CN112490712B - 电连接器 - Google Patents

电连接器 Download PDF

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CN112490712B
CN112490712B CN201910863840.3A CN201910863840A CN112490712B CN 112490712 B CN112490712 B CN 112490712B CN 201910863840 A CN201910863840 A CN 201910863840A CN 112490712 B CN112490712 B CN 112490712B
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frame body
cover
block
electrical connector
cover body
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CN112490712A (zh
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杨竣杰
林暐智
许修源
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Foxconn Kunshan Computer Connector Co Ltd
Foxconn Interconnect Technology Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Foxconn Interconnect Technology Ltd
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Priority to TW109130739A priority patent/TWI827883B/zh
Priority to US17/019,386 priority patent/US11322871B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/533—Bases, cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
    • H01R13/62933—Comprising exclusively pivoting lever
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots

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  • Engineering & Computer Science (AREA)
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  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

一种电连接器包括座体及盖体，所述座体的上表面设有用来承载芯片模块的承载空间及导电端子，所述盖体枢接于座体的侧边，所述盖体包括第一盖体及第二盖体，所述第一盖体设有第一框体及架设于第一框体的一散热块，散热块位于承载空间上方；散热块设有一收容于第一框体内的主体部及自主体部两侧向外延伸的延展部，第一盖体还包括压合于延展部上的抵压块，延展部与抵压块之间设有弹性元件。在抵压块与散热块的延展部之间设有弹性元件弹簧，电连接器压合的过程中，弹簧起到支撑的作用，从而使芯片模块受到的下压力更加均衡，不会损坏芯片模块，降低产品的损坏率。

Description

电连接器
【技术领域】
本发明有关一种电连接器，尤其涉及一种用以承载芯片模块并电性连接至电路板的电连接器。
【背景技术】
中国实用新型专利第CN203445305U号揭示了一种电连接器，其包括座体及盖体，盖体包括第一盖体及第二盖体，散热块收容于第一盖体中的固定块所形成的收容腔内，第一盖体与第二盖体相枢，第二盖体位于第一盖体的上方且直接压制于第一盖体。在上述这种结构中，当第二盖体下压至第一盖体的过程中，会使芯片模块受力不均衡，在靠近第一盖体与第二盖体枢转轴的地方，芯片模块受力较大，容易造成芯片模块变形甚至损坏。
因此，确有必要提供一种改进的电连接器，以克服上述缺陷。
【发明内容】
本发明的目的在于提供一种保护芯片模块不被损坏的电连接器。
本发明的目的通过以下技术方案来实现：一种电连接器，是用以承载芯片模块并电性连接至电路板，所述电连接器包括座体及盖体，所述座体的上表面设有用来承载芯片模块的承载空间，所述座体设有贯穿座体上表面且裸露于所述承载空间的导电端子，所述盖体枢接于所述座体的侧边，所述盖体包括抵接于所述座体的第一盖体及盖设于所述第一盖体上的第二盖体，所述第一盖体设有盖合于座体的第一框体及架设于所述第一框体的一散热块，所述散热块位于所述承载空间上方；所述散热块设有一收容于所述第一框体内的主体部及自所述主体部两侧向外延伸的延展部，所述第一盖体还包括压合于所述延展部上的抵压块，所述延展部与所述抵压块之间设有弹性元件。
进一步的，所述延展部设有自所述延展部上表面凹陷的若干个弹簧槽，每一所述弹簧槽中装设有弹簧；所述抵压块设有若干个对接槽，所述对接槽与所述弹簧槽一一对应。
进一步的，所述散热块延展部的中间部位设有贯穿所述延展部上、下表面的凹口，所述抵压块自其下表面凸设有凸块，所述凸块凸伸入所述凹口内且抵接于所述第一框体上表面。
进一步的，所述抵压块设有若干个螺钉孔，所述第一框体设有与所述若干个螺钉孔相对接的对接孔，螺钉通过所述螺钉孔与所述对接孔，将所述散热块固持于所述第一框体。
进一步的，所述散热块自其一侧面凹设有一植入槽，所述植入槽内装设有一温度检测器；所述散热块自其上表面凹设有一固持孔，所述固持孔与所述植入槽相连通。
进一步的，所述第二盖体包括抵接于所述抵压块的第二框体、压合于所述第二框体上的压合盖及枢转安装于所述第二框体前侧壁的锁扣部，所述第二框体的前侧壁设有一收容空间，所述锁扣部收容固持于所述收容空间内。
进一步的，所述压合盖具有相对设置的左、右侧部及连接所述左、右侧部的扣持件，所述扣持件向下凹设呈阶梯状，所述锁扣部与所述扣持件相配合，当所述压合盖压合于所述第二框体时，所述扣持件与所述锁扣部扣合。
进一步的，所述扣持件围设形成一收容口，所述锁扣部设有一可枢转按压的操作部，当所述压合盖压合于所述第二框体时，所述操作部收容于所述收容口内。
进一步的，所述锁扣部还设有自其下表面凸设的两个扣钩，所述两个扣钩间隔设置于所述操作部两侧，所述扣钩扣持于所述第二框体的侧壁。
进一步的，所述第二盖体由设有的转轴固定于所述座体的侧边并可做转轴运动。
与现有技术相比，本发明具有如下有益效果：本发明在抵压块与散热块的延展部之间设有弹性元件弹簧，电连接器压合的过程中，弹簧起到支撑的作用，从而使芯片模块受到的下压力更加均衡，不会损坏芯片模块，降低了产品的损坏率。
【附图说明】
图1是本发明电连接器的立体示意图。
图2是本发明电连接器另一角度的立体示意图。
图3是图1沿A-A线的剖视图。
图4是图1沿B-B线的剖视图。
图5是图1沿C-C线的剖视图。
图6是本发明电连接器的立体分解图。
图7是图6的另一角度立体分解图。
图8是图6的进一步的立体分解图。
图9是图8的另一角度立体分解图。
图10是本发明电连接器中的盖体的立体分解图。
图11是图10的另一角度立体分解图。
【主要元件符号说明】
电连接器 1000 芯片模块 2000
座体 100 座体上表面 101
承载空间 102 盖体 200
第一盖体 1 第一框体 11
前壁 111 后壁 112、
左壁 113 右壁 114
窗口 115 对接孔 116
凹槽 117 散热块 12
主体部 121 前侧面 1211
植入槽 1212 上表面 1213
固持孔 1214 延展部 122
弹簧槽 1221 凹口 1222
抵压块 13 对接槽 131
凸块 132 螺钉孔 133
第二盖体 2 第二框体 21
前侧壁 211 固持块 2111
收容空间 2112 压合盖 22
左侧部 221 右侧部 222
扣持件 223 收容口 224
安装孔 229 锁扣部 23
扣钩 231 操作部 232
第一通孔 233 第二枢转轴 24
第一枢转轴 300
如下具体实施方式将结合上述附图进一步说明本发明。
【具体实施方式】
请参图1至图11所示，一种电连接器1000，是用以承载芯片模块2000并电性连接至电路板(未图示)，所示电连接器1000包括座体100、枢接于所述座体旁侧的盖体200及用于枢接座体100与盖体200的第一枢转轴300。
所述座体100的上表面101设有用来承载芯片模块的承载空间102，所述座体100设有贯穿所述座体上表面101且裸露于所述承载空间102的导电端子(未图示)。
请参图8和图9所示，所述盖体200包括抵接于所述座体100的第一盖体1及盖设于所述第一盖体1上的第二盖体2。所述第一盖体1设有盖合于座体100的第一框体11、架设于所述第一框体11的一散热块12及压合于所述散热块12上的抵压块13，所述散热块12位于所述承载空间102上方。所述第二盖体2由设有的第一枢转轴300固定于所述座体100的侧边并可做转轴运动。
请参图10和图11所示，所述第一框体11大致呈矩形，所述第一框体11设有前、后、左、右壁111、112、113、114及由所述前、后、左、右壁111、112、113、114围设形成的窗口115，所述窗口115贯穿所述框体11的上、下表面。所述左、右壁113、114分别对应设有贯穿其上、下表面的若干个对接孔116，所述前壁111具有自其上表面凹设的一凹槽117，所述凹槽117横向贯穿所述前壁111的前、后表面。
所述散热块12设有一收容于所述第一框体11内的主体部121及自所述主体部121两侧向外延伸的延展部122，所述主体部121置于所述窗口115内，所述延展部122分别置于所述第一框体11的左、右壁113、114上方。所述主体部121自其前侧面1211凹设有一植入槽1212(详情请参图11)，所述植入槽1212贯穿所述散热块12的内部，所述植入槽1222内装设有一温度检测器(未图示)，用以时时监测所述芯片模块2000的测试温度，提高测试数据的准确性，并且还可以避免因为测试温度过高而损坏芯片模块2000。所述主体部121自其上表面1213凹设有一固持孔1214，所述固持孔1214与所述植入槽1212相连通(具体请参图5所示)，所述固持孔1214的直径略大于所述植入槽1212的直径，所述固持孔1214内装有用以固持植入槽1212内的温度检测器。温度检测器的线缆通过所述凹槽117连接至外部。所述延展部122大致呈矩形，所述抵压块13分别压合于所述延展部122上方。所述延展部122设有自其上表面凹陷的若干个弹簧槽1221，每一个所述弹簧槽1221中对应装设有弹簧(未图示)。所述延展部122的中间部位设有贯穿所述延展部122上、下表面的凹口1222。
所述抵压块13具有自其下表面凹设的若干个对接槽131、自其下表面凸设有凸块132及贯穿其上、下表面的若干个螺钉孔133。所述对接槽131与所述弹簧槽1221一一对应，当所述抵压块13压合于所述延展部122时，所述弹簧收容于所述弹簧槽1221与对接槽131构成的空间内。所述凸块132凸伸入所述凹口1222内且抵接于所述第一框体11的上表面。所述螺钉孔133设置于所述凸块132处，其贯穿所述凸块132的上、下表面，所述若干个螺钉孔133与所述第一框体的对接孔116相对接，螺钉通过所述螺钉孔133与所述对接孔116，将所述散热块12固持于所述第一框体11。
所述第二盖体2包括抵接于所述抵压块13的第二框体21、压合于所述第二框体21上的压合盖22、枢转安装于所述第二框体21的锁扣部23及第二枢转轴24。所述第二框体21设有与所述第一框体11的前壁111对应的前侧壁211，所述前侧壁111两端分别设有一固持块2111及由两固持块2111围设的收容空间2112。所述锁扣部23收容且枢转固持于所述收容空间2112内，设有自其下表面凸设的两个扣钩231、可枢转按压的操作部232及横向贯穿所述锁扣部23的第一通孔233，所述两个扣钩231间隔设置于所述操作部232两侧，所述扣钩231以硬干涉的方式扣持于所述第二框体21的前侧壁211。所述第二枢转轴24穿过所述第一通孔233以及安装孔229以使锁扣部23安装于压合盖22。所述第二枢转轴24与所述第一枢转轴300平行。
所述压合盖22具有相对设置的左、右侧部221、222及连接所述左、右侧部221、222的扣持件223，所述左、右侧部221、222与所述第一框体11的左、右壁113、114平行，与所述第一枢转轴300垂直。所述电连接器1000的开合方向与所述压合盖22的左、右部221、222平行，从而有利于散热块12的安装与拆卸。所述扣持件223向下凹设呈阶梯状且围设形成一收容口224，当所述压合盖22压合于所述第二框体21时，所述操作部232收容于所述收容口224内。如此设置，方便操作人员按压所述操作部232，从而不仅节省操作时间，还可降低对所述电连接器1000的损坏。
综上所述，本发明所述电连接器1000的有益效果如下：
1.本发明在散热块12的内部植入温度检测器，可以时时监测芯片模块2000的测试温度，不仅可以使芯片模块2000的测试数据更加准确，提高了芯片模块2000的性能，保证了芯片模块2000的质量，而且还可以避免因为测试温度过高而损坏芯片模块2000；
2.在抵压块13与散热块12的延展部122之间设有弹性元件弹簧，电连接器1000压合的过程中，弹簧起到支撑的作用，从而使芯片模块2000受到的下压力更加均衡，不会损坏芯片模块2000，降低产品的损坏率；
3.本发明的电连接器1000的开合方向与第一枢转轴300垂直，压合盖22和抵压块13的让位方向与第一枢转轴300垂直，方便散热块12的安装与拆卸，提高工作效率；
4.在压合盖22的前端设有扣持件223与锁扣部23相配合，将锁扣部23的操作部232设于扣持件223的收容空间2112内，方便操作人员操作。
以上所述仅为本发明的部分实施方式，不是全部的实施方式，本领域普通技术人员通过阅读本发明说明书而对本发明技术方案采取的任何等效的变化，均为本发明的权利要求所涵盖。

Claims (10)

1.一种电连接器，是用以承载芯片模块并电性连接至电路板，所述电连接器包括座体及盖体，所述座体的上表面设有用来承载芯片模块的承载空间，所述座体设有贯穿座体上表面且裸露于所述承载空间的导电端子，所述盖体枢接于所述座体的侧边，所述盖体包括抵接于所述座体的第一盖体及盖设于所述第一盖体上的第二盖体，所述第一盖体设有盖合于座体的第一框体及架设于所述第一框体的一散热块，所述散热块位于所述承载空间上方；其特征在于：所述散热块设有一收容于所述第一框体内的主体部及自所述主体部两侧向外延伸的延展部，所述第一盖体还包括压合于所述延展部上的抵压块，所述延展部与所述抵压块之间设有弹性元件。
2.如权利要求1所述的电连接器，其特征在于：所述延展部设有自所述延展部上表面凹陷的若干个弹簧槽，每一所述弹簧槽中装设有弹簧；所述抵压块设有若干个对接槽，所述对接槽与所述弹簧槽一一对应。
3.如权利要求1所述的电连接器，其特征在于：所述散热块延展部的中间部位设有贯穿所述延展部上、下表面的凹口，所述抵压块自其下表面凸设有凸块，所述凸块凸伸入所述凹口内且抵接于所述第一框体上表面。
4.如权利要求1所述的电连接器，其特征在于：所述抵压块设有若干个螺钉孔，所述第一框体设有与所述若干个螺钉孔相对接的对接孔，螺钉通过所述螺钉孔与所述对接孔，将所述散热块固持于所述第一框体。
5.如权利要求1所述的电连接器，其特征在于：所述散热块自其一侧面凹设有一植入槽，所述植入槽内装设有一温度检测器；所述散热块自其上表面凹设有一固持孔，所述固持孔与所述植入槽相连通。
6.如权利要求1所述的电连接器，其特征在于：所述第二盖体包括抵接于所述抵压块的第二框体、压合于所述第二框体上的压合盖及枢转安装于所述第二框体前侧壁的锁扣部，所述第二框体的前侧壁设有一收容空间，所述锁扣部收容固持于所述收容空间内。
7.如权利要求6所述的电连接器，其特征在于：所述压合盖具有相对设置的左、右侧部及连接所述左、右侧部的扣持件，所述扣持件向下凹设呈阶梯状，所述锁扣部与所述扣持件相配合，当所述压合盖压合于所述第二框体时，所述扣持件与所述锁扣部扣合。
8.如权利要求7所述的电连接器，其特征在于：所述扣持件围设形成一收容口，所述锁扣部设有一可枢转按压的操作部，当所述压合盖压合于所述第二框体时，所述操作部收容于所述收容口内。
9.如权利要求8所述的电连接器，其特征在于：所述锁扣部还设有自其下表面凸设的两个扣钩，所述两个扣钩间隔设置于所述操作部两侧，所述扣钩扣持于所述第二框体的侧壁。
10.如权利要求1所述的电连接器，其特征在于：所述第二盖体由设有的转轴固定于所述座体的侧边并可做转轴运动。
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