CN112373016B

CN112373016B - Three-dimensional laminated modeling method, three-dimensional laminated modeling device, electronic device, and storage medium

Info

Publication number: CN112373016B
Application number: CN202011146126.1A
Authority: CN
Inventors: 俞红祥; 庞伟; 咸刘永
Original assignee: Hangzhou Dedi Intelligent Technology Co ltd
Current assignee: Hangzhou Dedi Intelligent Technology Co ltd
Priority date: 2020-10-23
Filing date: 2020-10-23
Publication date: 2023-02-17
Anticipated expiration: 2040-10-23
Also published as: CN112373016A

Abstract

The application relates to a three-dimensional laminating modeling method, a three-dimensional laminating modeling device, an electronic device and a storage medium, wherein the three-dimensional laminating modeling device comprises a rigid frame, an imaging platform, a laser scanning unit, a two-degree-of-freedom bearing platform and a controller, the imaging platform is arranged in the rigid frame, the two-degree-of-freedom bearing platform is arranged at the top of the rigid frame, and the laser scanning unit is arranged on the two-degree-of-freedom bearing platform; the laser scanning unit comprises a galvanometer scanner; the controller is respectively electrically connected with the galvanometer scanner and the two-degree-of-freedom bearing platform; acquiring a scanning path through a controller; the controller decomposes the scanning path into a first scanning motion of the two-degree-of-freedom bearing platform and a second scanning motion of the galvanometer scanner; the controller controls the output power of the laser scanning unit, controls the motion of the two-degree-of-freedom bearing platform according to the first scanning motion and controls the motion of the galvanometer scanner according to the second scanning motion, so that the problems of complex laser scanning path planning and poor scanning continuity are solved, and the laser scanning technology is optimized.

Description

Three-dimensional laminated molding method, three-dimensional laminated molding device, electronic device, and storage medium

Technical Field

The present application relates to the field of optical electromechanical scanning technologies, and in particular, to a three-dimensional stack modeling method, an apparatus, an electronic apparatus, and a storage medium.

Background

The laser scanning device is a measuring device which utilizes a laser ranging and angle automatic recording device to truly reproduce the color and three-dimensional landscape of a measured object, has an important position in modern manufacturing industry, and is widely applied to various high-performance numerical control processing equipment, such as traditional processing machines of laser cutting machines, laser welding machines and the like, and emerging material-adding manufacturing equipment of laser selective area melting (SLM), laser selective area sintering (SLS), laser selective area photocuring (SLA), laser direct cladding forming (LDM) and the like. With the increasing demand of the manufacturing industry for high-performance laser processing equipment, how to effectively increase the scanning breadth and the processing range has become one of the common problems in the field of laser processing. The low-speed laser scanning device in the related art can simply expand the effective stroke of the linear servo device to obtain a larger scanning range, but the difficulty of expanding the scanning range of the medium-high speed galvanometer scanning device is higher because the effective deflection angle of the voice coil motor cannot be greatly improved. Two existing solutions include: the focal length of the laser beam is increased, a light path design scheme with larger projection distance is adopted, and a plurality of galvanometer scanning devices are used for multi-region concurrent and spliced scanning. The former sacrifices the scanning resolution while obtaining a larger scanning range, and the latter can obtain a larger scanning breadth without losing the scanning resolution, but the parameters of the plurality of galvanometers, optical elements and lasers matched with the galvanometers are difficult to adjust consistently, such as time delay characteristics, transmissivity, refractive index, reflectivity, light attenuation and the like, so that the process consistency of individual scanning areas of different galvanometers is influenced, and the laser processing quality is adversely affected. In addition, the requirement for edge splicing of the multi-galvanometer scanning area also leads to a complex path planning algorithm, and the situation that the scanning cannot be performed according to a continuous path optimally matched with the contour of the part is caused.

At present, no effective solution is provided for the problems of complex laser scanning path planning and poor scanning consistency in the related technology.

Disclosure of Invention

The embodiment of the application provides a three-dimensional laminated modeling method, a three-dimensional laminated modeling device, an electronic device and a storage medium, and aims to at least solve the problems of complex laser scanning path planning and poor scanning consistency in the related art.

In a first aspect, an embodiment of the present application provides a three-dimensional stacked modeling method, which is applied to a three-dimensional stacked modeling apparatus, where the three-dimensional stacked modeling apparatus includes a rigid frame, an imaging platform, a laser scanning unit, a two-degree-of-freedom bearing platform, and a controller, where the imaging platform is disposed in the rigid frame, the two-degree-of-freedom bearing platform is disposed at the top of the rigid frame, and the laser scanning unit is disposed on the two-degree-of-freedom bearing platform; the laser scanning unit comprises a galvanometer scanner; the controller is respectively electrically connected with the galvanometer scanner and the two-degree-of-freedom bearing platform, and the three-dimensional stacking modeling method comprises the following steps: the controller acquires a scanning path; the controller decomposes the scanning path into a first scanning motion of the two-degree-of-freedom carrying platform and a second scanning motion of the galvanometer scanner; the controller controls the output power of the laser scanning unit, controls the motion of the two-degree-of-freedom bearing platform according to the first scanning motion, and controls the motion of the galvanometer scanner according to the second scanning motion.

In some of these embodiments, the controller decomposing the scan path into a first scan motion of the two degree of freedom load-bearing platform and a second scan motion of the galvanometer scanner comprises: the controller selects a reference point on an imaging surface of the imaging platform and establishes a plane rectangular coordinate system by taking the reference point as a coordinate origin; the controller decomposes the uniform scanning motion along the scanning path to the X axis and the Y axis of the plane rectangular coordinate system respectively to obtain an X-axis motion curve and a Y-axis motion curve; the controller performs Fourier series decomposition on the X-axis motion curve to obtain an X-axis low-frequency motion curve and an X-axis high-frequency motion curve; performing Fourier series decomposition on the Y-axis motion curve to obtain a Y-axis low-frequency motion curve and a Y-axis high-frequency motion curve; the controller determines the first scanning motion according to the X-axis low-frequency motion curve and the Y-axis low-frequency motion curve; and determining the second scanning movement according to the X-axis high-frequency movement curve and the Y-axis high-frequency movement curve.

In some of these embodiments, the reference point is located at the geometric center of the imaging plane.

In some embodiments, the decomposing, by the controller, the uniform scanning motion along the scanning path into the X axis and the Y axis of the rectangular planar coordinate system, respectively, and obtaining the X-axis motion curve and the Y-axis motion curve includes: under the condition that the scanning path is a closed curve, after the controller cuts the closed curve from the scanning starting point position, the controller decomposes the uniform scanning motion along the closed curve onto the X axis and the Y axis of the plane rectangular coordinate system respectively to obtain an X axis motion curve and a Y axis motion curve.

In some embodiments, the decomposing, by the controller, the uniform scanning motion along the scanning path into the X axis and the Y axis of the rectangular planar coordinate system, respectively, and obtaining the X-axis motion curve and the Y-axis motion curve includes: under the condition that the scanning path is an unclosed curve, the controller decomposes the uniform scanning motion along the unclosed curve onto an X axis and a Y axis of the plane rectangular coordinate system respectively to obtain the X axis motion curve and the Y axis motion curve.

In some embodiments, the fluctuation range of the X-axis low-frequency motion curve and the fluctuation range of the Y-axis low-frequency motion curve do not exceed the effective stroke of the two-degree-of-freedom bearing platform; the fluctuation range of the X-axis high-frequency motion curve and the fluctuation range of the Y-axis high-frequency motion curve do not exceed the effective scanning range of the galvanometer scanner.

In some of these embodiments, the controller decomposing the scan path into a first scan motion of the two degree of freedom load-bearing platform and a second scan motion of the galvanometer scanner comprises: the controller decomposes the scanning path into a plurality of sub-scanning paths according to scanning types, and decomposes each sub-scanning path into a first scanning motion of the two-degree-of-freedom carrying platform and a second scanning motion of the galvanometer scanner corresponding to the sub-scanning paths respectively.

In a second aspect, an embodiment of the present application provides a three-dimensional stacked modeling apparatus, which includes a rigid frame, an imaging platform, a laser scanning unit, a two-degree-of-freedom bearing platform, and a controller, wherein the imaging platform is disposed in the rigid frame, the two-degree-of-freedom bearing platform is disposed on a top of the rigid frame, and the laser scanning unit is disposed on the two-degree-of-freedom bearing platform; the laser scanning unit comprises a galvanometer scanner; the controller is electrically connected with the galvanometer scanner and the two-degree-of-freedom bearing platform respectively, and the controller is used for executing the three-dimensional laminating modeling method according to the first aspect.

In a third aspect, an embodiment of the present application provides an electronic device, which includes a memory, a processor, and a computer program stored on the memory and executable on the processor, and the processor executes the computer program to implement the three-dimensional stack modeling method according to the first aspect.

In a fourth aspect, embodiments of the present application provide a computer-readable storage medium, on which a computer program is stored, which when executed by a processor, implements the three-dimensional stack modeling method according to the first aspect.

Compared with the related art, the three-dimensional stacking modeling method, the three-dimensional stacking modeling device, the electronic device and the storage medium are provided by the embodiment of the application, wherein the three-dimensional stacking modeling method is applied to the three-dimensional stacking modeling device, the three-dimensional stacking modeling device comprises a rigid frame, an imaging platform, a laser scanning unit, a two-degree-of-freedom bearing platform and a controller, the imaging platform is arranged in the rigid frame, the two-degree-of-freedom bearing platform is arranged at the top of the rigid frame, and the laser scanning unit is arranged on the two-degree-of-freedom bearing platform; the laser scanning unit comprises a galvanometer scanner; the controller is respectively electrically connected with the galvanometer scanner and the two-degree-of-freedom bearing platform, and the three-dimensional stacking modeling method obtains a scanning path through the controller; the controller decomposes the scanning path into a first scanning motion of the two-degree-of-freedom bearing platform and a second scanning motion of the galvanometer scanner; the controller controls the output power of the laser scanning unit, controls the motion of the two-degree-of-freedom bearing platform according to the first scanning motion, and controls the motion of the galvanometer scanner according to the second scanning motion, so that the problems of complex laser scanning path planning and poor scanning continuity in the related technology are solved, the complexity of the laser scanning path planning is simplified, and the scanning continuity is improved.

The details of one or more embodiments of the application are set forth in the accompanying drawings and the description below to provide a more thorough understanding of the application.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a flow chart of a three-dimensional stack molding method according to an embodiment of the present application;

FIG. 2 is a schematic illustration of a closed curve according to an embodiment of the present application;

FIG. 3 is a diagram of a motion function Xc (t) for the X-axis of a closed curve according to an embodiment of the present application;

FIG. 4 is a schematic diagram of a low frequency fractional function xcl (t) of the X-axis of a closed curve according to an embodiment of the present application;

FIG. 5 is a schematic diagram of a high frequency division function xch (t) of the X-axis of a closed curve according to an embodiment of the present application;

FIG. 6 is a schematic diagram of a motion function Yc (t) for the Y-axis of a closed curve according to an embodiment of the present application;

FIG. 7 is a schematic diagram of a low frequency component function ycl (t) of the Y-axis of a closed curve according to an embodiment of the present application;

FIG. 8 is a schematic diagram of the high frequency division function ych (t) of the Y-axis of a closed curve according to an embodiment of the present application;

FIG. 9 is a schematic illustration of a non-closed curve according to an embodiment of the present application;

FIG. 10 is a diagram of a motion function Xs (t) of the X-axis of a non-closed curve according to an embodiment of the present application;

FIG. 11 is a schematic diagram of a low frequency component function xsl (t) of the X-axis of a non-closed curve according to an embodiment of the present application;

FIG. 12 is a diagram of a high frequency division function xsh (t) of the X-axis of a non-closed curve according to an embodiment of the present application;

FIG. 13 is a graphical illustration of a motion function Ys (t) for the Y-axis of a non-closed curve according to an embodiment of the present application;

FIG. 14 is a schematic diagram of a low frequency component function ysl (t) of the Y-axis of a non-closed curve according to an embodiment of the present application;

FIG. 15 is a schematic diagram of a high frequency division function ysh (t) of the Y-axis of a non-closed curve according to an embodiment of the present application;

fig. 16 is a first schematic configuration diagram of a three-dimensional stack molding apparatus according to an embodiment of the present application;

FIG. 17 is a schematic diagram of the connection of control signals according to an embodiment of the present application;

fig. 18 is a schematic configuration diagram ii of a three-dimensional stack molding apparatus according to an embodiment of the present application;

fig. 19 is a schematic structural diagram of an electronic device according to an embodiment of the application.

Reference numerals:

201. a closed contour curve; 202. an X-axis motion function Xc (t); 203. y-axis motion function Yc (t); 212. the low frequency component xcl (t) of the X-axis motion function; 222. the high frequency component xch (t) of the X-axis motion function; 213. the low frequency component ycl (t) of the Y-axis motion function; 223. the high frequency component ych (t) of the Y-axis motion function;

301. densely filling lines with short line segments; 302. an X-axis motion function Xs (t); 303. y-axis motion function Ys (t); 312. a low frequency component xsl (t) of the X-axis motion function; 322. the high frequency component xsh (t) of the X-axis motion function; 313. the low frequency component ysl (t) of the Y-axis motion function; 323. the high frequency component ysh (t) of the Y-axis motion function;

401. a rigid frame; 402. an imaging platform; 403. a two-degree-of-freedom bearing platform; 404. a controller; 405. a galvanometer scanner; 406. a collimator; 407. a laser; 408. a field lens;

501. a memory; 502. a processor; 503. a transmission device; 504. and an input/output device.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clearly understood, the present application is described and illustrated below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided in the present application without any inventive step are within the scope of protection of the present application.

It is obvious that the drawings in the following description are only examples or embodiments of the application, and that it is also possible for a person skilled in the art to apply the application to other similar contexts on the basis of these drawings without inventive effort. Moreover, it should be appreciated that such a development effort might be complex and tedious, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure, given the benefit of this disclosure, without departing from the scope of this disclosure.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is to be expressly and implicitly understood by one of ordinary skill in the art that the embodiments described herein may be combined with other embodiments without conflict.

Unless defined otherwise, technical or scientific terms referred to herein shall have the ordinary meaning as understood by those of ordinary skill in the art to which this application belongs. Reference to "a," "an," "the," and similar words throughout this application are not to be construed as limiting in number, and may refer to the singular or the plural. The use of the terms "including," "comprising," "having," and any variations thereof herein, is meant to cover a non-exclusive inclusion; for example, a process, method, system, article, or apparatus that comprises a list of steps or modules (elements) is not limited to the listed steps or elements, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus. Reference to "connected," "coupled," and the like in this application is not intended to be limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The term "plurality" as used herein means two or more. "and/or" describes an association relationship of associated objects, meaning that three relationships may exist, for example, "A and/or B" may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. Reference herein to the terms "first," "second," "third," and the like, are merely to distinguish similar objects and do not denote a particular ordering for the objects.

The embodiment provides a three-dimensional stacking modeling method, which is applied to a three-dimensional stacking modeling device, wherein the three-dimensional stacking modeling device comprises a rigid frame, an imaging platform, a laser scanning unit, a two-degree-of-freedom bearing platform and a controller, wherein the imaging platform is arranged in the rigid frame, the two-degree-of-freedom bearing platform is arranged at the top of the rigid frame, and the laser scanning unit is arranged on the two-degree-of-freedom bearing platform; the laser scanning unit comprises a galvanometer scanner; the controller is respectively electrically connected with the galvanometer scanner and the two-degree-of-freedom bearing platform. Fig. 1 is a flowchart of a three-dimensional laminated modeling method according to an embodiment of the present application, and as shown in fig. 1, the flowchart includes the steps of:

in step S101, the controller acquires a scan path.

In this embodiment, the controller plans the scan path of the pattern to be imaged according to the geometric principle of laser vector scan imaging. The pattern to be imaged is a pattern that is scanned by a laser scanning technique to obtain a scanned image. The scan path refers to a pre-planned laser scan pattern profile. The scanning path comprises three types of end-to-end closed outer contour curves, end-to-end closed inner contour curves and short line segment dense filling lines. According to different pattern contents, the three types of paths can be a single group or a plurality of groups, and when the three types of paths are a plurality of groups, high-speed jump movement from the end point of the last group of vector paths to the starting point of the next group of vector paths is also included between the groups. The efficiency and the accuracy of laser scanning can be improved by planning the scanning path after the pattern to be imaged is predetermined.

Step S102, the controller decomposes the scanning path into a first scanning motion of the two-degree-of-freedom carrying platform and a second scanning motion of the galvanometer scanner.

In this embodiment, the two-degree-of-freedom bearing platform comprises a linear servo platform capable of moving in two directions, such as an X-axis direction and a Y-axis direction perpendicular to each other. The controller expands the scanning path on a time axis from a starting point to an end point according to a set linear speed through a computer algorithm to respectively obtain a motion function along an X-axis direction and a motion function along a Y-axis direction, and then obtains a first scanning motion for driving the two-degree-of-freedom bearing platform and a second scanning motion for driving the galvanometer scanner through a conversion function to carry out laser scanning construction path planning for controlling related components.

And step S103, controlling the output power of the laser scanning unit by the controller, controlling the motion of the two-degree-of-freedom bearing platform according to the first scanning motion, and controlling the motion of the galvanometer scanner according to the second scanning motion.

In this embodiment, the controller can control the two-degree-of-freedom carrying platform and the galvanometer scanner to move synchronously according to the first scanning motion and the second scanning motion, so as to achieve the effect of hybrid scanning motion of the synthetic laser beam and improve scanning efficiency.

Through the steps S101 to S103, laser hybrid scanning is performed according to a preset scanning path on the basis of synchronous motion of the two-degree-of-freedom bearing platform and the galvanometer scanner, hybrid laser scanning of a pattern to be imaged is realized under a unified coordinate system, the problems of complex laser scanning path planning and poor scanning continuity in the related art are solved, the complexity of laser scanning path planning is simplified, and the scanning continuity is improved.

The embodiments of the present application are described and illustrated below by way of preferred embodiments.

In the step S102, the controller decomposing the scanning path into the first scanning motion of the two-degree-of-freedom carrying platform and the second scanning motion of the galvanometer scanner includes the following steps:

the controller selects a reference point on an imaging surface of the imaging platform and establishes a plane rectangular coordinate system by taking the reference point as a coordinate origin; the controller decomposes the uniform scanning motion along the scanning path to the X axis and the Y axis of a plane rectangular coordinate system respectively to obtain an X axis motion curve and a Y axis motion curve; the controller performs Fourier series decomposition on the X-axis motion curve to obtain an X-axis low-frequency motion curve and an X-axis high-frequency motion curve; performing Fourier series decomposition on the Y-axis motion curve to obtain a Y-axis low-frequency motion curve and a Y-axis high-frequency motion curve; the controller determines a first scanning motion according to the X-axis low-frequency motion curve and the Y-axis low-frequency motion curve; and determining a second scanning motion according to the X-axis high-frequency motion curve and the Y-axis high-frequency motion curve.

In this embodiment, the geometric center Od of the imaging surface can be used as a reference point, the controller establishes a rectangular plane coordinate system OdXY, the positive direction of the X axis is consistent with the positive moving direction of the X axis of the two-degree-of-freedom bearing platform, and the positive direction of the Y axis is consistent with the positive moving direction of the Y axis of the two-degree-of-freedom bearing platform.

The controller expands the scanning path on a time axis according to a set linear speed to obtain an X-axis motion function X (t) and a Y-axis motion function Y (t) of the scanning path; since X (0) = X (t) is the X coordinate of the cutting point, Y (0) = Y (t) is the Y coordinate of the cutting point, the effective domains of the functions X (t) and Y (t) can be copied and expanded from t being more than or equal to 0 and less than or equal to t to-n X t and less than or equal to n X t, and then the motion functions X (t) and Y (t) with the period of t are obtained; fourier series decomposition is carried out on the periodic motion functions x (t) and y (t), so that low frequency division functions xl (t) and yl (t) and high frequency division functions xh (t) and yh (t) can be obtained; then the low frequency division functions xl (t) and yl (t) can be used as the first scanning movement of the two-degree-of-freedom bearing platform, the high frequency division functions xh (t) and yh (t) can be used as the second scanning movement of the galvanometer scanner, the two-degree-of-freedom bearing platform and the galvanometer scanner move synchronously, the mixed scanning movement of the laser beams can be synthesized, and the profile curve and/or the detail curve generated by the movement of the laser focusing light spot can be obtained on the imaging platform.

Through the steps, the scanning path is firstly decomposed into an X-axis motion function and a Y-axis motion function, then the X-axis motion function and the Y-axis motion function are further subjected to Fourier series decomposition, a low-frequency component function and a high-frequency component function of the X-axis motion function and a low-frequency component function and a high-frequency component function of the Y-axis motion function are obtained, laser scanning is divided into a low-frequency part and a high-frequency part, and the accuracy degree of mixed laser scanning is improved.

In the above step, the controller decomposes the uniform scanning motion along the scanning path into an X axis and a Y axis of the rectangular planar coordinate system, respectively, and obtaining an X axis motion curve and a Y axis motion curve includes:

under the condition that the scanning path is a closed curve, the controller cuts off the closed curve from the scanning starting point position, and then decomposes the uniform scanning motion along the closed curve onto an X axis and a Y axis of a plane rectangular coordinate system respectively to obtain an X axis motion curve and a Y axis motion curve.

In this embodiment, a closed curve is cut at a set starting point and developed on a time axis according to a set linear velocity, so as to obtain an X-axis motion function Xc (t) and a Y-axis motion function Yc (t) of a scanning path formed by the closed curve, wherein t is greater than or equal to 0 and less than or equal to tc, and the closed curve comprises an outer contour curve and an inner contour curve which are closed end to end. Since Xc (0) = Xc (tc) is the X coordinate of the cutting point, yc (0) = Yc (tc) is the Y coordinate of the cutting point, the effective domains of the functions Xc (t) and Yc (t) can be copied and expanded from t being more than or equal to 0 and less than or equal to tc to-n and less than or equal to t and less than or equal to n and tc, and then the motion functions Xc (t) and Yc (t) with the period tc are obtained; fourier series decomposition is carried out on the periodic motion functions xc (t) and yc (t) to obtain low frequency division functions xcl (t) and ycl (t) and high frequency division functions xch (t) and ych (t); the low-frequency division functions xcl (t) and ycl (t) can be used as contour motion instructions of a linear servo platform, the high-frequency division functions xch (t) and ych (t) can be used as contour motion instructions of a galvanometer scanner, the two-degree-of-freedom bearing platform and the galvanometer scanner synchronously move to synthesize mixed scanning motion of laser beams, and an outer contour curve and an inner contour curve generated by movement of laser focusing spots are obtained on an imaging platform.

FIG. 2 is a schematic illustration of a closed curve according to an embodiment of the present application.

Fig. 3 is a schematic diagram of a motion function Xc (t) of the X-axis of a closed curve according to an embodiment of the present application.

Fig. 4 is a diagram of a low frequency component function xcl (t) of the X-axis of a closed curve according to an embodiment of the present application.

FIG. 5 is a diagram of a high frequency division function xch (t) of the X-axis of a closed curve according to an embodiment of the present application.

FIG. 6 is a diagram illustrating a motion function Yc (t) for the Y-axis of a closed curve according to an embodiment of the present application.

FIG. 7 is a schematic diagram of the low frequency division function ycl (t) of the Y-axis of the closed curve according to an embodiment of the present application.

Fig. 8 is a schematic diagram of the high frequency division function ych (t) of the Y-axis of the closed curve according to an embodiment of the present application.

Referring to fig. 3 to 8, a parameter d of an ordinate represents a movement distance, mm represents millimeter, an abscissa t represents a movement time, and s represents second.

A closed contour curve 201 is arranged in the coordinate system OdXY, and the maximum values of the closed contour curve 201 along the X-axis direction and the Y-axis direction are both 250mm; cutting off at coordinates (250, 0), unfolding a closed contour curve 201 along a counterclockwise direction at a linear speed of 50mm/s to obtain an X-axis motion function Xc (t) -202 and a Y-axis motion function Yc (t) -203; performing Fourier series expansion on the X-axis motion function Xc (t) -202 to obtain a low-frequency component xcl (t) -212 of the X-axis motion function and a high-frequency component xch (t) -222 of the X-axis motion function, wherein the maximum values of the high-frequency component and the low-frequency component of the X-axis motion function are both 250mm; fourier series expansion is carried out on the Y-axis motion function Yc (t) -203, so that the low-frequency component ycl (t) -213 of the Y-axis motion function, the high-frequency component ych (t) -223 of the Y-axis motion function are obtained, and the maximum value of the high-frequency component and the low-frequency component of the Y-axis motion function is also 250mm; then xcl (t) and ycl (t) can be used as the motion commands of the linear servo stage with the effective stroke range of +/-250 mm, xch (t) and ych (t) can be used as the motion commands of the galvanometric scanner with the effective scanning range of +/-250 mm, the linear servo stage and the galvanometric scanner move synchronously, and the closed contour scanning path shown as the closed contour curve 201 can be synthesized on the imaging stage.

under the condition that the scanning path is an unclosed curve, the controller decomposes the uniform scanning motion along the unclosed curve onto the X axis and the Y axis of the plane rectangular coordinate system respectively to obtain an X axis motion curve and a Y axis motion curve.

In this embodiment, an unclosed curve is developed on a time axis from a starting point to an end point according to a set linear velocity, and an X-axis motion function Xs (t) and a Y-axis motion function Ys (t) are obtained, wherein t is greater than or equal to 0 and less than or equal to ts, and the unclosed curve includes short segment densely-packed lines. Fourier series decomposition is carried out on the functions xs (t) and ys (t) to obtain high frequency division functions xsh (t) and ysh (t) and low frequency division functions xsl (t) and ysl (t); wherein, the periods of the high frequency division functions xsh (t) and ysh (t) are equal to the length of the short line segment, and can be used as a filling motion instruction of the galvanometer scanner; correspondingly, the low-frequency component functions xsl (t) and ysl (t), namely the difference between the functions xs (t) and xsh (t) and the difference between ys (t) and ysh (t), can be used as filling motion instructions of the two-degree-of-freedom bearing platform; due to the clear geometrical characteristics of the short-line dense filling line, the functions xsh (t) and ysh (t) describe the dense reciprocating motion of the light spot on the imaging platform, and the functions xsl (t) and ysl (t) describe the envelope center line of the short-line dense filling line.

FIG. 9 is a schematic illustration of a non-closed curve according to an embodiment of the present application.

FIG. 10 is a diagram of a motion function Xs (t) of the X-axis of a non-closed curve according to an embodiment of the present application.

FIG. 11 is a diagram of a low frequency component function xsl (t) of the X-axis of a non-closed curve according to an embodiment of the present application.

FIG. 12 is a diagram of a high frequency division function xsh (t) of the X-axis of a non-closed curve according to an embodiment of the present application.

FIG. 13 is a diagram illustrating a motion function Ys (t) of a Y-axis of a non-closed curve according to an embodiment of the present application.

Fig. 14 is a schematic diagram of a low-frequency partial function ysl (t) of the Y-axis of an unclosed curve according to an embodiment of the application.

Fig. 15 is a schematic diagram of a high frequency division function ysh (t) of the Y-axis of a non-closed curve according to an embodiment of the present application.

Referring to fig. 9 to 15, there is a short segment densely-filled line 301 in the coordinate system OdXY, which has a maximum value of 60mm in the Y-axis direction and 250mm in the X-axis direction; expanding a short line segment dense filling line 301 from left to right according to the linear speed of 100mm/s to obtain an X-axis motion function Xs (t) -302 and a Y-axis motion function Ys (t) -303; fourier series expansion is carried out on the X-axis motion function Xs (t) -302, so that a low-frequency component xsl (t) -312 of the X-axis motion function, a high-frequency component xsh (t) -322 of the X-axis motion function are obtained, the maximum value of the low-frequency component of the X-axis motion function is 249mm, and the maximum value of the high-frequency component of the X-axis motion function is 1mm; fourier series expansion is carried out on the Y-axis motion function Ys (t) -303, so that a low-frequency component ysl (t) -313 of the Y-axis motion function and a high-frequency component ysh (t) -323 of the Y-axis motion function are obtained, the maximum value of the low-frequency component of the Y-axis motion function is 5mm, and the maximum value of the high-frequency component of the Y-axis motion function is 55mm; then xsl (t) and ysl (t) can be used as the motion instruction of the linear servo platform with the effective travel range of +/-250, xsh (t) and ysh (t) can be used as the motion instruction of the galvanometer scanner with the effective scanning range of +/-250, the linear servo platform and the galvanometer scanner move synchronously, and a short-line-segment dense filling path shown as a short-line-segment dense filling line 301 can be synthesized on the imaging platform.

In some preferred embodiments, the fluctuation range of the X-axis low-frequency motion curve and the fluctuation range of the Y-axis low-frequency motion curve do not exceed the effective stroke of the two-degree-of-freedom bearing platform; the fluctuation range of the X-axis high-frequency motion curve and the fluctuation range of the Y-axis high-frequency motion curve do not exceed the effective scanning range of the galvanometer scanner.

In this embodiment, if the effective stroke of the XY axis of the two-degree-of-freedom bearing platform is ± da, and the effective scanning range of the XY axis of the galvanometer scanner is ± db, the maximum length and width of the pattern to be imaged is 2 (da + db); taking the geometric center Od of the imaging surface as a reference point, the controller establishes a plane rectangular coordinate system OdXY, wherein the positive direction of an X axis is consistent with the positive direction of the X axis movement of the two-freedom-degree bearing platform, and the positive direction of a Y axis is consistent with the positive direction of the Y axis movement of the two-freedom-degree bearing platform; after the controller performs Fourier series decomposition on the X-axis motion function and the Y-axis motion function to obtain a low-frequency component function and a high-frequency component function of the X-axis motion function and a low-frequency component function and a high-frequency component function of the Y-axis motion function, the extreme value of the high-frequency component function in the interval from 0 to t is set to be not more than +/-db, the extreme value of the low-frequency component function is not more than +/-da, and any pattern with the length and width not more than 2 (da + db) can be matched into a coordinate system OdXY.

In some preferred embodiments, the controller decomposing the scan path into a first scan motion of the two degree of freedom load-bearing platform and a second scan motion of the galvanometer scanner comprises:

the controller divides the scanning path into a plurality of sub-scanning paths according to the scanning type, and respectively divides each sub-scanning path into a first scanning movement of the two-degree-of-freedom bearing platform and a second scanning movement of the galvanometer scanner, wherein the first scanning movement corresponds to the sub-scanning paths, and the second scanning movement corresponds to the sub-scanning paths.

In the present embodiment, the controller decomposes the scan type into a first sub-scan path and a second sub-scan path. The controller decomposes according to a first sub-scanning path to obtain a low-frequency component function and a high-frequency component function, calculates the starting point coordinate of the first sub-scanning path according to the low-frequency component function and the high-frequency component function, correspondingly sends the starting point coordinate to the two-degree-of-freedom bearing platform and the galvanometer scanner, and controls the two to be positioned to the starting point of the first sub-scanning path at the maximum running speed; the controller sends a starting instruction to the laser, controls the laser to start outputting laser beams and sets the current time to be zero, starts calculating instantaneous values of a low-frequency division function and a high-frequency division function in real time according to time increment, takes the calculated instantaneous values as displacement instructions, immediately sends the displacement instructions to the two-degree-of-freedom bearing platform and the galvanometer scanner so as to control the two to follow coordinate positions corresponding to the instantaneous values until the time increment reaches the maximum effective range of the current motion function, sends a closing instruction to the laser, and finishes execution of the first sub-scanning path.

Based on the principle similar to the first sub-scanning path, before the second sub-scanning path is carried out, the controller calculates the starting point coordinates of the low-frequency component function and the high-frequency component function of the second sub-scanning path, correspondingly sends the starting point coordinates to the two-degree-of-freedom bearing platform and the galvanometer scanner, controls the two to be positioned to the starting point of the path to be scanned at the maximum running speed, and then repeats the operations of starting the laser, calculating the instantaneous function value in real time, sending a displacement instruction and closing the laser.

And the steps of positioning to the starting point at a high speed, controlling the two-degree-of-freedom bearing platform, the galvanometer scanner and the laser to execute mixed scanning are repeatedly executed until all the sub-scanning paths of the planned scanning path are executed.

In some preferred embodiments, the controller in the present application may decompose the XY-axis motion function by using a discrete fourier transform, a digital filter, or the like, in addition to the fourier series expansion in the present embodiment; according to the method, the XY-axis low-frequency motion component function and the high-frequency motion component function are obtained, or the low-frequency component function is obtained firstly, and then the high-frequency motion component function is obtained by subtracting the XY-axis motion function and the low-frequency component function; when the maximum value of the high-frequency motion subfunction is smaller than the effective scanning range of the galvanometer scanner, part of the low-frequency motion subfunction can be distributed to the motion instruction of the galvanometer scanner, and the maximum value of the sum of the distributed part and the high-frequency motion subfunction is ensured not to exceed the effective scanning range of the galvanometer scanner; the controller can acquire the high-frequency motion division function, and can also adopt a mode of subtracting the XY-axis motion function from the actually measured motion function of the linear servo platform so as to compensate the dynamic position deviation of the linear servo platform and improve the large-format laser hybrid scanning precision.

In addition to the above embodiments, the present invention may have other embodiments. All technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the protection scope of the claims of the present invention.

In the three-dimensional stacked modeling method provided by this embodiment, in the process of planning a scan path, the controller may preferably adopt a global rectangular coordinate system constructed by taking the center of the imaging platform as the origin and taking the horizontal and vertical directions thereof as XY axes, and plan, according to the pattern to be imaged, an outer contour curve, an inner contour curve and a short line segment dense filling line, which may all be defined by absolute coordinate values; the controller expands the scanning path in a time domain to obtain an X-axis motion function and a Y-axis motion function, decomposes the X-axis motion function and the Y-axis motion function into a low-frequency division function and a high-frequency division function through Fourier series, and ensures that the extreme value of the low-frequency division function does not exceed the effective stroke of the linear servo platform and the extreme value of the high-frequency division function does not exceed the effective scanning range of the galvanometer scanner during the splitting; the two-degree-of-freedom bearing platform executes the low-frequency component of the laser scanning path, and the galvanometer scanner executes the high-frequency component of the laser scanning path. The method has the following advantages:

(1) It is not necessary to perform multi-region segmentation according to the limited range of the scanning device, it is not necessary to process multi-region edge splicing, and it is only necessary to refer to the working mode of single, large-range scanning device.

(2) The two-degree-of-freedom bearing platform can be used for obtaining a large scanning range at low cost, and the local high-speed scanning performance of the galvanometer scanner can be obtained within a large width range.

(3) The precise splicing of a plurality of optical scanning devices is not needed, a complex partition path planning algorithm is not needed, and the scanning path is continuous without a centralized splicing area.

(4) The optical path is simple, key optical components such as the laser, the collimator, the galvanometer scanner, the field lens and the like are unique, and the output deviation of a plurality of groups of optical elements does not need to be calibrated.

(5) When the laser cutting machine is used for laser cutting, laser thermoforming and laser curing forming, no centralized and large-size splicing part exists, the processing appearance is continuous, and the mechanical property is better.

(6) The scheme of the application is reasonable, and the laser cutting device can be popularized and applied to various laser processing devices such as laser cutting and laser 3D printing.

In combination with the three-dimensional laminated molding method of the above embodiment, the present embodiment provides a three-dimensional laminated molding apparatus. Fig. 16 is a first schematic configuration diagram of a three-dimensional stack molding apparatus according to an embodiment of the present application, and fig. 17 is a schematic connection diagram of control signals according to an embodiment of the present application, and as shown in fig. 16 and 17, the three-dimensional stack molding apparatus includes:

the device comprises a rigid frame 401, an imaging platform 402, a laser scanning unit, a two-degree-of-freedom bearing platform 403 and a controller 404, wherein the imaging platform 402 is arranged in the rigid frame 401, the two-degree-of-freedom bearing platform 403 is arranged at the top of the rigid frame 401, and the laser scanning unit is arranged on the two-degree-of-freedom bearing platform 403; the laser scanning unit includes a galvanometer scanner 405; the controller 404 is electrically connected to the two-degree-of-freedom carrying platform 403 and the galvanometer scanner 405, respectively, and the controller 404 is configured to execute the three-dimensional stack modeling method in the above-described embodiment.

In this embodiment, the controller 404 acquires the scan path; the controller 404 decomposes the scanning path into a first scanning motion of the two-degree-of-freedom carrying platform 403 and a second scanning motion of the galvanometer scanner 405; the controller 404 controls the output power of the laser scanning unit while controlling the movement of the two-degree-of-freedom carrying platform 403 according to the first scanning movement and the movement of the galvanometer scanner 405 according to the second scanning movement.

Through the embodiment, laser hybrid scanning is performed according to the preset scanning path on the basis of synchronous motion of the two-degree-of-freedom bearing platform 403 and the galvanometer scanner 405, hybrid laser scanning of patterns to be imaged is realized under a unified coordinate system, the problems of complex laser scanning path planning and poor scanning continuity in the related art are solved, the complexity of laser scanning path planning is simplified, and the scanning continuity is improved.

In this embodiment, the shape of the imaging platform 402 may be a square, a rectangle, a circle, or other polygons, and the embodiment is not limited.

In this embodiment, the two-degree-of-freedom stage 403 includes a linear servo stage.

Referring to fig. 16, in some of these embodiments, the three-dimensional stack molding apparatus further includes a collimator 406 and a laser 407. Referring to fig. 17, the controller 404 is electrically connected to the two-degree-of-freedom carrying platform 403, the galvanometer scanner 405, and the laser 407, respectively.

In this embodiment, the controller 404 sends an electrical signal to the two-degree-of-freedom carrying platform 403, and controls the two-degree-of-freedom carrying platform 403 to drive the galvanometer scanner 405 and the collimator 406 to integrally move along the horizontal and vertical directions of the imaging platform, so as to execute a low-frequency motion component of a large-format scanning path; the controller 404 sends an electrical signal to the galvanometer scanner 405 to control the deflection of the X-axis deflection motor and the Y-axis deflection motor in the galvanometer scanner 405, and then controls the X-axis scanning motion and the Y-axis scanning motion of the light beam at the light outlet through the mirrors of the X-axis deflection motor and the Y-axis deflection motor so as to execute the high-frequency motion component of the large-breadth scanning path; the controller 404 sends an electrical signal to the laser 407 to control the laser 407 to adjust the power of the corresponding laser beam while scanning the inner and outer contour paths, the short segment dense filling path, and turn off the laser beam during the non-scanning path movement.

Fig. 18 is a second schematic structural view of a three-dimensional laminated molding apparatus according to an embodiment of the present application, as shown in fig. 18, in some embodiments, the three-dimensional laminated molding apparatus further includes: a field lens 408.

Hereinafter, a preferred embodiment of the three-dimensional laminated molding machine will be described.

Referring to fig. 16-18, rigid frame 401 has square imaging platform 402 therein, imaging platform 402 being parallel to the cross-section of rigid frame 401; a two-degree-of-freedom bearing platform 403 is arranged at the top of the rigid frame 401, the displacement plane of the two-degree-of-freedom bearing platform 403 is parallel to the imaging platform 402, the X-axis moving direction is transversely consistent with the imaging platform 402, the Y-axis moving direction is longitudinally consistent with the imaging platform 3, and when the two-degree-of-freedom bearing platform 403 is located at a zero position, the center of the two-degree-of-freedom bearing platform is overlapped with the center projection of the imaging platform 402; a galvanometer scanner 405 and a collimator 406 are arranged on the two-degree-of-freedom bearing platform 403, the X-axis scanning direction of the galvanometer scanner 405 is consistent with the X-axis direction of the two-degree-of-freedom bearing platform 403, the Y-axis scanning direction of the galvanometer scanner 405 is consistent with the Y-axis direction of the two-degree-of-freedom bearing platform 403, when the galvanometer scanner 40 is positioned at a zero position, the optical axis center of a light outlet of the galvanometer scanner is overlapped with the center of the two-degree-of-freedom bearing platform 403 in a projection mode, the light outlet of the collimator 406 points to the light inlet of the galvanometer scanner 405, and the optical axis center of the collimator is overlapped with the optical axis center of the light inlet of the galvanometer scanner 405; a field lens 408 is arranged at the light outlet of the galvanometer scanner 405, the center of the field lens 408 is aligned with the center of the light outlet of the galvanometer scanner 405, and the light beam at the light outlet is ensured to be in a focusing state when being irradiated to the imaging platform 402; the rigid frame 401 is provided with a laser 407, and the light outlet of the laser 407 is connected with the light inlet of the collimator 406 through a flexible optical fiber.

The controller 404 sends an electrical signal to the two-degree-of-freedom bearing platform 403, and controls the two-degree-of-freedom bearing platform 403 to drive the galvanometer scanner 405 and the collimator 406 to integrally move along the transverse direction and the longitudinal direction of the imaging platform so as to execute low-frequency motion components of a large-format scanning path; the controller 404 sends an electric signal to the galvanometer scanner 405, controls the deflection of an X-axis deflection motor and a Y-axis deflection motor in the galvanometer scanner 405, and further controls the X-axis scanning motion and the Y-axis scanning motion of the light beam at the light outlet through the reflectors of the X-axis deflection motor and the Y-axis deflection motor so as to execute a high-frequency motion component of a large-breadth scanning path; the controller 404 sends an electrical signal to the laser 407 to control the laser 407 to adjust the power of the corresponding laser beam while scanning the inner and outer contour paths, the short segment dense filling path, and turn off the laser beam during the non-scanning path movement.

It should be noted that, for specific examples in this embodiment, reference may be made to examples described in the foregoing embodiments and optional implementations, and details of this embodiment are not described herein again.

Fig. 19 is a schematic structural diagram of an electronic device according to an embodiment of the present application, and as shown in fig. 19, the electronic device includes a memory 501, a processor 502, and a computer program stored in the memory 501 and executable on the processor 502, and when the processor 502 executes the computer program, the three-dimensional stack modeling method in the above-described embodiment is implemented.

Referring to fig. 19, the electronic apparatus may include one or more processors 502 (only one is shown in fig. 19) (the processor 502 may include, but is not limited to, a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a processing memory 501 for storing data, and optionally, may further include a transmission device 503 for communication function and an input-output device 504. It will be understood by those skilled in the art that the structure shown in fig. 19 is merely illustrative and is not intended to limit the structure of the electronic device. For example, the electronic device may also include more or fewer components than shown in FIG. 19, or have a different configuration than shown in FIG. 19.

The processing memory 501 may be used to store a computer program, for example, a software program and a module of application software, such as a computer program corresponding to the three-dimensional laminated modeling method in the embodiment of the present application, and the processor 502 executes various functional applications and data processing by running the computer program stored in the processing memory 501, so as to implement the method described above. The processing memory 501 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, processing memory 501 may further include memory located remotely from processor 502, which may be connected to an electronic device through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.

The transmission device 503 is used to receive or transmit data via a network. Specific examples of the network described above may include a wireless network provided by a communication provider of the electronic device. In one example, the transmission device 503 includes a Network adapter (NIC) that can be connected to other Network devices through a base station to communicate with the internet. In one example, the transmission device 503 may be a Radio Frequency (RF) module, which is used to communicate with the internet in a wireless manner.

In addition, in combination with the three-dimensional stacking modeling method in the foregoing embodiment, the embodiment of the present application may be implemented by providing a storage medium. The storage medium having stored thereon computer program instructions; the computer program instructions, when executed by a processor, implement any of the three-dimensional stack modeling methods of the above embodiments.

In summary, the above embodiments or preferred embodiments provided by the present application have the following advantages:

1. according to the method, precise splicing of a plurality of optical scanning devices and a complex partitioned path planning algorithm are not needed, the scanning path is coherent, and a centralized splicing area is not needed.

2. The optical path is simple, and key optical components such as a laser, a collimator, a galvanometer scanner, a field lens and the like are unique, and the output deviation of a plurality of groups of optical elements does not need to be calibrated.

3. When the laser cutting machine is used for laser cutting, laser thermoforming and laser curing forming, no centralized and large-size splicing part exists, the processing appearance is continuous, and the mechanical property is better.

4. The application universality is strong, and the method can be popularized and applied in various laser processing devices such as laser cutting and laser 3D printing.

All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above examples only express several embodiments of the present application, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A three-dimensional laminated modeling method is applied to a three-dimensional laminated modeling device, and the three-dimensional laminated modeling device comprises a rigid frame, an imaging platform, a laser scanning unit, a two-degree-of-freedom bearing platform and a controller, wherein the imaging platform is arranged in the rigid frame, the two-degree-of-freedom bearing platform is arranged at the top of the rigid frame, and the laser scanning unit is arranged on the two-degree-of-freedom bearing platform; the laser scanning unit comprises a galvanometer scanner; the controller is respectively and electrically connected with the galvanometer scanner and the two-degree-of-freedom bearing platform, and the three-dimensional stacking modeling method is characterized by comprising the following steps of:

the controller acquires a scanning path;

the controller decomposes the scanning path into a first scanning motion of the two-degree-of-freedom carrying platform and a second scanning motion of the galvanometer scanner;

the controller controls the output power of the laser scanning unit, controls the motion of the two-degree-of-freedom bearing platform according to the first scanning motion, and controls the motion of the galvanometer scanner according to the second scanning motion;

wherein the controller decomposing the scan path into a first scanning motion of the two degree of freedom load-bearing platform and a second scanning motion of the galvanometer scanner comprises: the controller selects a reference point on an imaging surface of the imaging platform and establishes a plane rectangular coordinate system by taking the reference point as a coordinate origin; the controller decomposes the uniform scanning motion along the scanning path to the X axis and the Y axis of the plane rectangular coordinate system respectively to obtain an X axis motion curve and a Y axis motion curve; the controller performs Fourier series decomposition on the X-axis motion curve to obtain an X-axis low-frequency motion curve and an X-axis high-frequency motion curve; performing Fourier series decomposition on the Y-axis motion curve to obtain a Y-axis low-frequency motion curve and a Y-axis high-frequency motion curve; the controller determines the first scanning motion according to the X-axis low-frequency motion curve and the Y-axis low-frequency motion curve; and determining the second scanning movement according to the X-axis high-frequency movement curve and the Y-axis high-frequency movement curve.

2. The three-dimensional laminated modeling method according to claim 1, wherein said reference point is located at a geometric center of said imaging plane.

3. The three-dimensional laminated modeling method according to claim 1, wherein said controller decomposes the uniform scanning motion along said scanning path into X-axis and Y-axis motion curves of said rectangular planar coordinate system, respectively, and obtains the X-axis motion curve and the Y-axis motion curve comprises:

under the condition that the scanning path is a closed curve, after the controller cuts the closed curve from the scanning starting point position, the controller decomposes the uniform scanning motion along the closed curve onto the X axis and the Y axis of the plane rectangular coordinate system respectively to obtain an X axis motion curve and a Y axis motion curve.

4. The three-dimensional laminated modeling method according to claim 1, wherein said controller decomposes the uniform scanning motion along said scanning path into X-axis and Y-axis motion curves of said rectangular planar coordinate system, respectively, and obtains the X-axis motion curve and the Y-axis motion curve comprises:

under the condition that the scanning path is an unclosed curve, the controller decomposes the uniform scanning motion along the unclosed curve onto an X axis and a Y axis of the plane rectangular coordinate system respectively to obtain the X axis motion curve and the Y axis motion curve.

5. The three-dimensional laminated modeling method according to claim 1, wherein the fluctuation range of the X-axis low-frequency motion curve and the fluctuation range of the Y-axis low-frequency motion curve do not exceed the effective stroke of the two-degree-of-freedom bearing platform;

the fluctuation range of the X-axis high-frequency motion curve and the fluctuation range of the Y-axis high-frequency motion curve do not exceed the effective scanning range of the galvanometer scanner.

6. The three-dimensional laminated modeling method as recited in any of claims 1 to 5, wherein said controller resolving said scan path into a first scan motion of said two degree of freedom carrier platform and a second scan motion of said galvanometer scanner comprises:

the controller decomposes the scanning path into a plurality of sub-scanning paths according to scanning types, and decomposes each sub-scanning path into a first scanning motion of the two-degree-of-freedom bearing platform and a second scanning motion of the galvanometer scanner corresponding to the sub-scanning paths respectively;

wherein the controller decomposing the scan path into a first scan motion of the two degree of freedom load-bearing platform and a second scan motion of the galvanometer scanner comprises: the controller selects a reference point on an imaging surface of the imaging platform and establishes a plane rectangular coordinate system by taking the reference point as a coordinate origin; the controller decomposes the uniform scanning motion along the scanning path to the X axis and the Y axis of the plane rectangular coordinate system respectively to obtain an X-axis motion curve and a Y-axis motion curve; the controller performs Fourier series decomposition on the X-axis motion curve to obtain an X-axis low-frequency motion curve and an X-axis high-frequency motion curve; performing Fourier series decomposition on the Y-axis motion curve to obtain a Y-axis low-frequency motion curve and a Y-axis high-frequency motion curve; the controller determines the first scanning motion according to the X-axis low-frequency motion curve and the Y-axis low-frequency motion curve; and determining the second scanning movement according to the X-axis high-frequency movement curve and the Y-axis high-frequency movement curve.

7. A three-dimensional laminating modeling device is characterized by comprising a rigid frame, an imaging platform, a laser scanning unit, a two-degree-of-freedom bearing platform and a controller, wherein the imaging platform is arranged in the rigid frame, the two-degree-of-freedom bearing platform is arranged at the top of the rigid frame, and the laser scanning unit is arranged on the two-degree-of-freedom bearing platform; the laser scanning unit comprises a galvanometer scanner; the controller is electrically connected with the galvanometer scanner and the two-degree-of-freedom carrying platform respectively, and is used for executing the three-dimensional laminated modeling method of any one of claims 1 to 6.

8. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, wherein the processor implements the three-dimensional stack modeling method according to any one of claims 1 to 6 when executing the computer program.

9. A computer-readable storage medium on which a computer program is stored, the program, when being executed by a processor, implementing the three-dimensional stack modeling method according to any one of claims 1 to 6.