surface of the wave-absorbing honeycomb sheet, and then embedding the wave-absorbing honeycomb sheet into the corresponding position of the non-wave-absorbing honeycomb sheet to realize bonding, so as to obtain a complete layer; and then, uniformly coating the adhesive on the upper surface and the lower surface of each layer of wave-absorbing honeycomb sheets, and stacking and bonding the wave-absorbing honeycomb sheets together according to a preset stacking sequence.
10. The method according to claim 3, wherein the pressing in step 4) is a mold pressing or a vacuum bag pressing, and the curing temperature is from room temperature to 130 ℃ for 2-24 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011400714.3A CN112492867B (en) | 2020-12-02 | 2020-12-02 | Wave-absorbing honeycomb with pyramid-like structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011400714.3A CN112492867B (en) | 2020-12-02 | 2020-12-02 | Wave-absorbing honeycomb with pyramid-like structure and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112492867A true CN112492867A (en) | 2021-03-12 |
| CN112492867B CN112492867B (en) | 2023-05-23 |
Family
ID=74939215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011400714.3A Active CN112492867B (en) | 2020-12-02 | 2020-12-02 | Wave-absorbing honeycomb with pyramid-like structure and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112492867B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113675618A (en) * | 2021-08-19 | 2021-11-19 | 太原理工大学 | Ultra-wideband terahertz absorption material with double truncated pyramid structure and absorber |
| CN114256632A (en) * | 2021-12-24 | 2022-03-29 | 中国人民解放军空军工程大学 | Novel honeycomb wave-absorbing composite structure based on inductively coupled plasma |
| CN114311654A (en) * | 2022-03-16 | 2022-04-12 | 成都飞机工业（集团）有限责任公司 | Metamaterial wave-absorbing structure based on 3D printing process and preparation method and application thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080129188A1 (en) * | 2006-12-05 | 2008-06-05 | Semiconductor Energy Laboratory Co., Ltd. | Plasma display panel and field emission display |
| CN102218868A (en) * | 2011-04-07 | 2011-10-19 | 中国人民解放军国防科学技术大学 | Wave-absorbing material for silicon carbide fibre reinforced resin base sandwich structure and preparation method thereof |
| CN104779447A (en) * | 2015-04-08 | 2015-07-15 | 哈尔滨工业大学深圳研究生院 | Structure of broadband wave absorber and preparation method |
| CN106469858A (en) * | 2015-08-21 | 2017-03-01 | 深圳光启尖端技术有限责任公司 | A kind of wave-absorber structure |
| CN106597129A (en) * | 2017-01-12 | 2017-04-26 | 深圳市通用测试系统有限公司 | Microwave anechoic chamber |
| CN107734948A (en) * | 2017-09-05 | 2018-02-23 | 西北工业大学 | Broadband absorbing material and preparation method based on frequency-selective surfaces and sandwich sandwich design |
| CN109066096A (en) * | 2018-07-24 | 2018-12-21 | 南京邮电大学 | A kind of THz ultra wide band wave absorbing device based on unequal spacing stepped construction |
| CN110614824A (en) * | 2019-10-11 | 2019-12-27 | 航天特种材料及工艺技术研究所 | Combined wave-absorbing pyramid and preparation method thereof |
| CN110768025A (en) * | 2019-11-18 | 2020-02-07 | 安徽璜峪电磁技术有限公司 | Preparation method of composite carbon powder broadband composite wave-absorbing material |
-
2020
- 2020-12-02 CN CN202011400714.3A patent/CN112492867B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080129188A1 (en) * | 2006-12-05 | 2008-06-05 | Semiconductor Energy Laboratory Co., Ltd. | Plasma display panel and field emission display |
| CN102218868A (en) * | 2011-04-07 | 2011-10-19 | 中国人民解放军国防科学技术大学 | Wave-absorbing material for silicon carbide fibre reinforced resin base sandwich structure and preparation method thereof |
| CN104779447A (en) * | 2015-04-08 | 2015-07-15 | 哈尔滨工业大学深圳研究生院 | Structure of broadband wave absorber and preparation method |
| CN106469858A (en) * | 2015-08-21 | 2017-03-01 | 深圳光启尖端技术有限责任公司 | A kind of wave-absorber structure |
| CN106597129A (en) * | 2017-01-12 | 2017-04-26 | 深圳市通用测试系统有限公司 | Microwave anechoic chamber |
| CN107734948A (en) * | 2017-09-05 | 2018-02-23 | 西北工业大学 | Broadband absorbing material and preparation method based on frequency-selective surfaces and sandwich sandwich design |
| CN109066096A (en) * | 2018-07-24 | 2018-12-21 | 南京邮电大学 | A kind of THz ultra wide band wave absorbing device based on unequal spacing stepped construction |
| CN110614824A (en) * | 2019-10-11 | 2019-12-27 | 航天特种材料及工艺技术研究所 | Combined wave-absorbing pyramid and preparation method thereof |
| CN110768025A (en) * | 2019-11-18 | 2020-02-07 | 安徽璜峪电磁技术有限公司 | Preparation method of composite carbon powder broadband composite wave-absorbing material |
Non-Patent Citations (1)
| Title |
|---|
| 李彬: "角锥结构炭黑/水泥基复合材料的吸波性能研究", 新型建筑材料 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113675618A (en) * | 2021-08-19 | 2021-11-19 | 太原理工大学 | Ultra-wideband terahertz absorption material with double truncated pyramid structure and absorber |
| CN113675618B (en) * | 2021-08-19 | 2023-11-14 | 太原理工大学 | Ultra-wideband terahertz absorbing material with double truncated pyramid structure and absorber |
| CN114256632A (en) * | 2021-12-24 | 2022-03-29 | 中国人民解放军空军工程大学 | Novel honeycomb wave-absorbing composite structure based on inductively coupled plasma |
| CN114256632B (en) * | 2021-12-24 | 2024-02-06 | 中国人民解放军空军工程大学 | Novel honeycomb wave-absorbing composite structure based on inductively coupled plasma |
| CN114311654A (en) * | 2022-03-16 | 2022-04-12 | 成都飞机工业（集团）有限责任公司 | Metamaterial wave-absorbing structure based on 3D printing process and preparation method and application thereof |
| CN114311654B (en) * | 2022-03-16 | 2022-07-15 | 成都飞机工业（集团）有限责任公司 | Metamaterial wave-absorbing structure based on 3D printing process and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112492867B (en) | 2023-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112492867B (en) | Wave-absorbing honeycomb with pyramid-like structure and preparation method thereof | |
| RU2020131973A (en) | MULTILAYER RADIO ABSORBING LAYERED MATERIAL FOR AIRCRAFT FROM COMPOSITE MATERIAL WITH POLYMER MATRIX CONTAINING GRAPHENE NANOPLABELS AND METHOD OF ITS MANUFACTURE | |
| CN104766934B (en) | A kind of preparation method of sandwich structure for lightweight battery case | |
| US20110076439A1 (en) | Multi-layered structure, product comprising said structure and a method for producing said structure | |
| CN109703136B (en) | Sectional wave-absorbing honeycomb composite material with corrugated structure and preparation method thereof | |
| US20120003495A1 (en) | Part made of a composite, including lightning protection means | |
| CN112223804B (en) | Method for forming and preparing laminated composite material honeycomb | |
| CN115821642B (en) | Wave-absorbing honeycomb coated with absorbent on surface layer of aramid fiber paper and preparation method thereof | |
| CN115821643B (en) | Absorbent gradient-distributed wave-absorbing honeycomb and preparation method thereof | |
| US3864206A (en) | Structurally Supported, Dimensionally Accurate, Shaped Articles and Method of Producing the Same | |
| CN112126116B (en) | Wave-absorbing polyurethane sponge/hard foam composite material and preparation method thereof | |
| CN112143023B (en) | Wave-absorbing honeycomb pyramid/hard foam composite material and preparation method thereof | |
| CN112126114B (en) | Wave-absorbing honeycomb/hard foam composite material and preparation method thereof | |
| CN101392426B (en) | Flexible gripper band laminate and autoclave molding method | |
| CN203733851U (en) | Lithium battery aluminum-plastic film | |
| CN112519351A (en) | Homogeneous wave-absorbing shelter deck and preparation method thereof | |
| CN109927310B (en) | Forming process of foam inner core composite material | |
| CN112126115A (en) | Wave-absorbing polyurethane pyramid/rigid foam composite material and preparation method thereof | |
| CN210553438U (en) | Aluminum-plastic composite film with high deep drawing forming performance | |
| US10994497B2 (en) | System and method for increasing density of structural composites | |
| JPH044112A (en) | Formation of composite material and formation of mold | |
| JP7356840B2 (en) | Honeycomb laminate with irregularities formed on the surface and its manufacturing method | |
| CN116512503A (en) | Wave-absorbing honeycomb core and preparation method thereof | |
| CN117507497A (en) | Honeycomb wave-absorbing composite material and preparation method thereof | |
| CN114535342B (en) | Preparation method of foldable nickel film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |