CN112372161A - Laser drilling system, method, computer device and readable storage medium - Google Patents
Laser drilling system, method, computer device and readable storage medium Download PDFInfo
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- CN112372161A CN112372161A CN202011019332.6A CN202011019332A CN112372161A CN 112372161 A CN112372161 A CN 112372161A CN 202011019332 A CN202011019332 A CN 202011019332A CN 112372161 A CN112372161 A CN 112372161A
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000005553 drilling Methods 0.000 title claims abstract description 34
- 238000003860 storage Methods 0.000 title claims abstract description 15
- 238000004590 computer program Methods 0.000 claims description 15
- 238000003754 machining Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 10
- 230000033001 locomotion Effects 0.000 claims description 9
- 238000007493 shaping process Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The application provides a laser drilling system, a laser drilling method, a computer device and a readable storage medium. The laser drilling system includes: the laser processing device comprises a laser processing device, a focusing device, an adjusting device and a control device. The laser processing device is used for emitting parallel laser beams. The focusing device is used for focusing the parallel laser beams and forming a focal point. The adjusting device is respectively and fixedly connected with the focusing device and the laser processing device. The adjusting device is used for adjusting the focusing device to move along the first direction. The control device is electrically connected with the laser processing device and the adjusting device respectively. The control device is used for dividing the area to be processed into a plurality of layers to be processed along the first direction according to the thickness of the area to be processed of the workpiece to be processed. The control device is also used for adjusting the relative distance between the focusing device and the workpiece to be processed through the adjusting device and controlling the focus to be positioned on the layer to be processed.
Description
Technical Field
The present application relates to the field of laser processing technology, and in particular, to a laser drilling system, method, computer device, and readable storage medium.
Background
The laser processing is a processing method which utilizes high-energy laser beams to reach extremely high energy density on a focus after being focused by a lens, and the material to be processed is at high temperature and gasified by virtue of a photothermal effect so as to achieve cutting or punching. During laser processing, the material at the focal point reaches a high temperature of tens of thousands of degrees, and at such a high temperature, the material is instantaneously melted or vaporized and evaporated. The laser processing method has the advantages of high processing speed, high production efficiency, high precision, wide material processing range, good economic benefit and the like, and is widely applied to the fine micromachining industry.
The ceramic substrate is a basic material of a high-power electronic circuit structure technology and an interconnection technology, has a compact structure and has certain brittleness. At present, laser processing is mainly used for processing a ceramic substrate. The method specifically comprises the following steps: after the focus adjustment is completed, the Z-axis movement mechanism is kept still in the machining process, so that the laser focus is fixed. However, due to the focusing and spatial distribution characteristics of the laser beam, the laser-processed micro-hole often has a certain taper, which may result in that the precision of the processed hole cannot meet the requirement.
Disclosure of Invention
In view of the above, it is necessary to provide a laser drilling system, a laser drilling method, a computer device and a readable storage medium for solving the problem of how to reduce the taper of a machined hole when machining the hole by using the existing laser.
A laser drilling system, comprising:
the laser processing device is used for emitting parallel laser beams;
a focusing device for focusing the parallel laser beams and forming a focal point;
the adjusting device is fixedly connected with the focusing device and the laser processing device respectively and used for adjusting the focusing device to move along a first direction; and
the control device is respectively electrically connected with the laser processing device and the adjusting device, and is used for dividing the region to be processed into a plurality of layers to be processed along the first direction according to the thickness of the region to be processed of the workpiece to be processed, adjusting the relative distance between the focusing device and the workpiece to be processed through the adjusting device, and controlling the focus to be positioned on the layer to be processed.
In one embodiment, the adjusting device comprises:
the power component is electrically connected with the control device;
and the moving assembly is respectively and fixedly connected with the driving shaft of the power part and the adjusting device, and is used for adjusting the relative distance between the focusing device and the workpiece to be processed and controlling the focus to be positioned on the layer to be processed.
In one embodiment, the motion assembly comprises:
the driving part is fixedly connected with a driving shaft of the power part; and
and the driven part is in transmission connection with the driving part and is fixedly connected with the adjusting device.
In one embodiment, the adjusting device further comprises:
and the bearing block is sleeved on the driving piece and is fixedly connected with the laser processing device.
In one embodiment, the laser processing apparatus includes:
the laser generator is electrically connected with the control device;
the beam shaping assembly is used for expanding and collimating the laser generated by the laser generator and forming the parallel laser beam;
the reflecting component is used for reflecting and transmitting the parallel laser beams; and
and the scanning galvanometer is electrically connected with the control device and is used for planning the path of the parallel laser beam reflected and transmitted by the reflecting component according to a preset processing shape and transmitting the planned parallel laser beam to the focusing device.
A laser drilling method applied to the laser drilling system according to any one of the above embodiments, the method comprising:
layering the to-be-machined area according to the thickness of the to-be-machined area of the to-be-machined workpiece, and obtaining a plurality of to-be-machined layers, wherein the thickness of each to-be-machined layer is equal;
and adjusting the relative distance between the focusing device and the workpiece to be processed through the adjusting device, and controlling the focus to be positioned on the layer to be processed.
In one embodiment, the step of adjusting the relative distance between the focusing device and the workpiece to be processed by the adjusting device and controlling the focus to be located at the layer to be processed comprises:
adjusting the relative distance between the focusing device and the workpiece to be processed through the adjusting device, and controlling the focus to be positioned on the current layer to be processed;
controlling the laser processing device to process the current layer to be processed according to a preset scanning path;
and after the current layer to be processed is processed, adjusting the focusing device to move along the first direction through the adjusting device, wherein the moving distance is equal to the thickness of the layer to be processed.
In one embodiment, the adjustment precision of the adjustment device is not more than 0.01 mm.
In one embodiment, the adjustment distance of the adjustment device is greater than the thickness of the workpiece to be processed.
In one embodiment, the thickness of the layer to be processed is not less than 0.1 mm.
A computer device comprising a memory storing a computer program and a processor implementing the steps of the method of any of the above embodiments when the processor executes the computer program.
A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the method of any of the preceding embodiments.
Compared with the prior art, the laser drilling system, the laser drilling method, the computer equipment and the readable storage medium have the advantages that the parallel laser beams emitted by the laser processing device are focused and form a focus through the focusing device. Dividing the area to be processed into a plurality of layers to be processed along a first direction according to the thickness of the area to be processed of the workpiece to be processed by the control device. And meanwhile, the control device adjusts the relative distance between the focusing device and the workpiece to be processed along a first direction through the adjusting device, and controls the focus to be positioned on the layer to be processed. This application is in the laser beam machining in-process, through controlling means with adjusting device cooperates, can adjust in real time the focus is in waiting to process the position of each layer in the region, makes the focus is located all the time wait to process the layer to reduce the tapering in processing hole, improve the machining precision.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a laser drilling system according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of an adjusting device according to an embodiment of the present disclosure;
FIG. 3 is a flow chart of a laser drilling method according to an embodiment of the present application;
FIG. 4 is a schematic view of a layered process provided in accordance with an embodiment of the present application;
fig. 5 is an internal structural diagram of a computer device according to an embodiment of the present application.
Description of reference numerals:
10. a laser drilling system; 100. a laser processing device; 101. a workpiece to be processed; 110. a laser generator; 120. a beam shaping component; 130. a reflective component; 140. scanning a galvanometer; 200. a focusing device; 300. an adjustment device; 310. a power component; 320. a motion assembly; 321. a driving member; 322. a driven member; 330. a bearing seat; 400. and a control device.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and it is therefore not intended to be limited to the embodiments disclosed below.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be considered as limiting the present application.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, an embodiment of the present application provides a laser drilling system 10. The laser drilling system 10 includes: a laser processing apparatus 100, a focusing apparatus 200, an adjusting apparatus 300, and a control apparatus 400. The laser processing apparatus 100 is configured to emit parallel laser beams. The focusing device 200 is used for focusing the parallel laser beams and forming a focal point. The adjusting device 300 is fixedly connected to the focusing device 200 and the laser processing device 100, respectively. The adjusting device 300 is used for adjusting the focusing device 200 to move in a first direction. The control device 400 is electrically connected to the laser processing device 100 and the adjustment device 300, respectively. The control device 400 is configured to divide the region to be processed into a plurality of layers to be processed along the first direction according to the thickness of the region to be processed of the workpiece 101 to be processed. The control device 400 is further configured to adjust a relative distance between the focusing device 200 and the workpiece 101 to be processed by the adjusting device 300, and control the focal point to be located at the layer to be processed. In one embodiment, a machining hole is arranged in the area to be machined.
It is to be understood that the specific structure of the laser processing apparatus 100 is not limited as long as it has a function of emitting the parallel laser beam. In one embodiment, the laser processing apparatus 100 may include a laser, a transmission fiber, a beam expander, a collimator lens, and a galvanometer lens. When laser processing is performed, laser emitted by the laser sequentially enters the beam expander and the collimating lens through the transmission optical fiber, finally enters the vibrating lens and is irradiated by the vibrating lens to emit parallel laser beams to the focusing device 200. In one embodiment, the focusing device 200 may be a focusing mirror. In one embodiment, the focal length of the focusing mirror may be selected to be 50 mm. And focusing the parallel laser beams by the focusing lens to form a focal point.
In one embodiment, the adjusting device 300 may be fixedly connected to the focusing device 200 and the laser processing device 100 by fixing brackets, respectively. It is understood that the specific structure of the adjusting device 300 is not limited as long as it has a function of adjusting the movement of the focusing device 200 in the first direction. In one embodiment, the adjustment device 300 may be a rack and pinion mechanism. In one embodiment, the adjustment device 300 may be a worm gear. In one embodiment, the adjustment device 300 may also be a ball screw structure. In one embodiment, the first direction may be a vertical direction. The relative distance between the focusing device 200 and the workpiece 101 to be processed can be adjusted by the adjusting device 300, so that the focal point formed by the focusing device 200 is always located on the layer to be processed in the region to be processed, and the taper of the processed hole can be reduced.
In one embodiment, the limit adjustment distance of the adjustment device 300 should be greater than the thickness of the workpiece 101 to be processed. In one embodiment, the limit adjustment distance of the adjustment device 300 should be greater than 5mm of the thickness of the workpiece 101 to be processed. When the adjusting device 300 adjusts the focusing device 200, the adjusting distance is sufficient to adjust the focusing device 200, so that the focal point moving position can penetrate through the thickness of the workpiece 101 to be processed during laser processing.
In one embodiment, before the laser processing of the workpiece 101 to be processed, the control device 400 may layer the region to be processed of the workpiece 101 to be processed along the first direction according to the thickness of the region to be processed. Namely, the area to be processed is divided into a plurality of layers to be processed along the first direction. Wherein the thickness of each layer is the same. In one embodiment, the material of the workpiece 101 to be processed is not limited, for example, the workpiece 101 to be processed may be an alumina ceramic substrate or an aluminum nitride ceramic substrate. In one embodiment, the thickness of the workpiece 101 to be processed is 0.3-2 mm. After the workpiece 101 to be processed is layered, the thickness of each layer to be processed should be not less than 0.1mm, so that the processing effect of each layer to be processed can be improved, and the taper of the processing hole can be reduced.
In one embodiment, the controlling device 400 adjusts the relative distance between the focusing device 200 and the workpiece 101 to be processed through the adjusting device 300, and controls the focal point to be located at the layer to be processed, by: after the laser processing apparatus 100 completes processing of the current layer to be processed, the control apparatus 400 may adjust the relative distance between the focusing apparatus 200 and the workpiece 101 to be processed by the adjusting apparatus 300, so that the focal point is located at the next layer to be processed. Namely, the control device 400 is matched with the adjusting device 300 to adjust the positions of the focus points at all layers in the region to be processed in real time, so that the focus points are always positioned at the layer to be processed, the taper of the processed hole is reduced, and the processing precision is improved. In one embodiment, the control device 400 may be an upper computer.
In one embodiment, when the control device 400 adjusts the relative distance between the focusing device 200 and the workpiece 101 to be processed through the adjusting device 300, the laser processing device 100 is kept stationary. Namely, the optical path transmission is fixed, thereby ensuring the stability of the optical path.
In this embodiment, the focusing device 200 focuses the parallel laser beam emitted from the laser processing device 100 to form a focal point. The region to be processed is divided into a plurality of layers to be processed along a first direction according to the thickness of the region to be processed of the workpiece 101 to be processed by the control device 400. Meanwhile, the control device 400 adjusts the relative distance between the focusing device 200 and the workpiece 101 to be processed in a first direction through the adjusting device 300, and controls the focal point to be located at the layer to be processed. Therefore, in the laser processing process, the control device 400 is matched with the adjusting device 300, so that the positions of the focus points in each layer of the to-be-processed area can be adjusted in real time, the focus points are always positioned on the to-be-processed layer, the taper of the processed hole is reduced, and the processing precision is improved.
Referring to fig. 2, in one embodiment, the adjusting device 300 includes: a power component 310 and a motion assembly 320. The power unit 310 is electrically connected to the control device 400. The moving assembly 320 is fixedly connected to the driving shaft of the power unit 310 and the adjusting device 300, respectively. The moving assembly 320 is used for adjusting the relative distance between the focusing device 200 and the workpiece 101 to be processed and controlling the focus to be located at the layer to be processed.
It is understood that the specific structure of the power unit 310 is not limited as long as it can move the moving assembly 320. In one embodiment, the power component 310 may be a common rotating electrical machine. In one embodiment, the power component 310 may also be a servo ac motor. The position of the focusing device 200 can be fed back to the control device 400 in real time by adopting the servo alternating current motor, so that the control device 400 can conveniently control the focusing device 200, and the control precision is improved.
It is understood that the specific structure of the moving assembly 320 is not limited as long as it has the function of adjusting the relative distance between the focusing device 200 and the workpiece 101 to be processed and controlling the focal point to be located at the layer to be processed. In one embodiment, the motion assembly 320 may be a rack and pinion mechanism. In one embodiment, the motion assembly 320 may also include: a driving member 321 and a driven member 322. Specifically, the driving member 321 is fixedly connected to the driving shaft of the power member 310. The driven member 322 is in transmission connection with the driving member 321. The follower 322 is fixedly connected to the adjusting device 300.
In one embodiment, the driving member 321 may be a precision ball screw. The follower 322 may be a nut socket. In one embodiment, the driving member 321 may be fixedly connected to the driving shaft of the power member 310 by a snap. In one embodiment, the driving member 321 may also be fixedly connected to the driving shaft of the power member 310 by a bolt. In one embodiment, the driven member 322 and the driving member 321 may be connected by a screw transmission. Specifically, the driving member 321 is provided with an external thread, and the driven member 322 is provided with an internal thread matched with the external thread. Thus, the driven part 322 and the driving part 321 can be connected in a transmission manner.
In one embodiment, the maximum moving distance of the driven member 322 on the driving member 321 should be greater than the thickness of the workpiece 101 to be processed. In one embodiment, the maximum moving distance may be greater than 5mm of the thickness of the workpiece 101 to be processed. Thus, when the driven part 322 adjusts the focusing device 200, the driven part 322 has a sufficient adjustment distance on the driving part 321 to realize the adjustment of the focusing device 200, thereby ensuring that the focal point moving position can penetrate through the thickness of the workpiece 101 to be processed during laser processing.
In one embodiment, the follower 322 and the adjusting device 300 can be fixedly connected by a snap or a screw. When the control device 400 controls the power component 310 to rotate, the driving shaft of the power component 310 can drive the driving member 321 to rotate. Then, the driving part 321 may drive the driven part 322 to move along the first direction, so that the focusing device 200 moves along the first direction synchronously, thereby adjusting the relative distance between the focusing device 200 and the workpiece 101 to be processed, so that the focus is always located on the layer to be processed, and further reducing the taper of the processed hole. While the laser machining apparatus 100 remains stationary. Namely, the optical path transmission is fixed, and the stability of the optical path is ensured.
In one embodiment, the adjusting apparatus 300 further comprises: a bearing housing 330. The bearing seat 330 is sleeved on the driving member 321. The bearing seat 330 is fixedly connected to the laser processing apparatus 100. In one embodiment, the driving member 321 can rotate in the bearing seat 330. In one embodiment, the bearing housing 330 and the laser processing apparatus 100 may be fixedly connected by a bracket.
In one embodiment, the laser processing apparatus 100 includes: a laser generator 110, a beam shaping assembly 120, a reflecting assembly 130, and a scanning galvanometer 140. The laser generator 110 is electrically connected to the control device 400. The beam shaping component 120 is configured to expand and collimate the laser generated by the laser generator 110 and form the parallel laser beam. The reflection assembly 130 is used for reflecting and transmitting the parallel laser beams. The scanning galvanometer 140 is electrically connected with the control device 400. The scanning galvanometer 140 is configured to plan a path of the parallel laser beam reflected and transmitted by the reflection assembly 130 according to a preset processing shape, and transmit the planned parallel laser beam to the focusing device 200.
In one embodiment, the laser generator 110 may employ a 500W infrared continuous fiber laser. Preferably, the laser power of the laser generator 110 is 250-350W, and the wavelength is 1064-1070 nm. It is understood that the specific structure of the beam shaping component 120 is not limited as long as it has the functions of expanding and collimating the laser generated by the laser generator 110 and forming the parallel laser beams. In one embodiment, the beam shaping assembly 120 may include a beam expander and a collimator. In one embodiment, the beam shaping component 120 may also include an aperture. The laser generated by the laser generator 110 is expanded and collimated by the beam shaping component 120, and the parallel laser beam is formed and transmitted to the reflection component 130.
In one embodiment, the reflective component 130 can comprise two or more mirrors. The parallel laser beams are transmitted to the scanning galvanometer 140 by the cooperation of a plurality of reflecting mirrors. In one embodiment, the scanning galvanometer 140 may be a conventional scanning galvanometer. The parallel laser beams reflected and transmitted by the reflection assembly 130 are subjected to path planning according to a preset processing shape through the scanning galvanometer 140, and the planned parallel laser beams are transmitted to the focusing device 200. In one embodiment, the predetermined machining shape may be input to the scanning galvanometer 140 via the control device 400. Wherein, the preset processing shape can be a round hole, an elliptical hole, a square hole, a special-shaped hole and the like.
Referring to fig. 3, an embodiment of the present application provides a laser drilling method applied to the laser drilling system 10 of any one of the above embodiments. The method comprises the following steps:
s102: and layering the to-be-processed region according to the thickness of the to-be-processed region of the to-be-processed workpiece 101, and obtaining a plurality of to-be-processed layers, wherein the thickness of each to-be-processed layer is equal.
In one embodiment, the control device 400 may be used to layer the to-be-processed region of the to-be-processed workpiece 101 along the first direction according to the thickness of the to-be-processed region, and obtain a plurality of to-be-processed layers, where the thickness of each of the to-be-processed layers is equal. In one embodiment, the thickness of the workpiece 101 to be processed is 0.3-2 mm. After the workpiece 101 to be processed is layered, the thickness of each layer to be processed should be not less than 0.1mm, so that the processing effect of each layer to be processed can be improved, and the taper of the processing hole can be reduced. In one embodiment, the first direction may be a vertical direction.
In one embodiment, the workpiece 101 to be processed may be first fixed on a jig platform before the area to be processed is layered. Then, the jig platform can be moved to the position below the focusing device 200 by a moving platform (such as an X-axis moving platform and a Y-axis moving platform), and the region to be processed of the workpiece 101 to be processed is located below the focusing device 200. Next, the laser power of the laser processing apparatus 100 may be selected. In one embodiment, the laser power is 250-. After the laser power is selected, the focusing device 200 can be adjusted by a Z-axis moving platform, so that the focal point is 1-2mm away from the upper surface of the workpiece 101 to be processed. At the same time, the focusing assembly 200 is located at the upper limit of the adjustment assembly 300. The Z-axis moving stage may be fixed at this time so that the laser processing apparatus 100 is fixed. Namely, the optical path transmission is fixed, thereby ensuring the stability of the optical path. Step S102 may then be performed.
In an embodiment, please refer to the above embodiment for the specific structure of the laser processing apparatus 100, the focusing apparatus 200, the adjusting apparatus 300, and the control apparatus 400, which is not described herein again.
S104: the relative distance between the focusing device 200 and the workpiece 101 to be processed is adjusted by the adjusting device 300, and the focus is controlled to be located at the layer to be processed.
In one embodiment, the control device 400 can adjust the relative distance between the focusing device 200 and the workpiece 101 to be processed through the adjusting device 300, and control the focal point to be located at the layer to be processed. Specifically, the control device 400 may first adjust the relative distance between the focusing device 200 and the workpiece 101 to be processed through the adjusting device 300, and control the focal point to be located at the current layer to be processed. That is, the focusing device 200 is adjusted by the adjusting device 300 to move downwards, so that the focal point is located at the current layer to be processed, and the adjusting device 300 stops moving.
Then, the control device 400 may control the laser processing device 100 to process the current layer to be processed according to a preset scanning path. In one embodiment, the preset scanning path is not limited in manner, for example, the preset scanning path may be a circular scanning or a spiral scanning. After the layer to be processed is processed, the control device 400 may further adjust the focusing device 200 to move along the first direction through the adjusting device 300, where the moving distance is equal to the thickness of the layer to be processed.
That is, after the layer to be processed is processed, the adjusting device 300 may adjust the focusing device 200 to move toward the workpiece 101 to be processed (i.e., the first direction), and control the distance of movement to be equal to the thickness of the layer to be processed (as shown in fig. 4). This allows the focal point to be located at the next layer to be processed. Then, the control device 400 may control the laser processing device 100 to process the current layer to be processed according to a preset scanning path. And repeating the logic until all the layers to be processed of the areas to be processed are processed.
In one embodiment, if the workpiece 101 to be processed is an aluminum nitride ceramic substrate, the thickness of the aluminum nitride ceramic substrate is 0.6mm, the diameter of the processing hole is 50-120 μm, and the focal length of the focusing device 200 is 50 mm. During machining, the workpiece 101 to be machined is first placed in a machining position. Then, the machining process of the workpiece 101 to be machined can be divided into three layers according to the thickness of the aluminum nitride ceramic substrate, and the machining depth of each layer is 0.2 mm. The laser processing apparatus 100 performs light scanning at a predetermined diameter in each layer. When processing the first layer, the focusing device 200 is 49.9mm away from the upper surface of the workpiece 101 to be processed. And then, when the number of the processing layers is increased by one layer, the adjusting device 300 drives the focusing device 200 to move downwards by 0.2 mm. Correspondingly, the focus is moved downwards by 0.2mm, so that the consistency of the aperture of the workpiece to be processed 101 in the processing direction is realized, the taper of the processed hole is reduced, and the processing precision is improved.
In this embodiment, by adopting the above method steps, the positions of the focus in each layer of the to-be-processed region can be adjusted in real time during the laser processing, so that the focus is always located in the to-be-processed layer, thereby reducing the taper of the processed hole and improving the processing precision.
In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as shown in fig. 5. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a laser drilling method. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the computer equipment, an external keyboard, a touch pad or a mouse and the like.
Those skilled in the art will appreciate that the architecture shown in fig. 5 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
Referring to fig. 5, another embodiment of the present application provides a computer device, which includes a memory and a processor, where the memory stores a computer program, and the processor implements the steps of the laser drilling method according to any one of the above embodiments when executing the computer program.
In one embodiment, the processor, when executing the computer program, performs the steps of:
s102: layering the to-be-processed region according to the thickness of the to-be-processed region of the to-be-processed workpiece 101, and obtaining a plurality of to-be-processed layers, wherein the thickness of each to-be-processed layer is equal;
s104: the relative distance between the focusing device 200 and the workpiece 101 to be processed is adjusted by the adjusting device 300, and the focus is controlled to be located at the layer to be processed.
An embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, implements the steps of the laser drilling method according to any one of the above embodiments.
In one embodiment, the computer program when executed by the processor implements the steps of:
s102: layering the to-be-processed region according to the thickness of the to-be-processed region of the to-be-processed workpiece 101, and obtaining a plurality of to-be-processed layers, wherein the thickness of each to-be-processed layer is equal;
s104: the relative distance between the focusing device 200 and the workpiece 101 to be processed is adjusted by the adjusting device 300, and the focus is controlled to be located at the layer to be processed.
The computer device and the computer-readable storage medium layer the to-be-processed region according to the thickness of the to-be-processed region of the to-be-processed workpiece 101, and obtain a plurality of to-be-processed layers. The relative distance between the focusing device 200 and the workpiece 101 to be processed is adjusted by the adjusting device 300, and the focus is controlled to be located at the layer to be processed. In the laser processing process, the positions of all layers of the focus in the to-be-processed area can be adjusted in real time, so that the focus is always positioned on the to-be-processed layer, the taper of a processed hole is reduced, and the processing precision is improved.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (12)
1. A laser drilling system, comprising:
the laser processing device is used for emitting parallel laser beams;
a focusing device for focusing the parallel laser beams and forming a focal point;
the adjusting device is fixedly connected with the focusing device and the laser processing device respectively and used for adjusting the focusing device to move along a first direction; and
the control device is respectively electrically connected with the laser processing device and the adjusting device, and is used for dividing the region to be processed into a plurality of layers to be processed along the first direction according to the thickness of the region to be processed of the workpiece to be processed, adjusting the relative distance between the focusing device and the workpiece to be processed through the adjusting device, and controlling the focus to be positioned on the layer to be processed.
2. The laser drilling system of claim 1, wherein the adjustment device comprises:
the power component is electrically connected with the control device;
and the moving assembly is respectively and fixedly connected with the driving shaft of the power part and the adjusting device, and is used for adjusting the relative distance between the focusing device and the workpiece to be processed and controlling the focus to be positioned on the layer to be processed.
3. The laser drilling system of claim 2, wherein the motion assembly comprises:
the driving part is fixedly connected with a driving shaft of the power part; and
and the driven part is in transmission connection with the driving part and is fixedly connected with the adjusting device.
4. The laser drilling system of claim 3, wherein the adjustment device further comprises:
and the bearing block is sleeved on the driving piece and is fixedly connected with the laser processing device.
5. The laser drilling system of claim 1, wherein the laser machining device comprises:
the laser generator is electrically connected with the control device;
the beam shaping assembly is used for expanding and collimating the laser generated by the laser generator and forming the parallel laser beam;
the reflecting component is used for reflecting and transmitting the parallel laser beams; and
and the scanning galvanometer is electrically connected with the control device and is used for planning the path of the parallel laser beam reflected and transmitted by the reflecting component according to a preset processing shape and transmitting the planned parallel laser beam to the focusing device.
6. A laser drilling method, applied to the laser drilling system according to any one of claims 1 to 5, the method comprising:
layering the to-be-machined area according to the thickness of the to-be-machined area of the to-be-machined workpiece, and obtaining a plurality of to-be-machined layers, wherein the thickness of each to-be-machined layer is equal;
and adjusting the relative distance between the focusing device and the workpiece to be processed through the adjusting device, and controlling the focus to be positioned on the layer to be processed.
7. The laser drilling method according to claim 6, wherein the step of adjusting the relative distance between the focusing means and the workpiece to be processed by the adjusting means and controlling the focal point to be located at the layer to be processed comprises:
adjusting the relative distance between the focusing device and the workpiece to be processed through the adjusting device, and controlling the focus to be positioned on the current layer to be processed;
controlling a laser processing device to process the current layer to be processed according to a preset scanning path;
and after the current layer to be processed is processed, adjusting the focusing device to move along the first direction through the adjusting device, wherein the moving distance is equal to the thickness of the layer to be processed.
8. The laser drilling method of claim 6, wherein the adjustment precision of the adjustment device is not greater than 0.01 mm.
9. The laser drilling method of claim 6, wherein an adjustment distance of the adjustment device is greater than a thickness of the workpiece to be processed.
10. The laser drilling method according to any one of claims 6 to 9, wherein the thickness of the layer to be processed is not less than 0.1 mm.
11. A computer device comprising a memory and a processor, the memory storing a computer program, wherein the processor implements the steps of the method of any one of claims 6 to 9 when executing the computer program.
12. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 6 to 9.
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