CN112475664B - Soldering tin alloy and preparation method thereof - Google Patents
Soldering tin alloy and preparation method thereof Download PDFInfo
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- CN112475664B CN112475664B CN202011329362.7A CN202011329362A CN112475664B CN 112475664 B CN112475664 B CN 112475664B CN 202011329362 A CN202011329362 A CN 202011329362A CN 112475664 B CN112475664 B CN 112475664B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The invention relates to the technical field of welding materials, in particular to a soldering tin alloy and a preparation method thereof, which at least comprises the following steps: sn, Ag, Cu, Bi and Sb, and the solder paste alloy also comprises Ni, Co and In; the soldering paste is prepared from the soldering tin alloy, the problems of collapse and copper plate corrosion of the obtained soldering paste can be avoided, and the falling resistance and the thermal shock resistance of the soldering tin alloy material can be effectively improved by controlling the types of the metals and the proportion of the metals; the aging resistance, the cold and hot cycle performance and the tensile property of the soldering paste are further improved, the wetting time is shortened, and the wetting power and the thermal fatigue are improved.
Description
Technical Field
The invention relates to the technical field of welding materials, in particular to a soldering tin alloy and a preparation method thereof.
Background
In recent years, electronic packaging technology is impacted by the design and manufacturing capability of upstream chips, and the production of high-density, high-I/O (input/output) number, high-speed and high-power related electronic components; and the invariance requirements of downstream consumers on light, thin, short and small 3C electronic products are met, and the two sides are clamped, so that practitioners of electronic packaging are forced to continuously develop new technology, the purposes of reducing volume, increasing yield, improving heat dissipation effect, reducing cost, enhancing reliability and the like are achieved, and the market requirements are met.
The main components of the soldering paste comprise soldering tin alloy and soldering paste, wherein the selection of the soldering tin alloy mainly influences the performances of the soldering tin alloy such as impact resistance, aging strength and the like; the soldering paste prepared in the prior art has the problems of low thermal shock resistance, weakening of strength after thermal cycle/aging, poor creep resistance, poor temperature fatigue resistance and the like; therefore, it is the focus of those skilled in the art to research a solder alloy with excellent thermal shock resistance and aging resistance and a preparation method thereof.
Disclosure of Invention
In order to solve the above-mentioned technical problem, a first aspect of the present invention provides a solder alloy including at least: sn, Ag, Cu, Bi, Sb.
In a preferred embodiment of the present invention, the solder alloy further includes Ni, Co, and In.
As a preferred technical scheme of the invention, the Ag accounts for 0.5-4.0 wt% of the soldering tin alloy in percentage by weight; cu accounts for 0.2-1.0 wt% of the soldering tin alloy; bi accounts for 1.0-6.0 wt% of the soldering tin alloy; sb accounts for 0.5-5.0 wt% of the soldering tin alloy; co accounts for 0.01-0.4 wt% of the soldering tin alloy; ni accounts for 0.01-0.4 wt% of the soldering tin alloy; in accounts for 0.1-1.5 wt% of the solder alloy, and the balance is Sn.
As a preferable technical scheme of the invention, Bi accounts for 2.0-5.0 wt% of the soldering tin alloy according to weight percentage.
As a preferred technical scheme of the invention, Sb accounts for 1.0-4.0 wt% of the solder alloy in percentage by weight.
As a preferred technical scheme of the invention, according to weight percentage, Co accounts for 0.01-0.2 wt% of the soldering tin alloy, and Ni accounts for 0.02-0.2 wt% of the soldering tin alloy.
As a preferred technical scheme of the invention, In accounts for 0.15-1.0 wt% of the solder alloy In percentage by weight.
As a preferred technical proposal of the invention, Bi accounts for 3.5wt percent of the solder alloy according to weight percentage.
As a preferable technical scheme of the invention, the Co accounts for 0.03 wt% of the soldering tin alloy and the Ni accounts for 0.05 wt% of the soldering tin alloy according to weight percentage.
In a second aspect of the present invention, a method for preparing a solder alloy is provided, the method at least comprising the steps of: mixing Sn, Ag, Cu, Bi, Sb, Ni, Co and In according to a ratio, melting the obtained metal mixture In a melting furnace and homogenizing to obtain the metal-containing composite material.
Has the advantages that: the invention provides a soldering tin alloy and soldering tin paste formed by the same; by controlling the types of the metals and the proportion of the metals, the drop resistance and the thermal shock resistance of the soldering tin alloy material are effectively improved; the aging resistance, the cold and hot cycle performance and the tensile property of the soldering paste are further improved, the wetting time is shortened, and the wetting power and the thermal fatigue are improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a SEM structural diagram of the solder pastes provided in examples 1 and 9 after being left at 150 ℃ for 240 hours.
Wherein FIG. 1a is a SEM structural diagram of a solder paste provided in example 9 before aging; FIG. 1b is a SEM structural diagram of the solder paste provided in example 1 before aging; FIG. 1c is a SEM structural diagram of the solder paste provided in example 9 after being aged for 240 h; FIG. 1d is a SEM structural diagram of the solder paste provided in example 1 after being aged for 240 h; FIG. 1 is a graph effectively demonstrating that the solder paste prepared in example 1 has better aging resistance than that of example 9 after being placed at 150 ℃ for 240 hours;
FIG. 2 is a comparative metallographic picture of solder pastes provided in examples 1 and 9 after 480h of storage at 150 ℃;
wherein fig. 2a is a structure diagram of a metallographic photograph of the solder paste provided in example 9 after being aged for 480 h; FIG. 2b is a structure diagram of a metallographic photograph of the solder paste provided in example 1 after being aged for 480 h; FIG. 2 is a graph showing that the solder paste prepared in example 1 has better aging resistance than that of example 9 after being placed at 150 ℃ for 480 hours;
FIG. 3 is a SEM structural diagram of the solder pastes provided in examples 1 and 9 after being subjected to a cooling-heating cycle test at-40 to 125 ℃;
FIG. 3a is a SEM structural diagram of the solder paste provided in example 9 after being subjected to a cooling-heating cycle test for 1000 cycles at-40 to 125 ℃; FIG. 3b is an SEM structural diagram of the solder paste provided in example 1 after being subjected to a cooling-heating cycle test for 1000 cycles at-40 to 125 ℃; as can be seen from the figure, the solder paste provided by example 1 has excellent cold and hot cycle resistance;
fig. 4 is a metallographic structure diagram of the solder pastes provided in examples 1 and 9 after being subjected to a cooling-heating cycle test;
wherein fig. 4a, 4b are metallographs of the solder paste provided in example 1 before recycling; FIG. 4c is a metallographic photograph of the solder paste of example 1 after being subjected to a cooling-heating cycle test at-40 to 125 ℃ for 1000 cycles; FIGS. 4d and 4e are metallographic photographs taken before recycling of the solder paste provided in example 9; FIG. 4f is a metallographic photograph of the solder paste obtained in example 9 after subjecting the solder paste to a cooling-heating cycle test at-40 to 125 ℃ for 1000 cycles; as can be seen from the figure, the solder paste provided in example 1 has better thermal fatigue reliability than the solder paste provided in example 9.
Detailed Description
The present invention will be more readily understood by reference to the following detailed description of preferred embodiments of the invention and the examples included therein. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control.
The term "prepared from …" as used herein is synonymous with "comprising". The terms "comprises," "comprising," "includes," "including," "has," "having," "contains," "containing," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion. For example, a composition, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, process, method, article, or apparatus.
The conjunction "consisting of …" excludes any unspecified elements, steps or components. If used in a claim, the phrase is intended to claim as closed, meaning that it does not contain materials other than those described, except for the conventional impurities associated therewith. When the phrase "consisting of …" appears in a clause of the subject matter of the claims rather than immediately after the subject matter, it defines only the elements described in the clause; other elements are not excluded from the claims as a whole.
When an amount, concentration, or other value or parameter is expressed as a range, preferred range, or as a range of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. For example, when a range of "1 to 5" is disclosed, the described range should be interpreted to include the ranges "1 to 4", "1 to 3", "1 to 2 and 4 to 5", "1 to 3 and 5", and the like. When a range of values is described herein, unless otherwise stated, the range is intended to include the endpoints thereof and all integers and fractions within the range.
The singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. "optional" or "any" means that the subsequently described event or events may or may not occur, and that the description includes instances where the event occurs and instances where it does not.
Approximating language, as used herein throughout the specification and claims, is intended to modify a quantity, such that the invention is not limited to the specific quantity, but includes portions that are literally received for modification without substantial change in the basic function to which the invention is related. Accordingly, the use of "about" to modify a numerical value means that the invention is not limited to the precise value. In some instances, the approximating language may correspond to the precision of an instrument for measuring the value. In the present description and claims, range limitations may be combined and/or interchanged, including all sub-ranges contained therein if not otherwise stated.
In addition, the indefinite articles "a" and "an" preceding an element or component of the invention are not intended to limit the number requirement (i.e., the number of occurrences) of the element or component. Thus, "a" or "an" should be read to include one or at least one, and the singular form of an element or component also includes the plural unless the stated number clearly indicates that the singular form is intended.
In order to solve the above-mentioned technical problem, a first aspect of the present invention provides a solder alloy including at least: sn, Ag, Cu, Bi, Sb.
In a preferred embodiment, the solder alloy of the present invention further includes Ni, Co, and In.
The solder alloy contains Sn, Ag, and,Cu is a common ternary eutectic solder, but the formed melting point is low, the drop resistance, the thermal shock resistance and the aging resistance of the ternary eutectic solder are required to be further improved, and when any one of Bi, Sb, Ni, Co and In is added into the system, the phenomenon can be well relieved, and the phenomenon is probably that bulk Ag is formed In Sn, Ag and Cu systems 3 The fracture boundary generated by Sn compound reduces the drop impact performance, and when any one of Bi, Sb, Ni, Co and In is added into the system, the Bi, Sb and Ni, Co and In act synergistically with Sn, Ag and Cu, and the formed compound second phase intermetallic compound reduces Ag 3 The generation of Sn compound, and the induction to the heat load is relatively slow, so the coarsening resistance of crystal grains is improved, the drop resistance, the thermal shock resistance, the ageing resistance and the thermal cycle performance are improved, especially when Bi, Sb, Ni, Co and In act together with Sn, Ag and Cu, the diffusion of Cu and the growth of an interface second phase intermetallic compound can be effectively inhibited, the disintegration process of the reliability of welding spots is delayed, the service life of the product is prolonged, and the ageing resistance is improved.
In a preferred embodiment, Ag accounts for 0.5-4.0 wt% of the solder alloy; cu accounts for 0.2-1.0 wt% of the soldering tin alloy; bi accounts for 1.0-6.0 wt% of the soldering tin alloy; sb accounts for 0.5-5.0 wt% of the soldering tin alloy; co accounts for 0.01-0.4 wt% of the soldering tin alloy; ni accounts for 0.01-0.4 wt% of the soldering tin alloy; in accounts for 0.1-1.5 wt% of the solder alloy, and the balance is Sn.
In a more preferred embodiment, Ag comprises 1 to 3 wt% of the solder alloy; cu accounts for 0.4-0.9 wt% of the solder alloy.
In a most preferred embodiment, Ag comprises 3.0 wt% of the solder alloy in weight percent; cu accounts for 0.5 wt% of the solder alloy.
In a more preferred embodiment, Bi is present in an amount of 2.0 to 5.0 wt% of the solder alloy.
In a most preferred embodiment, Bi comprises 3.5 wt% of the solder alloy, in weight percent.
In a more preferred embodiment, Sb comprises 1.0 to 4.0 wt% of the solder alloy in terms of weight percent.
In a more preferred embodiment, Co accounts for 0.01 to 0.2 wt% of the solder alloy, and Ni accounts for 0.02 to 0.2 wt% of the solder alloy.
In a more preferred embodiment, In is 0.15 to 1.0 wt% of the solder alloy.
In the system, the contents of the raw materials of all the substances are synergistic, the Ag content needs to be controlled to be 0.5-4.0 wt%, when the silver content is higher, the cost is wasted, and the Ag content in the system can be increased 3 The Sn compound causes the degradation of aging resistance, cold-hot circulation performance and tensile property, when the silver content is smaller, the melting range is widened, and the wetting property is reduced; the Cu content is 0.2-1.0 wt%, when the copper content is higher, the brittleness of the alloy is improved, the fatigue resistance is reduced, and when the copper content is lower, the creep resistance is reduced; bi content of 1.0-6.0 wt%, Sb content of 0.5-5.0 wt%; when the content of Bi or Sb is high, the phenomenon of splashing in the soldering process can be caused due to the balance among compounds being broken; when the content is reduced, the second phase intermetallic compounds of the material are reduced, and the thermal fatigue resistance and toughness of the material are reduced. The Ni content is 0.01-0.4 wt%, the Co content is 0.01-0.4 wt%, when the Ni or Co content is reduced, the wettability of the material is reduced, and when the Ni or Co content is higher, the balance among the compounds is broken, which may cause the splashing phenomenon in the soldering process.
The second aspect of the present invention provides a method for preparing a solder alloy, the method at least comprising the steps of: and mixing Sn, Ag, Cu, Bi, Sb, Ni, Co and In according to a ratio, and melting and homogenizing the obtained metal mixture In a melting furnace to obtain the alloy.
It should be noted that the following examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention, and that the insubstantial modifications and adaptations of the present invention by those skilled in the art based on the above disclosure are still within the scope of the present invention.
In addition, the raw materials used are commercially available from national chemical reagents, unless otherwise specified.
Examples
In order to better understand the technical solutions, the technical solutions will be described in detail with reference to specific embodiments. It is to be noted that the following examples are given solely for the purpose of illustration and are not to be construed as limitations on the scope of the invention, as many insubstantial modifications and variations of the invention described above will now occur to those skilled in the art. In addition, the raw materials are commercially available and the extraction methods of the extract are all conventional extraction methods, if not otherwise specified.
Example 1
Providing a soldering tin alloy, wherein Ag accounts for 3.0 wt% of the soldering tin alloy in percentage by weight; cu accounts for 0.5 wt% of the solder alloy; bi accounts for 3.5 wt% of the solder alloy; sb accounts for 1.5 wt% of the solder alloy; co accounts for 0.03 wt% of the solder alloy; ni accounts for 0.05 wt% of the solder alloy; in accounts for 0.2 wt% of the solder alloy, and the balance is Sn.
The preparation method of the soldering tin alloy comprises the following steps: mixing Sn, Ag, Cu, Bi, Sb, Ni, Co and In according to a ratio, and melting and homogenizing the obtained metal mixture In a melting furnace to obtain the alloy;
the preparation method of the solder paste comprises the following steps:
(1) preparing the obtained soldering tin alloy into soldering tin powder for later use by using a centrifugal atomization device;
(2) mixing the components in a mass ratio of 11.5: 88.5, adding the flux paste and the soldering tin powder into a double-planet stirrer, and mixing and stirring at the rotating speed of 40 rpm; obtaining the product;
wherein the grain size distribution of the welding powder is 4# which accords with the IPC J-std-005 and J-std-006 definitions;
the solder paste comprises the following raw materials, by weight, 15 parts of sebacic anhydride, 20 parts of disproportionated rosin, 60415 parts of acrylic acid modified rosin ke, 0.5 part of benzotriazole, 15 parts of diethylene glycol hexyl ether, 15 parts of diethylene glycol butyl ether, 8 parts of polyamide wax thickener clavevalley super, 5 parts of azelaic acid, 1 part of picolinic acid, 1.5 parts of dibromobutenediol and 4 parts of suberic acid.
Example 2
Providing a soldering tin alloy, wherein Ag accounts for 3.0 wt% of the soldering tin alloy in percentage by weight; cu accounts for 0.5 wt% of the solder alloy; bi accounts for 3.5 wt% of the solder alloy; sb accounts for 1.5 wt% of the solder alloy; ni accounts for 0.05 wt% of the solder alloy; in accounts for 0.2 wt% of the solder alloy, and the balance is Sn.
The preparation method of the soldering tin alloy comprises the following steps: mixing Sn, Ag, Cu, Bi, Sb, Ni and In according to a ratio, melting the obtained metal mixture In a melting furnace and homogenizing to obtain the metal-containing composite material.
The solder paste was prepared in a similar manner to example 1.
Example 3
Providing a soldering tin alloy, wherein Ag accounts for 3.0 wt% of the soldering tin alloy in percentage by weight; cu accounts for 0.5 wt% of the solder alloy; bi accounts for 3.5 wt% of the solder alloy; sb accounts for 1.5 wt% of the solder alloy; co accounts for 0.03 wt% of the solder alloy; in accounts for 0.2 wt% of the solder alloy, and the balance is Sn.
The preparation method of the soldering tin alloy comprises the following steps: mixing Sn, Ag, Cu, Bi, Sb, Co and In according to a ratio, melting the obtained metal mixture In a melting furnace and homogenizing to obtain the metal material.
The solder paste was prepared in a similar manner to example 1.
Example 4
Providing a soldering tin alloy, wherein Ag accounts for 3.0 wt% of the soldering tin alloy in percentage by weight; cu accounts for 0.5 wt% of the solder alloy; bi accounts for 3.5 wt% of the solder alloy; co accounts for 0.03 wt% of the solder alloy; ni accounts for 0.05 wt% of the solder alloy; in accounts for 0.2 wt% of the solder alloy, and the balance is Sn.
The preparation method of the soldering tin alloy comprises the following steps: and mixing Sn, Ag, Cu, Bi, Ni, Co and In according to a ratio, and melting and homogenizing the obtained metal mixture In a melting furnace to obtain the alloy.
The solder paste was prepared in a similar manner to example 1.
Example 5
Providing a soldering tin alloy, wherein Ag accounts for 5.0 wt% of the soldering tin alloy in percentage by weight; cu accounts for 1.5 wt% of the solder alloy; bi accounts for 3.5 wt% of the solder alloy; sb accounts for 1.5 wt% of the solder alloy; co accounts for 0.03 wt% of the solder alloy; ni accounts for 0.05 wt% of the solder alloy; in accounts for 0.2 wt% of the solder alloy, and the balance is Sn.
The preparation method of the soldering tin alloy comprises the following steps: and mixing Sn, Ag, Cu, Bi, Sb, Ni, Co and In according to a ratio, and melting and homogenizing the obtained metal mixture In a melting furnace to obtain the alloy.
The solder paste was prepared in a similar manner to example 1.
Example 6
Providing a soldering tin alloy, wherein Ag accounts for 1.0 wt% of the soldering tin alloy in percentage by weight; cu accounts for 1.3 wt% of the solder alloy; bi accounts for 3.5 wt% of the solder alloy; sb accounts for 1.5 wt% of the solder alloy; co accounts for 0.03 wt% of the solder alloy; ni accounts for 0.05 wt% of the solder alloy; in accounts for 0.2 wt% of the solder alloy, and the balance is Sn.
The preparation method of the soldering tin alloy comprises the following steps: mixing Sn, Ag, Cu, Bi, Sb, Ni, Co and In according to a ratio, melting the obtained metal mixture In a melting furnace and homogenizing to obtain the metal-containing composite material.
The solder paste was prepared in a similar manner to example 1.
Example 7
Providing a soldering tin alloy, wherein Ag accounts for 3.0 wt% of the soldering tin alloy in percentage by weight; cu accounts for 0.5 wt% of the solder alloy; bi accounts for 7.0 wt% of the solder alloy; sb accounts for 3.5 wt% of the solder alloy; co accounts for 0.03 wt% of the solder alloy; ni accounts for 0.05 wt% of the solder alloy; in accounts for 0.2 wt% of the solder alloy, and the balance is Sn.
The preparation method of the soldering tin alloy comprises the following steps: and mixing Sn, Ag, Cu, Bi, Sb, Ni, Co and In according to a ratio, and melting and homogenizing the obtained metal mixture In a melting furnace to obtain the alloy.
The solder paste was prepared in a similar manner to example 1.
Example 8
Providing a soldering tin alloy, wherein Ag accounts for 3.0 wt% of the soldering tin alloy in percentage by weight; cu accounts for 0.5 wt% of the solder alloy; bi accounts for 3.5 wt% of the solder alloy; sb accounts for 1.5 wt% of the solder alloy; co accounts for 0.03 wt% of the solder alloy; ni accounts for 0.05 wt% of the solder alloy; in accounts for 2.0 wt% of the solder alloy, and the balance is Sn.
The preparation method of the soldering tin alloy comprises the following steps: and mixing Sn, Ag, Cu, Bi, Sb, Ni, Co and In according to a ratio, and melting and homogenizing the obtained metal mixture In a melting furnace to obtain the alloy.
The solder paste was prepared in a similar manner to example 1.
Example 9
Provides a solder alloy SCA305, and the manufacturer is American love law.
The solder paste was prepared in a similar manner to example 1.
Evaluation of Performance
1. Aging resistance:
placing the solder pastes obtained in the examples 1 and 9 at 150 ℃ for 480h, and recording the anti-aging conditions of the solder pastes at 240h and 480 h; the results are shown in FIGS. 1 and 2;
the solder pastes prepared in examples 1 to 9 were respectively placed at 150 ℃ for 480 hours and tested for aging resistance; the results are shown in table 1 below;
and (4) judging the standard: the anti-aging performance of the solder paste obtained in example 1 after being placed for 480 hours at 150 ℃ is compared, and the grade can be excellent, good, common and poor.
2. Cold-hot cycling, thermal fatigue:
the solder pastes prepared in the embodiments 1 and 9 are respectively subjected to a cold-hot cycle test at a temperature of between 40 ℃ below zero and 125 ℃ according to a JESD22A121 test method, and are cycled for 1000 circles to test the thermal fatigue resistance; the circulating unit is as follows: heating to 125 deg.C at-40 deg.C for 15min, maintaining at 125 deg.C for 30min, cooling to-40 deg.C from 125 deg.C for 15min, and maintaining at-40 deg.C for 30 min; the results are shown in FIGS. 3 and 4;
the solder pastes prepared in the embodiments 1 to 9 are respectively subjected to a cold-hot cycle test at a temperature of between 40 ℃ below zero and 125 ℃ according to a JESD22A121 test method, and are cycled for 1000 circles to test the thermal fatigue resistance; the circulation unit is as described above; the test results are shown in table 1 below;
and (4) judging the standard: the thermal fatigue resistance of example 1 was measured as a comparison and the grades could be excellent, good, fair, poor.
3. Tensile strength: the tensile strength was measured by mounting each of the solder pastes prepared in examples 1 to 9 (weight: about 170g, total length: 170mm, width: 10mm and thickness: 10mm) in a universal testing machine AG-10kIS manufactured by Shimadzu corporation at a tensile rate of 6 mm/min; the test results are shown in table 1 below.
4. Wetting time: the solder pastes prepared in example 1 were tested for wetting time according to the IPC-tm-6502.4.45 test method, and the test results are shown in table 1 below.
TABLE 1 test results
| Aging resistance | Fatigue resistance | Tensile strength/MPa | Wetting time/s | |
| Example 1 | Superior food | Superior food | 44.3 | 0.7 |
| Example 2 | In general terms | In general | 42.0 | / |
| Example 3 | In general | In general terms | 42.5 | / |
| Example 4 | In general | In general | 39.8 | / |
| Example 5 | Good wine | Good quality | 38.9 | / |
| Example 6 | Good wine | Good wine | 40.1 | / |
| Example 7 | Good wine | Good quality | 37.6 | / |
| Example 8 | Good wine | Good quality | 39.4 | / |
| Example 9 | Is poor | Is poor | 38.9 | / |
The foregoing examples are merely illustrative and serve to explain some of the features of the method of the present invention. The appended claims are intended to claim as broad a scope as is contemplated, and the examples presented herein are merely illustrative of selected implementations in accordance with all possible combinations of examples. Accordingly, it is applicants' intention that the appended claims are not to be limited by the choice of examples illustrating features of the invention. Also, where numerical ranges are used in the claims, subranges therein are included, and variations in these ranges are also to be construed as possible being covered by the appended claims.
Claims (2)
1. A solder alloy, comprising at least: sn, Ag, Cu, Bi, Sb;
the soldering tin alloy also comprises Ni, Co and In;
according to the weight percentage, Ag accounts for 3.0 wt% of the soldering tin alloy; cu accounts for 0.5 wt% of the solder alloy; bi accounts for 3.5 wt% of the solder alloy; sb accounts for 1.5 wt% of the solder alloy; co accounts for 0.03 wt% of the solder alloy; ni accounts for 0.05 wt% of the solder alloy; in accounts for 0.2 wt% of the solder alloy, and the balance is Sn.
2. A method of manufacturing a solder alloy according to claim 1, wherein the method includes at least the steps of: and mixing Sn, Ag, Cu, Bi, Sb, Ni, Co and In according to a ratio, and melting and homogenizing the obtained metal mixture In a melting furnace to obtain the alloy.
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|---|---|---|---|---|
| US8691143B2 (en) * | 2005-06-03 | 2014-04-08 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
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| CN102174676A (en) * | 2011-01-27 | 2011-09-07 | 天津大学 | Preparation method for stannum, indium and stibium series lead-free solder tinning copper strip used for solar battery |
| US10518362B2 (en) * | 2015-07-24 | 2019-12-31 | Harima Chemicals, Incorporated | Solder alloy, solder paste, and electronic circuit board |
| JP6052381B2 (en) * | 2015-12-24 | 2016-12-27 | 千住金属工業株式会社 | Lead-free solder alloy |
| CN107931883A (en) * | 2017-11-29 | 2018-04-20 | 广西厚思品牌策划顾问有限公司 | A kind of solder alloy and preparation method thereof |
| CN108203776A (en) * | 2017-12-21 | 2018-06-26 | 柳州智臻智能机械有限公司 | A kind of high-strength tin spelter soldering alloy and preparation method thereof |
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2020
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