CN112432958A - Remote optical maintenance method and system for printed circuit board - Google Patents
Remote optical maintenance method and system for printed circuit board Download PDFInfo
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- CN112432958A CN112432958A CN202011293244.5A CN202011293244A CN112432958A CN 112432958 A CN112432958 A CN 112432958A CN 202011293244 A CN202011293244 A CN 202011293244A CN 112432958 A CN112432958 A CN 112432958A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8861—Determining coordinates of flaws
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Abstract
The invention discloses a remote optical maintenance method and a system for a printed circuit board, wherein the remote optical maintenance method comprises the following steps: s1, scanning the printed circuit board to be detected in the first area to obtain a scanned image, and analyzing the scanned image to obtain initial defect information; s2, the first area sends the initial defect information to a second area remotely through a transfer server; s3, eliminating false point defects from the initial defect information in the second area to obtain real defect information; s4, the second area remotely sends the real defect information to the first area through a transfer server; and S5, in the first area, repairing the printed circuit board according to the real defect information. The invention provides a solution for completing the cooperative maintenance work of the printed circuit board across areas, breaks through the traditional maintenance mode of the printed circuit board, realizes the high configuration of resources, saves the cost and improves the production efficiency.
Description
Technical Field
The invention relates to the field of circuit board detection, in particular to a remote optical maintenance method and system for a printed circuit board.
Background
In the current highly developed electronic industry era, Printed Circuit boards (PCBs for short) have become one of the essential parts of products such as computers and electronic communication. After the PCB is manufactured, a detection process is required, automatic Optical Inspection equipment (AOI for short) is generally used in the industry, the AOI can detect defects on the PCB, and then the Inspection is performed according to the defects detected by the AOI.
After the circuit board is scanned at an AOI (automatic optical inspection) device, different defect types are obtained after software classification, whether the classified defect types are correct or not is judged manually, and after the fact that the defects are true is confirmed, the defect positions are maintained manually. In the prior art, users realize the processes in the same factory.
The mode of remote optical inspection of circuit boards has not appeared in the prior art.
Disclosure of Invention
In order to solve the problems of the prior art, the invention provides a remote optical maintenance method and a system for a printed circuit board, which can be used for performing cooperative maintenance on the circuit board through a remote cooperative cross-region, reasonably utilizing the resources of equipment and workers to the maximum, saving the cost and improving the production efficiency, and the technical scheme is as follows:
on one hand, the invention provides a remote optical maintenance method for a printed circuit board, and two technical schemes are provided for the method:
the first technical scheme is as follows: a remote optical service method for printed circuit boards for performing a cooperative service of printed circuit boards across an area, the service method comprising the steps of:
s101, scanning a printed circuit board to be detected in a first area to obtain a scanned image, and analyzing the scanned image to obtain initial defect information, wherein the initial defect information comprises coordinate information of a defect position corresponding to the scanned image;
s102, remotely sending the initial defect information to a second area through a transfer server;
s103, responding to the second area to eliminate the false point defect from the initial defect information, and remotely receiving real defect information which is returned by the second area and is subjected to false point defect elimination by the first area through a transit server;
s104, according to the real defect information, the printed circuit board is overhauled in the first area
The second technical scheme is as follows: the method is used for completing cooperative overhaul work of the printed circuit board across areas, and comprises the following steps:
s201, responding to a first area to scan a printed circuit board to be detected to obtain a scanned image, analyzing the scanned image, and remotely receiving initial defect information obtained by analyzing the scanned image in the first area by a transfer server in a second area, wherein the initial defect information comprises coordinate information of a defect position corresponding to the scanned image;
s202, eliminating false point defects from the initial defect information by the second area to obtain real defect information;
s203, the real defect information is remotely sent to the first area through the transfer server, and the real defect information is used for providing maintenance prompts for maintenance work of the printed circuit board in the first area.
Further, the second area performs steps S201 to S203 for interfacing with the plurality of first areas.
In another aspect, the invention provides a remote optical maintenance system for a printed circuit board, which is used for completing cooperative maintenance work on the printed circuit board across areas, and comprises automatic optical detection equipment, defect screening AI equipment, a defect maintenance workstation and a first transit server which are arranged in a first area, and a virtual maintenance workstation and a second transit server which are arranged in a second area, wherein the geographical positions of the first area and the second area are different, and the first transit server is in bidirectional communication connection with the second transit server;
the automatic optical detection equipment is used for scanning a printed circuit board to be detected to obtain a scanned image, and the defect screening AI equipment is used for analyzing the scanned image to obtain initial defect information;
the virtual maintenance workstation is used for eliminating the false point defect from the initial defect information to obtain real defect information;
the defect overhauling workstation is used for providing overhauling prompt information for manual overhauling according to the real defect information;
the first transfer server and the second transfer server are used for sending initial defect information to the second area from the first area and returning real defect information to the first area from the second area.
Furthermore, the first area is also provided with a first database server, and the first database server is respectively connected with the automatic optical detection equipment, the defect screening AI equipment, the defect overhaul workstation and the first transfer server.
Furthermore, a second database server is further arranged in the second area, and the second database server is respectively connected with a second transfer server and the virtual maintenance workstation.
Preferably, the first area is further provided with an information checking workstation, which is in communication connection with the first database server, and the information checking workstation is used for checking initial defect information and real defect information of the printed circuit board.
Specifically, the defect maintenance workstation includes spot welding equipment, display screen, camera device, drive arrangement and controller under the control of controller, the drive arrangement drive camera device removes in proper order to the position relative with real defect, camera device is used for enlarging the formation of image to real defect, the display screen is used for showing camera device's formation of image result.
Preferably, the first transit server and the second transit server are in communication connection through an MES network system.
Optionally, the first transit Server is a DDE Server, and the second transit Server is a DDV Server.
Optionally, the automatic optical detection device and the defect screening AI device are of an integrated structure or a split structure.
Optionally, the number of the automatic optical detection device, the number of the defect inspection work stations and the number of the virtual inspection work stations are one or more respectively.
Optionally, the number of the first area and/or the second area is multiple, so that the multiple first areas and the multiple second areas cooperate to complete the maintenance work of the printed circuit board, or the first areas and the multiple second areas cooperate to complete the maintenance work of the printed circuit board.
The invention has the following beneficial effects:
a. the local geographical limitation of the circuit board to be overhauled is broken through, and the local overhauling mode of the traditional circuit board is broken through;
b. double optimization configuration and maximum utilization of equipment resources and artificial resources are realized;
c. the production of the circuit board adopts a cooperation mode to separate the nuclear detection links, so as to form a new industry and change the inherent form of the circuit board production industry;
d. the centralized optimization configuration of resources is beneficial to improving the production and maintenance efficiency.
Drawings
The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. The invention, however, both as to organization and method of operation, together with objects, features, and advantages thereof, may best be understood by reference to the following detailed description when read with the accompanying drawings in which:
FIG. 1 is a flow chart of a method for remote optical servicing of a printed circuit board provided by an embodiment of the present invention;
FIG. 2 is a schematic block diagram of a printed circuit board remote optical access system provided by an embodiment of the present invention;
FIG. 3 is a flow chart of a remote optical service of a service system provided by an embodiment of the invention under a first zone view;
FIG. 4 is a flow chart of a remote optical service of a service system provided by an embodiment of the invention under a second zone viewing angle;
fig. 5 is a schematic view of an implementation scenario of more than two cross-zones of the remote optical repair system for the pcb provided in the embodiment of the present invention.
Detailed Description
In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, and components have not been described in detail so as not to obscure the present invention.
The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. The invention, however, both as to organization and method of operation, together with objects, features, and advantages thereof, may best be understood by reference to the following detailed description when read with the accompanying drawings.
It will be appreciated that for simplicity and clarity of illustration, elements shown in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity.
Because the illustrative embodiments of the present invention may be implemented, to a great extent, using electronic components and circuits known to those skilled in the art, as described above, no greater detail is necessary to understand or appreciate the underlying concepts of the invention so as not to obscure or distract from the teachings of the present invention.
In one embodiment of the present invention, there is provided a remote optical service method for printed circuit boards for performing cooperative service work on the printed circuit boards across a region, as shown in fig. 1, the service method comprising the steps of:
and S1, scanning the printed circuit board to be detected in the first area (by related equipment) to obtain a scanning image, and analyzing the scanning image to obtain initial defect information.
Specifically, the initial defect information includes coordinate information of a defect position corresponding to the scanned image, for example, the initial defect information includes, but is not limited to, picture 1 (corresponding to the image and/or its name) and absolute coordinate information of a preliminary determined defect on picture 1, for example, a defect type code (short circuit, open circuit, missing welding, etc.) may also be included, each piece of initial defect information includes the scanned image itself, and after trans-regional transmission, the image review is performed by a device at a different location.
In a preferred embodiment of the present invention, the scan images obtained after the AOI device scans the circuit board may be classified, and the classification mainly includes: if the scanned image is good, not good and unclear, the corresponding circuit board does not need to be overhauled, the scanned image and the circuit board which needs to be overhauled (subsequently sent to an overhaul station) are separately placed, the scanned image is filtered (or deleted), and the scanned image is not sent to a cross-region for rechecking subsequently; if the scanned image is not good, the corresponding circuit board needs to be overhauled to generate initial defect information; if the scanned image is unclear, the scanned image needs to be rescanned for inspection, and if the scanned image is unclear three times in succession, the scanned image is manually checked or directly returned to be bad.
It should be noted that the above scanning and image analysis are respectively performed by the related devices of the first region, and the following other operations, including the operation of the second region, are the same. Specific related devices are detailed in the system embodiments.
And S2, the first area sends the initial defect information to the second area remotely through the transit server.
In this embodiment, the first area and the second area are respectively provided with the transit servers, the second area is different from the first area in geographic position, and the transit servers of the two areas are preferably connected by MES system two-way communication.
S3, removing the false point defect from the initial defect information in the second area (by the relevant device), and obtaining the real defect information.
False point defects, such as false judgment caused by dust and stain, may be included in the initial defect information obtained by the initial judgment, and the false point defects do not need to be repaired, and real defect information is obtained after the false point defects are removed, and the real defect information is more consistent with the defects which actually need to be repaired than the false point defects, and is not limited to 100% of the defects which need to be repaired.
And S4, the second area remotely sends the real defect information to the first area through the transfer server.
And S5, in the first area, repairing the printed circuit board according to the real defect information.
The mode of repairing the circuit board to be repaired can be manual repair, semi-automatic repair or automatic manipulator repair by using AI intelligent technology.
Compared with the prior art that the initial defect judgment and the false point defect elimination are arranged in the same area, one of the invention points is that the traditional mode of circuit board maintenance is changed, maintenance work is roughly divided into initial defect judgment, false point defect elimination and defect maintenance on the initial defect, and the initial defect judgment and defect maintenance are finished in the first area, specifically as shown in fig. 3:
s101, scanning a printed circuit board to be detected in a first area to obtain a scanned image, and analyzing the scanned image to obtain initial defect information, wherein the initial defect information comprises coordinate information of a defect position corresponding to the scanned image;
s102, remotely sending the initial defect information to a second area through a transfer server;
s103, responding to the second area to eliminate the false point defect from the initial defect information, and remotely receiving real defect information which is returned by the second area and is subjected to false point defect elimination by the first area through a transit server;
and S104, repairing the printed circuit board in the first area according to the real defect information.
And the work of eliminating the false point defect from the initial defect is finished in the second area, as shown in fig. 4:
s201, responding to a first area to scan a printed circuit board to be detected to obtain a scanned image, analyzing the scanned image, and remotely receiving initial defect information obtained by analyzing the scanned image in the first area by a transfer server in a second area, wherein the initial defect information comprises coordinate information of a defect position corresponding to the scanned image;
s202, eliminating false point defects from the initial defect information by the second area to obtain real defect information;
s203, the real defect information is remotely sent to the first area through the transfer server, and the real defect information is used for providing maintenance prompts for maintenance work of the printed circuit board in the first area.
This completely new mode enables a highly optimized configuration of resources, as shown in fig. 5:
the first application scenario is as follows: the geographic positions of the second area and the first area are different and are embodied in different places of the same field, such as different rooms, different floors or different buildings, and the communication connection between the first transfer server of the first area and the second transfer server of the second area can be realized through a local area network or an external network;
even the first and second regions across regions are not easy to establish a local area network in geographic locations, such as across regions, across cities, across provinces, or across countries, and there are two corresponding application scenarios:
the second application scenario is as follows: for a company, the equipment required for finishing preliminary judgment of initial defects and repairing the defects by arranging the first areas in a plurality of areas with low labor cost and the like is selected, and the equipment required for finishing the operation of eliminating the false point defects from the initial defects is configured in one area (the second area) in a centralized manner, so that the equipment required for eliminating the false point defects from the initial defects is not required to be configured in each first area. The selection of the second area preferably takes into account the cost of establishing an MES network with each first area, the cost of purchasing equipment to eliminate false point defects, and the like.
The third application scenario is as follows: this model is also suitable for cooperative troubleshooting between different enterprises, for example, A, B, C enterprise is the manufacturer of printed circuit boards, while D enterprise does not produce circuit boards, and D enterprise can provide A, B, C service for eliminating false point defects, so that resource allocation is highly centralized.
That is, the second area performs a cooperative maintenance work on a plurality of first areas, and the first area and the second area may be the same enterprise or different enterprises.
The application claims that "the second area is connected with a plurality of first areas", but the number of the second areas is not limited to a plurality of second areas or one second area, for example, a corporation A entrusts part of the service to a corporation D and part of the service to a corporation E, in which case the second area is not excluded from being a plurality of second areas. Specifically, the number of the first areas is that a plurality of sets of devices (automatic optical inspection devices, defect screening AI devices, defect inspection workstations, and first transfer servers) actually indicating that the first areas are distributed in different areas, and the areas are different first areas, such as the first area (i) and the first area (ii) in fig. 5; similarly, the number of the second areas is a plurality of actual devices (virtual service workstations, second transfer servers) that are distributed in different areas, and the areas are different second areas (not shown).
The solution of the invention for remotely and optically overhauling the circuit board not only saves the cost, but also improves the production efficiency, because the VVR Station is configured in the second area in a centralized way, the working efficiency of completing the virtual verification and overhauling in batches (namely, rechecking the initial defect information to obtain the real defect information) is improved, for example, the original mode needs 100 minutes for completing the rechecking of the scanned image of 1000 circuit boards in one local VVR Station, the remote mode of the invention is utilized to send the scanned image to ten trans-regional large-scale circuit boards, and the VVR Station only needs 10 minutes for completing the rechecking, thus being suitable for the batch overhauling mode in batches.
In an embodiment of the present invention, a remote Optical Inspection system for a printed circuit board is provided, which is configured to complete cooperative Inspection work on the printed circuit board across regions, as shown in fig. 2, the Inspection system includes an automatic Optical Inspection device (AOI for short) disposed in a first region, a defect screening AI device (AI for short, as shown in fig. 2), a defect Inspection workstation (VR Station for short), a first transit server, a Virtual Inspection workstation (VVR Station for short) disposed in a second region, and a second transit server, where geographic locations of the first region and the second region are different, and the first transit server is connected to the second transit server in a bidirectional communication manner;
the automatic optical inspection equipment (AOI) of the first area is used for scanning a Printed Circuit Board (PCB) to be inspected to obtain a scanning image, and the defect screening AI equipment is used for analyzing the scanning image to obtain initial defect information;
the virtual maintenance workstation (VVR Station) of the second area is used for eliminating false point defects from the initial defect information to obtain real defect information;
the defect repair workstation (VR Station) of the first area is configured to provide repair prompt information for manual repair according to the real defect information, which is described in detail below;
the first transfer server and the second transfer server are used for sending initial defect information to the second area from the first area and returning real defect information to the first area from the second area. Optionally, the first transit Server is a Dynamic Data Exchange (DDE) Server, so that after a connection relationship is established between the first area and the second area, when Data of one of the first area and the second area changes, the other area is immediately notified of the change.
Specifically, as shown in fig. 2, the first area is further provided with a first Database Server (Database Server i in fig. 2), the second area is further provided with a second Database Server (Database Server ii in fig. 2), and the Database Server i is respectively connected to the AOI device, the defect screening AI device, the VR Station, and the first transit Server; and the Database Server II is respectively connected with the second transit Server and the VVR Station. The first database server and the second database server function as follows:
the first database server is used for receiving the scanning image output by the AOI equipment and sending the scanning image to defect screening AI equipment; after the defect screening AI equipment analyzes and obtains initial defect information, sending the initial defect information to a first transit server, wherein the first transit server is preferably in communication connection with a second transit server through an MES network system, and the MES network system can check all file information output and input from a DDE and a DDV; the embodiment does not limit the number of scanned images corresponding to the initial defect information sent by the transit server to be single or multiple at a time, and particularly for a batch mode, the first transit server may further pack the initial defect information into a ZIP compressed file and then send the ZIP compressed file to the second transit server, specifically, send the image file to a folder inside the DDE server, create a ZIP file in the DDE server, the file including all AI classification information contents, the transit MES network system automatically transmits the ZIP file to the DDV server, and automatically delete the file from the DDE server after the file reaches the second transit server (DDV server);
after the ZIP file reaches the DDV server, the DDV server extracts the file from the ZIP (the object is the same as the DDE server); an operator in the second area operates the virtual overhaul workstation to check the (decompressed) picture file by using the DDV system, and automatically updates the screened and classified data (namely the real defect information obtained after the image rechecking) to the DDV server after finishing the classification work of the DDV server; after packing the real defect information into a new zip compressed file, the second transit server sends the new zip compressed file to the first transit server, where the new zip compressed file may only include more accurate (possibly smaller capacity) defect data after filtering.
The MES network system outputs a ZIP file to the DDE Server, then extracts the ZIP file and updates classification information, and the first transfer Server receives the relevant information and then sends the information to the VR Station through the Database Server I, so that the defective PCB can be repaired.
The Database Server II is used for receiving initial defect information acquired by the second transit Server from the first transit Server and then forwarding the initial defect information to a virtual maintenance workstation (VVR Station); and after eliminating the false point defect in the VVR Station and obtaining real defect information, the Database Server II sends the real defect information to a second transfer Server, and then the second transfer Server sends the real defect information to the Database Server I through the first transfer Server.
Obviously, the number of pieces of initial defect information (for example, picture 1, initial defect position coordinates a, b, c, d, e counted as one) sent by the first relay server to the second relay server is the same as and corresponds to the number of pieces of real defect information (for example, picture 1, false point defect position coordinates c, e, real defect position coordinates a, b, d counted as one) returned by the second relay server to the first relay server. The VR Station can be arranged for maintenance after correction, and the accuracy of maintenance data is ensured. For the case that the real defect is not present, the Database Server i returned to the first area is also needed, for example, returning NULL indicates that the initial defect information is all false point defects. In an embodiment of the present invention, the first area is further provided with an information checking workstation, which is in communication connection with the first database server, and the information checking workstation is used for checking initial defect information and real defect information of the printed circuit board. Specifically, the verification method is used for verifying whether the returned real defect information corresponds to the sent initial defect information, for example, if the number of information pieces in the sent zip compressed packet is inconsistent with that in the received zip compressed packet, or the real defect information is not part of the initial defect information, or the image information in the real defect information entry is inconsistent with that in the initial defect information entry, a verification failure result is obtained, manual intervention is required to be reminded to check the cause for correction, the obtained verification result can be stored locally or sent to a Database Server i for storage, the consistency of pictures of all circuit boards before and after being classified can be monitored, and the correctness and traceability of data can be ensured.
Specifically, the defect overhaul workstation includes spot welding equipment, display screen, camera device, drive arrangement and controller under the control of controller, the drive arrangement drive camera device removes in proper order to the position relative with real defect, camera device enlarges the formation of image to real defect, the display screen is used for showing camera device's formation of image result.
In the embodiment corresponding to fig. 2, the automatic optical inspection device and the defect screening AI device are in a split structure, and the defect screening AI device acquires the scanned image from the AOI device through the Database Server i.
Optionally, the number of the automatic optical detection device, the number of the defect inspection work stations and the number of the virtual inspection work stations are one or more respectively. In particular, from the viewpoint of resource allocation, a virtual maintenance workstation (VVR Station) of one second area is interfaced with the service works of a plurality of first areas, and the number of VVR stations is preferably plural. However, even in a single VVR Station, since the software operation efficiency is far greater than the operation (scanning or maintenance) efficiency of the real circuit board, the technical solution that can implement the service work of interfacing a plurality of first areas is also implemented to a certain extent.
The working process of the remote optical maintenance system for the printed circuit board of the embodiment is as follows:
scanning a printed circuit board to be detected by the AOI equipment of the first area to obtain a scanned image, and scanning N scanned images (N1, N2 and N3 … …) by taking a batch mode as an example;
analyzing the scanned image (N1, N2, N3 … …) by the defect screening AI device of the first area to obtain initial defect information, wherein each of the N pieces of information includes identity information (such as a number or an image name as identification) of the scanned image and position information (which may be simple coordinate information, or a form marked on the image, or image information plus coordinate information) of the initial defect;
after the initial defect information is compressed to obtain a compressed packet, the first transfer server sends the compressed packet to a second transfer server;
extracting the initial defect information from the second transit server and distributing the initial defect information to a virtual maintenance work Station (VVR Station) of a second area;
the VVR Station excludes a false point defect from the initial defect information to obtain real defect information;
after the real defect information is compressed, the second transfer server sends the real defect information to the first transfer server;
and after the real defect information is extracted by a defect repair workstation (VR Station) in the first area, the corresponding printed circuit board is started to be repaired according to the real defect information.
The AOI device and the defect screening AI device are existing devices in the field of circuit board maintenance, see chinese invention application with publication number CN110579479A, incorporated by reference in this application in its entirety, see in particular:
the scanning image is obtained through scanning, the scanned image is compared with a corresponding standard image loaded through a database server, the difference points obtained through comparison are used as the defects of the preliminary judgment, a defect list is constructed, and the defect list comprises defect coordinate information of the defects corresponding to the preliminary judgment of the scanned image, namely the working principle of the defect screening AI device in the embodiment is shown.
The Database Server i and the Database Server ii in the present embodiment perform similar basic functions as the Database Server in the related art.
Unlike the prior art, in which the virtual maintenance workstation (VVR Station) generally exists as a sub-module in the maintenance device (VR Station), the present invention is a separate device independent of the VR Station, but the principle of excluding the false point defect is the same as that of CN110579479A in the prior art, see the description:
the AOI equipment can obtain an overall layout picture of the defects after scanning a PCB, can accurately calibrate coordinates of corresponding defect points in the picture, and has the function of judging the types of the defects in an AOI equipment system, such as missing welding, multiple welding, welding errors and the like of a circuit board. The system comprises a database server, a maintenance equipment, a VVR system, an intelligent judgment system and a visual inspection system, wherein the database server is connected with the AOI and has a data storage function, the database server can accurately store information input after AOI scanning, the VVR system is connected with the database server and is used for maintaining equipment, the VVR acquires defect information of corresponding plates in the database server, the 'false point' information and the 'false point' coordinate information in the defect information can be accurately judged through an intelligent judgment system or a manual picture inspection, the judged 'false point' information can be deleted through operation, and after the 'false point' is deleted, the 'false point' information is moved to a position corresponding to a 'true point' defect coordinate through a Video on the VVR equipment to be manually maintained.
As a first optional technical solution, the rechecking the preliminarily determined defects by using an elimination method includes: extracting a local image at a defect coordinate corresponding to the preliminarily determined defect, and determining whether the local image meets a short-circuit characteristic or a broken-circuit characteristic, wherein the short-circuit characteristic comprises a straight line connecting two flat cables, the broken-circuit characteristic comprises a gap on the flat cables, if any one of the characteristics is met, the defect is determined to be a real defect, otherwise, the defect is determined to be a false point defect. The real defect is that manual repair is needed point by point, for example, a narrow slit of multiple welding leads to short circuit of the PCB, and the narrow slit needs to be manually removed.
As a second optional technical solution, the rechecking the preliminarily determined defects by using the feature correspondence method includes: extracting a local image at a defect coordinate corresponding to the preliminarily judged defect, and judging whether the local image simultaneously meets the following conditions: if the non-linear, irregular and isolated graphs simultaneously meet the characteristics, the defects are judged to be false point defects. The 'false point defects' can be dust, stain, fingerprints or the like, a large number of false point defects exist in the PCB, the defects can be judged during AOI scanning, if the defects are not intelligently eliminated, a large number of workers are spent on the 'false point defects' during subsequent maintenance, and the VVR system is introduced in the embodiment of the invention, so that the time cost in the aspect can be greatly reduced.
As a third optional technical solution, the rechecking the preliminarily determined defects by using the similarity matching method includes: loading a plurality of preset defect template images through a database server, wherein the defect template images are calibrated to be real defects or false point defects; extracting a local image at a defect coordinate corresponding to the preliminarily judged defect, and comparing the local image with the defect template image to find a defect template image with the highest similarity; if the defect template image with the highest similarity is calibrated to be a real defect, judging the preliminarily judged defect to be a real defect; and if the defect template image with the highest similarity is calibrated to be a false point defect, judging the defect of the preliminary judgment to be the false point defect.
As a fourth optional technical solution, the rechecking the preliminarily determined defects includes: and extracting a local image at a defect coordinate corresponding to the preliminarily judged defect, inputting the local image into a trained neural network model, and judging whether the defect is a real defect or a false point defect according to a result output by the neural network model. The neural network model can adopt a deep neural network in the prior art and train the neural network by combining a back propagation algorithm and a random gradient descent method. "
It can be known from the above disclosure of the prior art with the publication number CN110579479A that the automatic optical inspection apparatus scans a printed circuit board to be inspected to obtain a scanned image, the defect screening AI apparatus analyzes the scanned image to obtain initial defect information, the virtual inspection workstation eliminates a false point defect from the initial defect information, and the defect inspection workstation inspects the printed circuit board according to the real defect information are all the prior art, and by referring to the content of the prior art of CN110579479A, the functions of the automatic optical inspection apparatus, the defect screening AI apparatus, the virtual inspection workstation, and the defect inspection workstation executing each module are clear and complete, so that those skilled in the art can implement the technical solution of the present invention.
In one embodiment of the invention, another printed circuit board remote optical maintenance system is provided, wherein the maintenance system comprises automatic optical detection equipment, defect screening AI equipment, a defect maintenance workstation (VR Station), a first transit server, a virtual maintenance workstation (VVR Station) and a second transit server, and the first transit server is in bidirectional communication connection with the second transit server;
the automatic optical detection equipment is used for scanning a printed circuit board to be detected to obtain a scanned image, the defect screening AI equipment is used for analyzing the scanned image to obtain initial defect information, and the initial defect information comprises coordinate information of a defect position corresponding to the scanned image;
the first transit server is used for sending the initial defect information to a second transit server;
the virtual maintenance workstation (VVR Station) is used for eliminating a false point defect from the initial defect information to obtain real defect information;
the second transit server is used for returning the real defect information to the first transit server.
The defect inspection workstation (VR Station) is used for providing inspection prompt information for manual inspection according to the real defect information; in this embodiment, the VVR stations are separately and independently set with respect to the VR stations, and the number of the defect repair workstations (VR stations) is greater than the number of the virtual repair workstations (VVR stations), for example, the number of the VR stations is multiple of the number of the virtual repair workstations (VVR stations), and no bay or no bay is defined, so that the limitation of one-to-one correspondence between the VVR stations and the VR stations in the prior art is eliminated, and further optimized configuration of resources is realized.
On the basis, a solution for completing the cooperative maintenance work of the printed circuit board across the region is further provided, namely the scheme is introduced into the embodiment in full, as shown in fig. 5, the traditional mode of the detection and maintenance of the circuit board is creatively changed, the high configuration of resources is realized, the cost is saved, and the production efficiency is improved.
Further, those skilled in the art will appreciate that the boundaries between the above described operations are merely illustrative. Multiple operations may be combined into a single operation, a single operation may be distributed in additional operations, and operations may be performed at least partially overlapping times. Further, alternative embodiments may include multiple illustrations of specific operations, and the order of operations may be varied in various other embodiments.
However, other modifications, variations, and alternatives are also possible. The specification and drawings are, accordingly, to be regarded in an illustrative sense rather than a restrictive sense.
In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of other elements or steps than those listed in a claim. Furthermore, the terms "a" or "an," as used herein, are defined as one or more than one. Moreover, the use of the introductory phrases such as "at least one" and "one or more" in the claim recitations should not be interpreted to imply that the introduction of an indefinite articles "a" or "an" into another claim element limits any particular claim containing such introduced claim element to inventions containing only one such element, even when the same claim includes the introductory phrases "one or more" or "at least one" and indefinite articles such as "a" or "an". The same holds true for the use of definite articles. Unless otherwise specified, terms such as "first" and "second" are used to arbitrarily distinguish between the elements such terms describe. Thus, these terms are not necessarily intended to indicate temporal or other prioritization of such elements. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
While certain features of the invention have been illustrated and described herein, many modifications, substitutions, changes, and equivalents will now occur to those of ordinary skill in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
Claims (10)
1. A remote optical service method for printed circuit boards for performing a cooperative service of printed circuit boards across a region, the service method comprising the steps of:
s101, scanning a printed circuit board to be detected in a first area to obtain a scanned image, and analyzing the scanned image to obtain initial defect information, wherein the initial defect information comprises coordinate information of a defect position corresponding to the scanned image;
s102, remotely sending the initial defect information to a second area through a transfer server;
s103, responding to the second area to eliminate the false point defect from the initial defect information, and remotely receiving real defect information which is returned by the second area and is subjected to false point defect elimination by the first area through a transit server;
and S104, repairing the printed circuit board in the first area according to the real defect information.
2. A remote optical service method for printed circuit boards for performing a cooperative service of printed circuit boards across a region, the service method comprising the steps of:
s201, responding to a first area to scan a printed circuit board to be detected to obtain a scanned image, analyzing the scanned image, and remotely receiving initial defect information obtained by analyzing the scanned image in the first area by a transfer server in a second area, wherein the initial defect information comprises coordinate information of a defect position corresponding to the scanned image;
s202, eliminating false point defects from the initial defect information by the second area to obtain real defect information;
s203, the real defect information is remotely sent to the first area through the transfer server, and the real defect information is used for providing maintenance prompts for maintenance work of the printed circuit board in the first area.
3. The remote optical service method of claim 2, wherein the second zone performs steps S201-S203 with respect to a plurality of first zones.
4. A remote optical maintenance system for printed circuit boards is characterized by being used for completing cooperative maintenance work on the printed circuit boards across areas, and comprising automatic optical detection equipment, defect screening AI equipment, a defect maintenance workstation and a first transit server which are arranged in a first area, and a virtual maintenance workstation and a second transit server which are arranged in a second area, wherein the geographic positions of the first area and the second area are different, and the first transit server is in bidirectional communication connection with the second transit server;
the automatic optical detection equipment is used for scanning a printed circuit board to be detected to obtain a scanned image, the defect screening AI equipment is used for analyzing the scanned image to obtain initial defect information, and the initial defect information comprises coordinate information of a defect position corresponding to the scanned image;
the virtual maintenance workstation is used for eliminating the false point defect from the initial defect information to obtain real defect information;
the defect overhauling workstation is used for providing overhauling prompt information for manual overhauling according to the real defect information;
the first transfer server and the second transfer server are used for sending initial defect information to the second area from the first area and returning real defect information to the first area from the second area.
5. The remote optical inspection system of claim 4, wherein the first area is further provided with a first database server, and the first database server is respectively connected with the automatic optical inspection equipment, the defect screening AI equipment, the defect inspection workstation and the first transit server;
and the second area is also provided with a second database server which is respectively connected with a second transfer server and the virtual maintenance workstation.
6. The remote optical inspection system of claim 5 wherein the first area further comprises an information proofing workstation communicatively coupled to the first database server, the information proofing workstation operable to proof initial defect information and actual defect information of the printed circuit board.
7. The remote optical inspection system of claim 4, wherein the defect inspection workstation comprises a spot welding device, a display screen, a camera device, a driving device and a controller, under the control of the controller, the driving device drives the camera device to move to a position opposite to the real defect in sequence, the camera device is used for magnifying and imaging the real defect, and the display screen is used for displaying the imaging result of the camera device.
8. The remote optical service system of claim 4, wherein the first transit Server is communicatively coupled to the second transit Server via an MES network system, and the first transit Server is a DDE Server.
9. The remote optical inspection system of claim 4 wherein the number of automated optical inspection devices, defect inspection workstations, and virtual inspection workstations is one or more.
10. The remote optical access system of claim 4, wherein the number of the first and/or second zones is plural, such that the plural first zones cooperate with the second zones to perform access work to the printed circuit board, or the first zones cooperate with the plural second zones to perform access work to the printed circuit board.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011293244.5A CN112432958A (en) | 2020-11-18 | 2020-11-18 | Remote optical maintenance method and system for printed circuit board |
| TW110201297U TWM619772U (en) | 2020-11-18 | 2021-02-02 | System for remote optical overhaul of printed circuit board |
| TW110103888A TWI769688B (en) | 2020-11-18 | 2021-02-02 | A method and system for remote optical overhaul of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011293244.5A CN112432958A (en) | 2020-11-18 | 2020-11-18 | Remote optical maintenance method and system for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112432958A true CN112432958A (en) | 2021-03-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011293244.5A Pending CN112432958A (en) | 2020-11-18 | 2020-11-18 | Remote optical maintenance method and system for printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112432958A (en) |
| TW (2) | TWM619772U (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8290239B2 (en) * | 2005-10-21 | 2012-10-16 | Orbotech Ltd. | Automatic repair of electric circuits |
| CN108388223B (en) * | 2018-04-03 | 2022-01-28 | 深圳市同富信息技术有限公司 | Equipment control system based on data closed loop for intelligent factory |
-
2020
- 2020-11-18 CN CN202011293244.5A patent/CN112432958A/en active Pending
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2021
- 2021-02-02 TW TW110201297U patent/TWM619772U/en unknown
- 2021-02-02 TW TW110103888A patent/TWI769688B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI769688B (en) | 2022-07-01 |
| TWM619772U (en) | 2021-11-21 |
| TW202221313A (en) | 2022-06-01 |
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