CN112399781B - Heat exchange module and electronic device using same - Google Patents
Heat exchange module and electronic device using same Download PDFInfo
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- CN112399781B CN112399781B CN202011239684.2A CN202011239684A CN112399781B CN 112399781 B CN112399781 B CN 112399781B CN 202011239684 A CN202011239684 A CN 202011239684A CN 112399781 B CN112399781 B CN 112399781B
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- 125000006850 spacer group Chemical group 0.000 claims description 54
- 230000017525 heat dissipation Effects 0.000 description 20
- 230000000694 effects Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 7
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- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Abstract
An electronic device comprises an electronic device body and a heat exchange module; the electronic device body is provided with a top, and the top is provided with an inner wall; the heat exchange module sets up in the internal top of electron device, and the heat exchange module includes: a plurality of first channels and a plurality of second channels; the first channels are used for being communicated with the outside of the electronic device and used as a part of an external circulation path and for an external circulation airflow to pass through, and the airflow inlet direction and the airflow outlet direction of the first channels are the same; one end of the second channels is propped against the inner wall, so that the second channels form a single-side opening, the air flow inlet direction and the air flow outlet direction of the second channels are parallel and opposite, and the air flow inlet direction and the air flow outlet direction of the second channels are perpendicular to the air flow inlet direction and the air flow outlet direction of the first channels.
Description
Technical Field
The present invention relates to a heat exchange module and an electronic device using the same, and more particularly, to a heat exchange module and an electronic device using the same, which can reduce assembly time and cost.
Background
With the development of the electronic industry, the requirements on the operation speed and effect of the electronic device body are increased, but the heat dissipation problem derived from the electronic device body is also serious, so that the performance and stability during operation are affected. In order to enable the electronic device to normally operate, a heat dissipation device is generally added on the heating electronic device body, and heat energy is led out by the heat dissipation device.
However, if only the passive heat dissipation method is used, the heat cannot be removed immediately and effectively, so the electronic device is usually provided with a cooling device for dissipating the heat. The cooling device currently applied to the electronic device is mainly a heat exchange device, and the cooling device is configured in the electronic device to guide cold air flow outside the electronic device to exchange heat with hot air flow inside the electronic device so as to reduce the temperature inside the electronic device. Fig. 1A is a perspective view of a known heat exchange device, and fig. 1B is a side view of an airflow path of the heat exchange device of fig. 1A. Referring to fig. 1A and 1B, the conventional heat exchange device D has an electronic device body D1, a heat exchange module D2, a first fan D3 and a second fan D4, wherein the heat exchange module D2, the first fan D3 and the second fan D4 are disposed inside the electronic device body D1, and the heat exchange module D2 and the electronic device body D1 define an inner circulation path D5 and an outer circulation path D6 isolated from each other. The first fan D3 is disposed in the internal circulation path D5 to drive the internal circulation airflow, i.e. a side of the electronic device body D1 directs the hot airflow generated by the operation of the electronic component E1 of the electronic equipment E into the internal circulation path D5 of the heat exchange device D. Meanwhile, the second fan D4 is disposed in the external circulation path D6 to drive the external circulation airflow, that is, the cold air outside the electronic device E is guided by the other side surface of the electronic device body D1 to flow into the external circulation path D6 of the heat exchange device D, so that the heat exchange module D2 can perform heat exchange on the internal circulation airflow with relatively high temperature and the external circulation airflow with relatively low temperature, thereby cooling the internal circulation airflow and providing the cooled internal circulation airflow to the electronic element E1 of the electronic device E, so as to achieve the effect of reducing the internal temperature of the electronic device E.
In the conventional heat exchange device D, the heat exchange module D2 has a housing D7 for accommodating a plurality of heat dissipation aluminum sheets a arranged as heat dissipation cores (as shown in fig. 1C), however, the heat dissipation aluminum sheets a need to be bent by a machine or formed by stamping by a die, and then are stacked by rotating 180 degrees after being glued on the L-shaped edge, and the combination process is complex and time-consuming; the thin aluminum sheet adopted for achieving the better heat dissipation effect has the problems of insufficient rigidity, easy bending deformation, easy displacement or inclination in the shell under the condition of not drying the glue, and the like, so that the heat dissipation core formed by combining the prior thin aluminum sheets has unstable quality.
Therefore, how to provide a heat exchange module that can be rapidly stacked to form a heat exchange module with high rigidity by simple design and installation has become one of the important issues.
Disclosure of Invention
In view of the foregoing, an object of the present invention is to provide a heat exchange module that can be quickly stacked to form a heat exchange module with high rigidity by a simple design and installation.
To achieve the above object, the heat exchange module according to the present invention includes a housing, a plurality of first air guiding members and a plurality of first spacers. The first air guide piece is arranged inside the shell. Each first air guide piece comprises a plurality of first structures and a plurality of second structures. The first structures are arranged parallel to each other. The second structures are arranged between the first structures and connected with the first structures to form a plurality of first channels. The first spacers are respectively arranged between two adjacent first air guide pieces to form a second channel. The direction of air flow in the first channel is different from that in the second channel.
In an embodiment, the heat exchange module further includes a plurality of second air guiding members and a plurality of second spacers. Each second air guide piece and each first spacer are respectively arranged at two ends of the second channel. The second wind guide piece comprises a plurality of first structures and a plurality of second structures. The first structures are arranged parallel to each other. The second structures are arranged between the first structures and connected with the first structures to form a plurality of third channels. The second spacers are respectively arranged between two adjacent second air guide pieces to form a fourth channel.
In one embodiment, each first passage and each fourth passage are communicated with each other to form a plurality of inner/outer circulation passages. And each third passage communicates with each second passage to form a plurality of outer/inner circulation passages. The inner circulation channel and the outer circulation channel are arranged in a staggered and isolated mode.
In an embodiment, the heat exchange module further comprises a plurality of second spacers. The second spacers are respectively arranged between two adjacent first air guide pieces. Each second spacer and each first spacer are respectively arranged at two ends of the second channel.
In one embodiment, the direction of air flow in each first channel is the same. The direction of air flow in each second channel is the same. And the direction of the air flow in the first channel is different from that in the second channel.
In one embodiment, the first channel and the second channel are an inner circulation channel/an outer circulation channel and an outer circulation channel/an inner circulation channel, respectively. The inner circulation channel and the outer circulation channel are arranged in a staggered and isolated mode.
To achieve the above object, an electronic device according to the present invention includes an electronic device body and an electronic device body. A heat exchange module is arranged on the electronic device body. The heat exchange module comprises a shell, a plurality of first air guide pieces and a plurality of first partition pieces. The first air guide piece is arranged inside the shell. Each first air guide piece comprises a first structure and a plurality of second structures. The first structures are arranged parallel to each other. The second structures are arranged between the first structures and connected with the first structures to form a plurality of first channels. The first spacers are arranged between two adjacent first air guide pieces to form a second channel. The direction of air flow in the first channel is different from that in the second channel. The electronic component is accommodated in the electronic device body.
In an embodiment, the heat exchange module further includes a plurality of second air guiding members and a plurality of second spacers. Each second air guide piece and each first spacer are respectively arranged at two ends of the second channel. The second air guide piece comprises a plurality of first structures and a plurality of second structures. The first structures are arranged parallel to each other. The second structures are arranged between the first structures and connected with the first structures to form a plurality of third channels. The second spacers are respectively arranged between two adjacent second air guide pieces to form a fourth channel.
In one embodiment, each first passage and each fourth passage are communicated with each other to form a plurality of inner/outer circulation passages. And each third passage communicates with each second passage to form a plurality of outer/inner circulation passages. The inner circulation channel and the outer circulation channel are arranged in a staggered and isolated mode.
In an embodiment, the heat exchange module further comprises a plurality of second spacers. The second spacers are respectively arranged between two adjacent first air guide pieces. Each second spacer and each first spacer are respectively arranged at two ends of the second channel.
In one embodiment, the direction of air flow in each first channel is the same. The direction of air flow in each second channel is the same. And the direction of the air flow in the first channel is different from that in the second channel.
In one embodiment, the first channel and the second channel are an inner circulation channel/an outer circulation channel and an outer circulation channel/an inner circulation channel, respectively. The inner circulation channel and the outer circulation channel are arranged in a staggered and isolated mode.
In view of the above, the heat exchange module and the electronic device using the same provided by the present invention can bond the first air guide member and the first spacer member on the plane in a manner of arranging them at intervals by combining the components of the two structures, i.e. the first air guide member and the first spacer member, so as to quickly and neatly stack the first air guide member and the first spacer member to form a heat dissipation core structure, thereby saving the cost and time consumed by complex procedures such as stacking, bending or stamping forming the conventional heat dissipation core structure by a special machine, and preferably improving the yield of the heat exchange module by a simple structure and design.
In addition, the first air guide piece is of a corrugated plate-like structure formed by the two first structures and the plurality of second structures, so that a rail-like supporting structure is formed, and then the heat exchange module which is strong in rigidity and not easy to bend is formed, the service life of the heat exchange module is prolonged, and the heat exchange effect of the heat exchange module can be improved on the basis of a stable and not easy-to-deform structure.
Drawings
Fig. 1A is a perspective view of a known heat exchange device.
Fig. 1B is a side view of the airflow path of the heat exchange device of fig. 1A.
Fig. 1C is an enlarged schematic view of a heat dissipating aluminum sheet of the heat exchange device of fig. 1A.
Fig. 2A is an external view of a heat exchange module according to a preferred embodiment of the invention.
Fig. 2B is a schematic view of a portion of the heat exchange module shown in fig. 2A.
Fig. 2C is a partially exploded schematic view of the heat exchange module shown in fig. 2A.
Fig. 2D is a schematic diagram illustrating a state of the heat exchange module shown in fig. 2A applied to an electronic device.
Fig. 2E is a schematic diagram illustrating the airflow direction of the heat exchange module shown in fig. 2A.
Fig. 2F is a partially exploded schematic view of the heat exchange module shown in fig. 2A.
Fig. 3A is an external view of a heat exchange module according to another preferred embodiment of the invention.
Fig. 3B is a schematic view of a portion of the heat exchange module shown in fig. 3A.
Fig. 3C is a partially exploded schematic view of the heat exchange module shown in fig. 3A.
Fig. 3D is a schematic diagram illustrating a state of the heat exchange module shown in fig. 3A applied to an electronic device.
Fig. 4A is an external view of a heat exchange module according to another preferred embodiment of the invention.
Fig. 4B is a schematic diagram illustrating a state of the heat exchange module shown in fig. 4A applied to an electronic device.
Wherein reference numerals are as follows:
1. 1a, 1b, D2: heat exchange module
10. 10a, D7: shell body
101: first side surface
102: second side surface
103: a first opening
104: a second opening
105: a third opening
106: fourth opening
11: first air guide piece
111. 121: first structure
112. 122: second structure
12: second air guide piece
13: first spacer
14: second spacer
2. 2a, 2b: electronic device
21. E1: electronic component
23b: inner wall
A: radiating aluminum sheet
D: heat exchange device
20. 20b, D1: electronic device body
D3: first fan
D4: second fan
R1 and D5: internal circulation path
R2 and D6: external circulation path
E: electronic equipment
L1: a first channel
L2: second channel
L3: third channel
L4: fourth channel
X 1 、X 2 、Y 1 、Y 2 : direction of
Detailed Description
The preferred heat exchange module and the electronic device using the same according to the present invention will be described with reference to the accompanying drawings, wherein like elements will be described with like reference numerals.
Fig. 2A is an external view of a heat exchange module according to a preferred embodiment of the invention, fig. 2B is a partial external view of the heat exchange module shown in fig. 2A, fig. 2C is a partial exploded view of the heat exchange module shown in fig. 2A, and referring to fig. 2A, fig. 2B and fig. 2C, the heat exchange module 1 includes a housing 10, and a plurality of first air guiding members 11, a plurality of second air guiding members 12, a plurality of first spacers 13 and a plurality of second spacers 14 accommodated in the housing 10. In the present embodiment, the housing 10 has a rectangular parallelepiped structure, which has a first side 101 and a second side 102 opposite to the first side 101, but the present invention is not limited thereto, and the housing 10 may be a cube according to the design of the heat exchange module 1. The material of the housing of the present embodiment is not limited, and in practical application, the material of the housing may be plastic or metal.
For clarity, fig. 2B and 2C show the elements inside the housing 10 with the housing 10 removed, to illustrate the combination and connection of the elements other than the housing 10. In this embodiment, the five first air guiding members 11 are matched with the four second air guiding members 12, the four first spacers 13 and the five second spacers 14. However, the number of the above components is not limited to the present invention, and the heat exchange module should be adjusted according to the volume of the electronic device or the heat dissipation requirement thereof. The respective structural features of the heat exchange module 1 will be explained one by one.
Referring to fig. 2B and fig. 2C, each first air guiding member 11 has two first structures 111 and a plurality of second structures 112, the first structures 111 of the plurality of first air guiding members 11 are arranged in parallel, and the plurality of second structures 112 are disposed between the two first structures 111 of each first air guiding member 11. The second structures 112 are connected to the two first structures 111 of each first air guiding member 11 at the same time, and by the above structures, the two first structures 111 of each first air guiding member 11 and the plurality of second structures 112 define a plurality of first channels L1.
Referring to fig. 2B for the relation between the first structure 111 and the second structure 112, a single first air guiding member 11 is taken as an example, in this embodiment, when the first structure 111 and the second structure 112 are both flat and sheet-shaped structures in a macroscopic view, and the arrangement direction of the second structure 112 is substantially perpendicular to the arrangement direction of the two first structures 111, so as to improve the structural strength of each first air guiding member 11 in the stacking direction. Of course, the angle between the first structure 111 and the second structure 112 is not limited to the present invention, and may be changed according to the process or the usage mode during actual manufacturing and application, which does not affect the effect of the airflow in the first channel L1.
Referring to fig. 2A, 2B and 2C, the heat exchange module 1 further includes a plurality of second air guiding members 12, a plurality of first spacers 13 and a plurality of second spacers 14. Each first spacer 13 is respectively arranged between two adjacent first air guide pieces 11, and each first spacer 13 and two adjacent first air guide pieces 11 define a second channel L2; and each second air guide member 12 and each first spacer 13 are respectively disposed at two ends of the second channel L2. In other words, when viewed in whole, the first spacer 13 is disposed on a side of the second channel L2 near the first side 101 of the housing 10, and the second air guide 12 is disposed on a side of the second channel L2 near the second side 102 of the housing 10.
The second air guiding members 12 have substantially the same structure as the first air guiding members 11, and each second air guiding member 12 also has two first structures 121 and a plurality of second structures 122, and the first structures 121 and the plurality of second structures 122 define a plurality of third channels L3. However, the second air guiding member 12 and the first air guiding member 11 have substantially the same structure and features, and thus will not be described herein.
Referring to fig. 2A, 2B and 2C, the second spacers 14 have substantially the same structure as the first spacers 13, except that each second spacer 14 is disposed between two adjacent second air guiding members 12. Each second spacer 14 and two adjacent second air guiding members 12 define a fourth channel L4. In detail, the second spacers 14 are disposed with respect to each of the first air guides 11, in other words, when viewed in whole, the second spacers 14 are disposed on the side of the fourth channel L4 near the second side 102 of the housing 10, and the first air guides 11 are disposed on the side of the fourth channel L4 near the first side 101 of the housing 10.
With the above structure, each first channel L1 is in communication with each fourth channel L4 to define a plurality of inner/outer circulation channels, and each second channel L2 is in communication with each third channel L3 to define a plurality of outer/inner circulation channels. In this embodiment, a plurality of inner circulation channels are formed by the combination of the first channels L1 and the fourth channels L4, and a plurality of outer circulation channels are formed by the combination of the second channels L2 and the third channels L3, and the inner circulation channels and the outer circulation channels are arranged in a staggered and isolated manner, so as to achieve the heat exchange effect. However, the above heat exchange process will be described in detail with respect to the structure of the housing 10, and will not be described in detail.
It should be noted that, the first air guiding members 11, the second air guiding members 12, the first spacers 13 and the second spacers 14 are all similar to corrugated cardboard (corrugated) structures, which are preferably made of plastic materials or metal materials formed by an integral frame, or are partially made of plastic materials, partially made of metal materials or other materials with high heat dissipation performance. The first air guide member 11, the second air guide member 12, the first spacer 13 and the second spacer 14 of this embodiment are formed by cutting, and then the elements are connected to each other by gluing, thermosol, ultrasonic bonding or the like in a planar structure. Compared with the prior heat exchange module (heat dissipation core) which is formed by stacking and bending or stamping through a special machine, the invention has the advantages of neatly and rapidly stacking and bonding through the planar structure, and the cost and the complexity of the process are improved.
Fig. 2D is a schematic diagram illustrating a state of the heat exchange module shown in fig. 2A applied to an electronic device, fig. 2E is a schematic diagram illustrating an airflow direction of the heat exchange module shown in fig. 2A, and fig. 2F is a partially exploded schematic diagram of the heat exchange module shown in fig. 2A, wherein the embodiment illustrates an airflow direction and a heat exchange mechanism of the heat exchange module 1 by simulating a state of the heat exchange module 1 applied to an electronic device 2 and how the electronic device 2 achieves a heat dissipation effect by the heat exchange module 1 of the present invention.
Referring to fig. 2D, 2E and 2F, the heat exchange module 1 is covered by the electronic device body 20 to isolate from the external environment and form a channel for circulating air flow. The first fan D3 is disposed in the internal circulation path R1 to drive the internal circulation airflow, i.e. a side of the electronic device body 20 directs the hot airflow generated by the operation of the electronic components 21 of the electronic device 2 to enter the heat exchange module 1 along the internal circulation path R1. Meanwhile, the second fan D4 is disposed in the external circulation path R2 to drive the external circulation airflow, that is, the cold air outside the electronic device 2 is guided by the other side surface of the electronic device body 20 to flow into the heat exchange module 1 along the external circulation path R2. In this way, the heat exchange between the inner circulation airflow with relatively high temperature and the outer circulation airflow with relatively low temperature can be performed in the region where the inner circulation path R1 and the outer circulation path R2 are alternately arranged, so that the inner circulation airflow is cooled and provided to the electronic component 21 of the electronic device 2, and the effect of reducing the internal temperature of the electronic device 2 is achieved.
The manner in which the heat exchange module 1 of the present embodiment performs heat exchange is described in detail below. Referring to fig. 2D, 2E and 2F, in the present embodiment, the housing 10 has a first opening 103 located on the first side 101, a second opening 104 located on the second side 102, and a third opening 105 and a fourth opening 106 located on two adjacent surfaces of the first side 101 and the second side 102, respectively, as required by the airflow direction.
In the present embodiment, the internal circulation path R1 includes a hot air flow from the inside of the electronic device passing through the first fan D3 along the direction X 1 After flowing in the direction, the first opening 103 of the shell 10 is along Y 2 Respectively flow intoIn the first plurality of channels L1, then continues along Y 2 Into each fourth channel L4 communicating with each first channel L1 and finally along X via the third opening 105 of the housing 2 A flow path directed back into the interior of the electronic device; the external circulation path R2 includes the cold air from outside the electronic device guided along X by the second fan D4 2 After entering in the direction along Y via the second opening 104 of the housing 10 1 Respectively flows into the multiple third channels L3 and then continuously follows Y 1 Into each second channel L2 communicating with each third channel L3, and finally along X via the fourth opening 106 of the housing 1 Directed away from the flow path of the electronic device. Wherein X is 1 Direction and X 2 The direction being the opposite direction, and Y 1 Direction and Y 2 The directions are also opposite directions, X 1 direction/X 2 Direction and Y 1 direction/Y 2 The directions are mutually perpendicular. In other words, the inner circulation path R1 experiences a flow including Y in the fourth path L4 2 Direction and X perpendicular thereto 2 Directional flow, while the outer circulation path R2 experiences a flow pattern containing Y in the second channel 1 Direction and X perpendicular thereto 1 Directional flow.
In general, the air flow entering the first opening 103 and the second opening 104 can be equally split into the first passage L1 and the second passage L2. Because the inner circulation path R1 and the outer circulation path R2 are alternately arranged at intervals in the casing 10, adjacent layers are different circulation layers, and the air flow directions of the adjacent layers are opposite (an included angle of 180 degrees is formed in the projection direction), at the moment, cold air brought in through the outer circulation path R2 can exchange heat with hot air brought in through the inner circulation path R1, so that air in the outer circulation path R2 can take away hot air in a heat conduction mode, and the heat dissipation effect is achieved. Through the design of the interval channels of the heat exchange module 1, the heat dissipation efficiency can be greatly improved through interlayer convection and intersection.
Fig. 3A is a schematic external view of a heat exchange module according to another preferred embodiment of the present invention, fig. 3B is a schematic external view of a portion of the heat exchange module shown in fig. 3A, fig. 3C is a schematic exploded view of a portion of the heat exchange module shown in fig. 3A, and referring to fig. 3A, fig. 3B and fig. 3C, the heat exchange module 1a has substantially the same structure and characteristics as the constituent elements of the heat exchange module 1 according to the foregoing embodiment, but the heat exchange module 1a is formed by combining a housing 10a, and a plurality of first air guiding members 11, a plurality of first spacers 13 and a plurality of second spacers 14 accommodated in the housing 10 a. It should be noted that, the first air guiding member 11 and the second air guiding member 12 of the foregoing embodiment have substantially the same structure, and the first spacer 13 and the second spacer 14 also have substantially the same structure, so they can be applied instead of each other.
In detail, the first structures 111 of the plurality of first air guides 11 of the heat exchange module 1a are arranged parallel to each other, and the second structures 112 are disposed between the two first structures 111 of each first air guide 11. The second structures 112 are connected to the two first structures 111 of each first air guiding member 11 at the same time, and by the above structures, the two first structures 111 of each first air guiding member 11 and the plurality of second structures 112 define a plurality of first channels L1. Each first spacer 13 and each second spacer 14 are respectively disposed between two adjacent first air guiding members 11 to define a second channel L2. When viewed in whole, each first air guiding member 11 (and the first channels L1 defined by the first air guiding members) is adjacent to and spaced apart from each second channel L2, in other words, a second channel L2 is sandwiched between two first air guiding members 11. In the embodiment, a plurality of first channels L1 are defined as a part of the inner circulation path R1, and a plurality of second channels L2 are defined as a part of the outer circulation path R2, but the present invention is not limited thereto, and the positions and directions of the first channels L1 and the second channels L2 can be adjusted according to the heat dissipation requirement in practical application.
Slightly different from the heat exchange module 1 of the foregoing embodiment, the airflow flowing direction of the adjacent layers of the heat exchange module 1a of the present embodiment forms an included angle of about 90 degrees in the projection direction, and when the heat exchange module is actually applied to the inside of the electronic device 2a (as shown in fig. 3D), the inner circulation path R1 and the outer circulation path R2 are configured to be in a cross-type flow direction, which is favorable for saving the configuration space required by the heat exchange module, and further can be applied to the electronic device with smaller volume.
The direction of the air flow and the heat exchange mechanism of the heat exchange module 1a are described below, wherein the hot air flow generated from the electronic device (not shown) enters the heat exchange module 1a along the internal circulation path R1. At the same time, cool air from outside the electronic device flows into the heat exchange module 1a along the external circulation path R2. In this way, the heat exchange between the inner circulation airflow with relatively high temperature and the outer circulation airflow with relatively low temperature can be performed in the region where the inner circulation path R1 and the outer circulation path R2 are alternately arranged, so that the inner circulation airflow is cooled and provided to the inside of the electronic device, and the effect of reducing the internal temperature of the electronic device is achieved.
Fig. 4A is a schematic view of an external heat exchange module according to another preferred embodiment of the present invention, and fig. 4B is a schematic view of a state of simulating the heat exchange module shown in fig. 4A applied to an electronic device, please refer to fig. 4A and fig. 4B, wherein the heat exchange module 1B has substantially the same structure and characteristics as the heat exchange module 1a of the previous embodiment, but the heat exchange module 1B is applied to a top portion of the electronic device 2B, i.e. a top-mounted configuration.
In detail, the heat exchange module 1b of the present embodiment is applied to communicate with the outside of the electronic device 2b in a plurality of first passages L1 as a part of the external circulation path R2; and one end of the plurality of second channels L2 abuts against an inner wall 23b of the electronic device body 20b of the electronic device 2b, so that the second channels L2 form a structure with a single side opening, and when the hot air flow from the interior of the electronic device 2b flows into the second channels L2, the hot air flows into the second channels L2 and contacts with the flow guide of the inner wall 23b, and flows out of the heat exchange module 1b again along the structure in the second channels. When the electronic device is viewed as a whole, the region where the inner circulation path R1 and the outer circulation path R2 are stacked and staggered can perform heat exchange on the inner circulation airflow with relatively high temperature and the outer circulation airflow with relatively low temperature, so that the inner circulation airflow is cooled and provided to the inside of the electronic device 2b, and the effect of reducing the internal temperature of the electronic device 2b is achieved.
The present invention further provides an electronic device using the heat exchange modules 1, 1a, 1b, but the heat exchange device and the electronic device are described in detail herein, and are not described herein.
In summary, the heat exchange module and the electronic device using the same provided by the present invention are capable of bonding the first air guide member and the first spacer on a plane in a manner of arranging the first air guide member and the first spacer at intervals, so as to quickly and neatly stack the heat dissipation core structure, thereby saving the cost and time consumed by complex procedures such as stacking, bending or stamping forming of the conventional heat dissipation core structure by a special machine, and preferably improving the yield of the heat exchange module by a simple structure and design.
In addition, the first air guide piece is of a corrugated plate-like structure formed by the two first structures and the plurality of second structures, so that a rail-like supporting structure is formed, and then the heat exchange module which is strong in rigidity and not easy to bend is formed, the service life of the heat exchange module is prolonged, and the heat exchange effect of the heat exchange module can be improved on the basis of a stable and not easy-to-deform structure.
The foregoing is illustrative only and is not intended to be limiting of the present invention. Any equivalent modifications or variations to the present invention without departing from the spirit and scope of the present invention are intended to be included in the following claims.
Claims (4)
1. An electronic device, comprising:
an electronic device body having a top with an inner wall; and
a heat exchange module disposed at the top of the electronic device body, the heat exchange module comprising:
a plurality of first channels, which are used for being communicated with the outside of the electronic device, are used as a part of an external circulation path, and are used for an external circulation airflow to pass through, and the airflow inlet direction and the airflow outlet direction of the first channels are the same direction; and
One end of each second channel is propped against the inner wall, so that a single-side opening is formed in the second channel, the air flow inlet direction and the air flow outlet direction of the second channel are parallel and opposite, and the air flow inlet direction and the air flow outlet direction of the second channel are vertical to the air flow inlet direction and the air flow outlet direction of the first channel;
when the hot air flow from the inside of the electronic device flows into the second channel, the hot air flows into the second channel and contacts with the flow guide of the inner wall, and then flows out of the heat exchange module along the structure in the second channel.
2. The electronic device of claim 1, wherein the heat exchange module further comprises:
a housing;
the first air guide pieces are arranged in the shell, each first air guide piece comprises a plurality of first structures and a plurality of second structures, the first structures are mutually parallel, and the second structures are arranged among the first structures and connected with the first structures to form a plurality of first channels;
a plurality of first spacers respectively arranged between two adjacent first air guiding members, an
The second spacers are respectively arranged between the two adjacent first air guide pieces, wherein each first spacer and each second spacer are respectively arranged between the two adjacent first air guide pieces and correspond to the opposite ends of the first air guide pieces respectively to form the second channels.
3. The electronic device of claim 1, wherein the direction of air flow in each of the first channels is the same and the direction of air flow in each of the second channels is the same.
4. The electronic device of claim 1, wherein the first channels and the second channels are outer circulation channels and inner circulation channels, respectively, and the inner circulation channels and the outer circulation channels are arranged in a staggered and isolated manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011239684.2A CN112399781B (en) | 2015-03-24 | 2015-03-24 | Heat exchange module and electronic device using same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510130080.7A CN106163208A (en) | 2015-03-24 | 2015-03-24 | Heat exchange module and apply its electronic installation |
| CN202011239684.2A CN112399781B (en) | 2015-03-24 | 2015-03-24 | Heat exchange module and electronic device using same |
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| CN201510130080.7A Division CN106163208A (en) | 2015-03-24 | 2015-03-24 | Heat exchange module and apply its electronic installation |
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| CN112399781A CN112399781A (en) | 2021-02-23 |
| CN112399781B true CN112399781B (en) | 2024-04-02 |
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| CN202011239684.2A Active CN112399781B (en) | 2015-03-24 | 2015-03-24 | Heat exchange module and electronic device using same |
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| US4616695A (en) * | 1984-05-11 | 1986-10-14 | Mitsubishi Denki Kabushiki Kaisha | Heat exchanger |
| CN1735786A (en) * | 2002-12-02 | 2006-02-15 | Lg电子株式会社 | Heat exchanger of ventilating system |
| CN101634477A (en) * | 2008-07-25 | 2010-01-27 | 华为技术有限公司 | Heat exchanger and communication device |
| CN101672597A (en) * | 2009-09-28 | 2010-03-17 | 爱克奇换热技术（太仓）有限公司 | Core of heat exchanger |
| CN101710830A (en) * | 2009-11-13 | 2010-05-19 | 深圳市中兴新地通信器材有限公司 | Integrated outdoor BTS equipment |
| CN203586909U (en) * | 2013-11-06 | 2014-05-07 | 贵州永红航空机械有限责任公司 | Core component for aluminum alloy plate-fin radiator |
| CN203660350U (en) * | 2014-01-15 | 2014-06-18 | 艾默生网络能源有限公司 | Outdoor power cabinet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3045326C2 (en) * | 1980-12-02 | 1982-10-21 | Autz & Hermann, 6900 Heidelberg | Heat exchanger used for dust-free cooling of a switch cabinet |
| CN201008252Y (en) * | 2007-03-27 | 2008-01-16 | 曾国辉 | Heat exchanger and machine cabinet equipped with the same |
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2015
- 2015-03-24 CN CN201510130080.7A patent/CN106163208A/en active Pending
- 2015-03-24 CN CN202011239684.2A patent/CN112399781B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4616695A (en) * | 1984-05-11 | 1986-10-14 | Mitsubishi Denki Kabushiki Kaisha | Heat exchanger |
| CN1735786A (en) * | 2002-12-02 | 2006-02-15 | Lg电子株式会社 | Heat exchanger of ventilating system |
| CN101634477A (en) * | 2008-07-25 | 2010-01-27 | 华为技术有限公司 | Heat exchanger and communication device |
| CN101672597A (en) * | 2009-09-28 | 2010-03-17 | 爱克奇换热技术（太仓）有限公司 | Core of heat exchanger |
| CN101710830A (en) * | 2009-11-13 | 2010-05-19 | 深圳市中兴新地通信器材有限公司 | Integrated outdoor BTS equipment |
| CN203586909U (en) * | 2013-11-06 | 2014-05-07 | 贵州永红航空机械有限责任公司 | Core component for aluminum alloy plate-fin radiator |
| CN203660350U (en) * | 2014-01-15 | 2014-06-18 | 艾默生网络能源有限公司 | Outdoor power cabinet |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106163208A (en) | 2016-11-23 |
| CN112399781A (en) | 2021-02-23 |
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