CN112406117B - Vacuum thermoplastic laminating process and equipment for realizing same - Google Patents
Vacuum thermoplastic laminating process and equipment for realizing same Download PDFInfo
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- CN112406117B CN112406117B CN201910780389.9A CN201910780389A CN112406117B CN 112406117 B CN112406117 B CN 112406117B CN 201910780389 A CN201910780389 A CN 201910780389A CN 112406117 B CN112406117 B CN 112406117B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
- B32B2037/1223—Hot-melt adhesive film-shaped
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a vacuum thermoplastic laminating process and equipment for realizing the process. Specifically, the invention discloses a vacuum thermoplastic laminating process, which can realize that the heat and pressure transferred by using a thermoplastic film can achieve a very good laminating effect of glue between samples to be laminated.
Description
Technical Field
The invention relates to the field of material processing, in particular to a vacuum thermoplastic laminating process and equipment for realizing the process.
Background
Along with the popularity of hot melt adhesive bonding application on large-size PCB boards, such as intelligent sound touch panels, notebook touch panels and the like, customers have high requirements on bonding strength and flatness of bonded samples and subsequent functional multi-site capacitance tests.
The traditional hot-pressing lamination process has the defect of lamination of the product, namely, bubbles are easy to remain in the middle of two lamination surfaces after lamination along with the increase of lamination areas, so that the height difference of different areas of the lamination surfaces is caused, and the effect of a simple deaeration machine process on solving the problem is limited.
Disclosure of Invention
The invention aims to provide a vacuum thermoplastic bonding process which has excellent bonding effect (such as basically no bubble residue) and is particularly suitable for large-area bonding, and equipment for realizing the process.
In a first aspect of the invention, a vacuum thermoplastic laminating device is provided, comprising a temperature control heating plate, a film support, a support column for supporting the temperature control heating plate, an infrared temperature measuring probe, a base, a control panel and a vacuum pump from top to bottom,
the temperature of the temperature control heating plate is regulated by the control panel;
the film support is positioned under the temperature control heating plate and is movably connected to the support column;
the support posts are vertically arranged on two sides of the base;
the infrared temperature measuring probes are arranged on two sides of the base and are used for monitoring the temperature of the thermoplastic film on the film support;
the base is provided with a metal plate with uniform holes for vacuumizing;
the control panel is used for adjusting the temperature of the temperature control heating plate and adjusting the vacuum degree of the vacuum pump;
the vacuum pump is located below the metal plate.
In another preferred embodiment, the length of the heating area of the temperature control heating plate is more than or equal to 4cm; and/or
The width of the heating area of the temperature control heating plate is more than or equal to 4cm.
In another preferred embodiment, the film support comprises two rectangular frame members matched up and down.
In another preferred embodiment, the height of the support post is 10-40cm.
In another preferred embodiment, the outer ring of the bottom of the film support is provided with sealing rubber.
In another preferred embodiment, the heating zone of the temperature-controlled heating plate has a length of not less than 13cm, preferably not less than 15cm, such as 30cm.
In another preferred embodiment, the heating zone of the temperature-controlled heating plate has a width of 18cm or more, preferably 22cm or more, such as 25cm or more.
In another preferred embodiment, the heating temperature of the temperature-controlled heating plate is in the range of 25-250 ℃, preferably 30-190 ℃.
In another preferred embodiment, the dimensions of the film support match the dimensions of the temperature-controlled heating plate, e.g. 35cm by 24cm.
In another preferred embodiment, the film support comprises two rectangular frame members matched up and down, and the thermoplastic film is clamped and fixed between the two rectangular frame members in operation.
In another preferred embodiment, the height of the struts is 10-20cm, preferably 10-15cm.
In another preferred embodiment, the diameter of the struts is 3-7cm.
In another preferred embodiment, the support posts are located at the middle positions of the two sides of the base.
In another preferred embodiment, the length of the metal plate is 10-40cm, preferably 15-35cm, more preferably 17-30cm.
In another preferred embodiment, the width of the metal plate is 10-40cm, preferably 15-35cm, more preferably 15-30cm.
In another preferred embodiment, the thickness of the metal plate is 0.05-0.5cm, preferably 0.1-0.3cm.
In another preferred example, the metal plate has a hole density of 8 to 20 holes/cm 2 Preferably 10-18 holes/cm 2 。
In another preferred embodiment, the holes of the metal plate have a diameter of 0.05-1cm, preferably 1mm.
In a second aspect of the present invention, there is provided a vacuum thermoplastic bonding method comprising the steps of:
1) Providing the vacuum thermoplastic laminating equipment, the thermoplastic film and the glue-containing sample according to the first aspect of the invention, wherein the glue-containing sample is a sample obtained by adding a glue film between two laminating materials, and the softening temperature of the thermoplastic film is T1;
2) Placing the thermoplastic film on a film support, placing the glue-containing sample on the metal plate, and setting the heating temperature of the temperature control heating plate to be T2;
3) Raising the film support to be close to the temperature control heating plate, and preheating the thermoplastic film;
4) When the infrared temperature measuring probe monitors that the temperature of the thermoplastic film reaches T1, the vacuum pump is started, the film is manually supported and dropped to enable the thermoplastic film to fall on the glue-containing sample, and the vacuum treatment is carried out for the first time, so that the glue-containing sample is finally attached under the action of the temperature and the pressure transmitted by the thermoplastic film.
In another preferred embodiment, the method further comprises the steps of:
5) And (3) using a deaerating machine to deaerate the product obtained in the step (4) to obtain a product treated by the deaerating machine.
In another preferred embodiment, the thermoplastic film is selected from the group consisting of: polycarbonates (PCs), ABS plastics, PVC, acrylates, polystyrenes, polyethylenes, polypropylenes, copolyesters (PETG), or combinations thereof; and/or
The adhesive film is selected from the following groups: tesa HAF, tesa LTR, tesa58484, tesa 58486, tesa58488, tesa 58480, tesa 58470, tesa 58474, tesa 58476, tesa 58478, tesa8440.
In another preferred embodiment T1 is 80-200deg.C, preferably 90-180deg.C, more preferably 100-160deg.C.
In another preferred embodiment, the softening temperatures of the various thermoplastic films are as follows:
polycarbonates (PC) class: 140-160 ℃, preferably 150 ℃;
ABS plastic: 100-130 ℃, preferably 130 ℃;
PVC: 100-130 ℃, preferably 130 ℃;
acrylic esters: 80-120 ℃, preferably 120 ℃;
polystyrenes: 100-130 ℃, preferably 130 ℃;
polyethylenes: 90-120 ℃, preferably 120 ℃;
polypropylene: 100-140 ℃, preferably 140 ℃;
copolyester (PETG) class: 90-130℃and preferably 130 ℃.
In another preferred embodiment, the thermoplastic film has a thickness of 0.1 to 20mm, preferably 0.5 to 15mm.
In another preferred embodiment, the thermoplastic film has a length of 0.5 to 40cm, preferably 1 to 30cm.
In another preferred embodiment, the thermoplastic film has a width of 0.5 to 40cm, preferably 1 to 30cm.
In another preferred embodiment, the hot melt temperature T3 of the adhesive film is 50-120 ℃, preferably 60-110 ℃.
In another preferred embodiment, the thickness of the adhesive film is 30-200um, preferably 30-150um.
In another preferred example, the adhesive film is a hot melt adhesive film, such as the products tesa HAF, tesa LTR, tesa58484, tesa 58486, tesa58488, tesa 58480, tesa 58470, tesa 58474, tesa 58476, tesa 58478, tesa8440 of the present company.
In another preferred embodiment, the adhesive film is a material selected from the group consisting of: phenolic butyronitrile systems, reactive polyurethane systems, copolyamide systems.
In another preferred embodiment, the conformable material is selected from the group consisting of: polycarbonate, alumina, glass, PCB board, aluminum plate, ceramic.
In another preferred embodiment, the thickness of the conformable material is from 0.5 to 10mm, preferably from 1 to 6mm, more preferably from 1.2 to 4mm.
In another preferred embodiment, the glue containing sample is a flat plate sample or a non-flat surface sample.
In another preferred embodiment, the gel-containing sample is selected from the group consisting of: printed Circuit Boards (PCBs), glass, ceramics.
In another preferred embodiment, the gel-containing sample has a length of 0.5-40cm, preferably 1-30cm.
In another preferred embodiment, the width of the glue containing sample is 0.5-15cm, preferably 1-10cm.
In another preferred embodiment, the glue containing sample has a thickness of 50 μm to 20mm, preferably 100 μm to 12mm.
In another preferred embodiment, the diameter of the gel-containing sample is 5-40cm, preferably 8-30cm.
In another preferred embodiment, T2 is 150-190℃and preferably 160-170 ℃.
In another preferred embodiment, T2 > T1 > T3.
In another preferred embodiment, T2-T1 is not less than 30 ℃, preferably not less than 20 ℃, more preferably not less than 10 ℃, most preferably not less than 5 ℃.
In another preferred embodiment, T1-T3 is not less than 20 ℃, preferably not less than 10 ℃, more preferably not less than 0 ℃.
In another preferred embodiment, the vacuum pump is operated at a vacuum level of 0.08-2bar, preferably 0.1-1.5bar.
In another preferred embodiment, the first time is 5-180s, preferably 10-150s.
In a further preferred embodiment, in step 5), the pressure of the deaeration treatment is 1-5bar, preferably 2-4bar.
In another preferred embodiment, in step 5), the temperature of the deaeration treatment is 40-80 ℃, preferably 50-70 ℃.
In another preferred embodiment, in step 5), the time for the defoaming treatment is 3 to 20 minutes, preferably 5 to 15 minutes.
In a third aspect of the invention there is provided a vacuum thermoplastic conformable product made by the method of the second aspect of the invention.
In another preferred embodiment, the bubble residual rate of the bonding region of the product is less than or equal to 3%.
In another preferred embodiment, the bubble retention rate in the conforming region of the product is 2% or less, preferably 1% or less, preferably 0%.
It is understood that within the scope of the present invention, the above-described technical features of the present invention and technical features specifically described below (e.g., in the examples) may be combined with each other to constitute new or preferred technical solutions. And are limited to a space, and are not described in detail herein.
Drawings
Fig. 1 is a schematic view of a conventional thermocompression bonding apparatus.
Fig. 2 and 3 are schematic structural views of the attaching device according to the present invention.
Fig. 4 is an illustration of an example of the laminating operation of the no-film sample.
Fig. 5 is a schematic diagram of a part of the operation in example 2.
Fig. 6-8 are sample schematic and test schematic diagrams of push-out force test.
Fig. 9 shows the results of the push-out force test with a polycarbonate film as the upper bonding material, tesa 58486 as the adhesive film, and an anodized aluminum plate as the lower bonding material, with the abscissa being temperature and the ordinate being push-out force test result.
FIG. 10 is a schematic diagram of a sample of residual bubble rate test with a clear polycarbonate as thermoplastic film (i.e., c), tesa 58486 as adhesive film (i.e., b), and clear glass (i.e., a) as bonding material.
Fig. 11 is a schematic diagram of a test of the residual bubble ratio according to the present invention, wherein a is a conventional hot pressing method, and b is a vacuum bonding method according to the present invention.
FIG. 12 shows the residual bubble ratio test results of the products obtained by different lamination processes.
Fig. 13 is a schematic structural diagram of a glue-containing sample according to the present invention, wherein a is an upper bonding material, B is a glue film, and C is a lower bonding material.
Detailed Description
The inventors have conducted long and intensive studies, and have found that the lamination effect of the resulting laminated product (the lamination area is substantially free of bubble residues, for example, the bubble residue rate may be absent) can be remarkably improved by preheating the thermoplastic film, subjecting the adhesive film of the adhesive-containing sample to heat pressing treatment by using the heat and weight of the preheated thermoplastic film, and optionally to a vacuum defoamation process, and that the lamination process is also suitable for large-area lamination (for example, lamination of a sample having a single horizontal dimension of 1cm or more) and lamination of a non-flat surface substrate. On this basis, the inventors completed the present invention.
Bonding process
Typically, the lamination process (or method) comprises the steps of:
1) Placing a glue-containing sample to be attached to a vacuumizing platform;
2) Mounting a thermoplastic film of a specific softening temperature onto the fixture e.g.160 devigel C;
3) Setting the number of infrared detection modules Wen Can to 160DEG, wherein the vacuum parameter is 0.1bar;
4) Pulling up the thermoplastic film to approach the heating surface table, and conducting heat to the thermoplastic film surface to a set 160 ℃ by the ceramic tube and air;
5) After infrared detection of the temperature of the film surface to 160 ℃ is carried out, a vacuum machine is started, and a thermoplastic film clamp (namely a film holder) is manually dropped onto the surface of a sample to form a closed vacuum environment;
6) The temperature carried by the film can be transferred to the plate and the adhesive surface of the sample to activate the hot melt adhesive film, and the thermoplastic film can be cold molded into an irregular shape on the surface of the adhesive material (i.e. the bonding material) and uniformly conducts heat; meanwhile, bubbles on the joint surface can be effectively removed in a vacuum environment, and adhesion is enhanced.
The process is particularly suitable for hot melt adhesive lamination of large-size PCB boards, can effectively reduce bubble residues between lamination surfaces, and improves lamination effects.
Thermoplastic films of the PC, ABS, PVC, ACRYLIC type can be released by application of silicone oil and/or wax. That is, silicone oil may be applied to the upper surface of the gel-containing sample to release the thermoplastic film.
There is no strong adhesive force between the tesa HAF (i.e., adhesive film) and the adhesive surface (first adhesive material a (or adhesive material a) or first adhesive material B (or adhesive material B)) before bonding, and bubbles between the adhesive film and the adhesive surface between any materials are sucked away by vacuum thermoplastic bonding.
The thermoplastic film reaching softening temperature activates the hot melt adhesive film by heat conduction after profiling, and the thermoplastic film is vacuumized by a vacuum pump to provide attaching pressure.
Desha LTR (low temperature glue) can be directly attached through the process, and for Desha HAF which requires higher temperature, the subsequent process assistance of a deaerator is required.
In the invention, after the thermoplastic film is preheated, the thermoplastic film is placed on the surface of a glue-containing sample, the sealing rubber of the film support can enable the film support and the base to form a closed space, the heat of the thermoplastic film is transferred to the hot melt adhesive (or adhesive film) through the surface of the bonding material so that the hot melt adhesive reacts and is bonded with the plate (or bonding material), and meanwhile, the negative pressure adsorption force of the thermoplastic film can also be transferred to the plate so as to better promote the bonding of the plate and the hot melt adhesive. The thermoplastic film has a changeable shape after softening, so that the thermoplastic film can be suitable for various glue-containing samples with regular shapes and irregular shapes, and uniform heat conduction is realized. Meanwhile, the vacuum pump can effectively remove bubbles between the bonding material and the hot melt adhesive in the closed space, strengthen the bonding effect and realize bonding with basically zero bubble residues.
Laminating equipment
Typically, the laminating apparatus has a structure as shown in fig. 2 and/or fig. 3, and fig. 4 is a schematic diagram of an example of laminating operation of the adhesive-film-free sample.
In general, the main components of the laminating apparatus of the present invention (from top to bottom) and their modes of operation are as follows:
1) Temperature-control heating plate: the thermoplastic film is heated by means of heat radiation by means of resistive heating.
2) Thermoplastic film and film support: after the thermoplastic film is heated to reach the set softening temperature, the thermoplastic film is put down to the base through the handheld film holder. The thermoplastic film is clamped and fixed by two rectangular frame pieces arranged up and down of the film support.
3) Sealing rubber: the sealing rubber is arranged at the bottom of the film support in a circle to form a closed space.
4) An infrared temperature measurement probe; the infrared temperature measuring probe is fixed on the side edge of the base and used for monitoring the temperature rising process of the thermoplastic film, and when the thermoplastic film reaches the set softening temperature, the vacuum pump is automatically started.
5) Base and control panel: a metal plate with uniform holes is arranged on the base and is used for bearing a die (namely a glue sample); the control panel is used for starting a program and setting temperature and vacuum degree.
6) Vacuum pump: when the thermoplastic film is put down and forms a closed space, the vacuum pump pumps out the air in the closed space, so that the thermoplastic film and the mould are profiled.
Compared with the prior art, the invention has the following main advantages:
(1) The process can realize excellent bonding effect, and the bonding area basically has no bubble residue;
(2) The process is also suitable for large-area lamination (such as lamination of samples with the size of more than or equal to 1cm in a single horizontal direction) and lamination of non-flat surface base materials;
(3) The equipment has small size, excellent laminating effect and high laminating efficiency;
(4) The thermoplastic film can be replaced to adapt to the adhesive films or plates with different reaction temperatures.
The invention will be further illustrated with reference to specific examples. It is to be understood that these examples are illustrative of the present invention and are not intended to limit the scope of the present invention. The experimental procedures, which do not address the specific conditions in the examples below, are generally carried out under conventional conditions or under conditions recommended by the manufacturer. Percentages and parts are by weight unless otherwise indicated.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. In addition, any methods and materials similar or equivalent to those described herein can be used in the methods of the present invention. The preferred methods and materials described herein are presented for illustrative purposes only.
Film information
Example 1 laminating apparatus
The main components (from top to bottom) of the laminating device and the action modes thereof are as follows:
1) Temperature-control heating plate: the thermoplastic film is heated by means of heat radiation by means of resistive heating. The temperature-controlling heating plate is supported and combined with the top end of the equipment through two struts combined with the base. The heating area of the temperature control heating plate is 32cm by 28cm. The temperature of the temperature control heating plate is regulated and controlled through the control panel. The height of the support column is 30cm.
2) Thermoplastic film and film support: after the thermoplastic film is heated to reach the set softening temperature, the thermoplastic film is put down to the base through the handheld film holder. The film support is movably connected to two struts supporting the temperature control heating plate, locking and movement of the film support can be manually adjusted, and the film support is conveniently provided with a handle for moving the film support, and the thermoplastic film is horizontally arranged on the upper surface of the film support.
3) Sealing rubber: the sealing rubber is arranged at the bottom of the film support in a circle to form a closed space.
4) An infrared temperature measurement probe; the infrared temperature measuring probe is fixed on the side edge of the base and used for monitoring the temperature rising process of the thermoplastic film, and when the thermoplastic film reaches the set softening temperature, the vacuum pump is automatically started.
5) Base and control panel: a metal plate (34 cm in size and 29cm in size) with holes uniformly is arranged on the base and used for bearing the die; the control panel is used for starting a program and setting temperature and vacuum degree.
6) Vacuum pump: when the thermoplastic film is put down and forms a closed space, the vacuum pump pumps out the air in the closed space, so that the thermoplastic film and the mould are profiled.
Example 2 bonding Process 1
1) Placing the glue-containing sample (sequentially comprising upper bonding material anodized aluminum, tesa58484 and lower bonding material polycarbonate) to be bonded on a vacuumizing platform (namely a uniformly perforated metal plate with the thickness of 1mm and the hole distribution density of 16pcs/1 cm) 2 Pore diameter of 1 mm);
2) Mounting a thermoplastic film (e.g., HIPS high density polystyrene, 31cm x 26cm in size, 130 ℃ softening temperature) of a specified softening temperature onto a fixture (i.e., film holder);
3) Setting the number of infrared detection modules Wen Can to 130 degrees, wherein the vacuum parameter is 0.2bar or 0.5bar or 0.9bar;
4) Pulling up the thermoplastic film to approach a heating surface table (namely, a temperature control heating plate is arranged to set the heating temperature to 165 ℃), and heating the surface temperature of the thermoplastic film to set 130 ℃ by heat conduction of a ceramic tube and air;
5) After the infrared detection of the temperature of the film surface reaches the set 130 ℃, starting a vacuum machine, and manually dropping a thermoplastic film clamp onto the surface of the sample to form a closed vacuum environment;
6) The temperature carried by the film can be transferred to the plate and the adhesive surface of the sample to activate the hot melt adhesive film, and the thermoplastic film can be cold molded into an irregular shape which is attached to the surface of the material and uniformly conducts heat; meanwhile, bubbles on the joint surface can be effectively removed in a vacuum environment, and adhesion is enhanced. In the step 6), the temperature of the hot melt adhesive surface is 83 ℃, 90 ℃, 95 ℃, 100 ℃ and the action time is 20s, 30s or 40s.
The specific process refers to fig. 5, where a is a vacuum laminator, b is a PCB and Al touchpad, c is a vacuum laminator, and d is a notebook touchpad.
Example 3 bonding Process 2
The difference from example 2 is that: the glue used in example 2 is replaced by a hot melt glue such as tesa 58474; and further comprising the step after step 6): the vacuum defoaming treatment comprises the following specific steps: the half reacted glue containing sample after step 6) is thrown into a high Wen Tuopao machine to continue the pressurizing reaction so as to obtain better adhesive force or other higher mechanical requirements.
Example 4 bonding Process 3
The difference from example 2 is that: a glue-containing sample with uneven surface (electronic components with uneven surface, such as semiconductor electronic components) is used.
Example 5 bonding Process 4
The difference from example 2 is that: the thermoplastic film of example 2 was replaced with a thermoplastic film of high softening point 120℃composed of ABS, and the heating temperature of the temperature-controlled heating plate was set to 160 ℃.
Example 6 bonding Process 5
The difference from example 3 is that: the thermoplastic film used in example 2 was replaced with a thermoplastic film having a higher softening point of 150℃composed of PC, and the heating temperature of the temperature-controlled heating plate was set to 190 ℃.
Example 7 bonding Process 6
The difference from example 2 is that: adopting a glue-containing sample comprising polycarbonate, tesa58484 adhesive tape and transparent glass in sequence; polycarbonate was used as the thermoplastic film (T1 at 150 ℃) and T2 at 190 ℃.
Comparative example 1 conventional thermal compression bonding 1
Conventional hot press bonding (hot press temperature is set at 83 ℃, 90 ℃, 95 ℃, 100 ℃, hot press pressure is set at 0.2bar, 0.5bar, 0.9bar, 3bar, hot press time is set at 20s, 30s, 40 s) is performed on a glue-containing sample sequentially of anodized aluminum, a hot melt adhesive (such as a high temperature reaction adhesive tesa 58484) and polycarbonate.
Comparative example 2 conventional thermal compression bonding 2
The same as in comparative example 1, except that: hot melt adhesives such as tesa 58474 and the like are adopted to replace the adhesive used in the comparative example 1; and further comprising the steps of:
the obtained sample was subjected to vacuum degassing treatment as follows: the resulting semi-reacted gum-containing sample was discarded to a high Wen Tuopao machine and the compression reaction continued to give better adhesion or otherwise higher mechanical requirements.
Comparative example 3 conventional thermal compression bonding 3
The same as in comparative example 1, except that: adopting a glue-containing sample comprising polycarbonate, tesa58484 adhesive tape and transparent glass in sequence; polycarbonate is used as the thermoplastic film.
Performance testing
Lamination performance test 1 (push-out force)
As shown in fig. 6-8, two different sheets of board were attached with a hot melt adhesive tape in between (tesa 58484,
100 μm) pushing two plates away (the central axes of the small hole, the hot melt adhesive tape and the circle PC coincide) through one small hole (the penetrating hole, the radius is 0.9 cm), and the pushing force is the test data of us.
Adhesive area 2.8cm 2
Test materials anodized aluminum (i.e., material A was 4cm long, 4cm wide, 1.2mm thick, and a small hole in the center) and polycarbonate (i.e., material B, round piece, 3mm thick, 2.1cm diameter)
Storage conditions: 24 hours at room temperature
Push head area 0,4cm2
Push-out speed 10mm/min, vertically downward
Measurement unit N/mm2 (MPa)
Measurement conditions of 23.+ -. 1 ℃ and 50.+ -. 5% humidity
When tested, anodized aluminum was on top, in the middle of the hot melt adhesive, polycarbonate PC underneath; wherein the anode aluminum is required to be overhead above the pillar material
The test results are shown in fig. 9, and it can be seen that:
1) For products bonded by the traditional hot pressing process, the pushing force tends to be larger at the same temperature along with the increase of the hot pressing pressure;
2) For the products bonded by the bonding process, the bonding force can be obviously improved relative equivalent hot pressing parameters, and the cost of metal die sinking on the upper surface can be saved.
Lamination performance test 2 (residual bubble content)
Infiltration test the attached sample pictures were scanned in different gray levels by a piece of Image J software, and the infiltration between the tape (tesa 58484, low temperature glue, 50mm long, 50mm wide, 100 μm thick) and the plate was tested by the area ratio of dark area to the whole block.
Bonding area 50 mm.50 mm
Test panels transparent glass (50 mm long, 50mm wide, 2mm thick) and transparent polycarbonate PC (50 mm long, 50mm wide, 1mm thick)
Storage conditions: 24 hours at room temperature
Measurement units:%
Measurement conditions of 23.+ -. 1 ℃ and 50.+ -. 5% humidity
In fig. 11, the infiltration rate of the conventional hot press bonding is calculated to be 64% according to the standard gray photo feedback measurement, namely, the bubble residual rate is 36%.
As can be seen from fig. 12:
1) When the transparent polycarbonate is used as a thermoplastic film, the polycarbonate is used as an upper bonding material, the tesa58484 is used as an adhesive tape and the transparent glass (namely a) is used as a lower bonding material, and when the bonding process is used, when the vacuum thermal bonding parameter (namely T3) is 90 ℃, the time is 30s and the pressure is 0.9bar, the bubble residual rate of the obtained product is 26%, and further after the vacuum defoaming treatment is carried out at the temperature of a deaerator for 10min and the pressure is 3bar, the bubble residual rate of the obtained product is 0%;
2) When the transparent polycarbonate is used as a thermoplastic film, the polycarbonate is used as an upper bonding material, the tesa58484 is used as an adhesive tape and the transparent glass (namely a) is used as a lower bonding material, and a traditional hot pressing process is adopted, when the hot pressing adhesive surface is 90 ℃, the time is 30s and the pressure is 0.9bar, the bubble residual rate of the obtained product is 40%, and further after the vacuum defoaming treatment is carried out at the defoaming temperature of 60 ℃ for 10min and the pressure of 3bar, the bubble residual rate of the obtained product is 5%.
Therefore, compared with the traditional hot pressing process, the bonding process can improve the defoaming rate by 35 percent (= (40-26)/40) before the vacuum defoaming treatment, and can improve the defoaming rate to 100 percent (namely, the bubble residual rate is 0 percent) after the vacuum defoaming treatment, namely, the bonding process has no bubble residual.
Example 8 bonding Process 7
The difference from example 2 is that: the PCB is used as an upper bonding material, and the large metal aluminum cover is used as a lower bonding material.
As can be seen from the tests of the products obtained in the above examples 2-8, the vacuum thermoplastic bonding process provided by the invention combines profiling hot pressing and vacuum defoaming, effectively minimizes bubbles in the bonding process, can even achieve bubble-free after being combined with a defoaming machine process, effectively increases bonding strength, and the samples bonded by the process completely reach the standard in flatness and functional multi-site capacitance test.
All documents mentioned in this application are incorporated by reference as if each were individually incorporated by reference. Further, it will be appreciated that various changes and modifications may be made by those skilled in the art after reading the above teachings, and such equivalents are intended to fall within the scope of the claims appended hereto.
Claims (10)
1. A vacuum thermoplastic laminating device is characterized by comprising a temperature control heating plate, a film support, a support column for supporting the temperature control heating plate, an infrared temperature measuring probe, a base, a control panel and a vacuum pump from top to bottom,
the temperature of the temperature control heating plate is regulated by the control panel;
the film support is positioned under the temperature control heating plate and movably connected to the support column, and is used for placing a thermoplastic film;
the support posts are vertically arranged on two sides of the base; the height of the support column is 10-40cm;
the infrared temperature measuring probes are arranged on two sides of the base and are used for monitoring the temperature of the thermoplastic film on the film support;
the base is provided with a metal plate with uniform holes for vacuumizing;
the control panel is used for adjusting the temperature of the temperature control heating plate and adjusting the vacuum degree of the vacuum pump;
the vacuum pump is positioned below the metal plate;
the apparatus is used in a vacuum thermoplastic bonding process as shown below, comprising the steps of:
1) Providing the vacuum thermoplastic laminating equipment, a thermoplastic film and a glue-containing sample, wherein the glue-containing sample is a sample obtained by adding a glue film between two laminating materials, and the softening temperature of the thermoplastic film is T1;
2) Placing the thermoplastic film on a film support, placing the glue-containing sample on the metal plate, and setting the heating temperature of the temperature control heating plate to be T2;
3) Raising the film support to be close to the temperature control heating plate, and preheating the thermoplastic film;
4) When the infrared temperature measuring probe monitors that the temperature of the thermoplastic film reaches T1, the vacuum pump is started, the film is manually supported and dropped to enable the thermoplastic film to fall on the glue-containing sample, and the vacuum treatment is carried out for the first time, so that the glue-containing sample is finally attached under the action of the temperature and the pressure transmitted by the thermoplastic film.
2. The apparatus of claim 1, wherein the heating zone of the temperature-controlled heating plate is greater than or equal to 4cm in length; and/or
The width of the heating area of the temperature control heating plate is more than or equal to 4cm.
3. The apparatus of claim 1, wherein the film holder comprises two rectangular frame members that mate up and down.
4. The apparatus of claim 1, wherein the height of the struts is 20-40cm.
5. The apparatus of claim 3, wherein the outer rim of the bottom of the tray is provided with sealing rubber.
6. A vacuum thermoplastic bonding method, which is characterized by comprising the following steps:
1) Providing the vacuum thermoplastic laminating equipment, a thermoplastic film and a glue-containing sample according to claim 1, wherein the glue-containing sample is a sample obtained by adding a glue film between two laminating materials, and the softening temperature of the thermoplastic film is T1;
2) Placing the thermoplastic film on a film support, placing the glue-containing sample on the metal plate, and setting the heating temperature of the temperature control heating plate to be T2;
3) Raising the film support to be close to the temperature control heating plate, and preheating the thermoplastic film;
4) When the infrared temperature measuring probe monitors that the temperature of the thermoplastic film reaches T1, the vacuum pump is started, the film is manually supported and dropped to enable the thermoplastic film to fall on the glue-containing sample, and the vacuum treatment is carried out for the first time, so that the glue-containing sample is finally attached under the action of the temperature and the pressure transmitted by the thermoplastic film.
7. The method of claim 6, further comprising the step of:
5) And (3) using a deaerating machine to deaerate the product obtained in the step (4) to obtain a product treated by the deaerating machine.
8. The method of claim 6, wherein the thermoplastic film is selected from the group consisting of: polycarbonates (PCs), ABS plastics, PVC, acrylates, polystyrenes, polyethylenes, polypropylenes, copolyesters (PETG), or combinations thereof; and/or
The adhesive film is selected from the following groups: tesa HAF, tesa LTR, tesa58484, tesa 58486, tesa58488, tesa 58480, tesa 58470, tesa 58474, tesa 58476, tesa 58478, tesa8440.
9. A vacuum thermoplastic conformable product made by the method of claim 6.
10. The product of claim 9, wherein the bubble retention rate of the product in the conforming region is less than or equal to 3%.
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