CN112420788B

CN112420788B - Display panel, manufacturing method thereof and display device

Info

Publication number: CN112420788B
Application number: CN202011264315.9A
Authority: CN
Inventors: 刘越; 周琦; 乔贵洲
Original assignee: Hefei Visionox Technology Co Ltd
Current assignee: Hefei Visionox Technology Co Ltd
Priority date: 2020-11-12
Filing date: 2020-11-12
Publication date: 2023-09-08
Anticipated expiration: 2040-11-12
Also published as: CN112420788A

Abstract

The invention discloses a display panel, a manufacturing method thereof and a display device. The display panel includes: a substrate base; an inorganic layer on the substrate base; a plurality of metal traces on the inorganic layer; wherein, a buffer structure is filled between any two adjacent metal wires; the buffer structure comprises N layers of buffer parts which are sequentially stacked, the length of the ith layer of buffer part is greater than that of the (i+1) th layer of buffer part, the distance between the ith layer of buffer part and the inorganic layer is smaller than that between the (i+1) th layer of buffer part and the inorganic layer, N is an integer greater than or equal to 3, and i is greater than or equal to 1 and less than or equal to N-1; the edge of the buffer part of the j-th layer is provided with at least one bulge of the j-th layer, the edge of the buffer part of the j+1-th layer is provided with at least one bulge of the j+1-th layer, and the bulges of the j-th layer and the bulges of the j+1-th layer are arranged in a staggered way, and j is more than or equal to 1 and less than or equal to N-2. The scheme disclosed by the invention can avoid the problem of short circuit caused by incomplete etching in the manufacturing process of the metal wiring, so that the product yield is improved.

Description

Display panel, manufacturing method thereof and display device

Technical Field

The embodiment of the invention relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device.

Background

With the development of display technology, display panels have been changed from large to thin, from narrow to borderless, and from inflexible to flexible. The flexible display panel is a flexible display device, has the advantages of portability, bending and curling, and the like, and is a hot spot for research and development in the current display technology.

In the production and manufacture of display panels, softer organic materials are often used instead of inorganic materials in consideration of the bending characteristics of flexible display panels. However, in the photolithography process of the metal traces, excessive level differences of the organic material may form more photoresist residues at the bottoms of the level differences, and the photoresist residues may cause that the metal in the etched area cannot be completely removed in the etching process, thereby causing short circuits between the metal traces and affecting the product yield.

Disclosure of Invention

The invention provides a display panel, a manufacturing method thereof and a display device, which can avoid the problem of short circuit caused by incomplete etching in the manufacturing process of metal wires so as to improve the product yield.

In a first aspect, an embodiment of the present invention provides a display panel, including: a substrate base; an inorganic layer on the substrate base; a plurality of metal traces on the inorganic layer;

wherein, a buffer structure is filled between any two adjacent metal wires;

the buffer structure comprises N layers of buffer parts which are sequentially stacked, the length of the ith layer of buffer part is greater than that of the (i+1) th layer of buffer part, the distance between the ith layer of buffer part and the inorganic layer is smaller than that between the (i+1) th layer of buffer part and the inorganic layer, N is an integer greater than or equal to 3, and i is greater than or equal to 1 and less than or equal to N-1;

the edge of the buffer part of the j-th layer is provided with at least one bulge of the j-th layer, the edge of the buffer part of the j+1-th layer is provided with at least one bulge of the j+1-th layer, and the bulges of the j-th layer and the bulges of the j+1-th layer are arranged in a staggered way, and j is more than or equal to 1 and less than or equal to N-2.

The display panel above, optionally, N has a value of 3;

the buffer structure comprises a first buffer part, a second buffer part and a third buffer part which are sequentially stacked, wherein the length of the first buffer part is greater than that of the second buffer part, and the length of the second buffer part is greater than that of the third buffer part;

the edge of the first buffer part is provided with at least one first bulge, the edge of the second buffer part is provided with at least one second bulge, and the first bulge and the second bulge are arranged in a staggered mode.

The display panel as above, optionally, the edge of the j+1th layer protrusion is flush with the edge of the j-th layer buffer portion; and/or, when j=1, the edge of the j-th layer bump is flush with the edge of the inorganic layer.

The display panel as above, optionally, when the number of the jth layer protrusions is greater than 1, the orthographic projections of the jth layer protrusions on the substrate are the same or different; when the number of the j+1 layer bulges is larger than 1, the orthographic projections of the j+1 layer bulges on the substrate base plate are the same or different;

preferably, the orthographic projection of the j-th layer bulge on the substrate base plate is any one or a combination of a plurality of rectangular, triangular, trapezoidal, semicircular, polygonal and wedge-shaped;

preferably, the orthographic projection of the j+1th layer protrusion on the substrate base plate is any one or a combination of a plurality of rectangular, triangular, trapezoidal, semicircular, polygonal and wedge-shaped.

In the display panel as above, optionally, the height of the jth layer protrusion is less than or equal to the height of the jth layer buffer portion, and/or the height of the jth+1 layer protrusion is less than or equal to the height of the jth+1 layer buffer portion.

The display panel as above, optionally, the display panel includes a functional area and a fan-out area located at least on one side of the functional area, and the metal wiring is used for connecting the functional area and the fan-out area;

the height of the j-th layer protrusion gradually decreases along the direction in which the functional area points to the fan-out area, and/or the height of the j+1-th layer protrusion gradually decreases.

The display panel above, optionally, the material of the buffer structure is an organic material;

preferably, the material of the buffer structure is an optical cement.

In a second aspect, embodiments of the present invention further provide a display device, including a display panel having any of the features of the first aspect.

In a third aspect, an embodiment of the present invention further provides a method for manufacturing a display panel, including:

forming an inorganic layer on a substrate base;

forming a functional layer on the inorganic layer, wherein the functional layer comprises a plurality of metal wires, and a buffer structure is filled between any two adjacent metal wires;

In the above method for manufacturing a display panel, optionally, when the value of N is 3, forming a functional layer on the inorganic layer includes:

forming a plurality of first buffer parts on the inorganic layer, wherein the edges of the first buffer parts are provided with at least one first bulge;

forming a plurality of first wirings on the inorganic layer and in the gaps between any two adjacent first buffer parts;

forming a second buffer part on each first buffer part, wherein the length of the first buffer part is longer than that of the second buffer part, and at least one second bulge is arranged on the edge of the second buffer part, and the first bulges and the second bulges are arranged in a staggered manner;

forming a second wire on each first wire, wherein the first wires and the second wires together form a metal wire;

a third buffer portion is formed on each of the second buffer portions, and a length of the second buffer portion is greater than a length of the third buffer portion.

The invention provides a display panel, a manufacturing method thereof and a display device, wherein a buffer structure filled between metal wires is designed, so that the buffer structure comprises at least three layers of buffer parts which are sequentially stacked, a step-shaped structure is formed between the buffer parts, and the break difference of the buffer structure can be relieved; meanwhile, except for one layer of buffer part farthest from the inorganic layer, the edges of the buffer parts of the other layers are provided with at least one bulge, and the bulge can avoid the problem of short circuit caused by incomplete etching in the manufacturing process of the metal wiring, so that the product yield is improved.

Drawings

FIG. 1 is a schematic diagram of a conventional display panel;

fig. 2 is a schematic top view of a display panel according to an embodiment of the invention;

FIG. 3 is an enlarged view of a portion of the structure shown in phantom in FIG. 2, in accordance with an embodiment of the present invention;

FIG. 4 is an enlarged view of a portion of another configuration shown in phantom in FIG. 2, provided in accordance with an embodiment of the present invention;

FIG. 5 is an enlarged view of a portion of yet another alternate embodiment of the present invention shown in phantom in FIG. 2;

FIG. 6 is an enlarged view of a portion of yet another alternate embodiment of the present invention shown in phantom in FIG. 2;

fig. 7 is a schematic structural diagram of a display device according to an embodiment of the present invention;

fig. 8 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;

fig. 9 is a flowchart illustrating another method for manufacturing a display panel according to an embodiment of the invention.

Detailed Description

The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.

Meanwhile, the description of the drawings and the embodiments is illustrative and not restrictive. Like reference numerals refer to like elements throughout the specification. In addition, the thickness of some layers, films, panels, regions, etc. may be exaggerated in the drawings for understanding and ease of description. It will also be understood that when an element such as a layer, film, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. In addition, "on … …" refers to positioning an element on or under another element, but does not in essence refer to positioning on the upper side of another element according to the direction of gravity. For ease of understanding, the drawings of the present invention depict elements on the upper side of another element.

In addition, unless explicitly described to the contrary, the word "comprise" and variations such as "comprises" or "comprising" will be understood to imply the inclusion of a stated element but not the exclusion of any other element.

It should also be noted that references to "and/or" in embodiments of the present invention are intended to encompass any and all combinations of one or more of the associated listed items. Various components are described in the embodiments of the present invention using "first", "second", "third", etc., but these components should not be limited by these terms. These terms are only used to distinguish one element from another element. Also, the singular forms "a," "an," and "the ()" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

While an embodiment may be practiced differently, the specific process sequence may be performed differently than as described. For example, two consecutively described processes may be performed at substantially the same time or in an order reverse to the order described.

In the production and manufacture of display panels, softer organic materials are often used instead of inorganic materials in consideration of the bending characteristics of flexible display panels. Fig. 1 shows a schematic layout diagram of a conventional display panel, in which, in order to reduce the problem that the photoresist residue at the bottom of the offset is too large to form more photoresist residue, which can cause the problem that the metal in the etched area cannot be completely removed in the etching process, the organic material filled between the metal traces 12 is coated in batches, as shown in fig. 1, and the organic material is coated in two steps, for example, the organic material is coated in two steps, so that the organic material forms a first organic layer 10 and a second organic layer 11, i.e., two step structures as shown in fig. 1. However, although the above-mentioned method reduces the difference between the first organic layer 10 and the second organic layer 11 to some extent, the metal residue (such as the portion marked by the dashed line frame in fig. 1) caused by the difference still cannot be completely avoided, and a short circuit phenomenon may still occur between the metal traces 12, which affects the display effect of the display panel. In order to solve the problems, the embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, which can avoid the problem of short circuit caused by incomplete etching in the manufacturing process of metal wires so as to improve the product yield.

Next, the display panel, the method of manufacturing the display panel, and the display device will be described in detail.

In addition, the following embodiments are exemplified by the display panel being rectangular, and in practical applications, the display panel may be regular or irregular, such as circular, polygonal, etc., and the present invention is not limited thereto. Meanwhile, in order to describe the structure of the display panel more clearly, the following drawings in the embodiments of the present invention correspondingly adjust the sizes of the structures in the display panel.

Fig. 2 shows a schematic top view of a display panel according to an embodiment of the present invention, and as shown in fig. 2, the display panel includes a functional area 200 and a fan-out area 201 located on at least one side of the functional area 200, and a metal wire 202 is used to connect the functional area 200 and the fan-out area 201. In order to realize a narrow frame, the fan-out area 201 is usually folded back to the back of the display panel, so the flexibility and reliability of the metal trace 202 have a crucial significance for the life and yield of the display panel.

It is understood that the functional area 200 may be a pixel display area or a touch area.

When the functional region 200 is a pixel display region, the functional region 200 includes a plurality of pixels, each of which may include an emission layer and a circuit layer for controlling an amount of light emitted from the emission layer. The circuit layer may include a display line, a display electrode, and at least one transistor. The emissive layer may include an organic light emitting material. The emissive layer may be encapsulated by an encapsulation layer. The encapsulation layer may seal the emission layer to prevent (or at least reduce) moisture or the like from being introduced from the outside. The encapsulation layer may be composed of a single inorganic layer or a plurality of layers thereof, or a stack of inorganic layers and organic layers alternately stacked on each other. The fan-out area 201 may include a driving pad on which a driving chip and a flexible circuit board (Flexible Printed Circuit, FPC) are disposed.

When the functional area 200 is a touch area, the functional area 200 may acquire (or detect) position information of an input point through at least one of a capacitive method, a resistive film method, an electromagnetic induction method, an infrared method, and the like. The functional area 200 may include a touch electrode, and the fanout area 201 may include a touch PAD (TP PAD).

The metal trace 202 for connecting the functional area 200 and the fan-out area 201 may be a signal line, or may be a lead for connecting a pad and a signal line, and the material thereof is not limited herein, and may be a single-layer metal or a multi-layer metal or a metal alloy.

An embodiment of the present invention provides a display panel including: a substrate base; an inorganic layer on the substrate base; a plurality of metal traces on the inorganic layer; wherein, a buffer structure is filled between any two adjacent metal wires; the buffer structure comprises N layers of buffer parts which are sequentially stacked, the length of the ith layer of buffer part is greater than that of the (i+1) th layer of buffer part, the distance between the ith layer of buffer part and the inorganic layer is smaller than that between the (i+1) th layer of buffer part and the inorganic layer, N is an integer greater than or equal to 3, and i is greater than or equal to 1 and less than or equal to N-1; the edge of the buffer part of the j-th layer is provided with at least one bulge of the j-th layer, the edge of the buffer part of the j+1-th layer is provided with at least one bulge of the j+1-th layer, and the bulges of the j-th layer and the bulges of the j+1-th layer are arranged in a staggered way, and j is more than or equal to 1 and less than or equal to N-2.

Specifically, fig. 3 is a partially enlarged view of a structure shown by a dashed box in fig. 2 according to an embodiment of the present invention, where fig. 3 (a) is a schematic top view structure; FIG. 3 (b) is a schematic cross-sectional view taken along aa' in FIG. 3 (a); fig. 3 (c) is a schematic cross-sectional structure along bb' in fig. 3 (a). As shown in fig. 3, the display panel includes: a substrate base 30; an inorganic layer 31 on the base substrate 30; a plurality of metal traces 202 on the inorganic layer 31; the buffer structure 32 is filled between any two adjacent metal wires 202.

The buffer structure 32 includes N layers of buffer portions (n=3 is drawn as an example in fig. 3) stacked in order, that is, the buffer structure includes a first buffer portion 321, a second buffer portion 322, and a third buffer portion 323 stacked in order, where the length of the first buffer portion 321 is greater than the length of the second buffer portion 322, and the length of the second buffer portion 322 is greater than the length of the third buffer portion 323; the distance between the first buffer portion 321 and the inorganic layer 31 is smaller than the distance between the second buffer portion 322 and the inorganic layer 31, and the distance between the second buffer portion 322 and the inorganic layer 31 is smaller than the distance between the third buffer portion 323 and the inorganic layer 31, i.e., the first buffer portion 321, the second buffer portion 322, and the third buffer portion 323 form a stepped structure.

The edge of the first buffer portion 321 has at least one first protrusion a (drawn with the number of the first protrusions a being 1 in fig. 3), and the edge of the second buffer portion 322 has at least one second protrusion B (drawn with the number of the second protrusions B being 1 in fig. 3), and the first protrusions a are staggered with the second protrusions B.

In the display panel structure, the buffer structure 32 comprises at least three layers of buffer parts which are sequentially stacked, and a step-shaped structure is formed between the buffer parts, so that the break difference of the buffer structure 32 can be slowed down, and the problem that metal in an etching area cannot be completely removed due to the too large break difference is avoided to a certain extent; meanwhile, referring to fig. 3 (a), metal of the etched region may remain at the edge where the inorganic layer 31 overlaps the first buffer portion 321 and the edge where the first buffer portion 321 overlaps the second buffer portion 322, and since the edge of the first buffer portion 321 has at least one first protrusion a and the edge of the second buffer portion 322 has at least one second protrusion B, the existence of the protrusions greatly prolongs the distance that metal of the etched region may remain, resulting in a greatly reduced probability that the remaining metal can communicate with the two metal traces 202, thereby avoiding a short circuit problem caused by incomplete etching during the metal trace manufacturing process, and thus improving the product yield.

It will be appreciated that the greater the number of bumps, the longer the distance that metal in the etched area may remain, resulting in a lower probability that the remaining metal will be able to communicate with the two metal traces 202.

In order to further improve the product yield, in an embodiment, fig. 4 is a partial enlarged view of another structure shown by a dashed box in fig. 2 according to an embodiment of the present invention, where fig. 4 (a) is a schematic top view structure; FIG. 4 (b) is a schematic cross-sectional view taken along aa' in FIG. 4 (a); fig. 4 (c) is a schematic cross-sectional structure along bb' in fig. 4 (a). As shown in fig. 4, on the basis of the display panel shown in fig. 3, the edge of the first protrusion a is flush with the edge of the inorganic layer 31 and/or the edge of the second protrusion B is flush with the edge of the first buffer 321.

The edges of the first protrusions a are flush with the edges of the inorganic layer 31 so that no metal remains on the inorganic layer 31 in the region corresponding to the edges of the first protrusions a; the edge of the second protrusion B is flush with the edge of the first buffer portion 321 so that no metal remains on the first buffer portion 321 and in the region corresponding to the edge of the second protrusion B. Thereby completely cutting off the path of the residual metal for connecting the two metal wires 202, fundamentally avoiding the short circuit problem caused by incomplete etching in the manufacturing process of the metal wires, and improving the product yield.

In an embodiment, when the number of the first protrusions a is greater than 1, the orthographic projections of the first protrusions a on the substrate base plate 30 are the same or different; when the number of the second protrusions B is greater than 1, the orthographic projections of the second protrusions B on the substrate base 30 are the same or different.

In an embodiment, the orthographic projection of the first protrusion a on the substrate 30 is any one or a combination of a plurality of rectangular, triangular, trapezoidal, semicircular, polygonal, and wedge-shaped; and/or, the orthographic projection of the second protrusion B on the substrate 30 is any one or a combination of a plurality of rectangular, triangular, trapezoidal, semicircular, polygonal, and wedge-shaped.

In an embodiment, fig. 5 is a partial enlarged view of a structure shown in a dashed box in fig. 2 according to an embodiment of the present invention, where fig. 5 (a) is a schematic top view; FIG. 5 (b) is a schematic cross-sectional view taken along aa' in FIG. 5 (a); fig. 5 (c) is a schematic cross-sectional structure along bb' in fig. 5 (a). As shown in fig. 5, the height of the first protrusion a is less than or equal to the height of the first buffer 321, and/or the height of the second protrusion B is less than or equal to the height of the second buffer 322. The smaller the height of the bump, the smaller the difference between the bump and the underlying film layer, and therefore the lower the probability of metal remaining around the bump, resulting in a lower probability of metal remaining being able to communicate with the two metal traces 202.

In an embodiment, fig. 6 is a partial enlarged view of a structure shown in a dashed box in fig. 2 according to an embodiment of the present invention, where fig. 6 (a) is a schematic top view; FIG. 6 (b) is a schematic cross-sectional view taken along aa' in FIG. 6 (a); fig. 6 (c) is a schematic cross-sectional structure along bb' in fig. 6 (a). As shown in fig. 6, the height of the first protrusion a gradually decreases and/or the height of the second protrusion B gradually decreases in a direction in which the functional area 200 points to the fan-out area 201. The gradual decrease in the height of the bump may further decrease the probability of metal remaining around the bump, thereby decreasing the probability that the remaining metal can connect two metal traces 202.

It should be noted that the height of the protrusion gradually decreases, and may decrease smoothly as shown in fig. 6, or may decrease stepwise, which is not particularly limited in the embodiment of the present invention.

In an embodiment, the material of the buffer structure is an organic material. The organic material may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a polyurethane resin, a cellulose resin, a silicone resin, a polyimide resin, a polyamide resin, and a perylene resin.

Optionally, the material of the buffer structure is optical cement.

It is understood that the buffer structure provided in the embodiment of the present invention is not limited to the three-layer buffer portion, but may be a four-layer buffer portion, a five-layer buffer portion, or a more-layer buffer portion.

When the buffer structure includes N-layer buffer portions that are laminated in order, the following two relationships are satisfied between the N-layer buffer portions:

the length of the buffer part of the ith layer is larger than that of the buffer part of the (i+1) th layer, the distance between the buffer part of the ith layer and the inorganic layer is smaller than that between the buffer part of the (i+1) th layer and the inorganic layer, N is an integer larger than or equal to 3, and i is larger than or equal to 1 and smaller than or equal to N-1;

the edge of the buffer part of the j layer is provided with at least one bulge of the j layer, the edge of the buffer part of the j+1 layer is provided with at least one bulge of the j+1 layer, and the bulges of the j layer and the bulges of the j+1 layer are arranged in a staggered way, and j is more than or equal to 1 and less than or equal to N-2.

Optionally, the edge of the j+1 layer of protrusion is flush with the edge of the j layer of buffer; and/or, when j=1, the edge of the j-th layer bump is flush with the edge of the inorganic layer.

Optionally, the height of the jth layer protrusion is less than or equal to the height of the jth layer buffer portion, and/or the height of the jth+1 layer protrusion is less than or equal to the height of the jth+1 layer buffer portion.

Optionally, the height of the j-th layer protrusion gradually decreases in a direction in which the functional area points to the fan-out area, and/or the height of the j+1-th layer protrusion gradually decreases.

In one embodiment, the thickness of the buffer structure 32 may be 4.5um. The thickness of each layer of cushioning portions is uniform (i.e., 1.5um for each layer of cushioning portions when cushioning structure 32 includes 3 layers of cushioning portions, and 0.9um for each layer of cushioning portions when cushioning structure 32 includes 5 layers of cushioning portions). The offset (i.e., step width) of two adjacent layers of buffer portions is 5um.

The present invention provides a display panel, comprising: a substrate base; an inorganic layer on the substrate base; a plurality of metal traces on the inorganic layer; wherein, a buffer structure is filled between any two adjacent metal wires; the buffer structure comprises N layers of buffer parts which are sequentially stacked, the length of the ith layer of buffer part is greater than that of the (i+1) th layer of buffer part, the distance between the ith layer of buffer part and the inorganic layer is smaller than that between the (i+1) th layer of buffer part and the inorganic layer, N is an integer greater than or equal to 3, and i is greater than or equal to 1 and less than or equal to N-1; the edge of the buffer part of the j-th layer is provided with at least one bulge of the j-th layer, the edge of the buffer part of the j+1-th layer is provided with at least one bulge of the j+1-th layer, and the bulges of the j-th layer and the bulges of the j+1-th layer are arranged in a staggered way, and j is more than or equal to 1 and less than or equal to N-2. The buffer structure filled between the metal wires is designed, so that the buffer structure comprises at least three layers of buffer parts which are sequentially stacked, a step-shaped structure is formed between the buffer parts, and the break difference of the buffer structure can be relieved; meanwhile, except for one layer of buffer part farthest from the inorganic layer, the edges of the buffer parts of the other layers are provided with at least one bulge, and the bulge can avoid the problem of short circuit caused by incomplete etching in the manufacturing process of the metal wiring, so that the product yield is improved.

The embodiment of the invention also provides a display device, and fig. 7 shows a schematic structural diagram of the display device provided by the embodiment of the invention. As shown in fig. 7, the display device 70 includes a display panel 71 provided in any of the embodiments of the present invention.

The display device 70 may also include a front camera and a sensor. The front camera and the sensor are disposed correspondingly below the display area of the display panel 71. Alternatively, other devices, such as a gyroscope or an earpiece, may be provided below the display area in addition to the front camera and the sensor.

The display panel 71 may be any one of an Organic Light-Emitting Diode (OLED) display panel, an In-Plane Switching (IPS) display panel, a Twisted Nematic (TN) display panel, a vertical alignment (Vertical Alignment, VA) display panel, an electronic paper, a QLED (Quantum Dot Light Emitting Diodes) display panel, a micro LED (micro LED) display panel, or the like, which is not particularly limited In the present invention. The light emission mode of the display panel 71 may be top emission, bottom emission, or double-sided emission.

The display device 70 provided by the embodiment of the invention can be applied to intelligent wearable equipment (such as an intelligent bracelet and an intelligent watch) and also can be applied to equipment such as an intelligent mobile phone, a tablet personal computer and a display.

Fig. 8 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention, as shown in fig. 8, the method includes:

s101, forming an inorganic layer on a substrate.

The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

S102, forming a functional layer on an inorganic layer, wherein the functional layer comprises a plurality of metal wires, and a buffer structure is filled between any two adjacent metal wires; the buffer structure comprises N layers of buffer parts which are sequentially stacked, the length of the ith layer of buffer part is greater than that of the (i+1) th layer of buffer part, the distance between the ith layer of buffer part and the inorganic layer is smaller than that between the (i+1) th layer of buffer part and the inorganic layer, N is an integer greater than or equal to 3, and i is greater than or equal to 1 and less than or equal to N-1; the edge of the buffer part of the j-th layer is provided with at least one bulge of the j-th layer, the edge of the buffer part of the j+1-th layer is provided with at least one bulge of the j+1-th layer, and the bulges of the j-th layer and the bulges of the j+1-th layer are arranged in a staggered way, and j is more than or equal to 1 and less than or equal to N-2.

Specifically, referring to fig. 8, fig. 9 is a schematic flow chart of another method for manufacturing a display panel according to an embodiment of the present invention, as shown in fig. 9, when the value of N is 3, step S102 may include steps S102a to S102e:

s102a, forming a plurality of first buffer parts on the inorganic layer, wherein the edges of the first buffer parts are provided with at least one first bulge.

S102b, forming a plurality of first wirings on the inorganic layer and in the gap between any two adjacent first buffer parts.

S102c, forming a second buffer part on each first buffer part, wherein the length of the first buffer part is larger than that of the second buffer part, at least one second bulge is arranged on the edge of the second buffer part, and the first bulges and the second bulges are arranged in a staggered mode.

S102d, forming a second wire on each first wire, wherein the first wires and the second wires jointly form a metal wire.

S102e, forming a third buffer part on each second buffer part, wherein the length of the second buffer part is larger than that of the third buffer part.

Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.

Claims

1. A display panel, comprising: a substrate base; an inorganic layer on the substrate base plate; a plurality of metal traces on the inorganic layer;

wherein a buffer structure is filled between any two adjacent metal wires;

the buffer structure comprises N layers of buffer parts which are sequentially stacked, the length of the i layer of buffer part is greater than that of the i+1 layer of buffer part, the distance between the i layer of buffer part and the inorganic layer is smaller than that between the i+1 layer of buffer part and the inorganic layer, N is an integer greater than or equal to 3, and i is greater than or equal to 1 and less than or equal to N-1;

the edge of the jth layer buffer part is provided with at least one jth layer bulge, the edge of the jth+1 layer buffer part is provided with at least one jth+1 layer bulge, and the jth layer bulge and the jth+1 layer bulge are arranged in a staggered manner, wherein j is more than or equal to 1 and less than or equal to N-2.

2. The display panel according to claim 1, wherein N has a value of 3;

the edge of the first buffer part is provided with at least one first bulge, the edge of the second buffer part is provided with at least one second bulge, and the first bulges and the second bulges are arranged in a staggered mode.

3. The display panel according to claim 1, wherein an edge of the j+1-th layer protrusion is flush with an edge of the j-th layer buffer; and/or, when j=1, the edge of the j-th layer protrusion is flush with the edge of the inorganic layer.

4. The display panel of claim 1, wherein the display panel comprises,

when the number of the j-th layer bulges is larger than 1, the orthographic projections of the j-th layer bulges on the substrate base plate are the same or different; when the number of the j+1 layer bulges is larger than 1, the orthographic projections of the j+1 layer bulges on the substrate base plate are the same or different.

5. The display panel of claim 4, wherein the orthographic projection of the j-th layer of protrusions on the substrate base plate is any one or a combination of a plurality of rectangular, triangular, trapezoidal, semicircular, polygonal, and wedge-shaped.

6. The display panel of claim 4, wherein the orthographic projection of the j+1th layer projection on the substrate base plate is any one or a combination of a plurality of rectangular, triangular, trapezoidal, semicircular, polygonal and wedge-shaped.

7. The display panel according to claim 1, wherein a height of the j-th layer protrusion is less than or equal to a height of the j-th layer buffer portion, and/or a height of the j+1-th layer protrusion is less than or equal to a height of the j+1-th layer buffer portion.

8. The display panel of claim 1 or 7, wherein the display panel comprises a functional area and a fan-out area located on at least one side of the functional area, the metal wiring being used to connect the functional area and the fan-out area;

9. The display panel of claim 1, wherein the material of the buffer structure is an organic material.

10. The display panel of claim 9, wherein the material of the buffer structure is an optical adhesive.

11. A display device comprising a display panel as claimed in any one of claims 1-10.

12. A method for manufacturing a display panel, comprising:

forming an inorganic layer on a substrate base;

13. The method of claim 12, wherein forming a functional layer on the inorganic layer when N has a value of 3, comprises:

forming a second buffer part on each first buffer part, wherein the length of each first buffer part is longer than that of each second buffer part, at least one second bulge is arranged on the edge of each second buffer part, and the first bulges and the second bulges are arranged in a staggered manner;

forming a second wire on each first wire, wherein the first wires and the second wires jointly form the metal wire;

and forming a third buffer part on each second buffer part, wherein the length of the second buffer part is greater than that of the third buffer part.