CN114417774A - Control method for local area expansion and shrinkage of PCB - Google Patents
Control method for local area expansion and shrinkage of PCB Download PDFInfo
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- CN114417774A CN114417774A CN202111536196.2A CN202111536196A CN114417774A CN 114417774 A CN114417774 A CN 114417774A CN 202111536196 A CN202111536196 A CN 202111536196A CN 114417774 A CN114417774 A CN 114417774A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
Abstract
The invention discloses a control method for local area expansion and contraction of a PCB (printed circuit board), which comprises the steps of designing a positioning point; making a para position; manufacturing the contraposition point in the longitude and latitude direction of the process edge of the unit area, and acquiring the original coordinate value of the contraposition point according to the original data; obtaining the offset coordinate value of the opposite point, obtaining the actual coordinate value of the opposite point after pressing, and calculating the offset coordinate value of the opposite point; calculating the expansion and contraction coefficient of the unit area by using the corresponding side length value and the offset coordinate value of the unit area; manufacturing a harmomegathus file in a segmented manner according to the harmomegathus coefficient of the corresponding unit area; according to the method, the number of the alignment points is determined by the number of the jointed boards, the alignment points are manufactured in the longitude and latitude directions of the two sides of the process edge of the unit area, the coordinate values of the alignment points are obtained, the offset coordinate points of the alignment points are obtained after lamination, the offset coordinate values are measured, the expansion and contraction coefficient of the unit area is calculated by utilizing the corresponding side length value and the offset coordinate values, and the negative influence of the expansion and contraction of the unit area on the graphic precision of the printed circuit board is effectively reduced.
Description
Technical Field
The invention relates to the technical field of PCB boards, in particular to a control method for expansion and contraction of a local area of a PCB board.
Background
In the manufacturing process flow of the printed circuit board, the expansion and contraction of the board plays an important role in the final process precision of the product. In the practical application of the expansion and contraction rule of the plate, the whole expansion and contraction range of the plate is mostly controlled by 3 or 4 alignment holes on the periphery, and the problem of local expansion and contraction of the plate cannot be considered and solved. Particularly, when the composite material is used for high-rise back plates and plates with uneven residual copper, local expansion and contraction are more obvious. According to the conventional method for integrally measuring and calculating the expansion and contraction coefficient, the problem of alignment precision cannot be solved, and even the problem of positioning deviation of the subsequent process is aggravated, so that the method is scrapped.
Disclosure of Invention
Based on this, it is necessary to provide a method for controlling the expansion and contraction of the local area of the PCB to solve the problem of the alignment accuracy.
A control method for local area expansion and contraction of a PCB comprises
S1, designing alignment points, determining the number of the alignment points according to the number of jointed boards of the PCB and the process precision requirement, and deducing and acquiring the number value of the alignment points in the process side-warp and weft directions of a unit area through a formula;
s2, manufacturing an alignment point; manufacturing the contraposition point in the longitude and latitude direction of the process edge of the unit area, and acquiring the original coordinate value of the contraposition point according to the original data;
s3, obtaining offset coordinate values of the alignment points, obtaining actual coordinate values of the alignment points after pressing, and calculating the offset coordinate values of the alignment points by comparing the original coordinate values and the actual coordinate values of the alignment points; (ii) a
S4, calculating a harmomegathus coefficient, and calculating the harmomegathus coefficient of the unit area by using the corresponding side length value and the offset coordinate value of the unit area;
and S5, creating a harmomegathus file, creating harmomegathus files in a segmented mode according to the harmomegathus coefficient of the corresponding unit area, and adjusting and optimizing post processes of each unit area.
In one embodiment, in S1, when the number of the panels is equal to or less than four, the number of the positioning points in the longitudinal direction is the same; the number of alignment sites is: [ n ] is not less than Max (X, Y) Z/. DELTA.P,. DELTA.P-acceptable shrinkage size error value; z-harmomegathus control accuracy; max (X, Y) -the longer side length value in warp and weft directions, the [ n ] value being an upward integer value.
In one embodiment, in S1, when the total number of panels is greater than four, the number of the warp and weft directions of the alignment points is the number of the warp and weft direction units plus 1.
In one of the embodiments, Δ P =0.075 mm.
In one embodiment, the expansion coefficient calculation formula is: the X coefficient = (X '' + DeltaX)/CAM X, the Y coefficient = (Y '' + DeltaY)/CAM Y, the theta deflection coefficient = (theta + Deltatheta)/90 degrees, X '' and Y '' are length values of corresponding sides of a unit area, theta is an included angle between an original coordinate point of a contraposition point and an actual coordinate point of the contraposition point, DeltaX is a change value of the contraposition point in the X direction, DeltaY is a change value of the contraposition point in the Y direction, Deltatheta is a change value of the angle theta in the vertical direction, the default value of theta is that the angle of the longitude and latitude vertical direction is 90 degrees, and CAM X and CAM Y are design values of an original file drilling zone, namely standard values.
In one embodiment, the variation values of the opposite points in the X, Y directions and the deflection angles corresponding to the warp and weft directions of the board are obtained by means of integration, namely Δ X = ^ f (X) dx, Δ Y = ^ f (Y) dy,
△θ=
。
in one embodiment, the rate of change for the respective warp and weft directions is calculated as: and f (X) = (X '-X)/(Y' -Y), f (Y) = (Y '-Y)/(X' -X), X, Y, X 'and Y' are coordinate values of the inner point of the plate material.
In one embodiment, the location of the pair of sites is distinguished from the location of the alignment holes.
In one embodiment, the origin-to-location points of the latitudinal and latitudinal directions are common pair points.
In one embodiment, the pair of sites are marker points.
In one embodiment, the method for making the collapsible file comprises the following steps:
s11, determining a unit area generating expansion and contraction;
s12, recording the expansion and contraction coefficient of the unit area generating expansion and contraction into the CAM file of the corresponding area;
s13, revising the CAM file of the corresponding area to obtain a revised CAM file;
s14, compensating the unit area generating the expansion and contraction according to the revised CAM file;
and S15, realigning the jointed boards.
The method for obtaining the harmomegathus coefficient of the unit area of the PCB comprises the steps of determining the number of alignment points according to the number of jointed boards of the PCB and the process precision requirement, deducing and obtaining the number value of the alignment points in the process edge of the unit area in the latitudinal direction and the longitudinal direction through a formula, manufacturing the alignment points in the process edge of the unit area in the latitudinal direction and obtaining the original coordinate values of the alignment points according to original data, obtaining the actual coordinate values of the alignment points after pressing, calculating the offset coordinate values of the alignment points by comparing the original coordinate values and the actual coordinate values of the alignment points, and calculating the harmomegathus coefficient of the unit area by using the corresponding side length value and the offset coordinate values of the unit area; and the expansion and shrinkage file is manufactured in a segmented manner, the post-process of each unit area is adjusted and optimized, the negative influence of the expansion and shrinkage of the unit area of the board on the graphic precision of the printed circuit board is effectively reduced, a basis is provided for optimizing the design of a corresponding circuit, and the circuit board is gradually free from the influence of local expansion and shrinkage.
Drawings
FIG. 1 is a flow chart of a method for controlling expansion and contraction of a local area of a PCB board according to the present invention;
FIG. 2 is a schematic diagram of a PCB before and after pressing according to the method for controlling expansion and contraction of a local area of the PCB of the present invention;
FIG. 3 is a schematic structural diagram of a unit area alignment point setting of a control method for local area expansion and contraction of a PCB according to the present invention;
FIG. 4 is a schematic diagram of a compensation structure after unit area shrinkage for a control method of local area expansion and shrinkage of a PCB according to the present invention;
FIG. 5 is a schematic diagram of a compensation structure after expanding a unit area of a control method for expansion and contraction of a local area of a PCB according to the present invention;
FIG. 6 is a schematic diagram of a compensation structure after unit area deflection for a control method of local area expansion and contraction of a PCB according to the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly connected" to another element, there are no intervening elements present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in FIG. 1, FIG. 2 and FIG. 3, a method for controlling expansion and contraction of a local area of a PCB comprises
S1, designing alignment points 100, determining the number of the alignment points 100 according to the number of jointed boards of the PCB and the process precision requirement, and deducing and acquiring the numerical value of the alignment points 100 in the process edge warp and weft directions of a unit area through a formula;
s2, manufacturing a positioning point 100; manufacturing the contraposition point 100 in the longitude and latitude directions of the process edge of the unit area, and acquiring the original coordinate value of the contraposition point 100 according to the original data;
s3, obtaining offset coordinate values of the alignment point 100, obtaining actual coordinate values of the alignment point 100 after pressing, and calculating the offset coordinate values of the alignment point 100 by comparing the original coordinate values and the actual coordinate values of the alignment point 100;
s4, calculating a harmomegathus coefficient, and calculating the harmomegathus coefficient of the unit area by using the corresponding side length value and the offset coordinate value of the unit area;
and S5, creating a harmomegathus file, creating harmomegathus files in a segmented mode according to the harmomegathus coefficient of the corresponding unit area, and adjusting and optimizing post processes of each unit area.
In one embodiment, in S1, when the number of panels is equal to or less than four, the number of the alignment points 100 in the warp and weft directions is the same; the number of alignment sites 100 is: [ n ] is not less than Max (X, Y) Z/. DELTA.P,. DELTA.P-acceptable shrinkage size error value; z-harmomegathus control accuracy; max (X, Y) -the longer side length value in warp and weft directions, the [ n ] value being an upward integer value.
In one embodiment, in S1, when the total number of panels is greater than four, the number of longitude and latitude of the alignment point 100 is the unit number of longitude and latitude plus 1.
In one of the embodiments, Δ P =0.075 mm.
In one embodiment, the expansion coefficient calculation formula is: the X coefficient = (X '' + DeltaX)/CAM X, the Y coefficient = (Y '' + DeltaY)/CAM Y, the theta deflection coefficient = (theta + Deltatheta)/90 degrees, X '', Y '' are length values of corresponding sides of a unit area, theta is an included angle between an original coordinate point of the alignment point 100 and an actual coordinate point of the alignment point 100, DeltaX is a change value of the alignment point 100 in the X direction, DeltaY is a change value of the alignment point 100 in the Y direction, Deltatheta is a change value of an angle theta in the vertical direction, theta default values are angles in the vertical direction of longitude and latitude of 90 degrees, and CAM X and CAM Y are design values of an original file drill tape, namely standard values.
In one embodiment, the variation values of the opposite points in the X, Y directions and the deflection angles corresponding to the warp and weft directions of the board are obtained by means of integration, namely Δ X = ^ f (X) dx, Δ Y = ^ f (Y) dy,
△θ= 
。
in one embodiment, the rate of change for the respective warp and weft directions is calculated as: and f (X) = (X '-X)/(Y' -Y), f (Y) = (Y '-Y)/(X' -X), X, Y, X 'and Y' are coordinate values of the inner point of the plate material.
In one embodiment, the location of the docking station 100 is distinguished from the location of the registration aperture.
In one embodiment, the origin of the latitudinal and longitudinal directions is a common pair of points 100 to the location points 100.
In one embodiment, the pair of sites 100 are marker sites.
In one embodiment, the method for making the collapsible file comprises the following steps:
s11, determining a unit area generating expansion and contraction;
s12, recording the expansion and contraction coefficient of the unit area generating expansion and contraction into the CAM file of the corresponding area;
s13, revising the CAM file of the corresponding area to obtain a revised CAM file;
s14, compensating the unit area generating the expansion and contraction according to the revised CAM file;
and S15, realigning the jointed boards.
Generally, the locating hole of the pcb panel that we designed, for 4 points on a board, distribute in four angular point positions, generally for preventing slow-witted, can design into four points of right trapezoid, length through measuring two actual right-angle sides and theoretical length of value, obtain the variation value, and solve the corresponding panel harmomegathus coefficient in two directions, feed back to the engineering and accomplish the data proportion change, because present pcb panel is usually formed by the concatenation of a plurality of makeup boards, the harmomegathus coefficient between each makeup has the difference, calculate the harmomegathus coefficient of whole board, lead to harmomegathus coefficient rate greatly reduced very easily, provide wrong information for subsequent processing production. Therefore, the present application provides a method of calculating the expansion and contraction coefficient of a unit area. According to different precision requirements, different unit areas can be selected to calculate the expansion and contraction coefficients. E.g., 1SET, 1 PCS. A panel in this application is SET.
Example 1: when the number of jointed boards is less than or equal to four;
a control method for local area expansion and contraction of a PCB comprises
S1, designing alignment points 100, and arranging the same number of alignment points 100 in the warp and weft directions at the two sides of the process edge of the unit area; the number and spacing of the sites 100 can be further adjusted according to the accuracy requirements;
s2, manufacturing the contraposition point 100 in the longitude and latitude directions of the two sides of the process edge of the unit area, and acquiring the original coordinate value of the contraposition point 100; setting original coordinates of a contraposition point 100 as P (X, Y);
s3, obtaining offset coordinate values of the alignment point 100, obtaining actual coordinate values of the alignment point 100 after pressing, and calculating the offset coordinate values of the alignment point 100 by comparing the original coordinate values and the actual coordinate values of the alignment point 100; (ii) a The actual coordinate values are set to P '(X', Y '), the direction vector of the expansion and contraction is PP' (X '-X, Y' -Y), and thus the rate of change in the corresponding warp and weft directions can be calculated as: a rate of change f (X) = (X '-X)/(Y' -Y) in the X direction, a rate of change f (Y) = (Y '-Y)/(X' -X) in the Y direction, change Δ θ of angle θ = arccos (X '-X) 2+ (Y' -Y)/, a shift coordinate value Δ X = & (X) dx), Δ Y = & (Y) dx of position 100 found by way of integration, Δ θ = arccos (X '-X) 2+ (Y' -Y) of position 100;
s4, calculating a harmomegathus coefficient, and calculating the harmomegathus coefficient of the unit area by using the corresponding side length value and the offset coordinate value of the unit area;
the expansion and contraction coefficient of the unit area corresponding to the direction is: the X coefficient = (X '' + DeltaX)/CAM X, the Y coefficient = (Y '' + DeltaY)/CAM Y, the theta deflection coefficient = (theta + Deltatheta)/90 DEG, namely the expansion and contraction coefficient of different points is obtained; x 'and Y' are length values of corresponding sides of a unit area, theta is an included angle between an original coordinate point of a contraposition point 100 and an actual coordinate point of the contraposition point 100, delta X is a change value of the contraposition point 100 in the X direction, delta Y is a change value of the contraposition point 100 in the Y direction, delta theta is a change value of an angle theta in the vertical direction, theta default value is that the angle in the vertical direction of longitude and latitude is 90 degrees, and CAM X and CAM Y are design values of an original file drilling strip, namely standard values;
s5, creating an expansion and contraction file, creating the expansion and contraction file in a segmented manner according to the expansion and contraction coefficient of the corresponding unit area, and adjusting and optimizing post processes of each unit area; and different expansion and contraction files are manufactured according to different expansion and contraction coefficients of different unit areas.
Example 2: when the number of the jointed boards is more than four;
a control method for local area expansion and contraction of a PCB comprises
S1, designing alignment points 100, and determining the number of the alignment points 100 in the longitudinal and latitudinal directions on two sides of the process edge of the unit area according to the arrangement number of the jointed boards; for example, a spliced M × N plate is designed, and the number of the longitude and latitude opposite points 100 is correspondingly M +1 and N + 1;
s2, manufacturing the contraposition point 100 in the longitude and latitude directions of the two sides of the process edge of the unit area, and acquiring the original coordinate value of the contraposition point 100; setting original coordinates of a contraposition point 100 as P (X, Y);
s3, obtaining offset coordinate values of the alignment point 100, obtaining actual coordinate values of the alignment point 100 after pressing, and calculating the offset coordinate values of the alignment point 100 by comparing the original coordinate values and the actual coordinate values of the alignment point 100; (ii) a The actual coordinate values are set to P '(X', Y '), the direction vector of the expansion and contraction is PP' (X '-X, Y' -Y), and thus the rate of change in the corresponding warp and weft directions can be calculated as: a rate of change f (X) = (X '-X)/(Y' -Y) in the X direction, a rate of change f (Y) = (Y '-Y)/(X' -X) in the Y direction, change Δ θ of angle θ = arccos (X '-X) 2+ (Y' -Y)/, a shift coordinate value Δ X = & (X) dx), Δ Y = & (Y) dx of position 100 found by way of integration, Δ θ = arccos (X '-X) 2+ (Y' -Y) of position 100;
s4, calculating a harmomegathus coefficient, and calculating the harmomegathus coefficient of the unit area by using the corresponding side length value and the offset coordinate value of the unit area;
the expansion and contraction coefficient of the unit area corresponding to the direction is: the X coefficient = (X '' + DeltaX)/CAM X, the Y coefficient = (Y '' + DeltaY)/CAM Y, the theta deflection coefficient = (theta + Deltatheta)/90 DEG, namely the expansion and contraction coefficient of different points is obtained; x 'and Y' are length values of corresponding sides of a unit area, theta is an included angle between an original coordinate point of a contraposition point 100 and an actual coordinate point of the contraposition point 100, delta X is a change value of the contraposition point 100 in the X direction, delta Y is a change value of the contraposition point 100 in the Y direction, delta theta is a change value of an angle theta in the vertical direction, theta default value is that the angle in the vertical direction of longitude and latitude is 90 degrees, and CAM X and CAM Y are design values of an original file drilling strip, namely standard values;
s5, creating an expansion and contraction file, creating the expansion and contraction file in a segmented manner according to the expansion and contraction coefficient of the corresponding unit area, and adjusting and optimizing post processes of each unit area; and different expansion and contraction files are manufactured according to different expansion and contraction coefficients of different unit areas.
Thus, the method for obtaining the expansion and contraction coefficient of the unit area of the PCB determines the quantity of the alignment points 100 according to the quantity of jointed boards of the PCB and the process precision requirement, deduces and obtains the quantity value of the alignment points 100 in the process edge of the unit area in the latitudinal direction through a formula, manufactures the alignment points 100 in the latitudinal direction of the process edge of the unit area, obtains the original coordinate values of the alignment points 100 according to the original data, obtains the actual coordinate values of the alignment points 100 after lamination, calculates the offset coordinate values of the alignment points 100 by comparing the original coordinate values and the actual coordinate values of the alignment points 100, and calculates the expansion and contraction coefficient of the unit area by using the corresponding side length value and the offset coordinate values of the unit area; and the expansion and shrinkage file is manufactured in a segmented manner, the post-process of each unit area is adjusted and optimized, the negative influence of the expansion and shrinkage of the unit area of the board on the graphic precision of the printed circuit board is effectively reduced, a basis is provided for optimizing the design of a corresponding circuit, and the circuit board is gradually free from the influence of local expansion and shrinkage.
Further, when the number of the jointed boards is less than or equal to four, the alignment points 100 with the adaptive number are arranged in the longitude and latitude directions of the two sides of the process edge of the unit area, and the number of the alignment points 100 is as follows: n is greater than or equal to Max (X, Y) Z/delta P, delta P-acceptable expansion and contraction size error value; z-precision of control required; max (X, Y) -the longer side length value in warp and weft directions, the [ n ] value being an upward integer value.
Since it is impossible to set an infinite number of alignment points 100 on both sides of the panel, an appropriate number of corresponding points are set to control the expansion and contraction coefficients according to the accuracy requirement. The acceptable size error value of delta P, delta P =0.075mm, Z-the precision to be controlled, is formulated according to the actual precision requirement, generally not less than four thousandths, otherwise the number of the alignment points 100 is too much, which affects the setting of other positioning holes, the length value of the longer side in Max (X, Y) -warp-weft direction, that is, the value of the long side in two mutually perpendicular sides of one jigsaw, when calculating the number n of the alignment points 100, the calculated value is usually a small value, but the value of our alignment point 100 needs to obtain an integer value, so we adopt an upward value method, remove n value as an integer value, for example, the calculated n value is 5.2, and then we take n value as 6.
Therefore, the number of the contraposition points 100 matched with the unit area can be obtained through the contraposition point 100 number formula, the accuracy of the expansion and contraction coefficient is guaranteed, and the arrangement of other positioning holes cannot be hindered.
Further, the pair of location points 100 needs to be distinguished from the location hole pattern of the actual Xray punching, the X-ray punching location holes only punch the location holes drilled in the subsequent process, and only the location coordinate values are recorded for the location points 100.
Furthermore, the alignment point 100 is only a mark point, and in a subsequent routing process of the routing machine, the mark of the alignment point 100 can be routed, and the mark cannot be left on the board, so that the subsequent process is not affected.
As shown in fig. 4, 5, and 6, the method for creating the collapsible file further includes:
s11, determining a unit area generating expansion and contraction;
s12, recording the expansion and contraction coefficient of the unit area generating expansion and contraction into the CAM file of the corresponding area;
s13, revising the CAM file of the corresponding area to obtain a revised CAM file;
s14, compensating the unit area generating the expansion and contraction according to the revised CAM file; for example: the unit area is reduced, and the CAM file is amplified according to a preset proportion when modified, so that the reduced unit area after actual pressing meets the normal proportion and can be spliced with other jointed boards; the unit area is enlarged, and is reduced according to a preset proportion when the CAM file is modified, so that the enlarged unit area after actual pressing meets the normal proportion and can be spliced with other jointed boards; if the unit area deflects, the CAM file is corrected according to a preset proportion when the CAM file is modified, so that the deflected unit area conforms to a normal proportion after actual pressing and can be spliced with other spliced boards.
And S15, realigning the jointed boards. No matter the jointed board is expanded or contracted, the jointed board is aligned in the direction close to the zero coordinate point, when the jointed board is divided into unit areas by a single SET, the original connectivity of a circuit is not influenced, and the jointed board can be directly corrected and aligned according to the expansion and contraction coefficient of the unit areas.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A control method for expansion and shrinkage of a local area of a PCB is characterized by comprising the following steps: comprises that
S1, designing alignment points, determining the number of the alignment points according to the number of jointed boards of the PCB and the process precision requirement, and deducing and acquiring the number value of the alignment points in the process side-warp and weft directions of a unit area through a formula;
s2, manufacturing an alignment point; manufacturing the contraposition point in the longitude and latitude direction of the process edge of the unit area, and acquiring the original coordinate value of the contraposition point according to the original data;
s3, obtaining offset coordinate values of the alignment points, obtaining actual coordinate values of the alignment points after pressing, and calculating the offset coordinate values of the alignment points by comparing the original coordinate values and the actual coordinate values of the alignment points;
s4, calculating a harmomegathus coefficient, and calculating the harmomegathus coefficient of the unit area by using the corresponding side length value and the offset coordinate value of the unit area;
and S5, creating a harmomegathus file, creating harmomegathus files in a segmented mode according to the harmomegathus coefficient of the corresponding unit area, and adjusting and optimizing post processes of each unit area.
2. The method for controlling expansion and contraction of a local area of a PCB board of claim 1, wherein: in S1, when the number of jointed boards is less than or equal to four, the number of the contraposition points in the longitudinal direction is the same; the number of alignment sites is: [ n ] is not less than Max (X, Y) Z/. DELTA.P,. DELTA.P-acceptable shrinkage size error value; z-harmomegathus control accuracy; max (X, Y) -the longer side length value in warp and weft directions, the [ n ] value being an upward integer value.
3. The method for controlling expansion and contraction of a local area of a PCB board of claim 1, wherein: in S1, when the total number of the panels is greater than four, the number of the aligned points in the warp and weft directions is the number of the unit in the warp and weft directions plus 1.
4. The method for controlling expansion and contraction of a local area of a PCB board of claim 2, wherein: Δ P =0.075 mm.
5. The method for controlling expansion and contraction of a local area of a PCB board of claim 1, wherein: the expansion and contraction coefficient calculation formula is as follows: the X coefficient = (X '' + DeltaX)/CAM X, the Y coefficient = (Y '' + DeltaY)/CAM Y, the theta deflection coefficient = (theta + Deltatheta)/90 degrees, X '' and Y '' are length values of corresponding sides of a unit area, theta is an included angle between an original coordinate point of a contraposition point and an actual coordinate point of the contraposition point, DeltaX is a change value of the contraposition point in the X direction, DeltaY is a change value of the contraposition point in the Y direction, Deltatheta is a change value of the angle theta in the vertical direction, the default value of theta is that the angle of the longitude and latitude vertical direction is 90 degrees, and CAM X and CAM Y are design values of an original file drilling zone, namely standard values.
6. The method for controlling expansion and contraction of a local area of a PCB board of claim 5, wherein: calculating the change values of the opposite points in the X, Y directions and the deflection angles corresponding to the longitude and latitude directions of the plates in an integral mode, namely, DeltaX = ^ f (X) dx, DeltaY = ^ f (Y) dy, and Deltatheta =
。
7. The method for controlling expansion and contraction of a local area of a PCB board of claim 6, wherein: calculating the change rate corresponding to the longitude and latitude directions as follows: and f (X) = (X '-X)/(Y' -Y), f (Y) = (Y '-Y)/(X' -X), X, Y, X 'and Y' are coordinate values of the inner point of the plate material.
8. The method for controlling expansion and contraction of a local area of a PCB board of claim 1, wherein: the position of the contraposition point is distinguished from the position of the positioning hole.
9. The method for controlling expansion and contraction of a local area of a PCB board of claim 1, wherein: and the origin point pair points in the longitudinal direction and the latitudinal direction are public point pairs.
10. The method for controlling expansion and contraction of a local area of a PCB board of claim 1, wherein: the pair of sites are marker points.
11. The method for controlling expansion and contraction of a local area of a PCB board of claim 1, wherein: the method for manufacturing the collapsible file comprises the following steps:
s11, determining a unit area generating expansion and contraction;
s12, recording the expansion and contraction coefficient of the unit area generating expansion and contraction into the CAM file of the corresponding area;
s13, revising the CAM file of the corresponding area to obtain a revised CAM file;
s14, compensating the unit area generating the expansion and contraction according to the revised CAM file;
and S15, realigning the jointed boards.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111536196.2A CN114417774A (en) | 2021-12-16 | 2021-12-16 | Control method for local area expansion and shrinkage of PCB |
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| CN202111536196.2A CN114417774A (en) | 2021-12-16 | 2021-12-16 | Control method for local area expansion and shrinkage of PCB |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115112086A (en) * | 2022-05-30 | 2022-09-27 | 广州广芯封装基板有限公司 | Expansion and shrinkage test method of circuit board |
| CN115859895A (en) * | 2023-03-03 | 2023-03-28 | 惠科股份有限公司 | PCB (printed Circuit Board) segmentation preshrinking method, device, equipment and computer-readable storage medium |
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2021
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115112086A (en) * | 2022-05-30 | 2022-09-27 | 广州广芯封装基板有限公司 | Expansion and shrinkage test method of circuit board |
| CN115859895A (en) * | 2023-03-03 | 2023-03-28 | 惠科股份有限公司 | PCB (printed Circuit Board) segmentation preshrinking method, device, equipment and computer-readable storage medium |
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