CN112382581A - Semiconductor three-temperature test production line - Google Patents
Semiconductor three-temperature test production line Download PDFInfo
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- CN112382581A CN112382581A CN202011073980.XA CN202011073980A CN112382581A CN 112382581 A CN112382581 A CN 112382581A CN 202011073980 A CN202011073980 A CN 202011073980A CN 112382581 A CN112382581 A CN 112382581A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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Abstract
The invention relates to the technical field of semiconductor chip testing, in particular to a semiconductor three-temperature testing production line which comprises a low-temperature testing line, a high-temperature testing line and a control cabinet, wherein the low-temperature testing line and the high-temperature testing line are arranged side by side, the low-temperature testing line comprises a first base, a feeding table, a low-temperature testing box and a low-temperature transfer table are fixedly arranged on the upper end surface of the first base in sequence from front to back, a first feeding rail penetrating through the low-temperature testing box is embedded in the middle of the upper surface of the feeding table, and the tail end of the first feeding rail extends to the upper surface of the low-temperature transfer table; the high-temperature test line comprises a second base, and a blanking table, a high-temperature test box and a high-temperature transfer table are fixedly arranged on the upper end face of the second base in sequence from front to back; according to the invention, the nitrogen gas flow curtain wall can be formed at the feed inlet and the discharge outlet of the low-temperature test chamber and the high-temperature test chamber, and the sealing property and the heat insulation box of the nitrogen gas flow curtain wall are very excellent, so that the heat in the low-temperature test chamber and the high-temperature test chamber is not easy to dissipate, and the test accuracy is also ensured.
Description
Technical Field
The invention relates to the technical field of semiconductor chip testing, in particular to a semiconductor three-temperature testing production line.
Background
An integrated circuit is a microelectronic device or component. The transistor, resistor, capacitor and inductor elements and wiring required in a circuit are interconnected together by a certain process, and are manufactured on a small semiconductor wafer or a plurality of small semiconductor wafers or medium substrates, and then are packaged in a package to form the micro-structure with the required circuit function.
The integrated circuit industry includes chip design, chip manufacturing, and chip package testing. After a wafer is subjected to complex processes of exposure, etching, ion implantation, deposition, growth and the like, a chip is formed and packaged, and various extremely strict tests such as an electrical parameter test, a function test and the like on an automatic test system (ATE) are required until the chip is qualified, and the chip can not be delivered to a customer.
In view of the above problems, it is necessary to develop a semiconductor three-temperature automatic test production line, for example, the invention of patent application No. 201910171870.8 discloses a semiconductor three-temperature automatic test production line, which includes a high-temperature test line, a low-temperature test line, and a SCARA robot arranged between the high-temperature test line and the low-temperature test line, the high-temperature test line has a control cabinet at its end, the high-temperature test line includes a base and a high-temperature test box, the front and rear ends of the upper surface of the base are respectively and movably provided with a feeding table and a high-temperature transfer table, and the high-temperature test box is arranged in the middle of the base; the tail end of the low-temperature test line is provided with a test machine computer, and the low-temperature test box is arranged in the middle of the base; a SCARA robot; according to the invention, the high-temperature test box and the low-temperature test box are sealed by the sealing plate and the insulation plate, so that the shapes of the sealing plate and the insulation plate are required to be completely matched with the shapes of the feeding track and the limiting plate, no gap is ensured, and the sealing performance and the insulation performance are difficult to guarantee and the test accuracy is not ideal in the conventional process.
Disclosure of Invention
The invention designs a semiconductor three-temperature test production line aiming at the problems provided by the background technology.
The invention is realized by the following technical scheme:
a semiconductor three-temperature test production line comprises a low-temperature test line, a high-temperature test line, a transfer manipulator and a control cabinet, wherein the low-temperature test line and the high-temperature test line are arranged side by side, the low-temperature test line comprises a first base, a feeding table, a low-temperature test box and a low-temperature transfer table are fixedly installed on the upper end surface of the first base in sequence from front to back, a first feeding rail penetrating through the low-temperature test box is embedded in the middle of the upper surface of the feeding table, and the tail end of the first feeding rail extends to the upper surface of the low-temperature transfer table; the high-temperature test line comprises a second base, a blanking table, a high-temperature test box and a high-temperature transfer table are fixedly mounted on the upper end surface of the second base in sequence from front to back, a second feeding rail penetrating through the high-temperature test box is embedded in the middle of the upper surface of the high-temperature transfer table, and the tail end of the second feeding rail extends to the upper surface of the blanking table;
a plurality of limiting plates are fixedly arranged on the upper end surfaces of the first feeding rail and the second feeding rail at equal intervals, a plurality of feeding cylinders are fixedly arranged on the lower surfaces of the first feeding rail and the second feeding rail, and pushing plates are fixed at the telescopic ends of the feeding cylinders; a feed port and a discharge port are respectively arranged at two ends of the low-temperature test box and the high-temperature test box, a guide rail and an electric cylinder are fixed on the outer walls of the feed port and the discharge port, a slide seat is slidably mounted in the guide rail, the top end of the slide seat is fixed with a telescopic rod of the electric cylinder, a support rod is fixed at the bottom end of the slide seat, a horizontal frame is fixed at the bottom end of the support rod, the horizontal frame extends into the feed port or the discharge port, an air guide box is fixed at the bottom end of the horizontal frame, and an air curtain machine is mounted at the top end of the air guide;
a first transfer platform is arranged between the feeding platform and the discharging platform, a second transfer platform is arranged between the low-temperature transfer platform and the high-temperature transfer platform, and the transfer mechanical arms are mounted on the upper end surfaces of the first transfer platform and the second transfer platform; a testing machine is arranged between the low-temperature test box and the high-temperature test box, and the testing machine, the low-temperature test line, the high-temperature test line and the transferring manipulator are electrically connected with the control cabinet.
As a further improvement of the scheme, the air curtain machine is connected with an air outlet connector of an external nitrogen tank through a heat insulation guide pipe, and an air outlet adjusting switch and an output gas pressure gauge are arranged on the air outlet connector.
As a further improvement of the above scheme, the bottom of horizontal stand still is fixed with the buffering subassembly, the bottom mounting of buffering subassembly has the fork of pressing, press the fork to form by a mobile jib and a plurality of branch welding, branch perpendicular welding respectively on the preceding, the back outer wall of mobile jib, just parallel arrangement between the branch.
As a further improvement of the above scheme, the buffer assembly includes a cylinder, a round bar and a buffer spring, the top end of the round bar is sleeved on the inner wall of the cylinder, a slider is fixed on the top end of the round bar, the buffer spring is fixed between the upper end surface of the slider and the top surface of the inner wall of the cylinder, and a limit ring is fixed on the lower port of the cylinder.
As a further improvement of the scheme, the bottom end surfaces of the main rod and the plurality of the supporting rods are respectively fixed with a silica gel pad.
As a further improvement of the scheme, the upper surfaces of the feeding platform and the discharging platform are provided with groove bodies used for mounting the feeding air cylinders, and the material pushing plates are arranged at the inlets of the groove bodies.
As a further improvement of the above scheme, four positioning blocks are fixed on the upper surfaces of the feeding table and the discharging table, the four positioning blocks are distributed in a rectangular shape, and the four positioning blocks are respectively arranged at the peripheral positions of the inlets of the groove bodies.
Compared with the prior art, the invention has the beneficial effects that:
1. in the invention, a guide rail and an electric cylinder are fixed on the outer walls of a feed port and a discharge port, a slide seat is slidably arranged in the guide rail, the electric cylinder can drive the slide seat to move up and down along the inner part of the guide rail, a support rod is fixed at the bottom end of the slide seat, an air guide box is fixed at the bottom end of the support rod through a horizontal frame, an air curtain machine is arranged at the top end of the air guide box, the air curtain machine is arranged with an external nitrogen tank through a heat insulation guide pipe, therefore, when the low-temperature test chamber and the high-temperature test chamber are tested, the air outlet adjusting switch on the nitrogen tank can be opened, the nitrogen flows out at a certain flow speed, the air curtain machine is started, the air curtain machine can form a gas curtain wall by the nitrogen flow through the air guide box to seal the feed inlet and the discharge outlet, the sealing performance of the nitrogen flow gas curtain wall and the heat insulation box are very good, therefore, the heat in the low-temperature test chamber and the high-temperature test chamber is not easy to dissipate, and the test accuracy is also ensured.
2. According to the invention, the bottom end of the horizontal frame is also fixedly provided with the buffer component, the bottom end of the buffer component is fixedly provided with the pressing fork, when the air guide box moves downwards and works to form the nitrogen gas flow air curtain wall, the silica gel pad in the pressing fork just reaches the upper surface of the semiconductor chip, and the position movement of the semiconductor chip caused by the nitrogen gas flow blowing can be avoided due to the arrangement of the pressing fork; further, the buffering assembly comprises a cylinder, a round rod and a buffering spring, the buffering effect can be achieved on the pressure of the round rod through the arrangement of the buffering spring, and then the buffering effect can be achieved on the reverse pressure of the pressing fork, so that the semiconductor chip can be protected, and the semiconductor chip can be prevented from being damaged by the pressing fork.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a perspective view of a first perspective of the present invention;
FIG. 2 is a perspective view of a second embodiment of the present invention;
FIG. 3 is a schematic view of a partial structure of a low temperature test line according to the present invention;
FIG. 4 is a schematic view of the installation of the first feeding rail, the limiting plate, the feeding cylinder and the material pushing plate according to the present invention;
FIG. 5 is a schematic structural diagram of a mounting assembly at a feed port of a low-temperature test chamber in the invention;
FIG. 6 is a schematic view showing the connection between the air curtain machine and the external nitrogen tank according to the present invention;
FIG. 7 is a schematic structural diagram of a mounting assembly at a feed port of a low temperature test chamber in example 2 of the present invention;
FIG. 8 is a schematic structural diagram of a pressing fork according to embodiment 2 of the present invention;
fig. 9 is a schematic view of a temporal structure of a cushion assembly according to embodiment 3 of the present invention.
Wherein, 1-a low-temperature test line, 101-a first base, 102-a loading table, 103-a low-temperature test box, 104-a low-temperature transfer table, 105-a first feeding track, 2-a high-temperature test line, 201-a second base, 202-a discharging table, 203-a high-temperature test box, 204-a high-temperature transfer table, 205-a second feeding track, 3-a transfer manipulator, 4-a control cabinet, 5-a limiting plate, 6-a feeding cylinder, 7-a buffering component, 701-a cylinder, 702-a round rod, 703-a buffering spring, 704-a sliding block, 705-a limiting ring, 706-a silica gel pad, 8-a pressing fork, 801-a main rod, 802-a support rod, 9-a feeding port, 10-a discharging port, 11-a guide rail and 12-an electric cylinder, 13-a sliding seat, 14-a supporting rod, 15-a horizontal frame, 16-an air guide box, 17-an air curtain machine, 18-a first transfer platform, 19-a second transfer platform, 20-a testing machine, 21-a nitrogen tank, 22-an air outlet connector, 23-an air outlet adjusting switch, 24-an output gas pressure meter, 25-a material pushing plate, 26-a groove body and 27-a positioning block.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
The invention is further described below with reference to the accompanying drawings.
Example 1
A semiconductor three-temperature test production line is shown in figures 1 and 2 and comprises a low-temperature test line 1, a high-temperature test line 2, a transfer manipulator 3 and a control cabinet 4, wherein the low-temperature test line 1 and the high-temperature test line 2 are arranged side by side, the low-temperature test line 1 comprises a first base 101, a feeding table 102, a low-temperature test box 103 and a low-temperature transfer table 104 are fixedly installed on the upper end surface of the first base 101 in sequence from front to back, a first feeding rail 105 penetrating through the low-temperature test box 103 is embedded in the middle of the upper surface of the feeding table 102, and the tail end of the first feeding rail 105 extends to the upper surface of the low-temperature transfer table 104; the high-temperature test line 2 comprises a second base 201, a blanking table 202, a high-temperature test box 203 and a high-temperature transfer table 204 are fixedly installed on the upper end surface of the second base 201 from front to back in sequence, a second feeding rail 205 penetrating through the high-temperature test box 203 is embedded in the middle of the upper surface of the high-temperature transfer table 204, and the tail end of the second feeding rail 205 extends to the upper surface of the blanking table 202;
as shown in fig. 3-6, the upper end surfaces of the first feeding rail 105 and the second feeding rail 205 are fixedly provided with 3 limiting plates 5 at equal intervals, the lower surfaces of the first feeding rail 105 and the second feeding rail 205 are fixedly provided with 3 feeding cylinders 6, and the telescopic ends of the feeding cylinders 6 are respectively fixed with a material pushing plate 25; a feed inlet 9 and a discharge outlet 10 are respectively arranged at two ends of the low-temperature test box 103 and the high-temperature test box 203, a guide rail 11 and an electric cylinder 12 are fixed on outer walls of the feed inlet 9 and the discharge outlet 10, a slide seat 13 is slidably mounted inside the guide rail 11, the top end of the slide seat 13 is fixed with a telescopic rod of the electric cylinder 12, a support rod 14 is fixed at the bottom end of the slide seat 13, a horizontal frame 15 is fixed at the bottom end of the support rod 14, the horizontal frame 15 extends into the feed inlet 9 or the discharge outlet 10, an air guide box 16 is fixed at the bottom end of the horizontal frame 15, and an air curtain machine; the air curtain machine 17 is connected with an air outlet connector 22 of an external nitrogen tank 21 through a heat insulation conduit, and an air outlet adjusting switch 23 and an output gas pressure gauge 24 are arranged on the air outlet connector 22.
As shown in fig. 1-3, the upper surfaces of the feeding table 102 and the discharging table 202 are both provided with a groove body 26 for mounting the feeding cylinder 6, and the material pushing plate 25 is arranged at an inlet of the groove body 26; four positioning blocks 27 are fixed on the upper surfaces of the feeding platform 102 and the blanking platform 202, the four positioning blocks 27 are distributed in a rectangular shape, and the four positioning blocks 27 are respectively arranged at the peripheral positions of the inlets of the tank body 26; a first transfer platform 18 is arranged between the feeding platform 102 and the discharging platform 202, a second transfer platform 19 is arranged between the low-temperature transfer platform 104 and the high-temperature transfer platform 204, and transfer manipulators 3 are arranged on the upper end surfaces of the first transfer platform 18 and the second transfer platform 19; a testing machine 20 is arranged between the low-temperature test box 103 and the high-temperature test box 203, and the testing machine 20, the low-temperature test line 1, the high-temperature test line 2 and the transferring manipulator 3 are electrically connected with the control cabinet 4; wherein, the transferring manipulator 3 is four-axis linkage (X, Y, Z axis straight line, Z axis rotation), one side of the Z axis bottom is provided with an SMT suction nozzle, a suction chip and a carriage, and the other side is provided with a vision sensor, so as to judge whether a chip is arranged on the feeding track and position. The normal temperature, the high temperature and the low temperature share one tester 20, and the beat of the whole production line is the sum of the three testing and conveying time.
When the device works, a material tray is manually placed among the four positioning blocks 27 for positioning, a clamp of the transfer manipulator 3 sucks a chip carriage to be placed in a guide groove between two adjacent limiting plates 5, and the semiconductor chips are pushed into a hot box through the feeding cylinders 6 one by one, wherein a high-temperature test box 203 is set to be +125 ℃, and a low-temperature test box 103 is set to be-55 ℃; thirty minutes later than the chip is filled in each incubator, the chip is pushed out by the feeding cylinder 6 to be tested, the whole process is controlled by the control cabinet 4 in the whole process, and the specific steps are as follows:
(1) the chip is placed on the supporting plate and then on the tray, and the end of the manual whole tray is placed on the four positioning blocks 27 for positioning;
(2) the transferring manipulator 3 judges the specification and the position of a chip by a vision sensor, performs a normal temperature test after absorption, returns to the supporting plate after the test is finished, and then is put into the guide groove together with the supporting plate and is sequentially pushed into the low temperature test box 103 by the feeding cylinder 6;
(3) when the chip is tested in the low-temperature test box 103, the electric cylinder 12 can be started to extend downwards, so that the air guide box 16 is driven to move downwards, the air curtain machine 17 is started, and the air curtain machine 17 can form a gas curtain wall by nitrogen flow through the air guide box 16 and seal the gas curtain wall at the feed port 9 and the discharge port 10; thirty minutes after the low-temperature test box 103 is filled, pushing out chips which are unqualified in the test by the feeding air cylinder 6, putting the chips into an unqualified material box, and continuously executing the next operation;
(4) when the high-temperature detection is performed, the chip is sucked from the guide groove to be tested, the chip is returned to the supporting plate after being qualified, the chip is placed on the tray together with the supporting plate, and the tray is manually emptied after the tray is fully collected; and placing the unqualified chip into an unqualified material box, and grabbing the supporting plate of the chip into the corresponding tray together.
Compared with the prior art, this embodiment is when low temperature test box 103 is experimental with high temperature test box 203, can start electric cylinder 12 and extend downwards, open the regulating switch 23 of giving vent to anger on nitrogen gas jar 21 and control nitrogen gas and flow out with certain velocity of flow after that, restart air curtain machine 17, air curtain machine 17 can form a stifled air curtain wall with nitrogen gas stream through air box 16 and seal at feed inlet 9 and discharge gate 10, nitrogen gas stream air curtain wall leakproofness and insulation can are all very good, thereby low temperature test box 103 is difficult for losing with the inside heat of high temperature test box 203, the accuracy nature of experiment has also been guaranteed.
Example 2
In the embodiment, when the wind guide box 16 moves downwards and works to form a nitrogen gas flow curtain wall, the silicone pad 803 in the pressing fork 8 just reaches the upper surface of the semiconductor chip, and the arrangement of the pressing fork 8 can prevent the semiconductor chip from moving due to the blowing of nitrogen gas flow; in addition, when the chip is transferred, the electric cylinder 12 is contracted upward, and then the pressing fork 8 is separated from the upper surface of the semiconductor chip, so that the transfer of the chip is not affected.
Example 3
Embodiment 3 is based on embodiment 2, as shown in fig. 7 and 9, the buffer assembly 7 includes a cylinder 701, a round bar 702, and a buffer spring 703, the top end of the round bar 702 is sleeved on the inner wall of the cylinder 701, a slider 704 is fixed on the top end of the round bar 702, the buffer spring 703 is fixed between the upper end surface of the slider 704 and the top surface of the inner wall of the cylinder 701, and a limit ring 705 is fixed on the lower port of the cylinder 701.
When the wind guide box 16 moves downwards and works to form a nitrogen gas flow curtain wall, the buffer spring 703 can buffer the pressure of the round rod 702, and further can buffer the reverse pressure of the pressing fork 8, so that the semiconductor chip can be protected, and the semiconductor chip can be prevented from being damaged by the pressing fork 8.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. The utility model provides a three temperature test production lines of semiconductor, includes low temperature test line (1), high temperature test line (2), transports manipulator (3) and switch board (4), its characterized in that: the low-temperature test line (1) and the high-temperature test line (2) are arranged side by side, the low-temperature test line (1) comprises a first base (101), a feeding table (102), a low-temperature test box (103) and a low-temperature transfer table (104) are sequentially and fixedly mounted on the upper end face of the first base (101) from front to back, a first feeding track (105) penetrating through the low-temperature test box (103) is embedded in the middle of the upper surface of the feeding table (102), and the tail end of the first feeding track (105) extends to the upper surface of the low-temperature transfer table (104); the high-temperature test line (2) comprises a second base (201), a blanking table (202), a high-temperature test box (203) and a high-temperature adapter table (204) are sequentially and fixedly installed on the upper end surface of the second base (201) from front to back, a second feeding rail (205) penetrating through the high-temperature test box (203) is embedded in the middle of the upper surface of the high-temperature adapter table (204), and the tail end of the second feeding rail (205) extends to the upper surface of the blanking table (202);
a plurality of limiting plates (5) are fixedly mounted on the upper end surfaces of the first feeding rail (105) and the second feeding rail (205) at equal intervals, a plurality of feeding cylinders (6) are fixedly mounted on the lower surfaces of the first feeding rail (105) and the second feeding rail (205), and material pushing plates (25) are fixed at the telescopic ends of the feeding cylinders (6); a feed inlet (9) and a discharge outlet (10) are respectively arranged at two ends of the low-temperature test box (103) and the high-temperature test box (203), a guide rail (11) and an electric cylinder (12) are fixed on the outer walls of the feed inlet (9) and the discharge outlet (10), a slide seat (13) is slidably mounted in the guide rail (11), the top end of the slide seat (13) is fixed with an expansion link of the electric cylinder (12), a support rod (14) is fixed at the bottom end of the slide seat (13), a horizontal frame (15) is fixed at the bottom end of the support rod (14), the horizontal frame (15) extends into the feed inlet (9) or the discharge outlet (10) and is fixed with an air guide box (16) at the bottom end thereof, and an air curtain machine (17) is mounted at the top end of the air guide box (16);
a first transfer platform (18) is arranged between the feeding platform (102) and the discharging platform (202), a second transfer platform (19) is arranged between the low-temperature transfer platform (104) and the high-temperature transfer platform (204), and the transfer mechanical arm (3) is arranged on the upper end surfaces of the first transfer platform (18) and the second transfer platform (19); a testing machine (20) is arranged between the low-temperature test box (103) and the high-temperature test box (203), and the testing machine (20), the low-temperature test line (1), the high-temperature test line (2) and the transfer manipulator (3) are electrically connected with the control cabinet (4).
2. The semiconductor three-temperature test production line according to claim 1, characterized in that: the air curtain machine (17) is connected with an air outlet connector (22) of an external nitrogen tank (21) through a heat insulation guide pipe, and an air outlet adjusting switch (23) and an output gas pressure gauge (24) are arranged on the air outlet connector (22).
3. The semiconductor three-temperature test production line according to claim 1, characterized in that: the bottom of horizontal stand (15) still is fixed with buffering subassembly (7), the bottom mounting of buffering subassembly (7) presses fork (8), press fork (8) to form by a mobile jib (801) and a plurality of branch (802) welding, branch (802) weld perpendicularly respectively on the preceding, the back outer wall of mobile jib (801), just parallel arrangement between branch (802).
4. A semiconductor three-temperature test production line according to claim 3, characterized in that: the buffer assembly (7) comprises a cylinder (701), a round rod (702) and a buffer spring (703), the top end of the round rod (702) is sleeved on the inner wall of the cylinder (701), a sliding block (704) is fixed to the top end of the round rod (702), the buffer spring (703) is fixed between the upper end face of the sliding block (704) and the top face of the inner wall of the cylinder (701), and a limit ring (705) is fixed to the lower port of the cylinder (701).
5. A semiconductor three-temperature test production line according to claim 3, characterized in that: the bottom end surfaces of the main rod (801) and the plurality of the supporting rods (802) are respectively fixed with a silica gel pad (803).
6. The semiconductor three-temperature test production line according to claim 1, characterized in that: the feeding table (102) and the blanking table (202) are provided with groove bodies (26) used for mounting the feeding cylinder (6), and the material pushing plate (25) is arranged at an inlet of each groove body (26).
7. The semiconductor three-temperature test production line according to claim 1, characterized in that: the upper surfaces of the feeding table (102) and the discharging table (202) are respectively fixed with four positioning blocks (27), the four positioning blocks (27) are distributed in a rectangular shape, and the four positioning blocks (27) are respectively arranged at the peripheral positions of the inlets of the groove bodies (26).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011073980.XA CN112382581A (en) | 2020-10-10 | 2020-10-10 | Semiconductor three-temperature test production line |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011073980.XA CN112382581A (en) | 2020-10-10 | 2020-10-10 | Semiconductor three-temperature test production line |
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| CN112382581A true CN112382581A (en) | 2021-02-19 |
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| CN202011073980.XA Withdrawn CN112382581A (en) | 2020-10-10 | 2020-10-10 | Semiconductor three-temperature test production line |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114743896A (en) * | 2022-03-17 | 2022-07-12 | 无锡杰进科技有限公司 | Automatic chip testing equipment and use method thereof |
-
2020
- 2020-10-10 CN CN202011073980.XA patent/CN112382581A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114743896A (en) * | 2022-03-17 | 2022-07-12 | 无锡杰进科技有限公司 | Automatic chip testing equipment and use method thereof |
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Application publication date: 20210219 |