CN112410858A - Electroplating apparatus - Google Patents
Electroplating apparatus Download PDFInfo
- Publication number
- CN112410858A CN112410858A CN201910785139.4A CN201910785139A CN112410858A CN 112410858 A CN112410858 A CN 112410858A CN 201910785139 A CN201910785139 A CN 201910785139A CN 112410858 A CN112410858 A CN 112410858A
- Authority
- CN
- China
- Prior art keywords
- electroplating
- modules
- module
- independent
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 claims abstract description 46
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 238000005192 partition Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 4
- 238000011084 recovery Methods 0.000 claims description 4
- 238000009827 uniform distribution Methods 0.000 abstract description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000013043 chemical agent Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
Abstract
The invention discloses electroplating equipment which comprises a process cavity and two electroplating modules in the process cavity, wherein each electroplating module comprises a driving motor, an electroplating cavity, a tray, a liquid supply system and an exhaust system, and an independent fan filter unit is arranged above each electroplating module. The invention ensures the dustless process environment and the uniform distribution of air flow in the process cavity by arranging the independent fan filter groups above the two electroplating modules respectively.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to electroplating equipment.
Background
The electroplating process is to electrochemically deposit the desired metal on the cathode wafer. The existing electroplating equipment is composed of two electroplating modules, and a fan filter unit is arranged above the two electroplating modules and used for ensuring the dustless process environment in a cavity. In actual operation, when the electroplating module runs, the process conditions of the two modules are difficult to control and adjust by one fan filter unit, and the process result is greatly influenced.
In addition, a plurality of chemical agents are involved in the previous electroplating process, particularly, hydrogen peroxide is needed during edge removal, the hydrogen peroxide has volatility, and the plating solution is scrapped when the hydrogen peroxide enters an electroplating cavity; secondly, when one electroplating module breaks down and needs maintenance, the other side of the electroplating module must stop the process together, which can affect the operation of the whole machine and the electroplating efficiency seriously.
Disclosure of Invention
The invention provides electroplating equipment, aiming at the problems that a fan filter unit of the existing electroplating equipment is difficult to control, easy to cross-contaminate and low in efficiency. The technical scheme adopted by the invention is realized as follows:
the invention provides electroplating equipment which comprises a process cavity and two electroplating modules in the process cavity, wherein each electroplating module comprises a driving motor, an electroplating cavity, a tray, a liquid supply system and an exhaust system, and an independent fan filter unit is arranged above each electroplating module.
In order to further ensure that the two electroplating modules carry out the electroplating process in an independent environment atmosphere, a partition plate is arranged between the two electroplating modules.
The partition is removable in order to increase the space for maintenance operations on the electroplating module.
In order to facilitate the direct discharge of the gas that the fan filter unit blew off from exhaust system, and then guarantee the homogeneity of electroplating intracavity gas, fan filter unit is relative with exhaust system.
In order to enable the two electroplating modules to independently carry out the electroplating process, each electroplating module is provided with an independent liquid supply pipeline connected with a liquid supply system.
In order that the two electroplating modules can independently carry out the electroplating process, each electroplating module is provided with an independent exhaust system.
In order to facilitate the two electroplating modules to simultaneously carry out the electroplating process, each electroplating module is provided with an independent driving motor, the driving motors are positioned at two sides of the process cavity, and the two driving motors are distributed in an axial symmetry manner, preferably, the driving motors are distributed in a symmetry manner by taking the partition plate as a central axis. The layout mode that the two sides of the driving motor are distributed is convenient for integrating the wiring of the whole electroplating cavity, the middle partition plate is detached during maintenance operation, and when one half of the cavity in the process cavity is maintained, the space of the other half of the cavity can be used, so that larger maintenance space can be obtained.
In order to facilitate the recovery of leaked liquid in the electroplating process, the two electroplating modules share one tray for containing the leaked liquid, and the tray is connected with an external leaked liquid recovery device.
The invention ensures the dustless process environment and the uniform distribution of air flow in the process cavity by arranging the independent fan filter groups above the two electroplating modules respectively.
Drawings
FIG. 1 is a schematic structural diagram of an electroplating apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic structural diagram of an electroplating apparatus according to another embodiment of the present invention.
Detailed Description
The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments of the present invention when taken in conjunction with the accompanying drawings. The drawings are not intended to be to scale, emphasis instead being placed upon illustrating the principles of the invention.
FIG. 1 is a schematic structural diagram of an embodiment of an electroplating apparatus according to the present invention. The electroplating chamber comprises a process chamber body 100 and two electroplating modules 200, wherein the two electroplating modules 200 are placed in the process chamber body 100. A fan filter unit 300 is respectively arranged right above the two electroplating modules 200, and the wind direction of the fan filter unit 300 is downward all the time by adjusting the wind speed, so as to ensure a dustless process environment in the process cavity 100. Because the two electroplating modules 200 are respectively provided with a corresponding fan filter unit 300, the optimal parameters can be adjusted according to different operation requirements in the process, and the process effect is improved. In order to facilitate the exhaust system to directly draw the air blown by the fan filter unit 300 away, and further to make the air flow in the process chamber 100 uniform, the position of the fan filter unit 300 is opposite to the exhaust system 206 of the electroplating module. The plating module 200 includes a drive motor 201, a chuck 202, a plating chamber 203, a tray 204, a liquid supply system 205, and an exhaust system 206. The two electroplating modules 200 are respectively provided with independent driving motors 201, and the two driving motors 201 are located at two sides of the process chamber 100 and are symmetrically distributed with the central axis of the process chamber 100. The two driving motors 201 respectively drive the chucks 202 of the two electroplating modules 200, so that the problems that a dummy wafer is needed to run empty on the other side even if only one side of the existing electroplating module 200 needs to be plated with copper and the process needs to be suspended during equipment maintenance are solved, and the process efficiency is greatly improved. Two electroplating modules 200 share a tray 204 for the recovery of the leaked liquid. The left side of the electroplating modules 200 is connected with a liquid supply system 205, the right side of the electroplating modules 200 is connected with an exhaust system 206, the two electroplating modules 200 are provided with independent liquid supply pipelines to be connected with the same liquid supply system 205, and only one liquid supply system 205 is needed to supply liquid to the two electroplating modules 200. The two electroplating modules 200 are respectively provided with an exhaust system 206 for exhausting the process gas from the two electroplating chambers 203.
FIG. 2 is a layout view of another embodiment of the electroplating apparatus of the present invention. The electroplating chamber comprises a process chamber body 100 and two electroplating modules 200, wherein the two electroplating modules 200 are placed in the process chamber body 100. The fan filter unit 300 is arranged right above each of the two electroplating modules 200, the detachable partition plate 101 is further arranged in the process cavity 100, and the process cavity 100 is divided into two independent sub-process cavities by the partition plate 101, so that the two electroplating modules 200 are located in relatively independent environment atmospheres, and therefore pollution of volatile chemical agents in one sub-process cavity to the other sub-process cavity can be effectively reduced, and independent process environments are kept. In addition, when one of the sub-process chambers is maintained, the partition plate 101 can be taken away to increase the maintenance space, and the other sub-process chambers can also be operated as usual. The layout can also prevent the operation of another electroplating chamber and even the whole machine from being influenced when one electroplating chamber has problems.
In summary, the present invention has been described in detail with reference to the above embodiments and the accompanying drawings, so that those skilled in the art can implement the invention. The above-described embodiments are intended to be illustrative, but not limiting, of the present invention, the scope of which is defined by the appended claims. Variations on the number of elements described herein or substitutions of equivalent elements are intended to be within the scope of the present invention.
Claims (8)
1. The electroplating equipment is characterized by comprising a process cavity and two electroplating modules in the process cavity, wherein each electroplating module comprises a driving motor, an electroplating cavity, a tray, a liquid supply system and an exhaust system, and an independent fan filter unit is arranged above each electroplating module.
2. The electroplating apparatus of claim 1, wherein a partition is provided between the two electroplating modules to make the atmosphere of each electroplating module independent.
3. An electroplating apparatus according to claim 2, wherein the partition is removable.
4. The plating apparatus as recited in claim 1, wherein said fan filter unit is opposed to an exhaust system.
5. The electroplating apparatus of claim 1, wherein each electroplating module is provided with an independent liquid supply pipeline connected with the liquid supply system.
6. An electroplating apparatus according to claim 1, wherein each electroplating module is provided with an independent exhaust system.
7. The electroplating apparatus according to claim 1, wherein each electroplating module is provided with an independent driving motor, and the two driving motors are positioned at two sides of the process chamber and are distributed in axial symmetry.
8. The electroplating apparatus as claimed in claim 1, wherein the two electroplating modules share a tray for containing leaked liquid, and the tray is connected with an external leaked liquid recovery device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910785139.4A CN112410858A (en) | 2019-08-23 | 2019-08-23 | Electroplating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910785139.4A CN112410858A (en) | 2019-08-23 | 2019-08-23 | Electroplating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112410858A true CN112410858A (en) | 2021-02-26 |
Family
ID=74779845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910785139.4A Pending CN112410858A (en) | 2019-08-23 | 2019-08-23 | Electroplating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112410858A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050068560A (en) * | 2003-12-30 | 2005-07-05 | 주식회사 아이피에스 | A twin process chamber and a cluster tool system using it and a method of plating a thin film thereof |
| CN101748458A (en) * | 2008-12-01 | 2010-06-23 | 中芯国际集成电路制造(上海)有限公司 | Electroplating system |
| CN204509486U (en) * | 2015-02-13 | 2015-07-29 | 杭州天隆环保科技有限公司 | A kind of electroplating device |
-
2019
- 2019-08-23 CN CN201910785139.4A patent/CN112410858A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050068560A (en) * | 2003-12-30 | 2005-07-05 | 주식회사 아이피에스 | A twin process chamber and a cluster tool system using it and a method of plating a thin film thereof |
| CN101748458A (en) * | 2008-12-01 | 2010-06-23 | 中芯国际集成电路制造(上海)有限公司 | Electroplating system |
| CN204509486U (en) * | 2015-02-13 | 2015-07-29 | 杭州天隆环保科技有限公司 | A kind of electroplating device |
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