CN112435574A - Holographic information layer, anti-counterfeiting film and identification assembly - Google Patents
Holographic information layer, anti-counterfeiting film and identification assembly Download PDFInfo
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- CN112435574A CN112435574A CN202011353693.4A CN202011353693A CN112435574A CN 112435574 A CN112435574 A CN 112435574A CN 202011353693 A CN202011353693 A CN 202011353693A CN 112435574 A CN112435574 A CN 112435574A
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- 238000003384 imaging method Methods 0.000 claims abstract description 60
- 238000007747 plating Methods 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 31
- 230000001070 adhesive effect Effects 0.000 claims abstract description 30
- 239000000853 adhesive Substances 0.000 claims abstract description 26
- 239000011230 binding agent Substances 0.000 claims abstract description 18
- 239000003292 glue Substances 0.000 claims abstract description 12
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 239000012790 adhesive layer Substances 0.000 claims description 30
- 239000004925 Acrylic resin Substances 0.000 claims description 14
- 229920000178 Acrylic resin Polymers 0.000 claims description 14
- 239000002131 composite material Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 11
- 230000000181 anti-adherent effect Effects 0.000 claims description 9
- 238000010521 absorption reaction Methods 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000004611 light stabiliser Substances 0.000 claims description 5
- -1 propylene polyol Chemical class 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000012948 isocyanate Substances 0.000 claims description 4
- 150000002513 isocyanates Chemical class 0.000 claims description 4
- 229920005862 polyol Polymers 0.000 claims description 4
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000005299 abrasion Methods 0.000 claims description 3
- 238000004132 cross linking Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
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- 238000003860 storage Methods 0.000 description 3
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Images
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
- G09F3/0291—Labels or tickets undergoing a change under particular conditions, e.g. heat, radiation, passage of time
- G09F3/0294—Labels or tickets undergoing a change under particular conditions, e.g. heat, radiation, passage of time where the change is not permanent, e.g. labels only readable under a special light, temperature indicating labels and the like
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/08—Fastening or securing by means not forming part of the material of the label itself
- G09F3/10—Fastening or securing by means not forming part of the material of the label itself by an adhesive layer
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
- G09F2003/0257—Multilayer
Abstract
The application relates to the field of anti-counterfeiting printing, in particular to a holographic information layer, an anti-counterfeiting film and an identification component. The holographic information layer comprises a base layer, an imaging layer, a plating layer and a glue layer which are sequentially stacked; the imaging layer is provided with a holographic pattern; the plating layer is provided with a plurality of through holes penetrating through the plating layer along the thickness direction; the size of the through hole is less than 250 mu m; the distance between two adjacent through holes is greater than or equal to 500 mu m; and the through hole is filled with a binder, and the binder is used for bonding the coating and the imaging layer. The arrangement mode of the through holes in the coating layer does not cause the disappearance of the holographic patterns in the imaging layer; the through hole is internally provided with a binder for bonding the coating and the imaging layer, the binder in the through hole can also improve the adhesive force between the coating and the layer structure far away from one side of the imaging layer, and the problem that the imaging layer and the coating are easy to separate due to large material difference is effectively solved.
Description
Technical Field
The application relates to the field of anti-counterfeiting printing, in particular to a holographic information layer, an anti-counterfeiting film and an identification component.
Background
The anti-fake means of the certificate card is to adopt a chip and a holographic anti-fake means. The holographic anti-counterfeiting of the identification card is divided into two types, namely, the holographic anti-counterfeiting pattern is prepared in the identification card in the card manufacturing process, and the holographic anti-counterfeiting pattern is attached to the surface of the card after the card is manufactured. The problem of short service life exists in the easy separation of the image of present holographic anti-counterfeiting pattern.
Disclosure of Invention
An object of the embodiment of the application is to provide a holographic information layer, an anti-counterfeiting film and a mark assembly, which aim at improving the problem that an imaging layer of the existing anti-counterfeiting mark is easy to separate from a plating layer.
The first aspect of the application provides a holographic information layer, which comprises a base layer, an imaging layer, a plating layer and a glue layer which are sequentially stacked;
the imaging layer is provided with a holographic pattern;
the plating layer is provided with a plurality of through holes penetrating through the plating layer along the thickness direction; the size of the through hole is less than 250 mu m; the distance between two adjacent through holes is greater than or equal to 500 mu m;
and the through hole is filled with a binder, and the binder is used for at least binding the plating layer and the imaging layer.
The arrangement mode of the through holes in the coating layer does not cause the disappearance of the holographic patterns in the imaging layer; the binder used for bonding the coating and the imaging layer is arranged in the through hole, so that the adhesive force of the imaging layer and the coating is improved, the problem that the imaging layer and the coating are easy to separate is solved, the adhesive force of the coating and the layer structure far away from one side of the imaging layer can be improved by the binder in the through hole, and the problem that the imaging layer and the coating are easy to separate due to large material difference is effectively solved.
In some embodiments of the first aspect of the present application, the size of the through-holes is from 150 μm to 250 μm;
optionally, the through hole is a circular hole, and the diameter of the circular hole is 150-250 μm;
optionally, the distance between two adjacent through holes is 500-.
In some embodiments of the first aspect of the present application, the binder comprises a resin;
optionally, the binder comprises an acrylic resin;
optionally, the adhesive is the same material as the glue layer;
optionally, the adhesive layer is made of transparent thermosetting acrylic resin with the weight-average molecular weight of 20000-40000.
In some embodiments of the first aspect of the present application, the holographic information layer further comprises a uv absorbing layer between the plating layer and the glue layer;
optionally, the material of the ultraviolet absorption layer comprises acrylic resin, an ultraviolet resistant agent and a light stabilizer in a mass ratio of (6-8): (1.6-3.2): 0.4-0.8;
optionally, the weight average molecular weight of the acrylic resin is 40000-60000;
optionally, the thickness of the ultraviolet absorption layer is 3 μm to 5 μm;
optionally, the binder is the same material as the uv absorbing layer.
In some embodiments of the first aspect of the present application, the holographic information layer further comprises an abrasion resistant layer on a side of the base layer remote from the imaging layer;
optionally, the wear-resistant layer is made of a material with a mass ratio of 1: (1-2) crosslinking and curing the difunctional epoxy resin and the difunctional polyurethane;
optionally, the wear resistant layer has a thickness of 2 μm to 5 μm.
In some embodiments of the first aspect of the present application, the holographic information layer further comprises a composite layer between the base layer and the imaging layer; the composite layer comprises the following materials in a mass ratio of 2: (1-3) an isocyanate and a propylene polyol;
optionally, the composite layer has a thickness of 0.8 μm to 1.5 μm.
A second aspect of the present application provides an anti-counterfeiting film comprising a base film and the holographic information layer provided in the first aspect; and one surface of the base layer, which is far away from the imaging layer, is attached to the base film.
In some embodiments of the second aspect of the present application, the anti-counterfeiting film further comprises an anti-adhesive layer attached to a side of the base film remote from the holographic information layer;
optionally, the material of the anti-adhesion layer is a non-silicon anti-adhesion agent;
optionally, the anti-adhesion layer has a thickness of 0.5 μm to 2 μm.
The arrangement of the anti-reverse adhesion layer can avoid the adhesion of the adhesive layer and the basement membrane and can prevent the anti-reverse adhesion caused by high temperature during storage or transportation. The connecting layer can promote the holographic information layer to be smoothly and completely transferred to the surfaces of objects such as identification cards and the like.
In some embodiments of the second aspect of the present application, the anti-counterfeiting film further comprises a connecting layer located between the base layer and the base film, and the material of the connecting layer is transparent organic silica gel;
optionally, the thickness of the connection layer is 1 μm to 3 μm.
A third aspect of the application provides an identification component comprising a substrate and a holographic information layer as provided in the first aspect; the glue layer of the holographic information layer is attached to the substrate.
The adhesive layer has good adhesive force with the matrix, the holographic information layer has good adhesive force inside, and after the holographic information layer is transferred to the matrix, the holographic information layer is not easy to be completely uncovered, so that the information on the surface of the identification card can be prevented from being falsified.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a schematic structural diagram of an anti-counterfeiting film provided by an embodiment of the application;
FIG. 2 shows a cross-sectional view along line AA of FIG. 1;
FIG. 3 shows a cross-sectional view of FIG. 1 along line BB;
FIG. 4 illustrates a cross-sectional view of a marker assembly provided by embodiments of the present application.
Icon: 001-holographic information layer; 100-an anti-counterfeiting film; 110-anti-tack layer; 111-positioning a cursor; 120-base film; 130-a tie layer; 140-a wear resistant layer; 150-a base layer; 160-composite layer; 170-an imaging layer; 171-a holographic pattern; 180-plating; 181-a through hole; 190-an ultraviolet absorbing layer; 1100-glue layer; 200-an identification component; 210-base body.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present application, it is to be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, refer to the orientation or positional relationship as shown in the drawings, or as conventionally placed in use of the product of the application, or as conventionally understood by those skilled in the art, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be considered as limiting the present application.
Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present application, it should also be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, and may for example be fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Example 1
Fig. 1 shows a schematic structural view of an anti-counterfeiting film 100 provided by an embodiment of the present application, fig. 2 shows a cross-sectional view of fig. 1 along line AA, and fig. 3 shows a cross-sectional view of fig. 1 along line BB; referring to fig. 1 to 3, the present embodiment provides an anti-counterfeiting film 100, wherein the anti-counterfeiting film 100 mainly includes a holographic information layer 001 and a base film 120; in the using process, the adhesive layer 1100 of the anti-counterfeiting film 100 is attached to articles such as cards; the carrier film 120 is then separated leaving the holographic information layer 001 on the surface of the card or the like.
Referring to fig. 2, the main structure of the holographic information layer 001 is illustrated below.
The holographic information layer 001 mainly includes a base layer 150, an imaging layer 170, a plating layer 180, and a glue layer 1100, which are sequentially stacked. The imaging layer 170 is provided with the hologram pattern 171, and the structure, shape, and size of the hologram pattern 171 are not limited in this application.
The adhesive layer 1100 is used for bonding with a film-sticking article such as a card. The material of the adhesive layer 1100 may be transparent thermosetting acrylic resin having a weight average molecular weight of 20000 to 40000, and the thickness of the adhesive layer 1100 may be 4 μm to 6 μm (for example, 4 μm, 5 μm, 6 μm).
Illustratively, the material of base layer 150 may be BOPET, PETG, or the like. The thickness of the base layer 150 may be 12um to 23 um.
The material of the imaging layer 170 may be transparent acrylic resin, and the thickness of the imaging layer 170 may be 1 μm to 2 μm (e.g., may be 1 μm, 1.5 μm, 1.8 μm, 2 μm, etc.), and the glass transition temperature thereof may be 100 ℃ to 140 ℃ (e.g., may be 100 ℃, 120 ℃, 140 ℃, etc.).
The plating layer 180 is attached to the imaging layer 170; the plating layer 180 is formed by evaporation of zinc sulfide, and the thickness of the plating layer 180 is
(may be, for example
Or
)。
In the present application, the plating layer 180 is provided with a plurality of through holes 181, the plurality of through holes 181 penetrating the plating layer 180 in a thickness direction of the plating layer 180; the size of each through hole 181 is less than 250 μm, and the distance between every two adjacent through holes 181 is greater than or equal to 500 μm.
In other words, the plating layer 180 is provided with a plurality of through holes 181, the size of the through holes 181 is smaller than 250 μm, the through holes 181 can be square holes, round holes, prismatic holes or other irregularly-shaped holes, and the largest size inside the holes is 250 μm. For example, the size of the via 181 may be 50 μm, 90 μm, 100 μm, 130 μm, 150 μm, 151 μm, 155 μm, 160 μm, 167 μm, 172 μm, 180 μm, 190 μm, 201 μm, 210 μm, 230 μm, 240 μm, or 250, or the like. In some embodiments, the size of the via 181 is 150 μm to 250 μm.
The distance between two adjacent through holes 181 is greater than or equal to 500 μm; for example, the distance between the adjacent two through holes 181 may be 500 μm, 550 μm, 600 μm, 610 μm, 680 μm, 690 μm, 750 μm, 800 μm, 900 μm, 1000 μm, 1500 μm, 1800 μm, or the like. In some embodiments, the distance between two adjacent through holes 181 is 500 μm to 1000 μm. In the embodiment of the present application, the adjacent two through holes 181 refer to the adjacent two through holes 181 in any direction.
If the distance between two adjacent through holes 181 is too large or the size of the through hole 181 is too large, the holographic pattern 171 of the imaging layer 170 disappears.
As an example, the present application provides a method of forming the via hole 181:
arranging a plurality of water-washing ink dots on the surface of the imaging layer 170, then evaporating zinc sulfide on the surface of the imaging layer 170, and washing with water; after washing, the washed ink dots and the zinc sulfide covering the surfaces of the washed ink dots correspondingly fall off, and the plating layer 180 containing the through holes 181 is prepared.
It should be noted that in other embodiments of the present application, the through hole 181 may be formed by other methods, for example, the through hole 181 is formed by punching after the plating layer 180 is prepared.
The through hole 181 is filled with a binder for binding at least the plating layer 180 and the imaging layer 170. The adhesion between the plating layer 180 made of zinc sulfide and the imaging layer 170 made of organic material is small, which easily causes separation of the plating layer 180 and the imaging layer 170.
The use of an adhesive to adhere at least plating layer 180 and imaging layer 170 means that the adhesive in through-hole 181 can adhere plating layer 180 and imaging layer 170, and further, the adhesive in through-hole 181 can also adhere a layer of plating layer 180 that faces away from imaging layer 170, such as uv absorbing layer 190 of the present application.
In the application, the adhesive is filled in the through hole 181, so that the adhesive force of the plating layer 180 and the imaging layer 170 can be increased, the adhesive property of the plating layer 180 and the imaging layer 170 can be improved, and the problem that the plating layer 180 and the imaging layer 170 are easy to separate is solved.
In the embodiment of the present application, the through hole 181 is filled with an adhesive, and the adhesive may fill only the bottom of the through hole 181 or fill the entire through hole 181, as long as the imaging layer 170 can be adhered to the plating layer 180 by the adhesive.
In addition, the adhesive of the present application should be broadly construed as long as it can adhere the image forming layer 170 and the plating layer 180. For example, the adhesive includes a resin, in some embodiments, the resin may be an acrylic resin, and further, in some embodiments, the material of the adhesive may be the same as the material of the adhesive layer 1100. In other words, the material of the adhesive may be the same as the material of the layer to which the plating layer 180 is attached on the side away from the imaging layer 170; when preparing a layer attached on the side away from imaging layer 170, adhesive can be filled into imaging layer 170 to save the manufacturing process.
In the embodiment of the present application, in order to increase the resistance of the holographic information layer 001 to ultraviolet, the holographic information layer 001 further includes an ultraviolet absorption layer 190 between the plating layer 180 and the glue layer 1100; the ultraviolet absorbing layer 190 has an effect of absorbing ultraviolet rays.
In the embodiment of the present application, the uv absorbing layer 190 is disposed between the plating layer 180 and the adhesive layer 1100, and does not reduce the interlayer adhesion between the plating layer 180 and the adhesive layer 1100. If the ultraviolet absorbing layer 190 is disposed at the remaining position, since the ultraviolet resistant agent and the light stabilizer in the ultraviolet absorbing layer 190 are solid, interlayer adhesion between the remaining layers may be reduced during the preparation process.
Illustratively, the material of the ultraviolet absorption layer 190 comprises acrylic resin, an ultraviolet resistant agent and a light stabilizer in a mass ratio of (6-8): (1.6-3.2): (0.4-0.8); for example, the mass ratio of the acrylic resin, the ultraviolet inhibitor and the light stabilizer is 8:1.6:0.4, 7: 2: 0.6, 7: 2.5: 0.5, and so on. Wherein. The weight average molecular weight of the acrylic resin is 40000-60000; illustratively, the ultraviolet absorbing layer 190 has a thickness of 3 μm to 5 μm; for example, the ultraviolet absorbing layer 190 may have a thickness of 3 μm, 4 μm, 5 μm, or the like.
As mentioned above, for the embodiment of disposing the ultraviolet absorbing layer 190, the plating layer 180 is attached to the ultraviolet absorbing layer 190, and the through hole 181 in the plating layer 180 may be disposed with the raw material of the ultraviolet absorbing layer 190, so as to increase the adhesion between the plating layer 180 and the imaging layer 170 and increase the adhesion between the plating layer 180 and the ultraviolet absorbing layer 190.
It is understood that in some embodiments of the present application, the ultraviolet absorbing layer 190 is not necessary, the ultraviolet absorbing layer 190 may not be provided, or in other embodiments, the ultraviolet absorbing layer 190 may be provided at other positions.
As mentioned above, the base layer 150, the imaging layer 170, and the plating layer 180 are sequentially stacked, and in the embodiment of the present application, in order to increase the adhesion between the base layer 150 and the imaging layer 170, the composite layer 160 is disposed between the base layer 150 and the imaging layer 170; the material of the composite layer 160 includes 2: (1-3) an isocyanate and a propylene polyol; the composite layer 160 mainly functions to improve the adhesion between the base layer 150 and the imaging layer 170, and has a mass ratio of 2: the composite layer 160 made of the isocyanate and the propylene polyol (1-3) has a large adhesive force with the high base layer 150 and also has a large adhesive force with the imaging layer 170, so that the adhesive property between the base layer 150 and the imaging layer 170 can be improved.
Illustratively, the composite layer 160 has a thickness of 0.8 μm to 1.5 μm, and may be, for example, 0.8 μm, 1.0 μm, 1.2 μm, 1.3 μm, 1.5 μm, or the like. It should be noted that in other embodiments of the present application, the composite layer 160 is not necessary, and the composite layer 160 may not be provided.
Referring to fig. 2 again, in the process of using the anti-counterfeiting film 100, after the adhesive layer 1100 is attached to an object such as a card, the adhesive layer is peeled off and removed 120, and the base layer 150 is left on the surface of the object such as a card, in this embodiment, in order to avoid scratching the base layer 150 and increase the wear resistance of the holographic information layer 001, the holographic information layer 001 further includes a wear-resistant layer 140 located on the side of the base layer 150 away from the imaging layer 170.
The wear-resistant layer 140 is made of a wear-resistant material; in some embodiments, the wear layer 140 is formed from a material having a mass ratio of 1: (1-2) crosslinking and curing the difunctional epoxy resin and the difunctional polyurethane; the thickness of the wear resistant layer 140 may be 2 μm to 5 μm, for example, 2 μm, 3 μm, 4 μm, 5 μm, and the like.
The wear-resistant layer 140 is located on the upper surface of the holographic information layer 001 away from the identification card and other objects, so that the wear resistance of the holographic information layer 001 can be improved. In some embodiments, the wear layer 140 may not be provided.
The above is an example of a part of the holographic information layer 001 provided in the embodiments of the present application, and the following is an example description of the base film 120 and the like.
As described above, in the process of using the anti-counterfeiting film 100, the base film 120 and the holographic information layer 001 need to be peeled off.
In this embodiment, the bottom film 120 is a transparent biaxially oriented polyester film with a thickness of 30 μm to 50 μm, and the positioning cursor 111 is printed on the bottom surface of the bottom film 120.
In this embodiment, in order to make the holographic information layer 001 and the base film 120 have better adhesion performance, the holographic information layer 001 and the base film 120 are prevented from being separated before peeling off, a connecting layer 130 is disposed on one side of the base film 120 close to the holographic information layer 001, and the connecting layer 130 is made of transparent organic silicon; illustratively, the thickness of the connection layer 130 is 1 μm to 3 μm, for example, the thickness may be 1 μm, 2 μm, or 3 μm, and so on. The holographic information layer 001 is laminated on the connecting layer 130 in a laminating mode, so that the bonding force between the connecting layer 130 and the holographic information layer 001 can be improved, and the holographic information layer 001 is prevented from falling off in the coiling process.
The bonding force between the connecting layer 130 and the holographic information layer 001 is far less than the bonding force between the connecting layer 130 and the bottom film 120 and the bonding force between the adhesive layer 1100 and the objects such as the identification cards in the transfer process, so that the holographic information layer 001 is smoothly and completely transferred to the surfaces of the objects such as the identification cards.
It should be noted that in other embodiments of the present application, the connection layer 130 may not be provided.
Referring to fig. 1 again, in the process of receiving the anti-counterfeiting film 100, the adhesive layer 1100 contacts the bottom film 120, so as to avoid the problem of the adhesive property of the adhesive layer 1100 being reduced due to the adhesive property between the adhesive layer 1100 and the bottom film 120; in this embodiment, the anti-counterfeiting film 100 further includes an anti-adhesive layer 110 attached to a side of the base film 120 away from the holographic information layer 001; the material of the anti-adhesive layer 110 is a material that cannot be adhered to the adhesive layer 1100, such as release paper, and in some embodiments, the material of the anti-adhesive layer 110 is a non-silicon type anti-adhesive; the thickness of the anti-adhesive layer 110 may be 0.5 μm to 2 μm, and may be, for example, 0.5 μm, 0.6 μm, 0.8 μm, 1.5 μm, 2 μm, or the like. In use, the anti-adhesive layer 110 is peeled off together with the base film 120 from the holographic information layer 001.
The adhesive layer 1100 is in contact with the anti-sticking layer 110, and can prevent sticking due to high temperature during storage or transportation. It is understood that in other embodiments of the present application, the anti-adhesive layer 110 may not be provided.
The holographic information layer 001 provided by the embodiment of the application has at least the following advantages:
the plating layer 180 is provided with a plurality of through holes 181, and the through holes 181 are internally provided with a binder for binding the plating layer 180 and the imaging layer 170, so that the adhesive force between the through holes 181 and the plating layer 180 is improved, the problem that the through holes 181 and the plating layer 180 are easy to separate is avoided, and the holographic patterns 171 in the imaging layer 170 cannot disappear due to the arrangement mode of the through holes 181; in addition, the adhesive in the through hole 181 can also improve the adhesion between the plating layer 180 and the layer structure (such as the adhesive layer 1100 or the ultraviolet absorption layer 190) on the side away from the imaging layer 170, thereby effectively improving the problem that the imaging layer 170 and the plating layer 180 are easy to separate due to large material difference.
The abrasion resistant layer 140 is provided to prevent the surface of the holographic information layer 001 from being abraded by scratches.
The anti-counterfeiting film 100 provided by the embodiment of the application has the advantages of the holographic information layer 001, and in addition, the anti-adhesion layer 110 is arranged to prevent the adhesive layer 1100 from being bonded with the bottom film 120, so that the anti-adhesion caused by high temperature during storage or transportation can be prevented. The connecting layer 130 can promote the smooth and complete transfer of the holographic information layer 001 to the surface of an object such as a certificate card.
Example 2
Fig. 4 shows a schematic cross-sectional view of a marking element 200 provided in an embodiment of the present application, please refer to fig. 2 and fig. 4 together, embodiment 2 provides a marking element 200, the marking element 200 includes a substrate 210 and a holographic information layer 001, and for details of the structure of the holographic information layer 001, please refer to embodiment 1, which is not described again in this embodiment.
The glue layer 1100 of the holographic information layer 001 is connected to the substrate 210.
It is understood that the substrate 210 can be an identification card, a card, etc., and the embodiment of the present application does not limit the material of the substrate 210, and the identification assembly 200 has all the advantages of the holographic information layer 001.
The adhesive layer 1100 has good adhesive force with the substrate 210, the holographic information layer 001 has good adhesive force inside, and after the holographic information layer 001 is transferred to the substrate 210, the holographic information layer 001 is not easy to be completely uncovered, so that the information on the surface of the identification card can be prevented from being tampered. Meanwhile, the ultraviolet absorption layer 190 can absorb ultraviolet rays, thereby preventing the substrate 210 from being discolored and aged due to ultraviolet irradiation.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. The holographic information layer is characterized by comprising a base layer, an imaging layer, a plating layer and a glue layer which are sequentially stacked;
the imaging layer is provided with a holographic pattern;
the plating layer is provided with a plurality of through holes penetrating through the plating layer along the thickness direction; the size of the through hole is less than 250 mu m; the distance between two adjacent through holes is greater than or equal to 500 mu m;
and the through hole is filled with a binder, and the binder is used for at least binding the plating layer and the imaging layer.
2. The holographic information layer of claim 1, in which the size of the through-holes is 150-250 μ ι η;
optionally, the through hole is a circular hole, and the diameter of the circular hole is 150-250 μm;
optionally, the distance between two adjacent through holes is 500-.
3. The holographic information layer of claim 1, wherein the binder comprises a resin;
optionally, the binder comprises an acrylic resin;
optionally, the adhesive is the same material as the glue layer;
optionally, the adhesive layer is made of transparent thermosetting acrylic resin with the weight-average molecular weight of 20000-40000.
4. The holographic information layer of any of claims 1-3, further comprising an ultraviolet absorbing layer between the plating layer and the subbing layer;
optionally, the material of the ultraviolet absorption layer comprises acrylic resin, an ultraviolet resistant agent and a light stabilizer in a mass ratio of (6-8): (1.6-3.2): 0.4-0.8;
optionally, the weight average molecular weight of the acrylic resin is 40000-60000;
optionally, the thickness of the ultraviolet absorption layer is 3 μm to 5 μm;
optionally, the binder is the same material as the uv absorbing layer.
5. The holographic information layer of any of claims 1-3, further comprising an abrasion resistant layer on a side of the base layer remote from the imaging layer;
optionally, the wear-resistant layer is made of a material with a mass ratio of 1: (1-2) crosslinking and curing the difunctional epoxy resin and the difunctional polyurethane;
optionally, the wear resistant layer has a thickness of 2 μm to 5 μm.
6. The holographic information layer of any of claims 1-3, further comprising a composite layer between the base layer and the imaging layer; the composite layer comprises the following materials in a mass ratio of 2: (1-3) an isocyanate and a propylene polyol;
optionally, the composite layer has a thickness of 0.8 μm to 1.5 μm.
7. An anti-counterfeiting film, comprising a base film and the holographic information layer of any of claims 1 to 6; and one surface of the base layer, which is far away from the imaging layer, is attached to the base film.
8. The anti-counterfeiting film according to claim 7, further comprising an anti-adhesive layer attached to a side of the base film away from the holographic information layer;
optionally, the material of the anti-adhesion layer is a non-silicon anti-adhesion agent;
optionally, the anti-adhesion layer has a thickness of 0.5 μm to 2 μm.
9. The anti-counterfeiting film according to claim 7 or 8, further comprising a connecting layer positioned between the base layer and the base film, wherein the connecting layer is made of transparent organic silica gel;
optionally, the thickness of the connection layer is 1 μm to 3 μm.
10. An identification element, characterized in that it comprises a substrate and a holographic information layer according to any of claims 1 to 6; the glue layer of the holographic information layer is attached to the substrate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011353693.4A CN112435574A (en) | 2020-11-26 | 2020-11-26 | Holographic information layer, anti-counterfeiting film and identification assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011353693.4A CN112435574A (en) | 2020-11-26 | 2020-11-26 | Holographic information layer, anti-counterfeiting film and identification assembly |
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| CN112435574A true CN112435574A (en) | 2021-03-02 |
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| CN202011353693.4A Pending CN112435574A (en) | 2020-11-26 | 2020-11-26 | Holographic information layer, anti-counterfeiting film and identification assembly |
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| CN2286329Y (en) * | 1997-01-22 | 1998-07-15 | 付子平 | Mould pressing holographic antifake sign |
| CN1788996A (en) * | 2004-12-15 | 2006-06-21 | 华中科技大学 | Holographic false proof membrane |
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Application publication date: 20210302 |