CN206332009U - No ink spot wafer appearance inspecting system - Google Patents
No ink spot wafer appearance inspecting system Download PDFInfo
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- CN206332009U CN206332009U CN201720043198.0U CN201720043198U CN206332009U CN 206332009 U CN206332009 U CN 206332009U CN 201720043198 U CN201720043198 U CN 201720043198U CN 206332009 U CN206332009 U CN 206332009U
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Abstract
The utility model is related to a kind of no ink spot wafer appearance inspecting system, the system includes reading device, mobile microscope carrier, image capture unit, display device, control device and vernier device, the reading device reads the sequence number on wafer, and wafer mapping graph is exported by Computer Database；The movement microscope carrier is for placing wafer and can adjust its horizontal level；The image capture unit shoots the wafer；The control device is connected with the reading device, the movement microscope carrier, the image capture unit, the display device and the vernier device, and the control device receives the wafer mapping graph, and the wafer mapping graph and wafer image are shown by the display device；Flaw die locations are clicked in the vernier device display device, are recorded through the control device synchronized update, and show the flaw die locations in the wafer mapping graph, the inspection program of no ink spot is thereby imported, and lifting is estimated efficiency and checked on the quality.
Description
Technical field
The utility model is related to a kind of technical field of no ink spot wafer visual examination, more particularly to a kind of in visual inspection
Afterwards need not be directly in ink distribution point on wafer, but the wafer mapping graph (wafer of a sign flaw die locations can be obtained
Mapping design).
Background technology
Semiconductor chip (semiconductor chip) is the lamination on wafer (wafrer) substrate (substrate)
Form several layers of circuit pattern (circuit pattern) and manufacture number chip.After the completion of manufacture, the wafer can through repeatedly electrically or
Efficiency detect, finally carry out visual examination, during underproof crystal grain can all stamp ink dot (ink), with distinguish crystal grain quality.
Then the wafer after testing will deliver to encapsulation factory, allow encapsulation factory for several chips and can encapsulate core after cladding, encapsulation using cutting crystal wafer
Piece is examined through electric test and QC again, it is qualified after can dispatch from the factory, so that dealer is applied in various electronic products.
In above-mentioned test jobs, wafer is after circuit pattern formation, for the flaw on wafer, foreign matter or circuit pattern
The defect such as collapse, can be checked by the progress of wafer appearance inspecting system.Wafer appearance inspection method is commonly used, is that wafer is delivered into inspection
Board is looked into, wafer is shot by phtographic lens and is amplified and compare data, be confirmed whether have flaw, foreign matter or circuit pattern to collapse
Defect, underproof crystal grain separately must stamp ink dot (ink) manually to operate ink distribution machine, define, bad crystal grain, but straight in wafer
Taking the method for ink dot has following several shortcomings：
1) ink distribution point is in the operation on wafer, it is necessary to rely on ink distribution machine, is visually inspected by operating personnel and is operated, production effect
Rate is low；
2) the thick point of ink dot easily produces uneven phenomenon, it is impossible to meet the requirement that manufacturer wishes consistency of thickness, some
Wafer, usually because ink dot variable thickness or uneven, has a strong impact on the quality of wafer ink dot；
3) ink distribution point is directly to be marked on wafer, such as needs hard copy record manually must fill in addition, if being intended to make record
Management more efficiently or log into thr computer, need extra assignment again so that related data can not be collected effectively and computer digit
Change, can not also carry out the analysis and research of big data.
The content of the invention
Main purpose system of the present utility model provides a kind of no ink spot wafer appearance inspecting system, in the inspection of wafer outward appearance
The wafer mapping graph of a digitlization and sign flaw die locations is produced after looking into, to be used as follow-up cutting crystal wafer and each crystal grain of encapsulation
Foundation, though its by Manual Visual Inspection be not necessary to directly in stamping ink dot on wafer, ink distribution cost and manpower can be saved, can also be lifted
The efficiency and accuracy of visual examination.
Secondary objective system of the present utility model provides a kind of no ink spot wafer appearance inspecting system, and produced sign flaw is brilliant
The wafer mapping graph of grain position can be stored directly in server host or cloud database, so that client synchronously reads or carried out greatly
Data analysis, compare and manage.
In order to achieve the above object, the technical solution of the utility model includes as follows：
A kind of no ink spot wafer appearance inspecting system, including：Reading device, mobile microscope carrier, image capture unit, display dress
Put, control device and vernier device, the reading device reads the sequence number on wafer and its meets the wafer mapping graph of sequence number；
The movement microscope carrier is for placing wafer and can adjust its horizontal level；The image capture unit shoots the wafer；The control device with
The reading device, the movement microscope carrier, the image capture unit, the display device and the vernier device are connected, the control device
The wafer mapping graph is received, the wafer mapping graph and wafer image are shown by the display device；The vernier device display device
On click flaw crystal grain (die) position, through the control device in house software running and synchronized update record, and in the wafer mapping
Show the flaw die locations in figure.
In inspection system of the present utility model, further connection server, the server separately connects many wafer sorts
Machine, the server can receive and store the wafer mapping graph that many wafer test machine tests are completed, and the server separately passes through net
Internet is connected with client computer, can thereby provide more and more complete wafer visual examination data, is carried out for client
Big data com-parison and analysis, understands exception or flaw reason, studies modification method.
In inspection system of the present utility model, the system further comprises identifying device, and the control device connects the knowledge
Other device, the identifying device has comparison data storehouse, and multiple map files for comparing are stored in the comparison data storehouse, multiple flaws are included
Defect crystal grain map file and multiple indefectible crystal grain map files, by the identifying device auxiliary compare identification, can auxiliary operator reduce sentence
The disconnected situation artificially judged by accident, increases the precision of appearance test.
Compared with prior art, advantages of the present invention at least that：
1) it may achieve the purpose of a with no paper data collection, storage, analysis and management；
2) operation of prosthetic ink distribution point, can remove ink dot cost, the human cost for reducing this operation and activity duration,
Thereby reduce production cost, shorten production procedure, improving production efficiency；
If 3) click the error of ink distribution position, need only more new data, re-operate, it is convenient easily and quick, and data
It is more accurate, yield can be improved；
4) more and more complete wafer visual examination data can be provided, so that client carries out big data com-parison and analysis,
Exception or flaw reason are solved, modification method is studied.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, will be described to prior art and embodiment below
Needed for the accompanying drawing to be used be briefly described.
Figure 1A is the system architecture diagram of no ink spot wafer appearance inspecting system disclosed in the embodiment of the present invention；
Figure 1B is the schematic appearance of no ink spot wafer appearance inspecting system disclosed in the embodiment of the present invention；
Fig. 2 is another implementation of the system architecture diagram of no ink spot wafer appearance inspecting system disclosed in the embodiment of the present invention
Example；
Fig. 3 is the another implementation of the system architecture diagram of no ink spot wafer appearance inspecting system disclosed in the embodiment of the present invention
Example；
Fig. 4 is the flow chart of no ink spot wafer appearance inspection method disclosed in the embodiment of the present invention；
Fig. 5 be no ink spot wafer appearance inspection method disclosed in the embodiment of the present invention in image comparison step flow
Figure.
Description of reference numerals：1- no ink spot wafer appearance inspecting systems, 10- wafer test machines, 11- reading devices, 12- is moved
Dynamic load platform, 13- image capture units, 14- display devices, 15- vernier devices, 16- control devices, 161- computing modules, 17- knows
Other device, 171- comparison datas storehouse, 20- servers, 30- client computers.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described.
As illustrated in figures 1A and ib, it is system architecture diagram and the outward appearance signal of no ink spot wafer appearance inspecting system of the present invention
Figure.No ink spot wafer appearance inspecting system 1 of the present invention includes：It is reading device 11, mobile microscope carrier 12, image capture unit 13, aobvious
Showing device 14, vernier device 15 and the control device 16 being connected with foregoing each device.
The movement microscope carrier 12 is available for placing a wafer to be checked, and can carry the adjustment that the wafer makees horizontal level.Should
Reading device 11 to read the sequence number on wafer and its meet sequence number wafer mapping graph, afterwards the wafer mapping graph data
Data is then transmitted to the control device 16, and the wafer mapping graph is the crystal grain distribution figure of the wafer.On the other hand, the image is picked
The inside of device 13 tool optical photographic lens are taken, to shoot in the wafer on the movement microscope carrier 12, related wafer image data
Also it can transmit to the control device 16；The display device 14 is a display screen.The control device 16 receives the wafer map
With the wafer image data, after being handled through the computing module 161 inside the control device 16, shown by the display device 14
The wafer image after the wafer map and amplification.In addition, vernier device 15 be index point-seleecting device, such as mouse, stylus,
Trackpad, keyboard ... etc., click the flaw die locations that the display device 14 is shown, through the control device by the vernier device 15
16 are operated and synchronized update record by computing module 161, also in the wafer mapping graph, show the flaw die locations, finally
And the wafer map with sign flaw die locations can be exported.
Fig. 2 is another embodiment of the system architecture diagram of no ink spot wafer appearance inspecting system of the present invention.In this embodiment
In, no ink spot wafer appearance inspecting system of the present invention, separately can connection server 20, and the server 20 separately connects the survey of many wafers
Test-run a machine 10, thereby decapacitation of server 20 receives and stored the wafer mapping that many tests of wafer test machine (tester) 10 are completed
Figure, the data of the wafer mapping graph after no ink spot wafer appearance inspecting system 1 is recorded in addition also can synchronous transfer to server
20, it can be read via world-wide web by client computer 30 is synchronous, facilitate client further to manage or carry out big data analysis
Compare, flaw reason occurs in understanding.
Fig. 3 is the another embodiment of the system architecture diagram of no ink spot wafer appearance inspecting system of the present invention.In this embodiment
In, the control device 16 of no ink spot wafer appearance inspecting system 1 of the present invention further connects identifying device 17, the identifying device 17
With comparison data storehouse 171, the multiple map files for comparing of storage, include multiple flaw crystal grain wherein in the comparison data storehouse 171
Map file and multiple indefectible crystal grain map files, can be through the control if image capture unit 13 is stored as map file after shooting each grain appearance
Device 16 processed sends into the identifying device 17, on the other hand, the synchronous map file read in comparison data storehouse 171 of the identifying device 17,
,, should to there is flaw crystal grain map file if the identifying device judges that image capture unit 13 shoots the drawing and picture files of crystal grain after comparison
Identifying device 17 can send an abnormal signal and notify that alarm is shut down or sent to the control device 16, notify the outer of operator's crystal grain
Sight has exception, by the present embodiment, can auxiliary operator reduce the situation for judging artificially to judge by accident, increase appearance test it is accurate
Degree.
As shown in figure 4, flow chart for no ink spot wafer appearance inspection method of the present invention and also referring to Figure 1A to scheming
4, master of the invention is the inspection method carried out with said apparatus, and step is as follows：
Step 200, activation system.
Step 201, wafer sequence number is read, wafer mapping graph is shown by the display device 14.This step is by the reading
Device 11 is read after the wafer sequence number, and the reading device 11 obtains the wafer mapping graph for meeting sequence number, afterwards the wafer mapping graph
Data information then transmit to the control device 16, through the control device 16 drive the display device 14 show the wafer mapping
Figure.
Step 202, wafer is placed on the movement microscope carrier 12, the focal length of the image capture unit 13 is adjusted, by the display
Device 14 shows the wafer image of the wafer.This step master is the correction and adjustment of computer hardware, including by wafer with correct orientation
The movement microscope carrier 12 is positioned over, and is moved to correct position.Adjust optical photographic lens inside the image capture unit 13
Focal length, to obtain clearly image, and shows the wafer image after amplifying through the display device 12.
Step 203, wafer map and the wafer image position of the display device 14 display are proofreaded, makes both mutual
Correspondence.This step is mainly operated through the in house software of control device 16, including setup parameter, correction reference point, school
Positive coordinate and reference point setting.Wherein the setup parameter be input the wafer in crystal grain (die) spacing (pitch) or
It is other basic parameters.The correction reference point is moving cursor device and clicks the mark point (mark) of the wafer mapping graph, is made
The wafer image is obtained with the wafer map by Primary Location.Calibration coordinate is so that the coordinate and wafer image of the wafer image
The coordinate of figure is consistent.Reference point setting to proofread the die locations of the wafer map and the wafer image crystal grain whether
Correctly, it is ensured that the correctness of subsequent manual ink dot (ink) mark.
Step 204, through estimating the wafer image at the display device 14, if finding the flaw crystal grain on the wafer image
(die) the flaw die locations, are clicked with vernier device 15, via the more new record of the software synchronization in control device 16 and in this
Show the flaw die locations in wafer mapping graph.
This step is ink dot mark operation, mainly so that manually visual inspection confirms the wafer image one by one, if finding the crystalline substance
There is flaw crystal grain in circle image, then to click flaw crystal grain through the vernier device 15, updated by software synchronization and be recorded in this
Wafer mapping graph, eventually forms the wafer map of a sign flaw die locations, actually on the wafer can't be out of ink
Point, be a no ink spot (design of (inkless), post package factory can just determine that IC is non-defective unit or not according to the wafer mapping graph
Non-defective unit.
In above-mentioned steps 204, in addition to the wafer image is estimated at the display device 14, another no ink spot wafer outward appearance of the present invention
Inspection method, additionally comprises an image comparison step, and the image comparison step is manually one by one during the visual inspection wafer image
It is synchronous to carry out, as shown in figure 5, such as step 501, the image capture unit 13 is stored as after also shooting the image of grain appearance simultaneously
Map file, map file can be sent to the identifying device 17 through the control device 16；Such as step 502, the identifying device 17 is synchronous to read ratio
To the map file in database 171, multiple flaw crystal grain map files and multiple indefectible crystal grain map files are included；Such as step 503, the identification
Device 17 judges that image capture unit 13 shoots the drawing and picture files of crystal grain, if identical with there is flaw crystal grain map file, if YES,
Step 505 is then arrived, the identifying device 17 can send an abnormal signal and notify that alarm is shut down or sent to the control device 16, notify behaviour
Author, it is to avoid artificial visual inspection is neglected, and the situation being detected without discovery flaw crystal grain；If NO, then into step
504, the identifying device 14 judges that the image capture unit 13 shoots the drawing and picture files of crystal grain, if with indefectible crystal grain map file phase
Together, if NO, then to step 505；If YES, then it is non-defective unit to represent the crystal grain, does not make to circulate a notice of, and terminates this subsynchronous image
Compare step.The image comparison step is carried out when estimating next crystal grain afterwards again.
In the wafer mapping graph data of above-mentioned renewal, also can pass through the control device 16, through the reading device 11 transmit to
Server, through world-wide web so that client computer is synchronously read, for managing or carrying out big data com-parison and analysis, thereby
Wafer production manufacturer, which can further analyze, there is flaw reason, improved production processing procedure, to lift production yield.
In summary it is described, with no ink spot wafer appearance inspection method of the present invention, with following several advantages：
1) it may achieve the purpose of a with no paper data collection, storage, analysis and management；
2) operation of prosthetic ink distribution point, can remove ink dot cost, the human cost for reducing this operation and activity duration,
Thereby reduce production cost, shorten production procedure, improving production efficiency；
If 3) click the error of ink distribution position, need only more new data, re-operate, it is convenient easily and quick, and data
It is more accurate, yield can be improved.
4) more and more complete wafer visual examination data can be provided, so that client carries out big data com-parison and analysis,
Exception or flaw reason are solved, modification method is studied.
Above-mentioned embodiment, technical concept and architectural feature only to illustrate the invention, it is therefore intended that allow and be familiar with this
The stakeholder of item technology can implement according to this, but above content is not intended to limit protection scope of the present invention, every according to this hair
Any equivalent change or modification that bright Spirit Essence is made, all should fall into the interior of protection scope of the present invention.
Claims (3)
1. a kind of no ink spot wafer appearance inspecting system, including：
One reading device, reads the sequence number on wafer, and wafer mapping graph is exported by Computer Database；
One movement microscope carrier, for placing wafer and its horizontal level can be adjusted；
One image capture unit, shoots the wafer；
One display device；
One control device, is connected with the reading device, the movement microscope carrier, the image capture unit and the display device, the control
Device processed receives the wafer mapping graph, and the wafer mapping graph and the wafer image of the wafer are shown by the display device；
One vernier device, is connected with the control device, the vernier device by clicking flaw die locations in the display device, by
The control device synchronized update records and shows the flaw die locations in the wafer mapping graph.
2. no ink spot wafer appearance inspecting system according to claim 1, it is characterised in that：The system further connects clothes
Business device, the server separately connects many wafer test machines, and the server can receive and store many wafer test machines and test
Into wafer mapping graph, the server is separately connected through world-wide web with client computer.
3. no ink spot wafer appearance inspecting system according to claim 1, it is characterised in that：The system further comprises knowing
Other device, the control device connects the identifying device, and the identifying device has comparison data storehouse, stores many in the comparison data storehouse
The individual map file for comparing, the map file includes multiple flaw crystal grain map files and multiple indefectible crystal grain map files.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720043198.0U CN206332009U (en) | 2017-01-13 | 2017-01-13 | No ink spot wafer appearance inspecting system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720043198.0U CN206332009U (en) | 2017-01-13 | 2017-01-13 | No ink spot wafer appearance inspecting system |
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| CN206332009U true CN206332009U (en) | 2017-07-14 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110132543A (en) * | 2019-05-28 | 2019-08-16 | 北京兆维智能装备有限公司 | A kind of efficient COFCG appearance detection device |
-
2017
- 2017-01-13 CN CN201720043198.0U patent/CN206332009U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110132543A (en) * | 2019-05-28 | 2019-08-16 | 北京兆维智能装备有限公司 | A kind of efficient COFCG appearance detection device |
| CN110132543B (en) * | 2019-05-28 | 2024-06-07 | 北京兆维智能装备有限公司 | Efficient COFCG appearance inspection equipment |
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