CN112423546B - 一种微细通道液冷散热系统 - Google Patents
一种微细通道液冷散热系统 Download PDFInfo
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- CN112423546B CN112423546B CN202011175851.1A CN202011175851A CN112423546B CN 112423546 B CN112423546 B CN 112423546B CN 202011175851 A CN202011175851 A CN 202011175851A CN 112423546 B CN112423546 B CN 112423546B
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- Prior art keywords
- magnetic fluid
- channel
- liquid
- cooling liquid
- micro
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202011175851.1A CN112423546B (zh) | 2020-10-28 | 2020-10-28 | 一种微细通道液冷散热系统 |
Applications Claiming Priority (1)
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CN202011175851.1A CN112423546B (zh) | 2020-10-28 | 2020-10-28 | 一种微细通道液冷散热系统 |
Publications (2)
Publication Number | Publication Date |
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CN112423546A CN112423546A (zh) | 2021-02-26 |
CN112423546B true CN112423546B (zh) | 2022-03-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202011175851.1A Active CN112423546B (zh) | 2020-10-28 | 2020-10-28 | 一种微细通道液冷散热系统 |
Country Status (1)
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CN (1) | CN112423546B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114916193B (zh) * | 2022-04-24 | 2024-01-09 | 大连保税区金宝至电子有限公司 | 逆重力输送液体的方法和散热装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101329509A (zh) * | 2008-07-29 | 2008-12-24 | 西安交通大学 | 一种减阻表面的制造方法 |
EP3021354A1 (en) * | 2014-11-14 | 2016-05-18 | Alcatel Lucent | A fluidic pump |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130299145A1 (en) * | 2012-04-19 | 2013-11-14 | National University Of Singapore | Heat sink system |
CN109149012B (zh) * | 2018-09-29 | 2023-05-23 | 山东大学 | 基于磁制冷技术的温度控制系统、电动汽车电池组热管理系统及方法 |
CN109271008A (zh) * | 2018-11-05 | 2019-01-25 | 北京小米移动软件有限公司 | 外部冷却系统和电子设备 |
CN209133496U (zh) * | 2018-11-14 | 2019-07-19 | 中国科学院理化技术研究所 | 液态金属微流道散热装置 |
CN110926244A (zh) * | 2019-12-06 | 2020-03-27 | 南方科技大学 | 一种磁流体换热装置 |
-
2020
- 2020-10-28 CN CN202011175851.1A patent/CN112423546B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101329509A (zh) * | 2008-07-29 | 2008-12-24 | 西安交通大学 | 一种减阻表面的制造方法 |
EP3021354A1 (en) * | 2014-11-14 | 2016-05-18 | Alcatel Lucent | A fluidic pump |
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Publication number | Publication date |
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CN112423546A (zh) | 2021-02-26 |
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CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Qiu Zhiqiang Inventor after: Pang Jie Inventor after: Lao Xingsheng Inventor after: Gou Jinlan Inventor after: Ke Zhiwu Inventor after: Wu Jun Inventor after: Lv Weijian Inventor after: Li Yong Inventor after: Wei Zhiguo Inventor after: Li Bangming Inventor after: Wang Junrong Inventor after: Huang Chonghai Inventor after: Xiao Qi Inventor after: Zhou Hongkuan Inventor after: Zhang Kelong Inventor after: Ke Hanbing Inventor after: Wang Wei Inventor after: Chen Kai Inventor after: Li Shaodan Inventor after: Lin Yuansheng Inventor before: Huang Chonghai Inventor before: Pang Jie Inventor before: Lao Xingsheng Inventor before: Gou Jinlan Inventor before: Ke Zhiwu Inventor before: Wu Jun Inventor before: Lv Weijian Inventor before: Li Yong Inventor before: Wei Zhiguo Inventor before: Li Bangming Inventor before: Wang Junrong Inventor before: Zhou Hongkuan Inventor before: Xiao Qi Inventor before: Qiu Zhiqiang Inventor before: Zhang Kelong Inventor before: Ke Hanbing Inventor before: Wang Wei Inventor before: Chen Kai Inventor before: Li Shaodan Inventor before: Lin Yuansheng |
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