CN112447406B - Multilayer ceramic electronic component - Google Patents

Multilayer ceramic electronic component Download PDF

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Publication number
CN112447406B
CN112447406B CN202010885174.6A CN202010885174A CN112447406B CN 112447406 B CN112447406 B CN 112447406B CN 202010885174 A CN202010885174 A CN 202010885174A CN 112447406 B CN112447406 B CN 112447406B
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conductive layer
base electrode
ceramic body
electrode
electronic component
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CN112447406A (en
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郑仁景
申东辉
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates

Abstract

The present disclosure provides a multilayer ceramic electronic component comprising: a ceramic body, and first and second external electrodes disposed on the ceramic body, wherein the first external electrode includes a first conductive layer disposed on a corner of the ceramic body and a first base electrode covering the first conductive layer, the second external electrode includes a second conductive layer disposed on a corner of the ceramic body and a second base electrode covering the second conductive layer, and wherein an area A of the first conductive layer disposed on the fifth surface of the ceramic body 1 Or an area A of the second conductive layer disposed on the sixth surface of the ceramic body 1 Area A of a section taken in the second direction and the first direction with the ceramic body 2 Ratio A of (2) 1 /A 2 In the range of 0.1 to 0.3.

Description

Multilayer ceramic electronic component
The present application claims the benefit of priority of korean patent application No. 10-2019-0108007 filed in the korean intellectual property office on 9.2.2019, the disclosure of which is incorporated herein by reference in its entirety.
Technical Field
The present disclosure relates to a multilayer ceramic electronic component.
Background
With the trend of electronic product size reduction, multilayer ceramic electronic components are required to have reduced size and increased capacitance.
In accordance with the demand for the reduced size and increased capacity of the multilayer ceramic electronic component, external electrodes of the multilayer ceramic electronic component are also designed to have a reduced thickness.
In order to form the external electrode, paste for the external electrode may be prepared by mixing a general conductive metal with glass, a base resin, an organic solvent, etc., and the paste for the external electrode may be applied to both surfaces of the ceramic body, and the metal in the external electrode may be sintered by firing the ceramic body.
The paste for the external electrodes, which can fill empty spaces when the metal is sintered and reduced and can also provide a bonding force between the external electrodes and the chip, can secure chip sealing performance and electrical connectivity to the chip, using conductive metal as a main material, and using glass as an auxiliary material.
However, as the multilayer ceramic electronic component has been designed to have a reduced size and a high capacitance, an increased number of layers of the internal electrode may be provided to secure the capacitance, and thus, the upper cover layer may be designed to have a reduced thickness.
Accordingly, when forming the external electrode, the internal electrode may be formed up to a region adjacent to the corner of the ceramic body and having a reduced thickness, so that the internal electrode may be easily exposed to physical and chemical impacts.
Further, since the external electrodes of the multilayer ceramic electronic component have a reduced thickness, the thickness of the external electrodes disposed adjacent to the corners of the ceramic body may be further reduced, so that corner coverage performance may be deteriorated and plating solution may infiltrate into the corners.
In addition, in the case where the external electrode is used in a high-capacity capacitor, a material that can be sintered at a low temperature may be used to reduce thermal shock when sintering the external electrode. In particular, in the plating process, the acid resistance of glass softened at low temperatures may be relatively weak. Due to the above properties, when a plating layer is formed on the outside of the external electrode, the plating solution may easily penetrate into the ceramic body, which may deteriorate moisture-proof reliability and may deteriorate product quality.
Disclosure of Invention
An aspect of the present disclosure is to provide a multilayer ceramic electronic component that may improve corner coverage performance of external electrodes to block moisture penetration paths, so that moisture-proof reliability may be improved and a tape portion of the external electrodes may have a reduced thickness.
According to an aspect of the present disclosure, a multilayer ceramic electronic component includes: a ceramic body, the ceramic body comprising: a capacitor forming part including a dielectric layer stacked in a first direction and a first and a second internal electrode, wherein the dielectric layer is arranged between the first internal electrodeAnd between the second inner electrodes; edge portions provided on both surfaces of the capacitance forming portion in the second direction; cover portions provided on both surfaces of the capacitance forming portion in the first direction; and the ceramic body has first and second surfaces opposite to each other in the first direction, third and fourth surfaces opposite to each other in the second direction, and fifth and sixth surfaces opposite to each other in the third direction; and a first external electrode and a second external electrode respectively disposed on the fifth surface and the sixth surface of the ceramic body, wherein the first external electrode includes a first conductive layer disposed on a corner of the ceramic body and a first base electrode covering the first conductive layer, the second external electrode includes a second conductive layer disposed on a corner of the ceramic body and a second base electrode covering the second conductive layer, and wherein an area A of the first conductive layer disposed on the fifth surface of the ceramic body 1 Or an area A of the second conductive layer disposed on the sixth surface of the ceramic body 1 Area A of a cross section of the ceramic body taken in the second direction and the first direction 2 Ratio A of (2) 1 /A 2 In the range of 0.1 to 0.3.
According to another aspect of the present disclosure, a multilayer ceramic electronic component includes: a ceramic body including a capacitance forming portion including a dielectric layer and first and second internal electrodes stacked in a first direction with the dielectric layer interposed therebetween, the ceramic body having first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in the second direction, and fifth and sixth surfaces opposing each other in the third direction; and a first external electrode and a second external electrode respectively disposed on the fifth surface and the sixth surface of the ceramic body, wherein the first external electrode comprises a first conductive layer, an electrode layer formed on the fifth surface and the sixth surface of the ceramic bodyThe first conductive layer is disposed on the fifth surface and extends in the third direction onto the first, second, third and fourth surfaces, the second external electrode comprises a second conductive layer disposed on the sixth surface and extends in the third direction onto the first, second, third and fourth surfaces, the first conductive layer comprises an opening penetrating the first conductive layer on the fifth surface, the second conductive layer comprises an opening penetrating the second conductive layer on the sixth surface, wherein the first external electrode further comprises a first base electrode covering the first conductive layer, the second external electrode further comprises a second base electrode covering the second conductive layer, and wherein the area a of the first conductive layer disposed on the fifth surface of the ceramic body 1 Or an area A of the second conductive layer disposed on the sixth surface of the ceramic body 1 Area A of a cross section of the ceramic body taken in the second direction and the first direction 2 Ratio A of (2) 1 /A 2 In the range of 0.1 to 0.3.
Drawings
The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which:
fig. 1 is a perspective view illustrating a multilayer ceramic electronic component according to an exemplary embodiment of the present disclosure;
fig. 2 is a perspective view illustrating a structure in which a conductive layer is disposed on a ceramic body of a multilayer ceramic electronic component according to an exemplary embodiment of the present disclosure;
fig. 3 is a perspective view illustrating a ceramic body of a multilayer ceramic electronic component according to an exemplary embodiment of the present disclosure;
FIG. 4 is a cross-sectional view taken along line I-I' in FIG. 1;
fig. 5 and 6 are diagrams illustrating a multilayer ceramic electronic component viewed in the a direction according to an exemplary embodiment of the present disclosure;
fig. 7 and 8 are diagrams illustrating a multilayer ceramic electronic component viewed in the a direction according to another exemplary embodiment of the present disclosure;
fig. 9 is a perspective view illustrating a multilayer ceramic electronic component according to another exemplary embodiment of the present disclosure;
FIG. 10 is a cross-sectional view taken along line II-II' in FIG. 9;
fig. 11 is a diagram illustrating a multilayer ceramic electronic component viewed in the B direction according to an exemplary embodiment of the present disclosure; and
fig. 12 is a diagram illustrating a multilayer ceramic electronic component viewed in the B direction according to another exemplary embodiment of the present disclosure.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.
It should be understood that the following exemplary description of the invention is not intended to limit the invention to the particular forms of the invention, but is intended to cover all modifications, similarities and alternatives falling within the spirit and scope of the invention. Like elements will be indicated by like reference numerals.
Some elements may be omitted or schematically illustrated for clarity of description, and the thickness of the elements may be exaggerated to clearly show layers and regions. The terms "comprising," "including," "configured to," and the like in the description are used for indicating the presence of features number, step, operation, element, section or combination thereof, and does not exclude the possibility of combining or adding one or more features, quantities, steps, operations, elements, portions or combinations thereof.
In the drawing, the X direction may be defined as an L direction or a length direction, the Y direction may be defined as a W direction or a width direction, and the Z direction may be defined as a T direction or a thickness direction. The Z direction may also be defined as a first direction, the Y direction may also be defined as a second direction, and the X direction may also be defined as a third direction.
Parameters used to describe such as one-dimensional dimensions of the element (including but not limited to length, width, thickness, diameter, distance, gap, and/or size), two-dimensional dimensions of the element (including but not limited to area and/or size), three-dimensional dimensions of the element (including but not limited to volume and/or size), and properties of the element (including but not limited to roughness, density, weight ratio, and/or molar ratio) may be obtained by the methods and/or tools described in this disclosure. However, the present disclosure is not limited thereto. Other methods and/or tools as would be appreciated by one of ordinary skill in the art may be used, even if not described in the present disclosure.
In the following description, a multilayer ceramic electronic component according to an exemplary embodiment will be described with reference to fig. 1 to 4.
Referring to fig. 1 to 4, the multilayer ceramic electronic component in an exemplary embodiment may include a ceramic body 110, and first and second external electrodes 131 and 132, the ceramic body 110 including a capacitance forming portion α W And alpha T Edge portion d and cover portion c, capacitance forming portion α W And alpha T The ceramic body 110 includes a dielectric layer 111 stacked in a first direction (Z direction) and first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed between the first and second internal electrodes 121 and 122, an edge portion d is provided on each of both surfaces of the capacitance forming portion in the second direction, a cover portion c is provided on each of both surfaces of the capacitance forming portion in the first direction, the ceramic body 110 has first and second surfaces S1 and S2 opposite to each other in the first direction (Z direction), third and fourth surfaces S3 and S4 opposite to each other in the second direction (Y direction), and fifth and sixth surfaces S5 and S6 opposite to each other in the third direction (X direction), the first and second external electrodes 131 and 132 are provided on the fifth and sixth surfaces S5 and S6 of the ceramic body 110, respectively, and the first external electrode may include first and first base electrodes 131a and 131b, the first conductive layer 131a is provided on the ceramic body 110, the first conductive layer 131a may cover the second conductive layer 132a, the second external electrode 132a may cover the second conductive layer 132a, and the second base electrode 132a may include the first and second conductive layer 132a.
When the first and second conductive layers 131a and 132a are respectively disposed on the corners of the ceramic body 110, the first and second conductive layers 131a and 132a may protect the inner electrode from external impact.
In order to achieve miniaturization and high capacitance of the multilayer ceramic electronic component and to ensure capacitance, a structure in which an increased number of internal electrode layers is provided and a cover having a reduced thickness is provided may be applied. In this case, when the external electrode is formed, the internal electrode may be formed to a region adjacent to the corner of the ceramic body (the region has a reduced thickness) so that the internal electrode may be easily exposed to physical impact and chemical impact.
Since the external electrodes of the multilayer ceramic electronic component have been designed to have a reduced thickness, the thickness of the external electrodes in the region adjacent to the corners of the ceramic body may be further reduced, so that corner coverage performance may be reduced and plating solution may infiltrate into the corners. In addition, when glass is applied to the external electrode, the acid resistance of the external electrode may be relatively weak in the plating process. Due to the above properties, when a plating layer is formed on the outer electrode, the plating solution may easily penetrate into the ceramic body, which may reduce moisture-proof reliability and may deteriorate product quality. In the multilayer ceramic electronic component 100 in the exemplary embodiment, the first conductive layer 131a and the second conductive layer 132a may be disposed on corners of the ceramic body 110, respectively, to prevent deterioration of moisture-proof reliability caused by infiltration of plating solution and/or infiltration of moisture.
According to an exemplary embodiment, the area a of the first conductive layer 131a disposed on the fifth surface S5 of the ceramic body 110 1 Or the area A of the second conductive layer 132a on the sixth surface S6 1 Area A of a cross section taken in the second direction (Y direction) and the first direction (Z direction) with the ceramic body 110 2 Ratio (A) 1 /A 2 ) May be in the range of 0.1 to 0.3.
Area A of a cross section of the ceramic body 110 taken in the second direction (Y direction) and the first direction (Z direction) 2 May be a value obtained by multiplying the width of the ceramic body by the thickness of the ceramic body. For example, it can be obtained by (d+α) W +d)×(c+α T +c) calculating said value. This isIn addition, the area a of the first conductive layer 131a disposed on the fifth surface S5 of the ceramic body 110 1 Or the area A of the second conductive layer 132a on the sixth surface S6 1 May refer to an area of the first conductive layer 131a covering the fifth surface S5 or an area of the second conductive layer 132a covering the sixth surface S6, or may refer to an area of the first conductive layer 131a disposed only on the fifth surface S5 or an area of the second conductive layer 132a on the sixth surface S6 of the ceramic body 110. Thus, the area a of the first conductive layer 131a disposed on the fifth surface S5 or the second conductive layer 132a disposed on the sixth surface S6 of the ceramic body 110 1 May refer to an area of the first conductive layer 131a or the second conductive layer 132a disposed on the surface of the ceramic body 110 in the second direction (Y direction) and the first direction (Z direction).
By setting the area of the first conductive layer 131a on the fifth surface S5 or the area a of the second conductive layer 132a on the sixth surface S6 of the ceramic body 110 1 Area A of a cross section taken in the second direction (Y direction) and the first direction (Z direction) with the ceramic body 110 2 Ratio (A) 1 /A 2 ) Configured within the above range (e.g., within the range of 0.1 to 0.3), the multilayer ceramic electronic component 100 in the exemplary embodiment may have improved corner coverage performance.
In an exemplary embodiment, the ceramic body 110 may include: capacitance forming part alpha W And alpha T Comprises a dielectric layer 111, a first internal electrode 121 and a second internal electrode 122; edge portion d provided at capacitance forming portion α W And alpha T Each of the two surfaces in the second direction (Y direction); and a cover part c arranged at the capacitance forming part alpha W And alpha T Each of the two surfaces in the first direction (Z direction).
The shape of the body 110 may not be limited to any particular shape, but as shown, the body 110 may have a hexahedral shape or a hexahedral-like shape. The body 110 may have a general hexahedral shape due to shrinkage of the ceramic powder included in the body 110 during the sintering process, although the hexahedral shape may not be an exact hexahedral shape formed by a straight line. The ceramic body 110 may have first and second surfaces S1 and S2 opposite to each other in a thickness direction (Z direction), third and fourth surfaces S3 and S4 connected to the first and second surfaces S1 and S2 and opposite to each other in a width direction (Y direction), and fifth and sixth surfaces S5 and S6 connected to the first and second surfaces S1 and S2 and the third and fourth surfaces S3 and S4 and opposite to each other in a length direction (X direction).
The ceramic body 110 may be formed by alternately stacking ceramic green sheets on which the first internal electrodes 121 are printed on the dielectric layer 111 and ceramic green sheets on which the second internal electrodes 122 are printed on the dielectric layer 111 in the thickness direction (Z direction).
In the capacitor forming part alpha W And alpha T The dielectric layers 111 and the first and second internal electrodes 121 and 122 may be alternately stacked. Is included in the capacitance forming part alpha W And alpha T The plurality of dielectric layers 111 in (a) may be in a sintered state, and boundaries between adjacent dielectric layers 111 may be integrated such that it may be difficult to identify the boundaries without using a Scanning Electron Microscope (SEM).
In an exemplary embodiment, the material of the dielectric layer 111 may not be limited to any specific material as long as sufficient capacitance is available. For example, the dielectric layer 111 may be formed using a barium titanate material, a perovskite material combined with lead, a strontium titanate material, or the like.
In addition, barium titanate (BaTiO) including various ceramic additives, organic solvents, coupling agents, dispersants, etc. may be used according to the intended purpose 3 ) Powder, or the like as a material of the dielectric layer 111.
For example, the dielectric layer 111 may be formed by providing a plurality of ceramic sheets formed by forming a dielectric layer containing a material such as barium titanate (BaTiO 3 ) Is coated on a carrier film and dried. The ceramic sheet may be formed by manufacturing a slurry formed of a mixture of ceramic powder, a binder, and a solvent and manufacturing a sheet having a thickness of several μm through a doctor blade process using the slurry, but the exemplary embodiment thereof is not limited thereto.
In the multilayer ceramic electronic component in the exemplary embodiment, the internal electrodes 121 and 122 may be alternately stacked to face each other with the dielectric layer 111 interposed therebetween. The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122, the first and second internal electrodes 121 and 122 being alternately disposed opposite to each other with the dielectric layer 111 interposed between the first and second internal electrodes 121 and 122.
The first internal electrode 121 may be exposed to one surface of the ceramic body 110 in the third direction (X direction), and a portion of the first internal electrode 121 exposed to one surface in the third direction (X direction) may be connected to the first external electrode 131. The second inner electrode 122 may be exposed to another surface of the ceramic body 110 in the third direction (X direction), and a portion of the second inner electrode 122 exposed to the other surface in the third direction (X direction) may be connected to the second outer electrode 132. The first and second internal electrodes 121 and 122 may be electrically isolated from each other with the dielectric layer 111 interposed therebetween.
The material of the first and second internal electrodes 121 and 122 may not be limited to any particular material, and may be formed using a conductive paste including one or more materials of silver (Ag), palladium (Pd), nickel (Ni), gold (Au), platinum (Pt), copper (Cu), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. As a method of printing the conductive paste, a screen printing method, a gravure printing method, or the like can be used, but the printing method is not limited thereto.
In the multilayer ceramic electronic component, the edge portion d may be provided at the capacitance forming portion α W And alpha T Each of the two surfaces in the second direction. The edge portion d may be provided at the capacitance forming portion α W And alpha T Each of the two surfaces in the second direction (Y direction) perpendicular to the first direction and the third direction (Z direction and X direction, respectively). The edge portion d can prevent damage to the internal electrode caused by physical stress or chemical stress.
The edge portion d may be formed using an insulating material, and may be formed using a ceramic material such as barium titanate or the like. In this case, the edge portion d may contain the same ceramic material as that contained in the dielectric layer 111, or may be formed using the same material as that of the dielectric layer 111.
Forming an edge portion dThe method is not limited to any particular method. For example, the edge portion d may be formed by: by including in the capacitance forming portion alpha W Is formed to be larger than the area of the inner electrode by coating the slurry containing ceramic, forms an edge region on the outer peripheral portion except for the portion of the inner electrode connected to the outer electrode, or is formed by forming a capacitor at the capacitor forming portion alpha W Is formed by attaching a dielectric sheet on each of both surfaces in the second direction (Y direction).
The multilayer ceramic electronic component in an exemplary embodiment may include a cover part c. The cover c may be disposed on the outermost areas of the first and second internal electrodes 121 and 122. The cover part c may be disposed on the lowermost inner electrode and the uppermost inner electrode. In this case, the covering portion c may be formed using the same composition as that of the dielectric layer 111, and may be formed by laminating at least one dielectric layer on the uppermost internal electrode and the lowermost internal electrode. The cover part c can prevent the damage of the internal electrode caused by physical stress or chemical stress.
In the multilayer ceramic electronic component in the exemplary embodiment, the first and second external electrodes 131 and 132 may be disposed on both surfaces of the ceramic body in the third direction (X direction). The first external electrode 131 may be electrically connected to the first internal electrode 121, and the second external electrode 132 may be electrically connected to the second internal electrode 122.
The first external electrode 131 may include a first conductive layer 131a disposed on a corner of the ceramic body 110 and a first base electrode 131b covering the first conductive layer 131a, and the second external electrode 132 may include a second conductive layer 132a disposed on a corner of the ceramic body 110 and a second base electrode 132b covering the second conductive layer 132 a. Fig. 2 is a perspective view showing a structure in which only the first conductive layer 131a and the second conductive layer 132a are disposed on the ceramic body 110. Referring to fig. 2, the first conductive layer 131a may be disposed on corners where the fifth surface S5 intersects the first surface S1, the second surface S2, the third surface S3, and the fourth surface S4. Further, the second conductive layer 132a may be disposed on corners where the sixth surface S6 intersects the first surface S1, the second surface S2, the third surface S3, and the fourth surface S4.
In an exemplary embodiment, the first conductive layer 131a may extend to the fifth surface S5 of the ceramic body 110 and the first, second, third, and fourth surfaces S1, S2, S3, and S4 in contact with the fifth surface S5. Further, the second conductive layer 132a may extend to the sixth surface S6 of the ceramic body 110 and the first, second, third and fourth surfaces S1, S2, S3 and S4 in contact with the sixth surface S6. Referring to fig. 2, the first conductive layer 131a may be disposed on a corner of the fifth surface S5 of the ceramic body 110 and may extend to the first, second, third, and fourth surfaces S1, S2, S3, and S4 of the ceramic body 110. The second conductive layer 132a may be disposed on a corner of the sixth surface S6 of the ceramic body 110, and may extend to the first, second, third, and fourth surfaces S1, S2, S3, and S4 of the ceramic body 110. Accordingly, when the first conductive layer 131a and the second conductive layer 132a are configured to cover each corner of the multilayer ceramic electronic component 100, the corners of the multilayer ceramic electronic component 100 (vulnerable areas of the multilayer ceramic electronic component 100) can be protected.
As in the above-described exemplary embodiments, when the first and second conductive layers 131a and 132a extend to the first, second, third, and fourth surfaces S1, S2, S3, and S4 of the ceramic body 110, and the first and second conductive layers 131a and 132a are disposed too close to each other, a short circuit may occur between the first and second conductive layers 131a and 132 a. Accordingly, the first conductive layer 131a and the second conductive layer 132a may be configured to be spaced apart from each other. The separation distance between the first conductive layer 131a and the second conductive layer 132a is not limited to any specific size. For example, the first conductive layer 131a and the second conductive layer 132a may be spaced apart from each other by a distance of 1/20 times or more and less than 1 time the length of the ceramic body 110, but the exemplary embodiment thereof is not limited thereto.
In an exemplary embodiment, an end portion of the first conductive layer 131a disposed on the fifth surface S5 of the ceramic body 110 may be in contact with the first internal electrode 121. In addition, an end portion of the second conductive layer 132a disposed on the sixth surface S6 of the ceramic body 110 may be in contact with the second internal electrode 122. The configuration in which the first conductive layer 131a and the second conductive layer 132a are in contact with the first internal electrode 121 and the second internal electrode 122, respectively, may mean that the first conductive layer 131a may be electrically connected to the first internal electrode 121, and the second conductive layer 132a may be electrically connected to the second internal electrode 122. The configuration may mean that a portion of the first internal electrode 121 exposed through the fifth surface S5 of the ceramic body 110 may be in physical contact with the first conductive layer 131a, and a portion of the second internal electrode 122 exposed through the sixth surface S6 of the ceramic body 110 may be in physical contact with the second conductive layer 132 a.
Referring to fig. 4, in the foregoing exemplary embodiment, the first conductive layer 131a may be formed with the capacitance forming portion α T The first inner electrode 121 of the inner is in contact. The second conductive layer 132a can be connected to the capacitor formation portion α T The second inner electrode 122 is in contact. When moisture permeates into the multilayer ceramic electronic component 100, the capacitance forming portion α in terms of the structure of the multilayer ceramic electronic component 100 T The area between the cover c and the cover c may be a point of vulnerability. This is because the points where the outermost inner electrodes 121 and 122 intersect the overcoat layer c may have the smallest mechanical strength due to the difference in sintering shrinkage between the dielectric layer 111 and the inner electrodes 121 and 122. In the multilayer ceramic electronic component 100 in the exemplary embodiment, the first conductive layer 131a and the second conductive layer 132a may be configured to be in contact with the first internal electrode 121 and the second internal electrode 122, respectively, so that the capacitance forming portion α may be improved T The corner of the point where the cover c intersects is covered, and thus, the moisture permeation path can be blocked in advance.
The first and second base electrodes 131b and 132b of the multilayer ceramic electronic component 100 in the exemplary embodiment may cover the first and second conductive layers 131a and 132a, respectively. A configuration in which the base electrodes 131b and 132b may cover the conductive layers 131a and 132a may mean that the base electrodes 131b and 132b may be disposed such that the conductive layers 131a and 132a may not be exposed to the outside, and the first conductive layer 131a and the second conductive layer 132a may be disposed in the first external electrode 131 and the second external electrode 132, respectively, such that only the first base electrode 131b and the second base electrode 132b may be visible from the outside.
In an exemplary embodiment, a central portion of the fifth surface S5 of the ceramic body 110 of the multilayer ceramic electronic component 100 may be in contact with the first base electrode 131b, and a central portion of the sixth surface S6 may be in contact with the second base electrode 132 b. The configuration in which the fifth surface S5 of the ceramic body 110 may be in contact with the first base electrode 131b may represent a structure in which the first conductive layer 131a may not be disposed on the central portion of the fifth surface S5 of the ceramic body 110, and the configuration in which the sixth surface S6 of the ceramic body 110 may be in contact with the second base electrode 132b may represent a structure in which the second conductive layer 132a may not be disposed on the central portion of the sixth surface S6 of the ceramic body 110. In an exemplary embodiment, the first conductive layer 131a and the second conductive layer 132a may be disposed on corners of the ceramic body 110, the first base electrode 131b may cover the first conductive layer 131a, and the second base electrode 132b may cover the second conductive layer 132a, so that moisture-proof reliability may be improved, conductivity may be maintained, and performance of the multilayer ceramic electronic component may be maintained.
Fig. 5 to 8 are diagrams showing the multilayer ceramic electronic component 100 shown in fig. 1 viewed in the a direction. Referring to fig. 5 and 6, in an exemplary embodiment, a region of the first base electrode 131b where the first conductive layer 131a is not disposed in the third direction (X direction) of the ceramic body 110 may have a quadrangular shape, and a region of the second base electrode 132b where the second conductive layer 132a is not disposed in the third direction (X direction) of the ceramic body 110 may have a quadrangular shape. When each of the region of the first base electrode 131b where the first conductive layer 131a is not disposed and the region of the second base electrode 132b where the second conductive layer 132a is not disposed has a quadrangular shape, a region covered by the outer electrode corners can be uniformly formed, so that the effect of preventing the penetration of the plating solution can be improved.
In one exemplary embodiment, a maximum width w in the Y direction and a maximum height h in the Z direction of the region where the first conductive layer is not provided and the region where the second conductive layer is not provided of each of the first base electrode and the second base electrode in the third direction may be smaller than a maximum width α in the Y direction of the capacitance forming portion, respectively W And maximum height alpha in Z direction T . Such widths and heights can be measured by standard methods that will be apparent to and understood by those of ordinary skill in the art.
Referring to fig. 7 and 8, in the multilayer ceramic electronic component 100 in another exemplary embodiment, a region of the first base electrode 131b where the first conductive layer 131a is not disposed in the third direction (X direction) of the ceramic body 110 may have a circular shape, and a region of the second base electrode 132b where the second conductive layer 132a is not disposed in the third direction (X direction) of the ceramic body 110 may have a circular shape. When each of the first base electrode 131b and the second base electrode 132b in which the first conductive layer 131a is not disposed and the second conductive layer 132a is not disposed has a circular shape, a moisture penetration path may be reduced, so that an effect of preventing penetration of a plating solution may be improved.
In an exemplary embodiment, the first conductive layer 131a, the second conductive layer 132a, the first base electrode 131b, and the second base electrode 132b may include the same conductive metal. As in the exemplary embodiment, when the first conductive layer 131a, the second conductive layer 132a, the first base electrode 131b, and the second base electrode 132b include the same conductive metal, the bonding property between the conductive layer and the base electrode may be improved, so that penetration of moisture may be effectively prevented.
In another exemplary embodiment, the first conductive layer 131a, the second conductive layer 132a, the first base electrode 131b, and the second base electrode 132b may include conductive metals, and the average particle size of the conductive metals included in the first base electrode 131b and the second base electrode 132b may be greater than the average particle size of the conductive metals included in the first conductive layer 131a and the second conductive layer 132 a. The average particle size of the conductive metal may refer to the particle size of D50 and may be measured using a particle size analyzer such as Shimadzu's SALD-7101. When the average particle size of the conductive metal contained in the first and second conductive layers 131a and 132a is smaller than the average particle size of the conductive metal contained in the first and second base electrodes 131b and 132b, the first and second conductive layers 131a and 132a may have a denser structure, so that moisture penetration preventing performance may be improved. Further, the density between the first and second conductive layers 131a and 132a and the first and second base electrodes 131b and 132b may be increased, so that moisture resistance reliability may be improved.
In an exemplary embodiment, the first conductive layer 131a, the second conductive layer 132a, the first base electrode 131b, and the second base electrode 132b may include copper (Cu). The first conductive layer 131a, the second conductive layer 132a, the first base electrode 131b, and the second base electrode 132b may include at most copper (Cu), but the exemplary embodiment thereof is not limited thereto. For example, the first conductive layer 131a, the second conductive layer 132a, the first base electrode 131b, and the second base electrode 132b may be formed using a conductive paste including glass and one or more materials of nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof.
The method of forming the first conductive layer 131a, the second conductive layer 132a, the first base electrode 131b, and the second base electrode 132b may not be limited to any particular method. For example, the first conductive layer 131a, the second conductive layer 132a, the first base electrode 131b, and the second base electrode 132b may be formed by immersing the ceramic body in a conductive paste containing a conductive metal and glass, printing the conductive paste on the surface of the ceramic body by a screen printing method or a gravure printing method, coating the conductive paste on the surface of the ceramic body, or transferring a dry film formed by drying the conductive paste on the ceramic body, but examples of the method are not limited thereto. Since the first conductive layer 131a, the second conductive layer 132a, the first base electrode 131b, and the second base electrode 132b are formed using the above-described conductive paste, sufficient conductivity can be maintained, and since the added glass can increase the density of the external electrode, penetration of plating solution and/or moisture can be effectively prevented.
The glass composition included in the first conductive layer 131a, the second conductive layer 132a, the first base electrode 131b, and the second base electrode 132b may include a mixture of various oxides, and may include one or more selected from the group consisting of silicon oxide, boron oxide, aluminum oxide, a transition metal oxide, an alkali metal oxide, and an alkaline earth metal oxide. The transition metal may be selected from the group consisting of zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni), the alkali metal may be selected from the group consisting of lithium (Li), sodium (Na), and potassium (K), and the alkaline earth metal may be selected from the group consisting of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba).
In another exemplary embodiment, the multilayer ceramic electronic component may include a first terminal electrode 231c disposed on the first base electrode 131b and a second terminal electrode 232c disposed on the second base electrode 132 b. Fig. 9 is a perspective view illustrating a multilayer ceramic electronic component 200 according to an exemplary embodiment, and fig. 10 is a sectional view taken along line II-II' in fig. 9. Referring to fig. 9 and 10, the first terminal electrode 231c of the first external electrode 231 and the second terminal electrode 232c of the second external electrode 232 may cover the first base electrode 231b and the second base electrode 232b, respectively. The first and second base electrodes 231b and 232b may cover the first and second conductive layers 231a and 232a, respectively, disposed on the corners of the ceramic body 210.
In an exemplary embodiment, the first terminal electrode 231c and the second terminal electrode 232c may be formed through a plating process. The first terminal electrode 231c and the second terminal electrode 232c may be formed through a sputtering process or an electrodeposition process, but the exemplary embodiment thereof is not limited thereto.
The first terminal electrode 231c and the second terminal electrode 232c may include at most nickel (Ni), but the exemplary embodiment thereof is not limited thereto. The first and second terminal electrodes 231c and 232c may include at least one of nickel (Ni), tin (Sn), copper (Cu), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. By including the first terminal electrode 231c and the second terminal electrode 232c, mounting properties with a substrate, structural reliability, durability against external impact, heat resistance, and/or Equivalent Series Resistance (ESR) value can be improved.
Table 1 below relates to a method for forming a conductive layer based on whether the first conductive layer and the second conductive layer are applied or not and based on the areas (a 1 ) Area (A) with the cross-sectional surface of the ceramic body 2 ) The thickness of the external electrode at the corner of the ceramic body and the maximum thickness of the external electrode. The thicknesses and areas described in table 1 may be measured or calculated by standard methods as will be apparent to and understood by those of ordinary skill in the art.
TABLE 1
Figure BDA0002655349040000131
In table 1, X indicates that no conductive layer is provided, and o indicates that a conductive layer is provided. As shown in table 1, in examples 1, 2 and 3, the thickness of the external electrode disposed on the corner of the ceramic body can be increased without affecting the maximum thickness of the external electrode, as compared with comparative example 1 in which the first and second conductive layers are not disposed. In addition, when A 1 /A 2 Above 30%, the total thickness of the external electrode may be greatly increased, so that it may be difficult to reduce the size of the assembly.
According to the foregoing exemplary embodiments, a multilayer ceramic electronic component that can improve corner coverage performance of external electrodes can be provided.
In addition, a multilayer ceramic electronic component having improved moisture resistance reliability can be provided.
In addition, a multilayer ceramic electronic component in which a moisture permeation path can be blocked and the tape portion of the external electrode can have a reduced thickness can be provided.
While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the invention as defined by the appended claims.

Claims (22)

1. A multilayer ceramic electronic component comprising:
a ceramic body, the ceramic body comprising:
A capacitance forming portion including a dielectric layer stacked in a first direction and first and second internal electrodes with the dielectric layer interposed therebetween;
edge portions provided on both surfaces of the capacitance forming portion in the second direction;
cover portions provided on both surfaces of the capacitance forming portion in the first direction; and is also provided with
The ceramic body has first and second surfaces opposite to each other in the first direction, third and fourth surfaces opposite to each other in the second direction, and fifth and sixth surfaces opposite to each other in the third direction; and
first and second external electrodes respectively provided on the fifth and sixth surfaces of the ceramic body,
wherein the first external electrode includes a first conductive layer disposed on a corner of the ceramic body and in direct contact with the fifth surface, and a first base electrode covering the first conductive layer, the second external electrode includes a second conductive layer disposed on a corner of the ceramic body and in direct contact with the sixth surface, and a second base electrode covering the second conductive layer,
Wherein the area A of the first conductive layer disposed on the fifth surface of the ceramic body 1 Or an area A of the second conductive layer disposed on the sixth surface of the ceramic body 1 Area A of a cross section of the ceramic body taken in the second direction and the first direction 2 Ratio A of (2) 1 /A 2 In the range of 0.1 to 0.3,
wherein the first conductive layer and the second conductive layer comprise conductive metal and glass, and
wherein the first base electrode and the second base electrode contain a conductive metal, and an average particle size of the conductive metal contained in the first base electrode and the second base electrode is larger than an average particle size of the conductive metal contained in the first conductive layer and the second conductive layer.
2. The multilayer ceramic electronic component according to claim 1,
wherein the first conductive layer extends to the fifth surface and the first, second, third and fourth surfaces in contact with the fifth surface of the ceramic body, and
wherein the second conductive layer extends to the sixth surface and the first, second, third and fourth surfaces in contact with the sixth surface of the ceramic body.
3. The multilayer ceramic electronic component of claim 2, wherein the first conductive layer extending to the first, second, third, and fourth surfaces and the second conductive layer extending to the first, second, third, and fourth surfaces are spaced apart from one another.
4. The multilayer ceramic electronic component of claim 1, wherein an end of the first conductive layer disposed on the fifth surface is in direct contact with the first internal electrode and an end of the second conductive layer disposed on the sixth surface is in direct contact with the second internal electrode.
5. The multilayer ceramic electronic component of any one of claims 1-4, wherein a central portion of the fifth surface of the ceramic body is in direct contact with the first base electrode and a central portion of the sixth surface of the ceramic body is in direct contact with the second base electrode.
6. The multilayer ceramic electronic component of any one of claims 1 to 4, wherein a region of the first base electrode where the first conductive layer is not disposed in the third direction of the ceramic body has a quadrangular shape, and a region of the second base electrode where the second conductive layer is not disposed in the third direction of the ceramic body has a quadrangular shape.
7. The multilayer ceramic electronic component of any one of claims 1 to 4, wherein a region of the first base electrode where the first conductive layer is not disposed in the third direction of the ceramic body has a circular shape, and a region of the second base electrode where the second conductive layer is not disposed in the third direction of the ceramic body has a circular shape.
8. The multilayer ceramic electronic component of any one of claims 1-4, wherein the first conductive layer, the second conductive layer, the first base electrode, and the second base electrode comprise the same conductive metal.
9. The multilayer ceramic electronic component according to any one of claim 1 to 4,
wherein each of the first and second internal electrodes comprises one or more of silver, palladium, nickel, gold, platinum, copper, tin, tungsten, titanium, and alloys thereof.
10. The multilayer ceramic electronic component of any one of claims 1-4, wherein the first conductive layer, the second conductive layer, the first base electrode, and the second base electrode comprise copper.
11. The multilayer ceramic electronic component of any one of claims 1 to 4, wherein the first and second external electrodes further comprise:
A first terminal electrode and a second terminal electrode respectively covering the first base electrode and the second base electrode.
12. The multilayer ceramic electronic component of any one of claims 1 to 4, wherein a maximum width in the second direction and a maximum height in the first direction of the region of the first base electrode on which the first conductive layer is not disposed are smaller than a maximum width in the second direction and a maximum height in the first direction of the capacitance forming portion, respectively, and a maximum width in the second direction and a maximum height in the first direction of the region of the second base electrode on which the second conductive layer is not disposed are smaller than a maximum width in the second direction and a maximum height in the first direction of the capacitance forming portion, respectively.
13. A multilayer ceramic electronic component comprising:
a ceramic body including a capacitance forming portion including dielectric layers stacked in a first direction and first and second internal electrodes with the dielectric layers being based between the first and second internal electrodes,
the ceramic body has first and second surfaces opposite to each other in the first direction, third and fourth surfaces opposite to each other in the second direction, and fifth and sixth surfaces opposite to each other in the third direction; and
First and second external electrodes respectively provided on the fifth and sixth surfaces of the ceramic body,
wherein the first external electrode includes a first conductive layer disposed on the fifth surface, in direct contact with the fifth surface and extending in the third direction onto the first, second, third and fourth surfaces, the second external electrode includes a second conductive layer disposed on the sixth surface, in direct contact with the sixth surface and extending in the third direction onto the first, second, third and fourth surfaces, the first conductive layer includes an opening penetrating the first conductive layer on the fifth surface, the second conductive layer includes an opening penetrating the second conductive layer on the sixth surface,
wherein the first external electrode further comprises a first base electrode covering the first conductive layer, the second external electrode further comprises a second base electrode covering the second conductive layer,
wherein the area A of the first conductive layer disposed on the fifth surface of the ceramic body 1 Or an area A of the second conductive layer disposed on the sixth surface of the ceramic body 1 And said at least one ofArea A of a cross section of the ceramic body taken in the second direction and the first direction 2 Ratio A of (2) 1 /A 2 In the range of 0.1 to 0.3,
wherein the first conductive layer and the second conductive layer comprise conductive metal and glass, and
wherein the first base electrode and the second base electrode contain a conductive metal, and an average particle size of the conductive metal contained in the first base electrode and the second base electrode is larger than an average particle size of the conductive metal contained in the first conductive layer and the second conductive layer.
14. The multilayer ceramic electronic component of claim 13, wherein the ceramic body further comprises:
edge portions provided on both surfaces of the capacitance forming portion in the second direction; and
and a cover portion provided on both surfaces of the capacitance forming portion in the first direction.
15. The multilayer ceramic electronic component of claim 13, wherein the first conductive layer extending to the first, second, third, and fourth surfaces and the second conductive layer extending to the first, second, third, and fourth surfaces are spaced apart from one another.
16. The multilayer ceramic electronic component of claim 13, wherein an end of the first conductive layer disposed on the fifth surface is in direct contact with the first internal electrode and an end of the second conductive layer disposed on the sixth surface is in direct contact with the second internal electrode.
17. The multilayer ceramic electronic component of any one of claims 13 to 16, wherein a region of the first base electrode where the first conductive layer is not disposed in the third direction of the ceramic body has a quadrangular shape, and a region of the second base electrode where the second conductive layer is not disposed in the third direction of the ceramic body has a quadrangular shape.
18. The multilayer ceramic electronic component of any one of claims 13 to 16, wherein a region of the first base electrode where the first conductive layer is not disposed in the third direction of the ceramic body has a circular shape, and a region of the second base electrode where the second conductive layer is not disposed in the third direction of the ceramic body has a circular shape.
19. The multilayer ceramic electronic component according to any one of claim 13 to 16,
Wherein each of the first and second internal electrodes comprises one or more of silver, palladium, nickel, gold, platinum, copper, tin, tungsten, titanium, and alloys thereof.
20. The multilayer ceramic electronic component of any one of claims 13-16, wherein the first conductive layer, the second conductive layer, the first base electrode, and the second base electrode comprise copper.
21. A multilayer ceramic electronic component comprising:
a ceramic body, the ceramic body comprising:
a capacitance forming portion including a dielectric layer stacked in a first direction and first and second internal electrodes with the dielectric layer interposed therebetween;
edge portions provided on both surfaces of the capacitance forming portion in the second direction;
cover portions provided on both surfaces of the capacitance forming portion in the first direction; and is also provided with
The ceramic body has first and second surfaces opposite to each other in the first direction, third and fourth surfaces opposite to each other in the second direction, and fifth and sixth surfaces opposite to each other in the third direction; and
First and second external electrodes respectively provided on the fifth and sixth surfaces of the ceramic body,
wherein the first external electrode comprises a first conductive layer and a first base electrode, the first conductive layer is arranged on the corner of the ceramic main body, the first base electrode covers the first conductive layer, the second external electrode comprises a second conductive layer and a second base electrode, the second conductive layer is arranged on the corner of the ceramic main body, the second base electrode covers the second conductive layer,
wherein a central portion of the fifth surface of the ceramic body is in direct contact with the first base electrode, and a central portion of the sixth surface of the ceramic body is in direct contact with the second base electrode, wherein the first and second conductive layers comprise a conductive metal and glass, and
wherein the first base electrode and the second base electrode contain a conductive metal, and an average particle size of the conductive metal contained in the first base electrode and the second base electrode is larger than an average particle size of the conductive metal contained in the first conductive layer and the second conductive layer.
22. A multilayer ceramic electronic component comprising:
a ceramic body including a capacitance forming portion including dielectric layers stacked in a first direction and first and second internal electrodes with the dielectric layers being based between the first and second internal electrodes,
the ceramic body has first and second surfaces opposite to each other in the first direction, third and fourth surfaces opposite to each other in the second direction, and fifth and sixth surfaces opposite to each other in the third direction; and
first and second external electrodes respectively provided on the fifth and sixth surfaces of the ceramic body,
wherein the first external electrode includes a first conductive layer disposed on the fifth surface and extending in the third direction to the first, second, third, and fourth surfaces, the second external electrode includes a second conductive layer disposed on the sixth surface and extending in the third direction to the first, second, third, and fourth surfaces, the first conductive layer includes an opening penetrating the first conductive layer on the fifth surface, the second conductive layer includes an opening penetrating the second conductive layer on the sixth surface,
Wherein the first external electrode further comprises a first base electrode covering the first conductive layer, the second external electrode further comprises a second base electrode covering the second conductive layer,
wherein the first base electrode passes through the opening of the first conductive layer and is in direct contact with the fifth surface, the second base electrode passes through the opening of the second conductive layer and is in direct contact with the sixth surface,
wherein the first conductive layer and the second conductive layer comprise conductive metal and glass, and
wherein the first base electrode and the second base electrode contain a conductive metal, and an average particle size of the conductive metal contained in the first base electrode and the second base electrode is larger than an average particle size of the conductive metal contained in the first conductive layer and the second conductive layer.
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