CN112372146A - Laser lettering processing method - Google Patents

Laser lettering processing method Download PDF

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Publication number
CN112372146A
CN112372146A CN202011223605.9A CN202011223605A CN112372146A CN 112372146 A CN112372146 A CN 112372146A CN 202011223605 A CN202011223605 A CN 202011223605A CN 112372146 A CN112372146 A CN 112372146A
Authority
CN
China
Prior art keywords
lettering
plating
processing
processing method
carrying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011223605.9A
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Chinese (zh)
Inventor
田叶青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guizhou Aerospace Electronic Technology Co Ltd
Original Assignee
Guizhou Aerospace Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guizhou Aerospace Electronic Technology Co Ltd filed Critical Guizhou Aerospace Electronic Technology Co Ltd
Priority to CN202011223605.9A priority Critical patent/CN112372146A/en
Publication of CN112372146A publication Critical patent/CN112372146A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B05D7/16—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies using synthetic lacquers or varnishes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B05D7/26—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials synthetic lacquers or varnishes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B05D2202/20—Metallic substrate based on light metals
    • B05D2202/25—Metallic substrate based on light metals based on Al
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B05D2202/40—Metallic substrate based on other transition elements
    • B05D2202/45—Metallic substrate based on other transition elements based on Cu

Abstract

The invention provides a laser lettering processing method, which comprises at least two of the following steps: lettering: carrying out laser lettering on the surface of a part to be lettered; painting: spraying paint on the surface of the part to be engraved; plating: plating the surface of the part to be engraved; the method comprises the following steps of (1) carrying out a painting step and then carrying out a carving step on a part to be carved which needs to be painted; for parts to be engraved without painting, the engraving step is firstly carried out and then the plating step is carried out. The invention has the advantages of simple and standard operation, less processing errors, low repair rate, greatly simplified flow and low randomness.

Description

Laser lettering processing method
Technical Field
The invention relates to a laser lettering processing method.
Background
The laser lettering process is generally reflected in the process route of the main process (machining process rule, assembly process rule and welding process rule), so the technical requirements of laser lettering are only reflected in the main process, the concise and clear standard is lacked, the processing parameters are set by the experience of an operator, the operation is not standard, the randomness is large, the unified standard is lacked, and the quality of finished parts is not unified, and the repair rate is high.
Disclosure of Invention
In order to solve the technical problems, the invention provides a laser lettering processing method which effectively reduces randomness through simple, standard and effective steps, thereby effectively reducing the repair rate.
The invention is realized by the following technical scheme.
The invention provides a laser lettering processing method, which comprises at least two of the following steps:
lettering: carrying out laser lettering on the surface of a part to be lettered;
painting: spraying paint on the surface of the part to be engraved;
plating: plating the surface of the part to be engraved;
the method comprises the following steps of (1) carrying out a painting step and then carrying out a carving step on a part to be carved which needs to be painted; for parts to be engraved without painting, the engraving step is firstly carried out and then the plating step is carried out.
And for the part to be engraved and painted, firstly, carrying out a plating step and then carrying out a painting step.
In the lettering step, the lettering depth is 0.1-0.3 mm.
In the lettering step, the laser frequency is 20-30 KHz.
In the lettering step, if the part to be lettered is made of aluminum alloy or copper alloy, the processing parameters are as follows: the number of processing is 14-19/time, the speed is 100-300 mm/s, and the power is 70-80%.
In the lettering step, if the material of the part to be lettered is steel, the processing parameters are as follows: the number of processing is 21-24/time, the speed is 90-100 mm/s, and the power is 55-60%.
In the lettering step, if the part to be lettered is made of rubber, the processing parameters are as follows: the number of processing is 18-20/time, the speed is 90-100 mm/s, and the power is 70-90%.
In the lettering step, if the part to be lettered is made of bakelite, the processing parameters are as follows: the number of processing is 8-10/time, the speed is 500-510 mm/s, and the power is 55-60%.
The invention has the beneficial effects that: the method has the advantages of simple and standard operation, few processing errors, low repair rate, greatly simplified flow and low randomness.
Drawings
FIG. 1 is a schematic flow diagram of one embodiment of the present invention.
Detailed Description
The technical solution of the present invention is further described below, but the scope of the claimed invention is not limited to the described.
The invention provides a laser lettering processing method, which comprises at least two of the following steps:
lettering: carrying out laser lettering on the surface of a part to be lettered;
painting: spraying paint on the surface of the part to be engraved;
plating: plating the surface of the part to be engraved;
the method comprises the following steps of (1) carrying out a painting step and then carrying out a carving step on a part to be carved which needs to be painted; for parts to be engraved without painting, the engraving step is firstly carried out and then the plating step is carried out.
For the part to be engraved and required to be painted, the painting step is carried out after the plating step is carried out.
In the lettering step, the lettering depth is 0.1-0.3 mm.
In the lettering step, the laser frequency is 20-30 KHz.
In the carving step, if the part to be carved is made of aluminum alloy or copper alloy, the processing parameters are as follows: the number of processing is 14-19/time, the speed is 100-300 mm/s, and the power is 70-80%.
In the carving step, if the material of the part to be carved is steel, the processing parameters are as follows: the number of processing is 21-24/time, the speed is 90-100 mm/s, and the power is 55-60%.
In the lettering step, if the part to be lettered is made of rubber, the processing parameters are as follows: the number of processing is 18-20/time, the speed is 90-100 mm/s, and the power is 70-90%.
In the carving step, if the part to be carved is made of bakelite, the processing parameters are as follows: the number of processing is 8-10/time, the speed is 500-510 mm/s, and the power is 55-60%.
In general, the processing parameters for the specific operation of the present invention are shown in Table 1, depending on the material.
TABLE 1 processing parameters
Material for parts Number of working operations/number of times Speed mm/s Power/%)
Aluminium alloy 14～16 100～300 70～75
Copper alloy 16～19 100～300 75～80
Steel 21～24 90～100 55～60
Rubber composition 18～20 90～100 70～90
Bakelite 8～10 500～510 55～60
The specific process arrangement is shown in table 2 according to the requirements of the parts to be engraved.
TABLE 2 depth of lettering
Item Process arrangement Depth of lettering/mm
Parts without spraying finish after plating Lettering → plating 0.1～0.15
Parts needing spraying finish after plating Plating → spray painting → lettering 0.2～0.3
Parts without plating and needing spraying finish Spray painting → lettering 0.2～0.25
Example 1
The scheme is adopted, and specifically comprises the following steps as shown in figure 1:
preparing materials: cleaning a part to be engraved, wiping and drying;
sequentially carrying out plating, spray painting and lettering operations;
cleaning: removing burrs at the lettering part and dust on the surface of the part;
warehousing: and packaging with telephone paper or capacitor paper, and storing.

Claims (8)

1. A laser lettering processing method is characterized in that: comprises at least two of the following steps:
lettering: carrying out laser lettering on the surface of a part to be lettered;
painting: spraying paint on the surface of the part to be engraved;
plating: plating the surface of the part to be engraved;
the method comprises the following steps of (1) carrying out a painting step and then carrying out a carving step on a part to be carved which needs to be painted; for parts to be engraved without painting, the engraving step is firstly carried out and then the plating step is carried out.
2. The laser engraving processing method of claim 1, wherein: and for the part to be engraved and painted, firstly, carrying out a plating step and then carrying out a painting step.
3. The laser engraving processing method of claim 1, wherein: in the lettering step, the lettering depth is 0.1-0.3 mm.
4. The laser engraving processing method of claim 1, wherein: in the lettering step, the laser frequency is 20-30 KHz.
5. The laser engraving processing method of claim 1, wherein: in the lettering step, if the part to be lettered is made of aluminum alloy or copper alloy, the processing parameters are as follows: the number of processing is 14-19/time, the speed is 100-300 mm/s, and the power is 70-80%.
6. The laser engraving processing method of claim 1, wherein: in the lettering step, if the material of the part to be lettered is steel, the processing parameters are as follows: the number of processing is 21-24/time, the speed is 90-100 mm/s, and the power is 55-60%.
7. The laser engraving processing method of claim 1, wherein: in the lettering step, if the part to be lettered is made of rubber, the processing parameters are as follows: the number of processing is 18-20/time, the speed is 90-100 mm/s, and the power is 70-90%.
8. The laser engraving processing method of claim 1, wherein: in the lettering step, if the part to be lettered is made of bakelite, the processing parameters are as follows: the number of processing is 8-10/time, the speed is 500-510 mm/s, and the power is 55-60%.
CN202011223605.9A 2020-11-05 2020-11-05 Laser lettering processing method Pending CN112372146A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011223605.9A CN112372146A (en) 2020-11-05 2020-11-05 Laser lettering processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011223605.9A CN112372146A (en) 2020-11-05 2020-11-05 Laser lettering processing method

Publications (1)

Publication Number Publication Date
CN112372146A true CN112372146A (en) 2021-02-19

Family

ID=74578319

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011223605.9A Pending CN112372146A (en) 2020-11-05 2020-11-05 Laser lettering processing method

Country Status (1)

Country Link
CN (1) CN112372146A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2021117A1 (en) * 1989-07-14 1991-01-15 David J. Bauer Arrangement for forming an air bag deployment opening
CN1785693A (en) * 2004-12-10 2006-06-14 闳晖实业股份有限公司 Surface treatment method
CN201410842Y (en) * 2009-06-18 2010-02-24 郑杰纯 Novel aluminum gusset decorative material
CN104786688A (en) * 2015-04-02 2015-07-22 贵州航天电子科技有限公司 Method for carving characters on lacquered panel
CN111185676A (en) * 2019-10-30 2020-05-22 绍兴易捷信息技术有限公司 Two-dimensional code manufacturing method based on laser marking

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2021117A1 (en) * 1989-07-14 1991-01-15 David J. Bauer Arrangement for forming an air bag deployment opening
CN1785693A (en) * 2004-12-10 2006-06-14 闳晖实业股份有限公司 Surface treatment method
CN201410842Y (en) * 2009-06-18 2010-02-24 郑杰纯 Novel aluminum gusset decorative material
CN104786688A (en) * 2015-04-02 2015-07-22 贵州航天电子科技有限公司 Method for carving characters on lacquered panel
CN111185676A (en) * 2019-10-30 2020-05-22 绍兴易捷信息技术有限公司 Two-dimensional code manufacturing method based on laser marking

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
关振中: "《激光加工工艺手册》", 31 October 2007 *

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Application publication date: 20210219