CN112420894A - Micro LED transfer device, transfer method and display panel - Google Patents

Micro LED transfer device, transfer method and display panel Download PDF

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Publication number
CN112420894A
CN112420894A CN202011204175.6A CN202011204175A CN112420894A CN 112420894 A CN112420894 A CN 112420894A CN 202011204175 A CN202011204175 A CN 202011204175A CN 112420894 A CN112420894 A CN 112420894A
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micro led
substrate
micro
transfer device
led transfer
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Chinese (zh)
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李冬泽
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN202011204175.6A priority Critical patent/CN112420894A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The application discloses a Micro LED transfer device, a transfer method and a display panel, wherein the Micro LED transfer device comprises a printing device; the printing device comprises a substrate and a release layer positioned on the surface of the substrate; the substrate is used for adsorbing the Micro LED; the release layer is used for separating the substrate and the Micro LED under a set humidity condition, so that the problems that a transfer effect is poor and product yield is affected due to local force unbalance in the process of transferring the Micro LED are solved, and the transfer precision and the product yield of the Micro LED are improved.

Description

Micro LED transfer device, transfer method and display panel
Technical Field
The application relates to the technical field of display, in particular to a Micro LED transfer device, a transfer method and a display panel.
Background
Micro Light Emitting diodes (Micro LEDs) have been the main research in the display technology field because of their characteristics such as high brightness, high contrast, high resolution, high color gamut, and wide viewing angle. However, how to transfer the micro light emitting diodes to the corresponding pixels of the array substrate as required becomes a difficult point in developing the micro light emitting diode technology. At present, mass transfer technology is generally adopted to realize the transfer of the micro diode, but even the mature elastic Stamp (Stamp) transfer technology in the mass transfer technology is adopted, the technical defects also exist, for example, when anisotropic conductive adhesive or other bonding material technology is adopted, local force imbalance occurs, and the accurate transfer effect cannot be achieved.
Disclosure of Invention
The embodiment of the application provides a Micro LED transfer device, a transfer method and a display panel, and can solve the problems that a transfer effect is poor and product yield is affected due to local force unbalance in the Micro LED transfer process.
The embodiment of the application provides a Micro LED transfer device, includes: a printing apparatus, the printing apparatus comprising:
the substrate is used for adsorbing the Micro LED; and the number of the first and second groups,
and the release layer is positioned on the surface of the substrate and used for separating the substrate and the Micro LED under a set humidity condition.
In some embodiments, the release layer comprises a water vapor sensitive polymeric material.
In some embodiments, the moisture-sensitive polymeric material includes a solvent and a water-soluble polymeric compound and a reactant dispersed in the solvent.
In some embodiments, the water-soluble polymer compound comprises at least one of polyvinylpyrrolidone, and the reactant comprises a combination of at least one of citric acid, adipic acid, and sodium bicarbonate; the solvent includes dichloromethane and ethanol.
In some embodiments, the mass ratio of the water-soluble polymer compound to the reactant is 10: 1-1: 1.
in some embodiments, the dichloromethane is 0.5 to 1% by mass, and the ethanol is less than or equal to 5% by mass.
In some embodiments, the substrate includes a base and an elastomer on a side of the base adjacent to the release layer.
In some embodiments, the set humidity condition is a humidity greater than 50%.
The application also provides a Micro LED transfer method, and the Micro LED transfer device comprises the following steps:
s10: providing a bearing substrate and a target substrate; the surface of the bearing substrate is provided with a plurality of Micro LEDs to be transferred, and a target position where the Micro LEDs are to be placed is arranged on the target substrate;
s20: picking up the Micro LED with the printing device;
s30: placing the Micro LED at the target position of the target substrate, and performing water vapor treatment on the printing device to separate the Micro LED from the substrate.
The present application also provides a display panel, including:
the target substrate comprises a plurality of Micro LEDs obtained by transferring through the Micro LED transferring device or a plurality of Micro LEDs obtained by transferring through a Micro LED transferring method.
The embodiment of the application provides a Micro LED transfer device, a transfer method and a display panel, wherein the Micro LED transfer device comprises: a printing device; the printing apparatus includes: the substrate is used for adsorbing the Micro LED; and the release layer is positioned on the surface of the substrate and used for separating the substrate and the Micro LED under a set humidity condition so as to solve the problems that the transfer effect is poor and the product yield is influenced due to local force imbalance in the process of transferring the Micro LED, and improve the transfer precision and the product yield of the Micro LED.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1A to 1C are schematic structural views of a Micro LED transfer device provided in an embodiment of the present application;
FIG. 2A is an enlarged view of a portion of FIG. 1B at A;
fig. 2B is a top view of a printing apparatus provided by an embodiment of the present application;
fig. 3A to 3B are schematic structural diagrams of a carrier substrate according to an embodiment of the disclosure;
fig. 3C to 3D are schematic structural diagrams of a target substrate according to an embodiment of the present disclosure;
FIG. 4A is a schematic flow chart illustrating a Micro LED transferring method provided in an embodiment of the present application
FIGS. 4B to 4G are schematic views illustrating a process of transferring the Micro LED by the transferring method shown in FIG. 4A;
fig. 5 is a schematic structural diagram of a display panel according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Specifically, please refer to fig. 1A to 1C, which are schematic structural diagrams of a Micro LED transfer device according to an embodiment of the present application; as shown in fig. 2A, which is a partial enlarged view of a in fig. 1B; as shown in fig. 2B, which is a top view of the printing apparatus provided by the embodiment of the present application.
The embodiment of the application provides a Micro LED transfer device, includes: a printing apparatus 100, said printing apparatus 100 comprising:
the substrate 101 is used for adsorbing the Micro LED 200; and the number of the first and second groups,
the release layer 102 is located on the surface of the substrate 101, and the release layer 102 is used for separating the substrate 101 and the Micro LEDs 200 under a set humidity condition, so that the transfer precision and the product yield of the Micro LEDs 200 are improved.
Specifically, the release layer 102 includes a water vapor sensitive polymeric material 1021.
Further, the water vapor sensitive polymer material 1021 includes a solvent, and a water soluble polymer compound and a reactant dispersed in the solvent.
Specifically, the water-soluble high molecular compound comprises at least one of polyvinylpyrrolidone and polyvinylpyrrolidone, and the reactant comprises a combination of at least one of citric acid and adipic acid and sodium bicarbonate; the solvent includes dichloromethane and ethanol.
Wherein the mass ratio of the water-soluble high molecular compound to the reactant is 10: 1-1: 1; the mass percent of the dichloromethane is 0.5-1%, and the mass percent of the ethanol is less than or equal to 5%.
Taking the reactant as a combination of citric acid and sodium bicarbonate as an example, when the release layer 102 is in the environment of the set humidity condition, the reactant in the release layer 102 reacts in the presence of water, that is, the citric acid and the sodium bicarbonate in the release layer 102 react in the presence of water, and the reaction mechanism is: c6H8O7(aq)+3NaHCO3(aq)→Na3C6H5O7(aq)+3H2O(l)+3CO2(g) (ii) a The products obtained by the reaction are sodium citrate, water and carbon dioxide; in addition, under the set humidity condition, the water-soluble high molecular compound in the release layer 102 is dissolved in water, so that the substrate is madeThe bonding force between the substrate 101 and the Micro LED200 is reduced, so that the substrate 101 and the Micro LED200 are easily separated, and the problems of poor transfer effect and influence on the product yield caused by local force imbalance in the Micro LED transfer process can be solved.
Wherein the set humidity condition is that the humidity is more than 50%; specifically, whether the set humidity condition meets the requirement that the humidity is greater than 50% can be detected by a humidity detection device; the humidity detection device comprises a hygrometer or a humidity sensor and the like.
Further, the substrate 101 includes a base 1011 and an elastomer 1012, wherein the elastomer 1012 is located on a side of the base 1011 near the release layer 102.
The elastomer 1012 may be a full-face structure, as shown in FIG. 1A; however, as the density of the Micro LEDs 200 on the surface of the carrier substrate 400 is greater than the number of the Micro LEDs 200 required to be disposed on the target substrate 500, as shown in fig. 3A to 3D; therefore, to improve the selectivity of the Micro LED200, the elastomer 1012 may also be a patterned structure, as shown in fig. 1B, which is a schematic structural diagram of the elastomer 1012 being a concave-convex structure.
Fig. 3A to 3B are schematic structural diagrams of a carrier substrate according to an embodiment of the present disclosure; as shown in fig. 3C to 3D, which are schematic structural diagrams of a target substrate according to an embodiment of the present disclosure; the Micro LEDs 200 to be transferred are formed on the surface of the carrier substrate 400.
In addition, the colors of the Micro LEDs 200 to be transferred on the surface of the carrier substrate 100 may be the same or different; if the colors of the plurality of to-be-transferred Micro LEDs 200 on the surface of the carrier substrate 100 are different, for example, the plurality of to-be-transferred Micro LEDs 200 include red Micro LEDs 201 arranged in rows or columns, green Micro LEDs 202 arranged adjacent to the red Micro LEDs 201, blue Micro LEDs 203 arranged adjacent to the green Micro LEDs 202, and the like, as shown in fig. 3B; the elastomer 1012 is provided as a patterned structure to also realize the pick-up of the Micro LEDs of a certain color, and the transfer device 100 performs pick-up transfer on the Micro LEDs 200 of different colors to obtain the target substrate 500 shown in fig. 3D. The elastomer 1012 is provided as a patterned structure, which is not limited to a concave-convex structure, and a person skilled in the art can design other structures according to actual needs, and details thereof are not repeated here.
With continued reference to fig. 1A-1C and fig. 2A-2B, the material for preparing the substrate 1011 includes a silicon wafer; the elastomer 1012 is made of a material including silicone; specifically, the elastomer 1012 is polydimethylsilane.
Due to the methylene chloride contained in the release layer 102, a reaction occurs between the release layer 102 and the elastomer 1012, so that the surface of the elastomer 1012 close to the release layer 102 is dissolved, the surface of the elastomer 1012 forms a micro-etched rough surface, and the water vapor sensitive polymer material 1021 is positioned in the holes or the recesses of the rough surface of the elastomer 1012, as shown in fig. 2B; therefore, the bonding force between the elastic body 1012 and the Micro LED200 is not affected, and the printing device 100 can pick up the Micro LED200 from the carrier substrate 400.
The release layer 102 can be formed on the surface of the elastomer 1012 by using a spraying or ink-jet printing process; the film thickness of the release layer 102 is greater than or equal to 30nm and less than or equal to 300 nm; further, the film thickness of the release layer 102 is greater than or equal to 50nm and less than or equal to 200 nm.
The holes or depressions formed by the reaction between the release layer 102 and the elastomer 1012 are controlled by the amount of the water vapor sensitive polymer material 1021 in the release layer 102 and the manufacturing process for forming the release layer 102, so as to ensure that the hole diameter or the depression depth is small relative to the entire surface of the elastomer 1012 or the surface of the protrusions in the elastomer 1012, and avoid affecting the elastomer 1012 to pick up the Micro LED200 from the carrier substrate 400.
In the enlarged partial view shown in fig. 2A, only the Micro LED200 is taken as an example of a lateral structure, that is, the two electrodes 201 and 202 of the Micro LED200 are located on the same side; a person skilled in the art can also change the Micro LED200 to have a vertical structure instead of a horizontal structure, that is, the two electrodes 201 and 202 of the Micro LED200 are located on opposite sides, and the description thereof is omitted here.
With continued reference to fig. 1A to 1C and fig. 3A to 3D, the Micro LED transfer apparatus further includes a controller 300, wherein the controller 300 is configured to control the printing apparatus 100 to move the Micro LED200 from the carrier substrate 400 to a target position 501 on the target substrate 500 where the Micro LED is to be placed, so as to achieve precise transfer of the Micro LED.
Further, the Micro LED transfer device further includes a positioning device or the like, not shown, for detecting the position of the printing device 100; or for detecting the relative position of the printing device 100 with respect to the carrier substrate 400; or detecting a relative position of the printing apparatus 100 with respect to the target substrate 500; the printing device 100 aligns the printing device 100 with the carrier substrate 400 under the control of the controller 300 according to the detection result of the positioning device, so as to adsorb the Micro LEDs 200; or aligning the Micro LEDs 200 adsorbed by the printing device 100 with the target positions on the target substrate 500 where the Micro LEDs are to be placed, so as to ensure accurate transfer of the Micro LEDs. The positioning device may comprise a charge coupled camera.
In addition, the positioning device can also align the printing device 100 with the target substrate or the carrier substrate through the alignment mark 1013. Specifically, as shown in fig. 1C, the edge region of the substrate 101 is provided with the alignment mark 1013, and in a top view, the alignment mark 1013 is a circular structure, a T-shaped structure, a rectangular structure, a groove structure, a boss structure, or the like; correspondingly, the carrier substrate 400 and the target substrate 500 are also provided with positioning marks 1014 corresponding to the alignment marks 1013; the positioning marks 1014 are in the shape or structure of a circle, a T-shape, a rectangle, a groove, a boss, etc., as shown in fig. 3B and 3D. The shapes and sizes of the alignment marks 1013 and the positioning marks may be the same or different, and those skilled in the art can set the alignment marks according to actual needs, which is not described herein again.
Furthermore, the alignment mark 1013 further includes a first alignment mark, a second alignment mark, and a third alignment mark, and the first alignment mark, the second alignment mark, and the third alignment mark have different shapes; correspondingly, the positioning mark 10114 further comprises a first positioning mark 1014a, a second positioning mark 1014b and a third positioning mark 1014c, wherein the first positioning mark 1014a, the second positioning mark 1014b and the third positioning mark 1014c are different in shape. The first alignment mark, the second alignment mark, and the third alignment mark are used for realizing the transfer positioning of the Micro LEDs with different colors, together with the first positioning mark 1014a, the second positioning mark 1014b, and the third positioning mark 1014 c. If the first alignment mark and the first positioning mark 1014a are used for realizing the transfer positioning of the red Micro LED; the second alignment mark and the second positioning mark 1014b are used for realizing the transfer positioning of the green Micro LED and the like.
The alignment marks 1013 can be formed simultaneously with the patterning process of the elastomer 1012, so as to reduce the number of process steps.
Please refer to fig. 4A, which is a schematic flowchart illustrating a Micro LED transferring method according to an embodiment of the present disclosure; fig. 4B to 4G are schematic diagrams illustrating a process of transferring the Micro LED by the transferring method shown in fig. 4A. The application also provides a Micro LED transfer method, and the Micro LED transfer device comprises the following steps:
s10: providing a carrier substrate 400 and a target substrate 500; a plurality of Micro LEDs 200 to be transferred are formed on the surface of the carrier substrate 400, and a target position 501 where the Micro LEDs 200 are to be placed is arranged on the target substrate 500, as shown in fig. 4B to 4C;
s20: picking up the Micro LED200 by using the printing apparatus 100, as shown in fig. 4D to 4E;
s30: placing the Micro LED200 at the target position 501 of the target substrate 500, and performing moisture treatment on the printing apparatus 100 to separate the Micro LED200 from the substrate 101, so as to complete the transfer of the Micro LED200, as shown in fig. 4F to 4G.
In step S30, water vapor may be introduced or the printing apparatus 100 and the target substrate 500 may be integrally moved into a fixed humidity mechanism, so as to perform the water vapor treatment on the printing apparatus 100.
When the water vapor treatment is performed on the printing device 100, the humidity of the environment where the printing device 100 is located needs to be a set humidity condition; specifically, the set humidity condition is that the humidity is greater than 50%. Whether the set humidity condition meets the requirement that the humidity is more than 50% can be detected according to a humidity detection device; the humidity detection device comprises a hygrometer or a humidity sensor and the like.
In the water vapor treatment process, the release layer 102 reacts with water vapor to generate a large amount of gas, so that the substrate 101 is separated from the Micro LED200, and the Micro LED200 is transferred.
In the water vapor treatment process, the reaction speed of the release layer 102 and water vapor is faster and is far less than the humidity tolerance and reliability test conditions of the Micro LED200, so the influence of the water vapor treatment on the Micro LED200 is less. In addition, in the subsequent processes, a packaging and protection process is further included, so that the target substrate 500 and the Micro LED200 can be protected.
Please refer to fig. 5, which is a schematic structural diagram of a display panel according to an embodiment of the present application; the present application also provides a display panel, including:
the target substrate 500 comprises a plurality of Micro LEDs 200 obtained by transferring through the Micro LED transferring device or a plurality of Micro LEDs obtained by transferring through a Micro LED transferring method.
The target substrate 500 further includes a control circuit layer and a buffer layer, which are not shown, the control circuit layer includes a transistor and a control circuit, and the control circuit layer is used to control the Micro LED200 to emit light, so as to realize the display of the display panel.
The display panel further comprises an encapsulation layer 502 located on a side of the Micro LED200 away from the target substrate 500, wherein the encapsulation layer 502 is used for protecting the Micro LED200 from water and oxygen.
Further, the display panel may further include a circular polarizer or the like, not shown, to increase a viewing angle of the display panel.
Further, the display panel further includes a color conversion film, a color filter, or other parts, not shown, to improve the contrast and the display color purity of the display panel.
Furthermore, the display panel further comprises a touch panel, and the touch panel is arranged in the display panel in a built-in or external-hanging manner to realize the touch function of the display panel.
Further, the display panel further comprises a sensor, wherein the sensor comprises a distance sensor, a gravity sensor, a light sensor and the like, so as to realize functions of fingerprint identification, face identification, distance perception and the like of the display panel.
The embodiment of the application provides a Micro LED transfer device, a transfer method and a display panel, wherein the Micro LED transfer device comprises: a printing apparatus 100; the printing apparatus 100 includes: the substrate 101 is used for adsorbing the Micro LED 200; and the release layer 102 is positioned on the surface of the substrate 101, and the release layer 102 is used for separating the substrate 101 and the Micro LED200 under a set humidity condition so as to solve the problems that a transfer effect is poor and a product yield is influenced due to local force imbalance in the process of transferring the Micro LED, and improve the transfer precision and the product yield of the Micro LED.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The Micro LED transfer device, the transfer method, and the display panel provided in the embodiments of the present application are described in detail above, and specific examples are applied in the description to explain the principle and the implementation manner of the present application, and the description of the embodiments above is only used to help understanding the technical scheme and the core concept of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims (10)

1. A Micro LED transfer device, comprising: a printing apparatus, the printing apparatus comprising:
the substrate is used for adsorbing the Micro LED; and the number of the first and second groups,
and the release layer is positioned on the surface of the substrate and used for separating the substrate and the Micro LED under a set humidity condition.
2. A Micro LED transfer device according to claim 1, wherein the release layer comprises a water vapor sensitive polymeric material.
3. The Micro LED transfer device of claim 2, wherein the moisture sensitive polymeric material comprises a solvent and a water soluble polymeric compound and a reactant dispersed in the solvent.
4. A Micro LED transfer device according to claim 3, wherein the water soluble polymer compound comprises at least one of polyvinylpyrrolidone, polyvinylpyrrolidone; the reactants comprise a combination of at least one of citric acid, adipic acid, and sodium bicarbonate; the solvent includes dichloromethane and ethanol.
5. The Micro LED transfer device of claim 3, wherein the mass ratio of the water soluble polymer compound to the reactant is 10: 1-1: 1.
6. the Micro LED transfer device of claim 4, wherein the dichloromethane is 0.5-1% by mass, and the ethanol is less than or equal to 5% by mass.
7. The Micro LED transfer device of claim 1, wherein the substrate comprises a base and an elastomer on a side of the base adjacent to the release layer.
8. The Micro LED transfer device of claim 1, wherein the set humidity condition is a humidity greater than 50%.
9. A Micro LED transfer method is characterized in that the Micro LED transfer device as claimed in any one of claims 1 to 8 is adopted, and the method comprises the following steps:
s10: providing a bearing substrate and a target substrate; the surface of the bearing substrate is provided with a plurality of Micro LEDs to be transferred, and a target position where the Micro LEDs are to be placed is arranged on the target substrate;
s20: picking up the Micro LED with the printing device;
s30: placing the Micro LED at the target position of the target substrate, and performing water vapor treatment on the printing device to separate the Micro LED from the substrate.
10. A display panel, comprising:
a target substrate, comprising a plurality of Micro LEDs transferred by the Micro LED transfer device as claimed in any one of claims 1 to 8.
CN202011204175.6A 2020-11-02 2020-11-02 Micro LED transfer device, transfer method and display panel Pending CN112420894A (en)

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Citations (6)

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Publication number Priority date Publication date Assignee Title
WO2008040151A1 (en) * 2006-09-01 2008-04-10 Tao Wang Synthetic detergent and its preparation method
CN110088920A (en) * 2019-03-19 2019-08-02 京东方科技集团股份有限公司 Transfer method and transfer device
CN110112170A (en) * 2019-05-17 2019-08-09 上海九山电子科技有限公司 A kind of microchip transfer equipment and transfer method
CN110660712A (en) * 2019-10-08 2020-01-07 深圳市思坦科技有限公司 LED transfer method and device and chip magnetic end forming method
CN111081622A (en) * 2019-11-25 2020-04-28 广东省半导体产业技术研究院 Device transfer method
CN111518538A (en) * 2020-04-26 2020-08-11 深圳市华星光电半导体显示技术有限公司 Preparation method of light-emitting film, light-emitting film and display device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008040151A1 (en) * 2006-09-01 2008-04-10 Tao Wang Synthetic detergent and its preparation method
CN110088920A (en) * 2019-03-19 2019-08-02 京东方科技集团股份有限公司 Transfer method and transfer device
CN110112170A (en) * 2019-05-17 2019-08-09 上海九山电子科技有限公司 A kind of microchip transfer equipment and transfer method
CN110660712A (en) * 2019-10-08 2020-01-07 深圳市思坦科技有限公司 LED transfer method and device and chip magnetic end forming method
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Application publication date: 20210226