CN112447933A

CN112447933A - Laser peeling device and laser peeling machine

Info

Publication number: CN112447933A
Application number: CN201910741583.6A
Authority: CN
Inventors: 叶昱均
Original assignee: Incoflex Semiconductor Technology Ltd
Current assignee: Incoflex Semiconductor Technology Ltd
Priority date: 2019-08-12
Filing date: 2019-08-12
Publication date: 2021-03-05

Abstract

The embodiment of the disclosure relates to a laser stripping device and a laser stripping machine. The device comprises a laser, a laser control unit and a control unit, wherein the laser is used for emitting a preset laser beam; the beam amplifier is positioned in the light outgoing direction of the laser and is used for amplifying the light spot of the preset laser beam to a preset multiple; the beam shaper is positioned in the light outgoing direction of the beam amplifier and is used for shaping the laser beam amplified to a preset multiple to form a flat-topped beam; the galvanometer is positioned in the light outgoing direction of the beam shaper and used for controlling and changing the transmission direction of the flat-topped beam through the X scanning mirror and the Y scanning mirror to form a movable scanning beam; and the focusing lens is positioned in the light emergent direction of the vibrating mirror and used for focusing and irradiating the mobile scanning light beam output by the vibrating mirror to the surface of the flexible substrate to be stripped.

Description

Laser peeling device and laser peeling machine

Technical Field

The embodiment of the disclosure relates to the technical field of display, in particular to a laser stripping device and a laser stripping machine for stripping a flexible substrate.

Background

In recent years, the technology of the flexible display device is rapidly developed, and compared with the traditional glass rigid display device, the flexible display device has the advantages of impact resistance, strong shock resistance, light weight, small volume, wearability and the like. Flexible display devices currently use flexible substrates widely, but flexible substrates are too flexible and pose a challenge to various film forming processes. Therefore, a Carrier glass (Carrier glass) with good surface flatness and rigidity is generally required in the process of manufacturing a flexible substrate. After the flexible substrate is prepared, the flexible substrate needs to be peeled off from the carrier glass. Therefore, the effective peeling of the flexible substrate and the carrier glass is one of the key technologies for producing flexible display devices, namely, the release technology.

In the related art, a Laser Lift-off (LLO) technique is widely used for releasing the flexible substrate, such as a Laser release technique using a gas Laser, e.g., an Excimer Laser (Excimer Laser), or a DPSSL Laser release technique using a Diode-pumped Solid-State Laser (DPSSL) to generate a Solid-State Laser. With regard to the above technical solutions, the inventors have found that at least some of the following technical problems exist: the existing equipment adopting the laser stripping technology, such as a laser stripping machine, has huge volume and extremely high cost. Accordingly, there is a need to ameliorate one or more of the problems with the related art solutions described above.

It is noted that this section is intended to provide a background or context to the embodiments of the disclosure that are recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.

Disclosure of Invention

An object of the embodiments of the present disclosure is to provide a laser lift off device and a laser lift off machine, thereby overcoming, at least to some extent, one or more of the problems due to the limitations and disadvantages of the related art.

The embodiment of the present disclosure provides a laser lift-off device, which includes:

a laser for emitting a preset laser beam;

the beam amplifier is positioned in the light outgoing direction of the laser and is used for amplifying the light spot of the preset laser beam to a preset multiple;

the beam shaper is positioned in the light outgoing direction of the beam amplifier and is used for shaping the laser beam amplified to a preset multiple to form a flat-topped beam;

the galvanometer is positioned in the light outgoing direction of the beam shaper and used for controlling and changing the transmission direction of the flat-topped beam through the X scanning mirror and the Y scanning mirror to form a movable scanning beam;

and the focusing lens is positioned in the light emergent direction of the vibrating mirror and used for focusing and irradiating the mobile scanning light beam output by the vibrating mirror to the surface of the flexible substrate to be stripped.

In an embodiment of the present disclosure, the focusing lens comprises a flat-field focusing lens.

In an embodiment of the present disclosure, the wavelength of the predetermined laser beam emitted by the laser is 300-360 nm.

In an embodiment of the present disclosure, the predetermined laser beam emitted by the laser includes a pulse laser beam.

In an embodiment of the present disclosure, a pulse width of the pulse laser beam is 1-50 ps.

In an embodiment of the present disclosure, the pulsed laser beam includes a nanosecond, picosecond, or femtosecond laser beam.

In an embodiment of the present disclosure, the energy of the predetermined laser beam is 100mJ/cm²～400mJ/cm²。

In an embodiment of the present disclosure, the preset multiple is 2-20 times; and/or the moving scanning beam comprises rectangular beams, and the overlapping coverage rate between the previous rectangular beam and the next adjacent rectangular beam is 10-30%.

In an embodiment of the present disclosure, the laser further includes a controller, electrically connected to the laser and the galvanometer, for controlling the working mode and working parameters of the laser and controlling the movement of the galvanometer.

The embodiment of the present disclosure further provides a laser peeling machine, including:

the laser lift-off device described in any of the above embodiments;

the bearing platform is positioned below the focusing lens in the laser stripping device and used for bearing the flexible substrate to be stripped;

and the control driving mechanism is connected with the bearing platform and used for driving the bearing platform to move so as to drive the flexible substrate to move to complete the laser stripping process.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

in the embodiment of the disclosure, through the laser stripping device, the self-made laser stripping equipment is adopted to carry out the release treatment and the like of the flexible substrate, the device has a relatively simple structure, so that the volume of the laser stripping equipment is reduced, the cost is greatly reduced, and the release treatment effect is better.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.

FIG. 1 shows a schematic view of a laser lift-off device in an exemplary embodiment of the present disclosure;

FIG. 2 illustrates a schematic diagram of rectangular beam coincidence in an exemplary embodiment of the present disclosure;

FIG. 3 shows a schematic view of a laser debonder in an exemplary embodiment of the present disclosure.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Furthermore, the drawings are merely schematic illustrations of embodiments of the disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted. Some of the block diagrams shown in the figures are functional entities and do not necessarily correspond to physically or logically separate entities.

The existing laser stripper mainly comprises an imported machine, and some domestic machines, such as a laser stripper with the equipment model of HAN' S DSI elog 6, are technologies and complete sets of equipment suitable for laser stripping of a flexible display module and a glass substrate in the production of flexible OLEDs in panel factories. However, the current laser stripper equipment is bulky and very expensive.

First, in the present exemplary embodiment, a laser lift-off apparatus is provided. Referring to fig. 1, the laser lift-off device may include a laser 10, a beam expander 20, a beam shaper 30, a galvanometer 40, and a focusing lens 50. Wherein, the laser 10 is used for emitting a preset laser beam; the beam amplifier 20 is located in the light emitting direction of the laser 10 and is configured to amplify the light spot of the preset laser beam to a preset multiple; the beam shaper 30 is located in the light-emitting direction of the beam amplifier 20 and is used for shaping the laser beam amplified to a preset multiple to form a flat-top beam; the galvanometer 40 is positioned in the light outgoing direction of the beam shaper 30 and is used for controlling and changing the transmission direction of the flat-topped beam through X and Y scanning mirrors (41, 42) to form a moving scanning beam; the focusing lens 50 is located in the light outgoing direction of the galvanometer 40, and is configured to focus and irradiate the moving scanning beam output by the galvanometer 40 onto the surface of the flexible substrate to be peeled.

Through the laser stripping device of above-mentioned example, adopt self-made laser to peel off equipment and carry out leaving type processing etc. of flexible substrate, the device structure is simple relatively for laser peels off equipment volume and reduces, and the cost very reduces, and leaves type treatment effect better.

Next, each part of the above-described laser lift-off device in the present exemplary embodiment will be described in more detail with reference to fig. 1 to 2.

In an embodiment of the present disclosure, the laser 10 is used to emit a predetermined laser beam. Illustratively, the laser 10 may include, but is not limited to, a solid state laser or the like. In an embodiment of the disclosure, in order to achieve a better peeling effect of the release treatment, a wavelength of a predetermined laser beam emitted by the laser 10 may be 300 to 360nm, for example, 343nm or 355nm, that is, the embodiment may perform the peeling treatment by using an ultraviolet laser, but the embodiment is not limited thereto.

In order to achieve a better peeling effect of the release treatment, in an embodiment of the disclosure, the predetermined laser beam emitted by the laser 10 includes a pulse laser beam. For example, in an embodiment of the present disclosure, the pulse width of the pulsed laser beam may be 1-50 ps, such as 10ps, 20ps, 30ps, 40ps, 50ps, and the like. In an embodiment of the present disclosure, the pulsed laser beam may include a nanosecond, picosecond, or femtosecond laser beam. The inventor tests that the pulse laser beam can realize good release treatment on the transparent flexible substrate, and reduce or even avoid phenomena such as carbonization and scorching.

In an embodiment of the present disclosure, the energy of the predetermined laser beam may be 100mJ/cm²～400mJ/cm². For example 100mJ/cm²、200mJ/cm²、300mJ/cm²And the like. Optionally, in an example, in order to achieve a better peeling effect of the release treatment, the energy of the preset laser beam may be 150mJ/cm²～350mJ/cm²Specifically, it may be 150mJ/cm²、250mJ/cm²And so on.

In one embodiment of the present disclosure, the beam expander 20 may be a beam expansion assembly, such as a beam expansion assembly composed of a small number of lenses. The beam amplifier 20 is located in the light emitting direction of the laser 10, and is configured to amplify the light spot of the preset laser beam to a preset multiple. In one example, the preset multiple may be 2 to 20 times, such as 5 times, 10 times, 15 times, and the like. By the arrangement, the stripping effect of the release process of the flexible substrate can be improved on the whole by combining with the subsequent laser beam treatment.

In an embodiment of the present disclosure, the beam shaper 30 is located in the light outgoing direction of the beam amplifier 20, and is configured to shape the laser beam amplified to a predetermined multiple into a Flat-top beam (Flat-top). The light emitted by the laser 10 is typically a gaussian beam, and a flat-topped beam is generated by passing the gaussian beam through a beam shaper, such as a diffractive optic. The flat-top beam is a laser beam having almost uniform flux (energy density) in a circular region, and thus can improve the peeling effect of the release process of the flexible substrate.

In an embodiment of the present disclosure, the galvanometer 40 is located in the light outgoing direction of the beam shaper 30, and is configured to control and change the transmission direction of the flat-topped beam through an X-scan mirror 42 and a Y-scan mirror 41 to form a moving scanning beam. As for the specific structure of the galvanometer 40, etc., reference may be made to the prior art. For example, in order to further improve the peeling effect of the release process of the flexible substrate, as shown in fig. 2, the moving scanning beam may include a rectangular beam, and the overlapping coverage ratio between the previous rectangular beam 201 and the next rectangular beam 202 is 10% to 30%, that is, the area of the overlapping portion 203 occupies 10% to 30% of the area of the

rectangular beam

201 or 202. In this embodiment, a rectangular beam can be formed by moving a galvanometer, such as a high-speed galvanometer, at a high speed, and finally the rectangular beam is focused between, for example, glass and a polyimide PI substrate through a focusing lens to complete laser lift-off.

It should be noted that the laser beam can be regarded as one point, and the

rectangular beam

201 or 202 can be understood as a plane formed by the laser beams of the respective points when the high-speed galvanometer moves at a high speed, and can be regarded as a rectangular beam because the time is short. In a specific example, the high-speed galvanometer can form a

rectangular beam

201 or 202 of 100um x 100um under high-speed movement, and the rectangular beam can form a corresponding linear beam to irradiate the rectangular beam to the surface of the flexible substrate to be peeled after being focused. Due to the high speed of movement, it can be seen that a single rectangular beam of, for example, 100um x 100um, moves into focus and then splices into a linear beam of, for example, 0.1mm width by 750mm length. Thus, the peeling effect of the release process of the flexible substrate can be well improved through experiments.

Optionally, in order to further improve the peeling effect of the release process of the flexible substrate, for example, when the single rectangular light beam moves, a portion of the adjacent rectangular light beams overlaps and covers, and the coverage ratio is 10% to 30%, for example, 10%, 20%, 30%, and the like.

In an embodiment of the present disclosure, the focusing lens 50 is located in the light-emitting direction of the galvanometer 40, and for example, in an embodiment of the present disclosure, the focusing lens 50 may include, but is not limited to, a flat-field focusing lens (F-theta lens). The focusing lens 50 can focus and irradiate the moving scanning beam output by the galvanometer 40 onto the surface of the flexible substrate to be peeled, for example, the focusing lens 50 focuses the rectangular beam to form a linear beam (line beam) and irradiates the linear beam onto the surface of the flexible substrate to be peeled for peeling treatment, so as to further improve the peeling effect of the release process of the flexible substrate.

In one embodiment of the present disclosure, the apparatus further includes a controller (not shown), such as a programmable logic controller. The controller is electrically connected to the laser 10 and the galvanometer 40, and can be used for controlling the working mode and working parameters of the laser 10 and controlling the movement of the galvanometer 40. The operating parameters may include, but are not limited to, the energy, wavelength, and pulse width of the laser beam described above, among others.

The exemplary laser lift-off device in the above-mentioned embodiments of the present disclosure may include at least, but is not limited to, the following technical advantages as compared to a conventional line beam stripper:

i) the optical lens group can be reduced, the traditional line beam needs 30-40 groups of lenses, the existing mode can be achieved by only 10-15 groups of lenses, and the equipment cost is greatly reduced;

ii) the transparent substrate can be peeled off by using a laser source such as picosecond or femtosecond, thereby improving the carbonization problem;

iii) the glass substrate selection is not greatly influenced, and the overall equipment cost is low on the basis of ensuring a certain stripping effect.

The embodiment of the present disclosure further provides a laser peeling machine, which is shown in fig. 1 to 3 in a combined manner, and the laser peeling machine may include, but is not limited to, the laser peeling device, the carrying platform 60 and the control driving mechanism 70 described in any of the above embodiments.

For the laser lift-off device, reference may be made to the detailed description in the foregoing embodiments, which are not repeated herein. The carrying platform 60 is located below the focusing lens 50 in the laser lift-off device and is used for carrying the flexible substrate to be lifted off.

The control driving mechanism 70 is connected to the supporting platform 60, and is configured to drive the supporting platform 60 to move, so as to drive the flexible substrate to move, thereby completing the laser lift-off process. For example, the control driving mechanism 70 may be, for example, a motor driving mechanism or a cylinder driving mechanism, etc., which refer to the prior art, but is not limited thereto, and the control driving mechanism 70 may translate to drive the plane movement of the carrying platform 60. In this embodiment, the control driving mechanism 70 can drive the supporting platform 60 to drive the flexible substrate to peel off the flexible film in a large area, so that the production efficiency is greatly improved on the basis of ensuring a certain peeling effect.

It is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like in the foregoing description are used for indicating or indicating the orientation or positional relationship illustrated in the drawings, merely for the convenience of describing the disclosed embodiments and for simplifying the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and therefore should not be considered limiting of the disclosed embodiments.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless specifically limited otherwise.

In the embodiments of the present disclosure, unless otherwise specifically stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In the embodiments of the present disclosure, unless otherwise expressly specified or limited, the first feature "on" or "under" the second feature may comprise the first and second features being in direct contact, or may comprise the first and second features being in contact, not directly, but via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims

1. A laser lift-off device, comprising:

a laser for emitting a preset laser beam;

2. The laser lift off device of claim 1 wherein the focusing lens comprises a flat field focusing lens.

3. The laser lift-off device of claim 1, wherein the laser emits a predetermined laser beam having a wavelength of 300 to 360 nm.

4. The laser lift off device of claim 1 wherein the laser emits a predetermined laser beam comprising a pulsed laser beam.

5. The laser lift-off device according to claim 4, wherein the pulse width of the pulse laser beam is 1 to 50 ps.

6. The laser lift off device of claim 4, wherein the pulsed laser beam comprises a nanosecond, picosecond, or femtosecond laser beam.

7. The laser lift-off device according to any one of claims 1 to 6, wherein the predetermined laser beam is selected from the group consisting ofThe energy is 100mJ/cm²～400mJ/cm²。

8. The laser lift-off device according to claim 7, wherein the predetermined multiple is 2-20 times; and/or the moving scanning beam comprises rectangular beams, and the overlapping coverage rate between the previous rectangular beam and the next adjacent rectangular beam is 10-30%.

9. The laser lift off device of claim 7 further comprising a controller electrically connected to the laser and the galvanometer for controlling the mode and parameters of operation of the laser and controlling the movement of the galvanometer.

10. A laser debonder, comprising:

the laser lift-off device described in any one of the above claims 1 to 9;