CN112440329B - Multilayer board punching method and punching machine with double-sided circuit based on layer deviation detection - Google Patents
Multilayer board punching method and punching machine with double-sided circuit based on layer deviation detection Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/007—Control means comprising cameras, vision or image processing systems
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
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Abstract
The invention relates to the technical field of multilayer board processing with double-sided circuits, in particular to a multilayer board punching method based on layer deviation detection and with double-sided circuits and a punching machine applying the method, wherein the method comprises the following steps: establishing a coordinate system and a reference circuit board punching installation position, wherein the reference circuit board punching installation position is provided with a reference board center and a deflection angle; sending the multilayer board with double-sided circuits into a circuit board punching installation position; obtaining the center of the plate surface and the deflection angle of the multilayer plate according to the plate surface targets of the first surface and the plate surface targets of the second surface of the multilayer plate; and comparing the plate center and the deflection angle of the multilayer plate with the reference plate center and the deflection angle to determine whether to punch the multilayer plate. According to the method, the plate surface target of the first surface and the plate surface target of the second surface of the multilayer plate are simultaneously grabbed as references, so that the punched positioning hole has higher precision.
Description
Technical Field
The invention relates to the technical field of multilayer board processing with double-sided circuits, in particular to a multilayer board punching method based on layer deviation detection and with double-sided circuits and a punching machine applying the method.
Background
The multilayer board with the double-sided circuit has a first side and a second side which are opposite to each other, wherein the first side and the second side are sometimes called as the upper side and the lower side of the multilayer board, or the front side and the back side, and the like, and the first side and the second side are provided with board targets (or called as positioning targets) with the same number and are in one-to-one correspondence.
At present, when a multilayer board with double-sided circuits is punched, only a single-sided board target of the multilayer board is generally collected, for example, a board target of a first side or a board target of a second side; then, calculating according to the collected plate surface target, and adjusting the position of the multilayer plate according to the calculation result so as to compensate the error of the multilayer plate; and then punching positioning holes on the multilayer board.
However, in the manufacturing process of the multilayer board, due to the expansion and contraction, the machining precision and the like, the difference between the targets of the two opposite surfaces of the multilayer board is often several micrometers to several tens of micrometers, that is, the two surfaces of the multilayer board have layer deviation, so the precision of the positioning hole punched by using the single-surface target as a reference is not enough, and therefore, improvement is urgently needed.
Disclosure of Invention
In view of the above, the present invention provides a multilayer board punching method with double-sided circuits based on layer deviation detection and a punching machine using the method, and mainly aims to solve the technical problem of how to improve the precision of positioning holes of a multilayer board.
In order to achieve the purpose, the invention mainly provides the following technical scheme:
in one aspect, an embodiment of the present invention provides a multilayer board punching method with double-sided circuits based on layer deviation detection, which includes the following steps: establishing a coordinate system and a reference circuit board punching installation position, wherein the reference circuit board punching installation position is provided with a reference board surface center and a deflection angle; sending the multilayer board with double-sided circuits into a circuit board punching installation position; obtaining the center of the plate surface and the deflection angle of the multilayer plate according to the plate surface targets of the first surface and the plate surface targets of the second surface of the multilayer plate; and comparing the plate surface center and the deflection angle of the multilayer plate with the reference plate surface center and the deflection angle to determine whether to punch the multilayer plate.
Optionally, the center and the deflection angle of the surface of the multilayer board are obtained according to the surface targets of the first surface and the second surface of the multilayer board, and specifically:
obtaining the plate surface center and the deflection angle of the first surface of the multilayer plate according to each plate surface target of the first surface of the multilayer plate;
obtaining the plate surface center and the deflection angle of the second surface according to each plate surface target of the second surface of the multilayer plate;
and obtaining the plate surface center and the deflection angle of the multilayer plate according to the plate surface center and the deflection angle of the first surface and the second surface.
Optionally, the reference circuit board punching installation position is provided with reference targets corresponding to the board surface targets on the first surface and the second surface; the center and the deflection angle (X1, Y1, a1) of the first surface are obtained by calculating according to each plate surface target of the first surface by adopting a first formula:
a1＝atan((ΔYCm-ΔYC(m-1))/(DX+ΔXCm-ΔXC(m-1)))；
wherein m and n are both positive integers, n is more than or equal to 2, m is more than or equal to 2 and less than or equal to n, Δ XC1, Δ XCn, Δ XCm and Δ XC (m-1) are respectively deviations of a first plate surface target, an nth plate surface target, an mth plate surface target and an m-1 plate surface target on a first surface and corresponding reference targets thereof in the X-axis direction, Δ YC1, Δ YCn, Δ YCm and Δ YC (m-1) are respectively deviations of the first plate surface target, the nth plate surface target, the mth plate surface target and the m-1 plate surface target on the first surface and the corresponding reference targets thereof in the Y-axis direction, and DX is the length of a multilayer plate in the X-axis direction.
Optionally, the center and the deflection angle (X2, Y2, a2) of the second surface are obtained by calculating according to each plate surface target of the second surface by using a second formula:
a2＝atan((ΔYC(m+n)-ΔYC(m+n-1))/(DX+ΔXC(m+n)-ΔXC(m+n-1)))；
the ith plate surface target on the first surface is opposite to the ith + n plate surface target on the second surface, i is more than or equal to 1 and less than or equal to n, and i is a positive integer; Δ XC (n +1), Δ XC2n, Δ XC (m + n), and Δ XC (m + n-1) are deviations of the n +1 th, 2n nd, m + n th, and m + n-1 th plate targets on the second surface from their corresponding reference targets in the X-axis direction, respectively, and Δ YC (n +1), Δ YC2n, Δ YC (m + n), and Δ YC (m + n-1) are deviations of the n +1 th, 2n th, m + n th, and m + n-1 th plate targets on the second surface from their corresponding reference targets in the Y-axis direction, respectively.
Optionally, the center of the board surface and the deflection angle (X, Y, a) of the multilayer board are obtained by calculation according to a formula three, wherein the formula three is as follows:
X＝(X1+X2)/2；
Y＝(Y 1+Y 2)/2；
a＝(a 1+a 2)/2。
optionally, the center and the deflection angle of the surface of the multilayer board are compared with the center and the deflection angle of a reference surface, and whether to punch the multilayer board is determined, specifically: if the center and the deflection angle of the surface of the multilayer board are consistent with the center and the deflection angle of the reference surface, directly punching the multilayer board; if the deviation between the center of the plate surface of the multilayer plate and the deviation between the deflection angle of the multilayer plate and the center of the reference plate surface are within a preset adjusting range, adjusting the position of the multilayer plate to enable the center of the plate surface of the multilayer plate and the deflection angle of the multilayer plate to be consistent with the center of the reference plate surface and the deflection angle, and then punching the multilayer plate; and if the deviation between the center and the deflection angle of the surface of the multilayer board and the deviation between the center and the deflection angle of the reference surface of the multilayer board are out of the preset adjusting range, not punching the multilayer board.
On the other hand, the embodiment of the invention also provides a punching machine, which comprises a machine table, a first acquisition device, a second acquisition device and a controller;
the machine table is provided with a circuit board punching installation position for installing a multilayer board; the first acquisition device is used for acquiring each plate surface target on the first surface of the multilayer plate; the second acquisition device is used for acquiring each board surface target on the second surface of the multilayer board; the controller is used for obtaining the plate surface center and the deflection angle of the multilayer plate according to the plate surface targets of the first surface and the plate surface targets of the second surface of the multilayer plate; and comparing the center and the deflection angle of the surface of the multilayer board with the center and the deflection angle of a reference surface, and outputting corresponding signals.
Optionally, the first collecting device includes first cameras, and the number of the first cameras is equal to the number of the board targets on the first surface and corresponds to each other.
Optionally, the second collecting device includes a second camera, and the number of the second cameras is equal to the number of the board targets on the first surface and corresponds to the number of the board targets on the first surface.
Optionally, when the first collecting device includes a first camera, the first camera and the second camera are respectively located on two opposite sides of the circuit board punching installation position.
By the technical scheme, the multilayer board punching method based on layer deviation detection and provided with the double-sided circuit and the punching machine applying the method have the following beneficial effects that:
1. according to the method, the plate surface target of the first surface and the plate surface target of the second surface of the multilayer plate are simultaneously grabbed as references, so that compared with the prior art that only the single-surface plate surface target of the multilayer plate is grabbed as a reference, the method disclosed by the invention has the advantages that the punched positioning hole has higher precision;
2. when the error is large and the adjustment is difficult, punching can be omitted, so that the working procedure is saved, and warning is provided for operators.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to make the technical solutions of the present invention practical in accordance with the contents of the specification, the following detailed description is given of preferred embodiments of the present invention with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic structural diagram of the multi-layer plate of the present invention with the plate targets arranged in a cross pattern;
FIG. 2 is a schematic diagram of the structure of the multi-layer plate of the present invention in which the targets on the plate surface are arranged diagonally;
FIG. 3 is a block flow diagram of the method for punching a multilayer board with double-sided circuits based on layer deviation detection according to the present invention;
FIG. 4 is a diagram showing the relationship of the first side of a multi-layer board in a coordinate system with respect to a reference board punch mounting location when the multi-layer board is fed into the board punch mounting location;
FIG. 5 is a diagram showing the relationship of the second side of a multi-layer board in a coordinate system with respect to a reference board punch mounting location when the multi-layer board is fed into the board punch mounting location;
FIG. 6 is a diagram showing the positional relationship between the first and second surfaces of a multilayer board in a coordinate system when the multilayer board is fed into a punching and mounting position of a circuit board;
figure 7 is an exploded view of the punch die assembly of the punch of the present invention.
Reference numerals: 10. a first acquisition device; 20. a second acquisition device; 30. and (5) punching and installing positions of the circuit board.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
As shown in fig. 1, an embodiment of the present invention provides a method for punching a multilayer board with double-sided circuits based on layer deviation detection, where the multilayer board has a first side a1 and a second side a2 opposite to each other, and the first side a1 and the second side a2 both have circuits. In some applications, the first side A1 and the second side A2 can also be referred to as the top and bottom sides or both sides of the multilayer sheet. The first surface a1 and the second surface a2 both have board targets, which may also be called positioning targets in some occasions, and the board targets may be positioning holes. The number of deck targets on both the first face a1 and the second face a2 are equal and correspond one-to-one. Theoretically, the center line of the board target on the first plane a1 coincides with the center line of the corresponding board target on the second plane a2, however, in the actual production process, due to expansion and shrinkage or machining accuracy, the center line of the board target on the first plane a1 does not coincide with the center line of the corresponding board target on the second plane a2 generally, and there is a slight difference between the two, that is, there is a layer deviation.
The plate targets on both the first surface a1 and the second surface a2 may be arranged in a cross-like manner or a diagonal manner. Wherein the plate surface targets at four K points of the multilayer plate in fig. 1 show a cross-shaped arrangement; the four K plate targets of the multiwall sheet in figure 2 show a diagonal arrangement.
As shown in fig. 3, the method for punching a multilayer board with double-sided circuits based on layer deviation detection of the present invention comprises the following steps:
step S1: a coordinate system and a reference board punch mounting location a0 is established, the reference board punch mounting location a0 having a reference board center and a deflection angle.
In a specific application example, as shown in fig. 4, fig. 4 shows a schematic diagram of establishing a rectangular coordinate system with the center of the reference board as an origin, and a dashed box in the schematic diagram is a reference circuit board punching mounting position a 0. The reference circuit board punching mounting position A0 is a circuit board punching mounting position with zero error in design. The reference board punching mounting position a0 has a reference board center and a deflection angle (X0, Y0, a0), where (X0, Y0) are coordinates of the reference board center in a coordinate system, a0 is the deflection angle of the reference board punching mounting position a0, and a0 is 0 because the reference board punching mounting position a0 is a mounting standard in board punching. For convenience of calculation, a coordinate system is generally established with the center of the reference plate as an origin, so that X0 is 0 — Y0, i.e., the center of the reference plate and the deflection angle are (0,0, 0).
Step S2: and sending the multilayer board with the double-sided circuit into a circuit board punching mounting position.
The circuit board punching mounting position is an actual mounting position of a multilayer board during punching, and a positioning structure is arranged in the punching die and can fix the multilayer board on the circuit board punching mounting position.
Step S3: and obtaining the plate surface center and the deflection angle of the multilayer plate according to the plate surface targets of the first surface A1 and the plate surface targets of the second surface A2 of the multilayer plate.
In a specific application example, the step 3 may be implemented in the following manner, which includes the steps S31, S32 and S33, and the steps S31, S32 and S33 are respectively described in detail below:
step S31: the board center and the deflection angle of the first face a1 were obtained from each board target of the first face a 1.
In a specific application example, the center and the deflection angle of the board surface of the first surface a1 are (X1, Y1, a1), where (X1, Y1) is the coordinate of the center of the board surface of the first surface a1 (i.e., point C1 in fig. 4 and 6), and a1 is the deflection angle of the first surface a1 with respect to the reference board punching mounting position a 0.
Specifically, the center of the panel and the deflection angle (X1, Y1, a1) of the first panel a1 can be calculated according to the formula one for each panel target of the first panel a1 (i.e., the solid circles at 1, 2, 3 and 4 in fig. 4). Here, it should be noted that: the aforementioned reference board punch mounting location a0 also has a reference target K0 (i.e., a dashed circle at each K0 in fig. 4 and 5) corresponding to each board face target on the first face a1 and the second face a 2.
The first formula is as follows:
a1＝atan((ΔYCm-ΔYC(m-1))/(DX+ΔXCm-ΔXC(m-1)))；
wherein m and n are both positive integers, n is not less than 2, m is not less than 2 and not more than n, Δ XC1, Δ XCn, Δ XCm and Δ XC (m-1) are respectively the deviation of the 1 st plate surface target, the nth plate surface target, the mth plate surface target and the m-1 plate surface target on the first surface A1 in the X-axis direction from the corresponding reference targets, Δ YC1, Δ YCn, Δ YCm and Δ YC (m-1) are respectively the deviation of the 1 st plate surface target, the nth plate surface target, the mth plate surface target and the m-1 plate surface target on the first surface A1 from the corresponding reference targets in the Y-axis direction, and DX is the length of the multilayer plate in the X-axis direction.
Here, it should be noted that: for convenience of description, the plate surface targets on both the first surface a1 and the second surface a2 of the above-described multiwall plate are numbered in common order, and are numbered sequentially from the plate surface target on the first surface a 1. In a specific application example, if the number of the board targets on both the first side a1 and the second side a2 is four, that is, n is 4, the board targets on the first side a1 are sequentially taken as the 1 st board target, the 2 nd board target, the 3 rd board target and the 4 th board target, and the board targets on the second side a2 are respectively taken as the 5 th board target, the 6 th board target, the 7 th board target and the 8 th board target. The ith plate surface target on the first surface A1 is opposite to the ith + n plate surface target on the second surface A2, i is more than or equal to 1 and less than or equal to n, and i is a positive integer, then the 1 st plate surface target on the first surface A1 is opposite to the 5 th plate surface target on the second surface A2, the 2 nd plate surface target on the first surface A1 is opposite to the 6 th plate surface target on the second surface A2, the 3 rd plate surface target on the first surface A1 is opposite to the 7 th plate surface target on the second surface A2, and the 4 th plate surface target on the first surface A1 is opposite to the 8 th plate surface target on the second surface A2.
Fig. 6 shows a graph of the positional relationship of the two sides a1 and a2 of a multiwall sheet in the above coordinate system, wherein the solid line boxes represent the first side a1 of the multiwall sheet, the dashed line boxes represent the second side a2 of the multiwall sheet, the targets of the sheet surfaces on the first side a1 are 1, 2, 3 and 4, respectively, and the targets of the sheet surfaces on the second side a2 are 5, 6, 7 and 8, respectively.
Thus, the above
That is, X1 ═ Δ XC1+ Δ XC2+ Δ XC3+ Δ XC 4)/4;
in a specific application example, when m is 2, a1 is atan ((Δ YC2- Δ YC1)/(DX + Δ XC2- Δ XC 1)). In fig. 4, the deviation Δ XC1 of the first panel target and its corresponding reference target in the X axis direction on the first panel a1, the deviation Δ YC1 of the first panel target and its corresponding reference target in the Y axis direction, the deviation Δ XC2 of the second panel target and its corresponding reference target in the X axis direction on the first panel a1, the deviation Δ YC2 of the second panel target and its corresponding reference target in the Y axis direction on the second panel target, the deviation Δ 3 of the third panel target and its corresponding reference target in the X axis direction on the first panel a1, the deviation Δ YC3 of the third panel target and its corresponding reference target in the Y axis direction on the first panel a 8625, and the deviation Δ XC4 of the fourth panel target and its corresponding reference target in the X axis direction on the first panel a1, and the deviation Δ YC4 of the second panel target and its corresponding reference target in the Y axis direction are shown.
Step S32: the board center and deflection angle of the second face a2 are obtained from the board targets of the second face a 2.
In a specific application example, the center and the deflection angle of the board surface of the second surface a2 are (X2, Y2, a2), where (X2, Y2) is the coordinates of the center of the board surface of the second surface a2 (i.e., point C2 in fig. 5 and 6), and a2 is the deflection angle of the second surface a2 with respect to the reference board punching mounting position a 0.
Specifically, the center of the panel and the deflection angle (X2, Y2, a2) of the second face a2 can be calculated using equation two from each panel target of the second face a2 (i.e., the solid line circle at each of 5, 6, 7, and 8 in fig. 5).
The second formula is:
a2＝atan((ΔYC(m+n)-ΔYC(m+n-1))/(DX+ΔXC(m+n)-ΔXC(m+n-1)))；
the Δ XC (n +1), Δ XC2n, Δ XC (m + n), and Δ XC (m + n-1) are the deviation of the (n +1) th plate target, the (2) th plate target, the (m + n) th plate target, and the (m + n-1) th plate target on the second surface a2 from their corresponding reference targets in the X axis direction, and the Δ YC (n +1), Δ YC2n, Δ YC (m + n), and Δ YC (m + n-1) are the deviation of the (n +1) th plate target, the (2 n) th plate target, the (m + n) th plate target, and the (m + n-1) th plate target on the second surface a2 from their corresponding reference targets in the Y axis direction, respectively.
In a specific application example, when the number of the plate targets on the first face a1 and the second face a2 is 4, that is, n is 4, the above description is given
That is, X2 ═ Δ XC5+ Δ XC6+ Δ XC7+ Δ XC 8)/4;
In a specific application example, when m is 2, a2 is atan ((Δ YC6- Δ YC5)/(DX + Δ XC6- Δ XC 5)). In fig. 5, the deviation Δ XC5 of the 5 th plate surface target and its corresponding reference target on the second surface a2 in the X axis direction, the deviation Δ YC5 of the 5 th plate surface target and its corresponding reference target in the Y axis direction, the deviation Δ XC6 of the 6 th plate surface target and its corresponding reference target on the second surface a2 in the X axis direction, the deviation Δ YC6 of the 6 th plate surface target and its corresponding reference target in the Y axis direction, the deviation Δ XC7 of the 7 th plate surface target and its corresponding reference target on the second surface a2 in the X axis direction, the deviation Δ YC7 of the 7 th plate surface XC target and its corresponding reference target in the Y axis direction, and the deviation Δ XC8 of the 8 th plate surface target and its corresponding reference target on the second surface a2 in the X axis direction are shown, and the deviation Δ YC8 of the 8 th plate surface target and its corresponding reference target in the Y axis direction are shown.
Step S33: the panel center and the deflection angle of the multilayer panel were obtained from the panel center and the deflection angle of both the first panel a1 and the second panel a 2.
In a specific example of an application, the center of the board surface and the deflection angle of the multilayer board are (X, Y, a), where (X, Y) is the coordinate of the center of the board surface of the multilayer board (i.e., point C0 in fig. 6), and a is the deflection angle of the multilayer board with respect to the reference board punch mounting location a 0.
Specifically, the center of the board surface and the deflection angle (X, Y, a) of the multilayer board can be calculated according to the formula three:
X＝(X1+X2)/2；
Y＝(Y 1+Y 2)/2；
a＝(a 1+a 2)/2。
in a specific application example, when the number of plate targets on the first face a1 and the second face a2 is 4, that is, n is 4, then,
X＝(X1+X2)/2＝(ΔXC1+ΔXC2+ΔXC3+ΔXC4+ΔXC5+ΔXC6+ΔXC7+ΔXC8)/8；
Y＝(Y1+Y2)/2＝(ΔYC1+ΔYC2+ΔYC3+ΔYC4+ΔYC5+ΔYC6+ΔYC7+ΔYC8)/8；
a＝(a1+a2)/2＝(atan((ΔYC2-ΔYC1)/(DX+ΔXC2-ΔXC1))+atan((ΔYC6-ΔYC5)/(DX+ΔXC6-ΔXC5))/2。
specifically, as shown in fig. 6, the center C0 of the multilayer board is a center point of a line connecting the center C1 of the first face a1 and the center C2 of the second face a 2. The deflection angle a of the multilayer sheet is the average of the deflection angle a1 of the first face a1 and the deflection angle a2 of the second face a 2.
Step S4: the center of the face and the deflection angle (X, Y, a) of the multiwall sheet are compared to reference face centers and deflection angles (X0, Y0, a0) to determine whether to punch the multiwall sheet.
Wherein if the center of the plate surface and the deflection angle (X, Y, a) of the multilayer board are consistent with the reference plate surface center and the deflection angle (X0, Y0, a0), the multilayer board is directly punched.
If the deviations of the center of the plate surface and the deflection angle (X, Y, a) of the multilayer board from the reference plate surface center and the deflection angle (X0, Y0, a0) are within the preset adjustment range, the position of the multilayer board is adjusted so that the center of the plate surface and the deflection angle (X, Y, a) of the multilayer board are consistent with the reference plate surface center and the deflection angle (X0, Y0, a0), and then the multilayer board is punched.
If the deviation of the center of the panel and the deflection angle (X, Y, a) of the multiwall panel from both the reference panel center and the deflection angle (X0, Y0, a0) is outside the preset adjustment range, the multiwall panel is not punched. The multilayer board can be directly returned at the moment to remind an operator that the multilayer board is an abnormal board. Of course, in order to remind the operator of the attention, when the multilayer board is found to be an abnormal board, an audible and visual alarm can be given, for example, a buzzer gives an alarm.
In the above example, since the board surface target of the first surface a1 and the board surface target of the second surface a2 of the multilayer board are simultaneously grabbed as references, compared with the prior art in which only the single-surface board target of the multilayer board is grabbed as a reference, the precision of the positioning hole punched by the method of the present invention is higher; and when the error is large and the adjustment is difficult, the punching can be selected not to save the working procedure and provide warning for the operating personnel.
An embodiment of the present invention also provides a punching machine, as shown in fig. 7, including a machine table, a first collecting device 10, a second collecting device 20, and a controller. The machine table is provided with a circuit board punching installation position 30, and the multilayer board to be punched is used for being installed on the circuit board punching installation position 30. The first collecting device 10 is used for collecting the board targets on the first surface a1 of the multilayer board. The second collecting device 20 is used for collecting the plate surface targets on the second surface A2 of the multilayer plate.
The controller is used for obtaining the plate surface center and the deflection angle of the multilayer plate according to the plate surface targets of the first surface A1 and the plate surface targets of the second surface A2 of the multilayer plate; and comparing the center and the deflection angle of the surface of the multilayer board with the center and the deflection angle of a reference surface, and outputting corresponding signals. Specifically, if the board center and the deflection angle (X, Y, a) of the multilayer board coincide with the reference board center and the deflection angle (X0, Y0, a0), or the deviation of the board center and the deflection angle (X, Y, a) of the multilayer board from both the reference board center and the deflection angle (X0, Y0, a0) is within a preset adjustment range, a first signal is output, which may be a punch signal. Here, it should be noted that: if the center of the plate surface and the deflection angle (X, Y, a) of the multilayer board are consistent with the reference plate surface center and the deflection angle (X0, Y0 and a0), the control mechanism directly controls the punching mechanism to punch the multilayer board according to the first signal. If the deviation between the center of the plate surface and the deflection angle (X, Y, a) of the multilayer board and the reference plate surface center and the deflection angle (X0, Y0 and a0) of the multilayer board are within the preset adjusting range, the control mechanism firstly controls the adjusting mechanism to adjust the position of the multilayer board according to the first signal, so that the center of the plate surface and the deflection angle (X, Y, a) of the multilayer board are consistent with the reference plate surface center and the deflection angle (X0, Y0 and a0), and then controls the punching mechanism to punch the multilayer board.
And if the deviation between the plate center and the deflection angle (X, Y, a) of the multilayer board and the reference plate center and the deflection angle (X0, Y0 and a0) is out of the preset regulation range, outputting a second signal, wherein the second signal can be an NG signal. The control mechanism can control the push plate mechanism to directly return the multilayer board according to the second signal so as to remind an operator that the multilayer board is an abnormal board.
In the above example, the center of the board surface and the deflection angle of the multilayer board are obtained according to the board surface targets of the first surface a1 and the board surface targets of the second surface a2 of the multilayer board, which can be specifically implemented as follows: obtaining the plate surface center and the deflection angle of the first surface according to each plate surface target of the first surface; obtaining the plate surface center and the deflection angle of the second surface according to each plate surface target of the second surface; and then obtaining the plate surface center and the deflection angle of the multilayer plate according to the plate surface center and the deflection angle of the first surface and the second surface.
In a specific application example, the above-mentioned reference plate center and deflection angle are (X0, Y0, a0), and X0 ═ Y0 ═ a0 ═ 0. The center and the deflection angle of the first surface are (X1, Y1, a1), the center and the deflection angle of the second surface are (X2, Y2, a2), and the center and the deflection angle of the multilayer board are (X, Y, a). The center of the panel and the deflection angle (X1, Y1, a1) of the first panel can be calculated using the first equation, the center of the panel and the deflection angle (X2, Y2, a2) of the second panel can be calculated using the second equation, and the center of the panel and the deflection angle (X, Y, a) of the multi-layer panel can be calculated using the third equation. The specific calculations of the formula one, the formula two and the formula three can be referred to the corresponding descriptions above, and are not described herein again.
Here, it should be noted that: the reference board center and the deflection angle (X0, Y0, a0) of the reference board mounting position may be stored in a memory, which also stores reference targets K0 corresponding one-to-one to the respective board targets on the first face a1 and the second face a 2. The memory can be a Read Only Memory (ROM), a Random Access Memory (RAM) or the like, the controller can be a microprocessor, a PLC or the like, and the controller can access data stored in the memory.
In the above example, since the first collecting device 10 and the second collecting device 20 can respectively grab the board surface target of the first side a1 and the board surface target of the second side a2 of the multilayer board as references, the precision of the positioning holes punched by the punching machine of the present invention is higher compared with the prior art that only the single-side board surface target of the multilayer board is grabbed as a reference.
As shown in fig. 7, the first capturing device 10 may include a first camera, which may be a CCD camera or the like. The number of the first cameras is equal to the number of the board targets on the first surface a1, and the first cameras correspond to the board targets one by one. Each first camera acquires the coordinates of a corresponding one of the board targets on the first face a 1.
As shown in fig. 7, the second capturing device 20 may include a second camera, which may also be a CCD camera or the like. The number of the second cameras is equal to the number of the board targets on the second surface a2, and the second cameras correspond to the board targets one by one. Wherein each second camera acquires the coordinates of a corresponding one of the board targets on the second face a 2.
As shown in fig. 7, the first camera and the second camera are respectively located on two opposite sides of the circuit board punching installation site 30, and the first camera and the second camera are opposite to each other. Wherein, when the multiply wood sent into the circuit board of board and punched a hole installation position 30, the multiply wood was located between first camera and the second camera, so first camera and second camera both can gather the face target on the multiply wood two sides simultaneously, and work efficiency is higher like this.
The working principle and preferred embodiments of the present invention are described below.
The invention aims to design a multilayer board punching method with double-sided circuits based on layer deviation detection and a punching machine applying the method, wherein when the multilayer board is subjected to layer deviation detection, a CCD (charge coupled device) first camera positioned on one side can acquire board targets 1, 2, 3 and 4 on a first surface A1 of the multilayer board, and a CCD second camera positioned on the other side can simultaneously acquire board targets 5, 6, 7 and 8 on a second surface A2 of the multilayer board; the controller may then calculate the plate center and deflection angle (X1, Y1, a1) for first face a1 using formula one based on each plate target 1, 2, 3, and 4 on first face a1, and calculate the plate center and deflection angle (X2, Y2, a2) for the second face using formula two based on each plate target 5, 6, 7, and 8 on second face a2, and calculate the plate center and deflection angle (X2, Y2, a2) for the second face using formula three based on the plate center and deflection angle (X1, Y1, a1) for first face a1, and the plate center and deflection angle (X2, Y2, a2) for the second face, and compare the plate center and deflection angle (X, Y, a) for the multiwall sheet to the reference plate center and deflection angle (X0, Y0, a0) to determine whether to punch a hole.
If the center and the deflection angle (X, Y, a) of the surface of the multilayer board are consistent with the center and the deflection angle (X0, Y0 and a0) of the reference surface, punching the multilayer board directly; if the deviation of the center of the plate surface and the deflection angle (X, Y, a) of the multilayer board and the deviation of the center of the reference plate surface and the deflection angle (X0, Y0 and a0) of the multilayer board are within a preset adjusting range, adjusting the position of the multilayer board to enable the center of the plate surface and the deflection angle (X, Y, a) of the multilayer board to be consistent with the center of the reference plate surface and the deflection angle (X0, Y0 and a0), and then punching the multilayer board; if the deviation between the center of the plate surface and the deflection angle (X, Y, a) of the multilayer board and the deviation between the center of the reference plate surface and the deflection angle (X0, Y0 and a0) are outside the preset adjusting range, the multilayer board is not punched, and the multilayer board can be directly returned at the moment so as to remind an operator that the multilayer board is an abnormal board.
Here, it should be noted that: in the case of no conflict, a person skilled in the art may combine the relevant technical features in the foregoing examples with each other according to an actual situation to achieve a corresponding technical effect, and details of various combining situations are not described herein again.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (8)
1. A multilayer board punching method with double-sided circuits based on layer deviation detection is characterized by comprising the following steps:
establishing a coordinate system and a reference circuit board punching installation position, wherein the reference circuit board punching installation position is provided with a reference board surface center and a deflection angle;
sending the multilayer board with double-sided circuits into a circuit board punching installation position;
obtaining the center of the plate surface and the deflection angle of the multilayer plate according to the plate surface targets of the first surface and the plate surface targets of the second surface of the multilayer plate;
comparing the center and the deflection angle of the surface of the multilayer board with the reference center and the deflection angle to determine whether to punch the multilayer board;
obtaining the plate surface center and the deflection angle of the multilayer plate according to each plate surface target of the first surface and each plate surface target of the second surface of the multilayer plate, and specifically comprises the following steps: obtaining the plate surface center and the deflection angle of the first surface of the multilayer plate according to each plate surface target of the first surface of the multilayer plate; obtaining the plate surface center and the deflection angle of the second surface according to each plate surface target of the second surface of the multilayer plate; obtaining the plate surface center and the deflection angle of the multilayer plate according to the plate surface center and the deflection angle of the first surface and the second surface;
the reference circuit board punching installation position is provided with reference targets corresponding to the board surface targets on the first surface and the second surface; the center and the deflection angle (X1, Y1, a1) of the first surface are obtained by calculating according to each plate surface target of the first surface by adopting a first formula:
a1＝atan((ΔYCm-ΔYC(m-1))/(DX+ΔXCm-ΔXC(m-1)))；
wherein m and n are both positive integers, n is not less than 2, m is not less than 2 and not more than n, Δ XC1, Δ XCn, Δ XCm and Δ XC (m-1) are respectively the deviation of a first plate surface target, an nth plate surface target, an mth plate surface target and an m-1 plate surface target on a first surface and corresponding reference targets thereof in the X-axis direction, Δ YC1, Δ YCn, Δ YCm and Δ YC (m-1) are respectively the deviation of the first plate surface target, the nth plate surface target, the mth plate surface target and the m-1 plate surface target on the first surface and corresponding reference targets thereof in the Y-axis direction, and DX is the length of the multilayer plate in the X-axis direction.
2. The multi-layer board punching method according to claim 1, wherein the center of the second surface and the deflection angle (X2, Y2, a2) are calculated according to each target of the second surface by using the formula two:
a2＝atan((ΔYC(m+n)-ΔYC(m+n-1))/(DX+ΔXC(m+n)-ΔXC(m+n-1)))；
the ith plate surface target on the first surface is opposite to the ith + n plate surface target on the second surface, i is more than or equal to 1 and less than or equal to n, and i is a positive integer; Δ XC (n +1), Δ XC2n, Δ XC (m + n), and Δ XC (m + n-1) are deviations of the n +1 th, 2n nd, m + n th, and m + n-1 th plate targets on the second surface from their corresponding reference targets in the X-axis direction, respectively, and Δ YC (n +1), Δ YC2n, Δ YC (m + n), and Δ YC (m + n-1) are deviations of the n +1 th, 2n th, m + n th, and m + n-1 th plate targets on the second surface from their corresponding reference targets in the Y-axis direction, respectively.
3. The multilayer sheet punching method according to claim 2, wherein the center of the sheet face and the deflection angle (X, Y, a) of said multilayer sheet are calculated according to the formula three:
X＝(X1+X2)/2；
Y＝(Y 1+Y 2)/2；
a＝(a 1+a 2)/2。
4. the multilayer board punching method according to any one of claims 1 to 3, wherein the center of the plane and the deflection angle of the multilayer board are compared with reference to the center of the plane and the deflection angle to determine whether to punch the multilayer board, specifically:
if the center and the deflection angle of the surface of the multilayer board are consistent with the center and the deflection angle of the reference surface, directly punching the multilayer board;
if the deviation of the center and the deflection angle of the surface of the multilayer board and the deviation of the center and the deflection angle of the reference surface are within a preset adjusting range, adjusting the position of the multilayer board to enable the center and the deflection angle of the surface of the multilayer board to be consistent with the center and the deflection angle of the reference surface, and then punching the multilayer board;
and if the deviation between the center and the deflection angle of the surface of the multilayer board and the deviation between the center and the deflection angle of the reference surface of the multilayer board are out of the preset adjusting range, not punching the multilayer board.
5. A punching machine is characterized by comprising a machine table, a first acquisition device (10), a second acquisition device (20) and a controller; wherein,
the machine table is provided with a circuit board punching installation position (30) for installing a multilayer board;
the first acquisition device (10) is used for acquiring each plate surface target on the first surface of the multilayer plate;
the second acquisition device (20) is used for acquiring each plate surface target on the second surface of the multilayer plate;
the controller is used for obtaining the plate center and the deflection angle of the multilayer plate according to the plate targets of the first surface and the plate targets of the second surface of the multilayer plate; comparing the center and the deflection angle of the surface of the multilayer board with the center and the deflection angle of a reference surface, and outputting corresponding signals;
obtaining the plate surface center and the deflection angle of the multilayer plate according to each plate surface target of the first surface and each plate surface target of the second surface of the multilayer plate, and specifically comprises the following steps: obtaining the plate surface center and the deflection angle of the first surface of the multilayer plate according to each plate surface target of the first surface of the multilayer plate; obtaining the plate surface center and the deflection angle of the second surface according to each plate surface target of the second surface of the multilayer plate; obtaining the plate surface center and the deflection angle of the multilayer plate according to the plate surface center and the deflection angle of the first surface and the second surface;
the reference circuit board punching installation position is provided with reference targets corresponding to the board surface targets on the first surface and the second surface; and calculating the plate center and the deflection angle (X1, Y1, a1) of the first surface by adopting a first formula according to each plate surface target of the first surface, wherein the first formula is as follows:
a1＝atan((ΔYCm-ΔYC(m-1))/(DX+ΔXCm-ΔXC(m-1)))；
wherein m and n are both positive integers, n is not less than 2, m is not less than 2 and not more than n, Δ XC1, Δ XCn, Δ XCm and Δ XC (m-1) are respectively the deviation of a first plate surface target, an nth plate surface target, an mth plate surface target and an m-1 plate surface target on a first surface and corresponding reference targets thereof in the X-axis direction, Δ YC1, Δ YCn, Δ YCm and Δ YC (m-1) are respectively the deviation of the first plate surface target, the nth plate surface target, the mth plate surface target and the m-1 plate surface target on the first surface and corresponding reference targets thereof in the Y-axis direction, and DX is the length of the multilayer plate in the X-axis direction.
6. The punching machine of claim 5,
the first acquisition device (10) comprises first cameras, and the number of the first cameras is equal to that of the board targets on the first face and corresponds to the board targets on the first face one by one.
7. The punching machine according to claim 5 or 6,
the second acquisition device (20) comprises second cameras, and the number of the second cameras is equal to that of the plate surface targets on the first surface and corresponds to that of the plate surface targets on the first surface one by one.
8. The punching machine of claim 7,
when the first acquisition device (10) comprises a first camera, the first camera and the second camera are respectively positioned on two opposite sides of the circuit board punching installation position (30).
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| CN100484369C (en) * | 2004-07-03 | 2009-04-29 | 重庆工学院 | Correcting system of vision punching machine of printed circuit board machine |
| CN103687315B (en) * | 2013-12-12 | 2017-02-15 | 广州兴森快捷电路科技有限公司 | Designing method of punching alignment target |
| CN107072050B (en) * | 2017-03-30 | 2019-05-07 | 生益电子股份有限公司 | The production method and PCB of the upper jack of PCB |
| CN107610163A (en) * | 2017-08-07 | 2018-01-19 | 深圳市得鑫自动化设备有限公司 | A kind of punching localization method and device based on CCD scannings |
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| CN111351432A (en) * | 2020-04-13 | 2020-06-30 | 深圳市强华科技发展有限公司 | PCB hole position processing process capability assessment method |
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