CN112387647A - Silicon wafer cleaning method - Google Patents
Silicon wafer cleaning method Download PDFInfo
- Publication number
- CN112387647A CN112387647A CN202110072089.2A CN202110072089A CN112387647A CN 112387647 A CN112387647 A CN 112387647A CN 202110072089 A CN202110072089 A CN 202110072089A CN 112387647 A CN112387647 A CN 112387647A
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- China
- Prior art keywords
- silicon wafer
- cleaning
- silicon
- mounting plate
- pushing
- Prior art date
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 150
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 150
- 239000010703 silicon Substances 0.000 title claims abstract description 150
- 238000004140 cleaning Methods 0.000 title claims abstract description 108
- 238000000034 method Methods 0.000 title claims abstract description 30
- 235000012431 wafers Nutrition 0.000 claims abstract description 146
- 238000005507 spraying Methods 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 47
- 239000007921 spray Substances 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 19
- 230000000670 limiting effect Effects 0.000 claims description 14
- 238000007790 scraping Methods 0.000 claims description 14
- 239000012530 fluid Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 13
- 230000009471 action Effects 0.000 abstract description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 15
- 230000008569 process Effects 0.000 description 7
- 238000005406 washing Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 230000002209 hydrophobic effect Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 230000001174 ascending effect Effects 0.000 description 3
- 210000002268 wool Anatomy 0.000 description 3
- 238000011084 recovery Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 235000008216 herbs Nutrition 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001739 rebound effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
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- B08B1/12—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/14—Drying solid materials or objects by processes not involving the application of heat by applying pressure, e.g. wringing; by brushing; by wiping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Abstract
A silicon wafer cleaning method comprises the following steps: sequentially inserting the silicon wafer between two adjacent clamping teeth on the toothed bar so as to support the silicon wafer on each supporting bar; placing the flower basket main body with the silicon wafer installed at the bottom of a cleaning pool; the pushing end plate slides to the pushing block along the sliding rail until the three supporting rods are respectively contacted with the pushing surface, and then the spraying is opened; the end plate is continuously pushed to enable the push block to push the supporting rod to slide from a high position to a low position along the sliding groove, and the expanding spring is compressed to enable the silicon wafer to fall towards the supporting rod and expose a region where the silicon wafer is clamped by the clamping teeth for cleaning, so that the cleaning effect of the whole silicon wafer is improved; after the cleaning is finished, the push block loosens the supporting rod, the supporting rod pushes the silicon wafers to be inserted back between the two clamping teeth under the action of the resilience force of the expanding spring, and the silicon wafers are guaranteed to be arranged neatly through the resilience force.
Description
Technical Field
The invention relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer cleaning method.
Background
Chinese patent, application No. CN201811244464.1, application date 2018.10.24, grant publication No. CN109461791B, grant publication date 2020.08.25, have provided a method for making herbs into wool of monocrystalline silicon piece, mainly include: the monocrystalline silicon pieces are pairwise combined into a group and inserted into the flower basket, and then the flower basket loaded with the monocrystalline silicon pieces is placed into the wool making liquid for etching reaction; taking out the etched monocrystalline silicon piece and the flower basket, and sequentially carrying out high-temperature cleaning and low-temperature cleaning; slicing the monocrystalline silicon wafer after low-temperature cleaning; and carrying out subsequent cleaning and drying to obtain the monocrystalline silicon wafer with the pyramid textured structure on one surface. In the high-temperature cleaning process in the texturing method, the high-temperature cleaning liquid can promote the separation of the monocrystalline silicon pieces which are adhered together, and effectively clean residual liquid medicine and reaction products among the monocrystalline silicon pieces; during low-temperature cleaning, every two single crystal silicon wafers in one group are mutually attached, so that certain moisture is reserved between every two single crystal silicon wafers in one group, namely the effect of 'external drying and internal wetting' is realized on every two single crystal silicon wafers in one group, and the slicing is facilitated.
Although the method can enable the monocrystalline silicon wafers to be combined into a group in pairs and inserted into the flower basket, and then the flower basket loaded with the monocrystalline silicon wafers is placed in the wool making liquid, the cleaning of the monocrystalline silicon wafers is incomplete in such a way, and the silicon wafers cannot be well cleaned at the splicing positions of the monocrystalline silicon wafers and the flower basket.
Therefore, it is necessary to design a wafer cleaning method for complete cleaning.
Disclosure of Invention
The invention aims to provide a silicon wafer cleaning method.
In order to solve the technical problem, the invention provides a silicon wafer cleaning method, which comprises the following steps: sequentially inserting the silicon wafer between two adjacent clamping teeth on the toothed bar so as to support the silicon wafer on each supporting bar; placing the flower basket main body with the silicon wafer installed at the bottom of a cleaning pool; the end plate slides to the push block along the slide rail until the three support rods are respectively contacted with the push surface, and then the spraying is opened; continuously pushing the end plate to enable the push block to push the supporting rod to slide from a high position to a low position along the sliding groove, and compressing the expanding spring to enable the silicon wafer to fall towards the supporting rod and expose a region where the silicon wafer is clamped by the clamping teeth; and releasing the end plate, opening the spring to rebound, and pushing the silicon wafers to be inserted back between the clamping teeth by the support rod.
Further, after the flower basket main body is placed at the bottom of the cleaning pool, the end plate is pushed by the pushing motor; after the silicon wafer is cleaned, the end plate is loosened by the pushing motor.
Furthermore, after the three support rods are respectively contacted with the pushing surface, cleaning liquid is sprayed out through the spray head to spray the silicon wafer.
Further, after the flower basket main body is arranged at the bottom of the cleaning pool, a mounting plate is arranged between the two end plates; after the spray head is opened, the mounting plate is rotated to cover the silicon chip; cleaning fluid sprayed by the spray head is collected in the water collecting tank and presses the scraper blades to respectively scrape stains on the surfaces of the silicon wafers on the two sides.
Further, after enough cleaning fluid is collected in the water collecting tank, the scraper plate descends, and the brush head is attached to the surface of the silicon wafer and brushes stains on the surface of the silicon wafer; after the cleaning liquid in the water collecting tank is emptied, the scraper blade rises, and is attached to the surface of the silicon wafer through the scraper bar and scrapes water stains on the surface of the silicon wafer.
Further, after the spray head is closed, the cleaning liquid in the water collecting tank is emptied through the overflow hole.
Further, after the scraping strip scrapes water stains on the surface of the silicon wafer, cleaning fluid is guided into the drainage groove through the scraping strip; and then the cleaning liquid is discharged from the two sides of the scraper through the drainage groove.
Furthermore, after the flower basket main body is placed at the bottom of the cleaning pool, the rotating shaft is inserted through the linkage piece, so that the mounting plate rotates; after the mounting plate is opened, the mounting plate is supported by a second limiting block; after the mounting plate covers the silicon chip, the mounting plate is supported by the first limiting block.
Furthermore, when the supporting rod slides from a high position to a low position along the sliding groove, the supporting rod pushes the baffle on the right side so that the mounting plate covers the silicon wafer; when the support rod slides from a low position to a high position along the sliding groove, the support rod pushes the baffle on the left side to open the mounting plate.
The silicon wafer cleaning method has the beneficial effects that after the end plate is inserted into the cleaning pool, the end plate is pushed towards the push block to enable the end plate to slide along the slide rail at the bottom of the cleaning pool, the three support rods are synchronously pushed by the push block, further, the support rods slide downwards along the slide grooves to be separated from the silicon wafers and compress the opening springs, the support rods slide obliquely downwards to enable the silicon wafers to slide down and to be contacted with the support rods again in the cleaning process, at the moment, the clamping positions of the clamping teeth on the silicon wafers can be exposed for cleaning, so that the cleaning effect of the whole silicon wafers is improved, after the cleaning is finished, the push block loosens the support rods, the support rods push the silicon wafers to be inserted back between the two clamping teeth under the effect of the resilience force of the opening springs, and the silicon wafers are.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a perspective view of a preferred embodiment of a silicon wafer cleaning apparatus of the present invention;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
FIG. 3 is a schematic structural view of a preferred embodiment of the support pole of the present invention at an elevated position;
FIG. 4 is a schematic structural view of a preferred embodiment of the present invention with the support pole in a lowered position;
FIG. 5 is a partial enlarged view of portion B of FIG. 1;
FIG. 6 is an enlarged view of a portion C of FIG. 1;
FIG. 7 is a cross-sectional view of the preferred embodiment of the squeegee of the invention at section D in FIG. 6;
FIG. 8 is a schematic structural view of a preferred embodiment of the present invention in the open position of the mounting plate;
FIG. 9 is a schematic structural view of a preferred embodiment of the mounting plate of the present invention in a covering state;
FIG. 10 is a flow chart of a preferred embodiment of a wafer cleaning method of the present invention.
In the figure:
the flower basket comprises a flower basket body 1, an end plate 11, a sliding groove 111, a sliding block 112, a first limiting block 113, a rotating shaft 114, a second limiting block 115, a toothed bar 12, clamping teeth 121, a supporting bar 13 and a spreading spring 14;
a silicon wafer 2;
the cleaning device comprises a cleaning pool 3, a push block 31, a push surface 311, a slide rail 32, a dovetail groove 321, a push motor 33 and a spray head 34;
the scraper 4, the water collecting groove 41, the brush head 42, the scraping strip 43, the water drainage groove 44, the restoring spring 45 and the overflow hole 46;
linkage piece 6, plug piece 61, baffle 62.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
As shown in fig. 1 to 10, the present invention provides a silicon wafer cleaning method, including: sequentially inserting the silicon wafer 2 between two adjacent clamping teeth 121 on the toothed bar 12 so as to support the silicon wafer 2 on each supporting bar 13;
placing the flower basket main body 1 with the silicon wafer 2 installed at the bottom of the cleaning pool 3;
the pushing end plate 11 slides to the pushing block 31 along the slide rail 32 until the three support rods 13 are respectively contacted with the pushing surface 311, and then the spraying is opened;
continuing to push the end plate 11 to enable the push block 31 to push the support rod 13 to slide from a high position to a low position along the sliding groove 111, and compressing the expanding spring 14 to enable the silicon wafer 2 to fall towards the support rod 13 and expose a region where the silicon wafer 2 is clamped with the clamping teeth 121;
the end plate 11 is loosened, the expanding spring 14 rebounds, and the supporting rod 13 pushes the silicon wafers 2 to be inserted back between the clamping teeth 121 in order.
The method can be realized by adopting the following structure: referring to fig. 1 and 2, fig. 1 is a perspective view of a preferred embodiment of a silicon wafer cleaning apparatus according to the present invention; FIG. 2 is an enlarged view of a portion A of FIG. 1; as shown in fig. 1 and 2, when a silicon wafer 2 is cleaned, a basket body 1 is generally used to insert the silicon wafer 2 to fix the silicon wafer 2, specifically, the basket body 1 includes two parallel end plates 11, and three rack bars 12 and three support bars 13 disposed between the two end plates 11, the three rack bars 12 and the three support bars 13 are respectively arranged in an "L" shape, two "L" are oppositely disposed, specifically, two rack bars 12 are vertically arranged, another rack bar 12 is horizontally arranged below, two support bars 13 are vertically arranged, another support bar 13 is horizontally arranged below, the rack bars 12 and the support bars 13 are in one-to-one correspondence, a plurality of clamping teeth 121 are uniformly distributed on the rack bars 12, the clamping teeth 121 on the vertically arranged two rack bars 12 extend horizontally, the clamping teeth 121 on the horizontally arranged rack bars 12 extend vertically, that is, that the clamping teeth 121 face the direction in which the silicon wafer 2 is inserted, the silicon wafer 2 can be inserted between the two clamping teeth 121 and clamped by the two clamping teeth 121, meanwhile, the side wall of the silicon wafer 2 leans against the support rods 13 which are vertically arranged, the bottom wall of the silicon wafer 2 is supported on the support rods 13 which are horizontally arranged, and therefore, the installation of the silicon wafer 2 is completed, but when the silicon wafer 2 is cleaned in such a way, the position where the silicon wafer 2 is contacted with the clamping teeth 121 is difficult to clean, and in order to solve the problems, the following improvements need to be made on the structure:
the end plates 11 are provided with sliding grooves 111 at the positions of the support rods 13, the sliding grooves 111 extend in the direction away from the toothed bars 12 and incline downwards, the support rods 13 extend out of the two end plates 11, a distraction spring 14 is arranged in the sliding groove 111 to push the support rod 13, so that the support rod 13 is positioned at the high position of the sliding groove 111, the support rod 13 can slide along the sliding groove 111 under the pushing of an external force and compress the distraction spring 14, after the external force is removed, the expanding spring 14 rebounds to push the support rod 13 back to the high position of the sliding groove 111, before cleaning, after each silicon wafer 2 is inserted between two clamping teeth 121 in sequence, the support rod 13 is manually broken to compress the expanding spring 14, the supporting rods 13 are driven to synchronously flap the silicon wafers 2 when the expanding springs 14 rebound, so that the silicon wafers 2 are arranged orderly, and the loose silicon wafers 2 can be stored orderly so as to be convenient for the disassembly of the silicon wafers 2.
Referring to fig. 3 to 5, fig. 3 is a schematic structural view of a preferred embodiment of the supporting rod of the present invention at a high position; FIG. 4 is a schematic structural view of a preferred embodiment of the present invention with the support pole in a lowered position; FIG. 5 is a partial enlarged view of portion B of FIG. 1; as shown in fig. 1 to 5, in order to push the supporting rod 13 during cleaning, the silicon wafer cleaning apparatus further includes:
the washing tank 3 is provided with a washing tank,
the cleaning tank 3 is a cuboid, a cleaning tank is arranged from top to bottom, the cleaning tank 3 is used for cleaning the silicon wafers 2, the length of the cleaning tank is equal to that of the supporting rod 13, when the flower basket main body 1 is placed in the cleaning tank 3, the supporting rod 13 slides downwards along the inner wall of the cleaning tank 3, at the moment, the supporting rod 13 can play a guiding role, the downward sliding linearity of the flower basket main body 1 is ensured, and the silicon wafers 2 are prevented from falling off; the inner side walls of two short sides of the cleaning pool 3 are respectively provided with a push block 31, one side wall of the push block 31 is close to the inner side wall of a long side of the cleaning pool 3, the other side wall of the push block 31 is provided with a push surface 311, specifically, the push block 31 is of a structure that the width of the upper part is larger than that of the lower part, namely, the push surface 311 is in a step shape, the push surface 311 can synchronously contact with three support rods 13, after the basket body 1 is inserted into the cleaning pool 3, one transverse side of the push surface 311 and the transversely arranged support rods 13 are positioned on the same horizontal plane, the push block 31 pushes the end plate 11 to enable the end plate 11 to slide along a slide rail 32 at the bottom of the cleaning pool 3, the push surface 311 has a limiting effect on the transversely arranged support rods 13, so that the three support rods 13 are synchronously pushed by the push block 31, and then the support rods 13 slide downwards along the slide groove 111 to be separated, make silicon chip 2 can the landing and contact with bracing piece 13 again in the cleaning process, the chucking position that is pressed from both sides tight tooth 121 before this moment on silicon chip 2 can expose, wash, thereby whole silicon chip 2's cleaning performance has been improved, after the washing is accomplished, bracing piece 13 is loosened to ejector pad 31, bracing piece 13 pushes silicon chip 2 under the resilience force effect of strutting spring 14 and inserts back to two and press from both sides between the tight tooth 121, and guarantee through the resilience force that each silicon chip 2 arranges neatly.
In this embodiment, the clamping position of the clamping teeth 121 on the silicon wafer 2 can be exposed before, i.e. the clamping teeth 121 are clamped by replacing the place where the silicon wafer has been washed, in such a way that the whole silicon wafer 2 can be cleaned, and the structure of the clamping teeth 121 is such that the cross-sectional area gradually decreases away from the rack bar 12, even if the silicon wafer 2 tilts up when the silicon wafer 2 falls on the support bar 13 at the lower part of the sliding groove 111, the two sides of the silicon wafer 2 are still between the two clamping teeth 121 and do not go over the clamping teeth 121.
It should be noted that the length of the slide rail 32 is greater than the length of the end plate 11, and in the process that the end plate 11 slides along the slide rail 32, if the end plate 11 is separated from the slide rail 32, the end plate 11 may tilt to incline the silicon wafer 2 toward the rack bar 12, so that the effect of completely cleaning the silicon wafer 2 cannot be achieved, therefore, a dovetail groove 321 needs to be formed in the slide rail 32, and meanwhile, a slider 112 adapted to the dovetail groove 321 is arranged at the bottom of the end plate 11, and the slider 112 cannot be separated from the slide rail 32 when sliding through the design of the dovetail groove 321, so that the sliding linearity of the end plate 11 is ensured, and when the support bar 13 slides to the lower position of the slide groove 111, the silicon wafer 2 can be ensured to incline toward one side.
After the basket body 1 is inserted into the cleaning tank 3, in order to push the end plate 11, the following scheme can be adopted:
two pushing motors 33 are arranged on the bottom of the cleaning pool 3 in a mirror image mode, the pushing motors 33 correspond to the pushing blocks 31 one by one, the distance between the two pushing motors 33 is equal to the distance between the two end plates 11, so that the two end plates 11 can move synchronously, meanwhile, the pushing motors 33 can be arranged outside the cleaning pool 3, and the situation that the pushing motors 33 are damaged due to damp is avoided; wherein the end plate 11 inserts wash pond 3 to with the slide rail 32 laminating back, specifically, push motor 33 can promote end plate 11 slides to ejector pad 31 direction along slide rail 32, end plate 11 slide drive three bracing piece 13 simultaneously with push away the face 311 contact, continue to promote end plate 11 and make bracing piece 13 compress along sliding tray 111 and strut spring 14 for silicon chip 2 can expand so that clean push motor 33 loosens behind the end plate 11, strut spring 14 kick-backs and drives bracing piece 13 and promote silicon chip 2 and resume the normal position.
In order to effect the cleaning of the silicon wafer 2,
the inner side walls of the two long edges of the cleaning pool 3 are uniformly provided with a plurality of spray heads 34, specifically, the spray heads 34 are transversely and uniformly arranged and uniformly distributed, the spray heads 34 on the two sides are in one-to-one correspondence to ensure that cleaning liquid for washing the two sides of the silicon wafer 2 is uniform, the cleaning effect of the silicon wafer 2 is ensured, each spray head 34 forms a spray area, the spray area is higher than the height for installing the silicon wafer 2, so that the cleaning liquid is sprayed on the silicon wafer 2 from the oblique upper side, namely, the spray area is higher than the top surface of the end plate 11 when the end plate 11 slides in the cleaning pool 3, the completeness for washing the silicon wafer 2 is ensured, and the cleaning effect of the silicon wafer 2 is improved.
Referring to fig. 6 and 7, fig. 6 is a partially enlarged view of portion C of fig. 1; FIG. 7 is a cross-sectional view of a preferred embodiment of the squeegee of the invention; as shown in fig. 1 to 7, in order to further improve the cleaning effect of the silicon wafers 2, when the silicon wafers 2 are cleaned, a horizontally arranged scraper 4 is installed above each two adjacent silicon wafers 2, the width of the scraper 4 is equal to the distance between the two adjacent silicon wafers 2, and the silicon wafers 2 are brushed by sliding the scraper 4 downwards to improve the cleaning effect of the silicon wafers 2, specifically,
for the downward sliding of the scraper 4, a water collecting tank 41 can be arranged at the top of the scraper 4, the height of a spraying area is higher than the rising and falling height of the scraper 4, so that the spray head 34 can spray water into the water collecting tank 41, the mass of the whole scraper 4 is increased after water is continuously filled in the water collecting tank 41, the scraper 4 can slide downwards under the action of gravity, meanwhile, a brush head 42 can be arranged at the bottom of the scraper 4, the brush head 42 is bidirectional, two sides of the brush head 42 are attached to two sides of the scraper 4, and the brush head 42 brushes stains on the surface of the silicon wafer 2 while following the descending of the scraper 4, so that the cleaning effect of the silicon wafer 2 is improved;
furthermore, two scraping strips 43 can be installed on two sides of the upper end surface of the scraper 4 in a mirror image manner, the two scraping strips 43 are respectively attached to the surfaces of the silicon wafers 2 on two sides, the width of the scraping strips 43 is gradually reduced from the scraper 4 to the direction far away from the scraper 4, so that the installation stability of the scraping strips 43 can be ensured, the situation that the scraping strips 43 are turned over and deformed is avoided, meanwhile, a hydrophobic groove 44 with two mirror images is formed in the upper end surface of the scraper 4, the hydrophobic groove 44 is positioned between the water collecting groove 41 and the scraping strips 43, the wider end of the scraping strip 43 is close to the hydrophobic groove 44, the hydrophobic groove 44 penetrates through the scraper 4 in the length direction, in the ascending process of the scraper 4, the scraping strips 43 can scrape the water on the surfaces of the silicon wafers 2, further, the convenience for drying after the silicon wafers 2 are cleaned is improved, the drying time is shortened, the cleaning efficiency of the silicon wafers 2 is improved, and meanwhile, the, the water is discharged from two sides, through the design of the water drainage groove 44, the situation that the scraped water flows back into the water collection groove 41 to increase the weight of the scraper 4 to influence the ascending of the scraper 4 is avoided, and meanwhile, in order to avoid the scraped water from being retained in the water drainage groove 44, the water drainage groove 44 is designed to be of a structure with a high middle part and two low sides, so that the water in the water drainage groove 44 can be discharged from two sides;
in order to lift the scraper 4, two ends of the upper surface of the scraper 4 can be respectively provided with a restoring spring 45, when the water collecting tank 41 on the scraper 4 is filled with water and becomes heavy and slides downwards, the restoring spring 45 is stretched, and when the cleaning liquid in the water collecting tank 41 is emptied, the restoring spring 45 rebounds and drives the scraper 4 to lift;
in order to drain the cleaning liquid in the water collecting tank 41, an overflow hole 46 vertically penetrating the scraping plate 4 is formed at the bottom of the water collecting tank 41, the overflow hole 46 is obliquely arranged, the inclination directions of two adjacent overflow holes 46 are opposite, namely, the adjacent two overflow holes 46 are arranged in a staggered way, when the scraper 4 descends, the cleaning liquid in the water collecting tank 41 can pass through each overflow hole 46 to wash the silicon wafers 2 on the two sides, the silicon wafer 2 is washed in a close range to improve the cleaning effect of the silicon wafer 2, the water accumulation speed of the water collection tank 41 should be higher than the water flowing speed of the overflow holes 46, after the spray head 34 stops spraying water, the cleaning liquid in the water collecting tank 41 is slowly discharged from the overflow hole 46, when the whole weight of the scraper 4 is smaller than the elastic force of the recovery spring 45, the recovery spring 45 can rebound to drive the scraper 4 to ascend, and the design of the drainage groove 44 can avoid the situation that cleaning liquid flows back into the water collection groove 41 and wets the silicon wafer 2 through the overflow hole 46 for the second time in the ascending process of the scraper 4;
referring to fig. 8 and 9, fig. 8 is a schematic structural view of a preferred embodiment of the open state of the mounting plate according to the present invention; FIG. 9 is a schematic structural view of a preferred embodiment of the mounting plate of the present invention in a covering state; as shown in fig. 1 to 9, in order to install each scraper 4, a mounting plate 5 can be rotatably connected between two end plates 11, meanwhile, a water falling hole 51 is formed on the mounting plate 5, the water falling holes 51 are distributed at equal intervals, the positions of the water falling holes 51 correspond to the silicon wafers 2 one by one, two restoring springs 45 on one scraper 4 are fixed at two ends of the water falling hole 51, when the mounting plate 5 rotates to be horizontal, each scraper 4 can also be horizontal to slide downwards, a first limiting block 113 is arranged at the same height of the rotating position of the mounting plate 5 on the end plate 11, when the mounting plate 5 rotates to abut against the first limiting block 113, the mounting plate 5 is horizontal to provide a rising and falling point of the scraper 4, through the arrangement of the rotatable mounting plate 5, when the silicon wafers 2 need to be cleaned, the mounting plate 5 is covered above the silicon wafers 2 to facilitate the cleaning of the silicon wafers 2, when the silicon wafers 2 need to be loaded and unloaded, the mounting plate 5 can be rotated and opened, so that convenience is brought to the mounting and dismounting of the silicon wafers 2.
Preferably, the mounting plate 5 is mounted when the silicon wafer 2 needs to be cleaned, and the mounting plate 5 is removed when the silicon wafer 2 needs to be disassembled and assembled, so that the cleaning and the assembling and the disassembling of the silicon wafer 2 can be facilitated better, the scheme can be adopted, wherein the end plate 11 is provided with a rotating shaft 114 which is as high as the first limiting block 113, the rotating shaft 114 is positioned above the supporting rod 13 at the top, the rotating shaft 114 is matched with a linkage piece 6, the thickness of the linkage piece 6 is smaller than the distance between the silicon wafer 2 at the outermost side and the end plate 11, and therefore the linkage piece 6 cannot be interfered by the silicon wafer 2 in the rotating process; linkage piece 6 is "C" shape, linkage piece 6 has an opening so that be inserted by pivot 114, and simultaneously, linkage piece 6 can revolve pivot 114 and rotate, install this linkage piece 6 in the both sides of mounting panel 5, when needs installation mounting panel 5, as long as insert pivot 114 with linkage piece 6 just, when need not use mounting panel 5, can extract linkage piece 6 from pivot 114 and just can pull down mounting panel 5, and time saving and labor saving facilitates for the washing and the dismouting of silicon chip 2.
It should be noted that although the cleaning and dismounting of the silicon wafer 2 can be facilitated, the switching of the covering or opening state of the mounting plate 5 to the silicon wafer 2 still depends on manual operation, while the cleaning of the silicon wafer 2 generally uses a strong corrosive solution, and the threat to the life of workers is undoubtedly increased by excessive manual intervention, in order to solve the above problems, the following scheme can be adopted to realize the automatic switching state of the mounting plate 5:
a second stop block 115 is fixed at the upper right of the rotating shaft 114, the second stop block 115 is located at the upper right of the rotating shaft 114, so that the rotating shaft 114 is located between the first stop block 113 and the second stop block 115, the second limiting block 115 provides the mounting plate 5 with a leaning function in an opened state, the linkage sheet 6 comprises a fan-shaped plug sheet 61 and baffle plates 62 fixed at two ends of the plug sheet 61, the mounting plate 5 is fixedly connected with the insertion sheet 61, the arc center angle of the insertion sheet 61 is larger than 180 degrees, the plug-in sheet 61 is matched with the rotating shaft 114, the design that the arc center angle is more than 180 degrees ensures that the rotating shaft 114 is inserted into the plug-in sheet 61, so as to realize the rotation between the rotating shaft 114 and the inserting piece 61 without falling off, the arc center angle is preferably 300 degrees, therefore, the opening range of the plug sheet 61 is small when the plug sheet 61 is sleeved in the rotating shaft 114, and the situation that the plug sheet 61 is broken due to overlarge opening range of the plug sheet 61 when the plug sheet 61 is plugged for multiple times is avoided; the two baffles 62 extend to two sides of the supporting rod 13 at the top; after the end plate 11 is placed in the cleaning tank 3, the insertion sheet 61 is inserted into the rotating shaft 114 to complete the installation of the mounting plate 5, the mounting plate 5 abuts against the second limiting block 115, the pushing motor 33 pushes the end plate 11 to enable the supporting rod 13 at the top to be pushed by the pushing block 31, the supporting rod 13 slides along the sliding groove 111 and pushes the baffle plate 62 at the right side to enable the insertion sheet 61 to rotate around the rotating shaft 114, so that the mounting plate 5 rotates to be supported on the first limiting block 113 from the second limiting block 115 to achieve the installation of the end plate 11, and meanwhile, the mounting plate 5 covers the silicon wafer 2; after silicon chip 2 washs the completion, push motor 33 loosens end plate 11, make bracing piece 13 slide to the eminence along sliding tray 111 under the rebound effect of strutting spring 14, bracing piece 13 promotes left baffle 62 simultaneously and makes plug-in strip 61 revolve axle 114 and rotate, thereby mounting panel 5 rotates to leaning on second stopper 115 from first stopper 113, mounting panel 5 opens when taking out end plate 11 in order to realize, and then mounting panel 5 automatic lid closes the automation and opens, reduce artificial participation, provide the guarantee for workman's life safety.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (9)
1. A method for cleaning a silicon wafer is characterized by comprising the following steps:
sequentially inserting the silicon wafer between two adjacent clamping teeth on the toothed bar so as to support the silicon wafer on each supporting bar;
placing the flower basket main body with the silicon wafer installed at the bottom of a cleaning pool;
the pushing end plate slides to the pushing block along the sliding rail until the three supporting rods are respectively contacted with the pushing surface, and then the spraying is opened;
continuously pushing the end plate to enable the push block to push the supporting rod to slide from a high position to a low position along the sliding groove, and compressing the expanding spring to enable the silicon wafer to fall towards the supporting rod and expose a region where the silicon wafer is clamped by the clamping teeth;
and releasing the end plate, opening the spring to rebound, and pushing the silicon wafers to be inserted back between the clamping teeth by the support rod.
2. The method for cleaning a silicon wafer according to claim 1,
after the flower basket main body is placed at the bottom of the cleaning tank, the end plate is pushed by a pushing motor;
after the silicon wafer is cleaned, the end plate is loosened by the pushing motor.
3. The method for cleaning a silicon wafer according to claim 2,
after the three support rods are respectively contacted with the pushing surface, cleaning liquid is sprayed out through the spray head to spray the silicon wafer.
4. The method for cleaning a silicon wafer according to claim 3,
after the flower basket main body is arranged at the bottom of the cleaning pool, a mounting plate is arranged between two end plates;
after the spray head is opened, the mounting plate is rotated to cover the silicon chip;
cleaning fluid sprayed by the spray head is collected in the water collecting tank and presses the scraper blades to respectively scrape stains on the surfaces of the silicon wafers on the two sides.
5. The method for cleaning a silicon wafer according to claim 4,
after enough cleaning fluid is collected in the water collecting tank, the scraper plate descends, and the brush head is attached to the surface of the silicon wafer and brushes away stains on the surface of the silicon wafer;
after the cleaning liquid in the water collecting tank is emptied, the scraper blade rises, and is attached to the surface of the silicon wafer through the scraper bar and scrapes water stains on the surface of the silicon wafer.
6. The method for cleaning a silicon wafer according to claim 5,
and after the spray head is closed, emptying the cleaning liquid in the water collecting tank through the overflow hole.
7. The method for cleaning a silicon wafer according to claim 6,
after the scraping strip scrapes water stains on the surface of the silicon wafer, cleaning fluid is guided into the drainage groove through the scraping strip;
and then the cleaning liquid is discharged from the two sides of the scraper through the drainage groove.
8. The method for cleaning a silicon wafer according to claim 7,
after the flower basket main body is placed at the bottom of the cleaning tank, the rotating shaft is inserted through the linkage piece, so that the mounting plate rotates;
after the mounting plate is opened, the mounting plate is supported by a second limiting block;
after the mounting plate covers the silicon chip, the mounting plate is supported by the first limiting block.
9. The method for cleaning a silicon wafer according to claim 8,
when the supporting rod slides from a high position to a low position along the sliding groove, the supporting rod pushes the baffle on the right side so that the mounting plate covers the silicon chip;
when the support rod slides from a low position to a high position along the sliding groove, the support rod pushes the baffle on the left side to open the mounting plate.
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Effective date of registration: 20210521 Address after: 225300 No.151 Sanshui street, development zone, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 213000 8th Floor, Block B, Tianrun Science and Technology Building, 801 Changwuzhong Road, Changzhou City, Jiangsu Province Patentee before: CHANGZHOU JIANGSU UNIVERSITY ENGINEERING TECHNOLOGY Research Institute Patentee before: Jiangsu Yadian Technology Co.,Ltd. |
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Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225300 No.151 Sanshui street, development zone, Jiangyan District, Taizhou City, Jiangsu Province Patentee before: Jiangsu Yadian Technology Co.,Ltd. |