CN112367768B - Processing method of embedded unit circuit board - Google Patents
Processing method of embedded unit circuit board Download PDFInfo
- Publication number
- CN112367768B CN112367768B CN202011380019.5A CN202011380019A CN112367768B CN 112367768 B CN112367768 B CN 112367768B CN 202011380019 A CN202011380019 A CN 202011380019A CN 112367768 B CN112367768 B CN 112367768B
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- unit circuit
- circuit board
- substrate
- pressure
- processing
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- 238000003672 processing method Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 238000001514 detection method Methods 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 27
- 238000004080 punching Methods 0.000 claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 238000007781 pre-processing Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a processing method of an embedded unit circuit board, which comprises the following steps: preparing a substrate and carrying out pretreatment on the substrate; carrying out outline stamping on the substrate by using a punch press to obtain the outline of the unit circuit board; punching the hole and the groove of the substrate by using a punch press to obtain the hole and the groove on the substrate; carrying out flattening stamping on the substrate by using a punch press so as to flatten the surface of the unit circuit board; and carrying out pressure detection on the unit circuit board by using a pressure detection device. The method for integrally processing all the unit circuit boards is adopted, the outlines of all the unit circuit boards on one substrate are punched and formed at one time, the pressure born by each processed board body is consistent, and the final detection procedure further ensures that the pressure bearing capacity of the unit circuit boards is within a specified range. The method improves the appearance processing production efficiency of the unit circuit board, improves the appearance of a single surface and effectively reduces the appearance processing cost.
Description
Technical Field
The invention relates to the field of circuit board processing, in particular to a processing method of an embedded unit circuit board.
Background
In the PCB manufacturing industry, in order to improve the production efficiency, several unit boards are usually assembled into a large board, and after most of the processes are completed, the exterior manufacturing is usually completed by punching or routing. The traditional processing mode generally carries out independent stamping on each circuit board on one substrate, which easily causes different pressed degrees of different unit circuit boards on one substrate, cannot ensure the consistent pressure bearing capacity of the unit circuit boards, and has great influence on the next processing, so that the finally obtained unit circuit boards are difficult to determine in quality, the quality of subsequent processing is influenced, the defective rate is improved, the processing cost of the unit circuit boards is improved, and the processing efficiency is reduced; the separate processing also causes the appearance of the unit circuit board to be different, and the product appearance is influenced.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a processing method of an embedded unit circuit board, which can improve the appearance processing production efficiency, improve the appearance of the unit circuit board and effectively reduce the processing cost of the unit circuit board.
The processing method of the embedded unit circuit board according to the embodiment of the invention comprises the following steps: preparing a substrate and carrying out pre-processing, and obtaining a plurality of unit circuit boards on the substrate, wherein the unit circuit boards are arranged to be matched with each stamping die; carrying out contour stamping on the substrate to obtain the contours of the unit circuit boards; carrying out hole and groove punching on the substrate to obtain a hole and groove on the substrate; carrying out flattening stamping on the substrate to flatten the surface of the unit circuit board; the whole processing of all the unit circuit boards leads the outlines of all the unit circuit boards on one substrate to be punched and formed at one time, and the pressure applied to each unit circuit board by the punching machine in one-time processing is the same, thus leading the pressure born by each processed board body to be consistent; and carrying out pressure detection on the unit circuit board, wherein the pressure detection specifically comprises the steps of placing the substrate below a pressure detection device, enabling a joint of the pressure detection device to be abutted against the unit circuit board, setting the downward pressure of the pressure detection device, enabling the joint to press down the unit circuit board by the downward pressure, and observing whether the unit circuit board falls off from the substrate so as to judge whether the pressure bearing capacity of the unit circuit board is qualified.
The processing method of the embedded unit circuit board provided by the embodiment of the invention at least has the following beneficial effects: the method for integrally processing all the unit circuit boards is adopted, the outlines of all the unit circuit boards on one substrate are punched and formed at one time, the pressure applied to each unit circuit board by the punch press in one-time processing is the same, the pressure born by each processed board body is consistent, and the final detection procedure further ensures that the pressure bearing capacity of the unit circuit boards is within a specified range. The punching of the hole slot and the flat punching enable the unit circuit board to be more beautiful and elegant. The method improves the appearance processing production efficiency of the unit circuit board, improves the appearance of a single surface and effectively reduces the appearance processing cost.
According to some embodiments of the invention, the step of performing contour punching on the substrate specifically comprises: and putting the substrate into a processing station of a punch press, and punching the substrate through a first upper die and a first lower die so as to punch the appearance of the unit circuit board.
According to some embodiments of the present invention, the first upper mold includes a plurality of protrusions spaced apart from each other, the protrusions being fitted with the unit circuit board in shape, and the first lower mold further includes a plurality of recesses fitted with positions of the protrusions, the recesses being fitted with the unit circuit board in shape.
According to some embodiments of the present invention, the step of punching the hole and the groove on the substrate specifically includes: and putting the substrate into a processing station of a punch press, and punching the substrate through a second upper die and a second lower die so as to punch the technical edges of the unit circuit board and the groove positions on the periphery of the unit circuit board.
According to some embodiments of the invention, the second upper die comprises uniformly distributed bar-shaped protrusions, and the second lower die comprises bar-shaped grooves matched with the bar-shaped protrusions.
According to some embodiments of the present invention, the step of performing the flattening and pressing on the substrate specifically includes: and putting the substrate into a processing station of a punch press, and punching the substrate through a third upper die and a third lower die so as to level the surface of the unit circuit board.
According to some embodiments of the invention, the third upper die and the third lower die each comprise a smooth flat surface.
According to some embodiments of the present invention, the step of performing pressure detection on the unit circuit board by using a pressure detection device specifically includes: and placing the substrate below a pressure detection device, enabling a joint of the pressure detection device to be abutted against the unit circuit board, setting the downward pressure of the pressure detection device, enabling the joint to press the unit circuit board with the downward pressure, and observing whether the unit circuit board falls off from the substrate to judge whether the pressure bearing capacity of the unit circuit board is qualified.
According to some embodiments of the invention, the pressure detection device comprises a detection body, the detection body comprises a pressure gauge, a joint and the adjusting mechanism, the adjusting mechanism comprises an adjusting handle, and the adjusting handle is connected with the pressure gauge and the joint.
According to some embodiments of the present invention, the pressure detection apparatus further comprises a pressure-bearing mold disposed below the joint, the pressure-bearing mold being provided with a through hole that is shape-fitted to the unit circuit board. Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic view of a method for processing an embedded unit circuit board according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a first upper mold of a method for processing an embedded unit circuit board according to an embodiment of the invention;
FIG. 3 is a second top mold of the method for processing the embedded unit circuit board according to the embodiment of the present invention;
FIG. 4 is a schematic view of a pressure gauge of a method for processing an in-cell circuit board according to an embodiment of the present invention;
fig. 5 is a schematic view of a pressure-bearing mold of a method for processing an embedded unit circuit board according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1, a method for processing an embedded unit circuit board according to an embodiment of the present invention includes the following steps:
s1: preparing a substrate and carrying out pretreatment on the substrate;
s2: carrying out outline stamping on the substrate by using a punch press to obtain the outline of the unit circuit board;
s3: punching the hole and the groove of the substrate by using a punch press to obtain the hole and the groove on the substrate;
s4: carrying out flattening stamping on the substrate by using a punch press so as to flatten the surface of the unit circuit board;
s5: and carrying out pressure detection on the unit circuit board by using a pressure detection device.
The method for integrally processing all the unit circuit boards is adopted, the outlines of all the unit circuit boards on one substrate are punched and formed at one time, the pressure applied to each unit circuit board by the punch press in one-time processing is the same, the pressure born by each processed board body is consistent, and the final detection procedure further ensures that the pressure bearing capacity of the unit circuit boards is within a specified range. The punching of the hole slot and the flat punching enable the unit circuit board to be more beautiful and elegant. The method improves the appearance processing production efficiency of the unit circuit board, improves the appearance of a single surface and effectively reduces the appearance processing cost.
In some embodiments of the present invention, a substrate is prepared and subjected to a pre-processing, including processes of screen printing, electronic component soldering, and the like, on the substrate, a plurality of unit circuit boards are processed on the substrate, and the arrangement of the unit circuit boards is matched with each stamping die, so as to facilitate subsequent processing.
In some embodiments of the present invention, the step of performing contour stamping on the substrate specifically includes: and putting the substrate into a processing station of a punch press, and punching the substrate through a first upper die 100 and a first lower die so as to punch the appearance of the unit circuit board. Specifically, the first upper die 100 and the first lower die are replaceable to meet unit circuit boards of different sizes and requirements, and the pressure bearing capacity of the unit circuit board can be adjusted by adjusting the depth and the height of the first upper die 100 and the first lower die, so as to meet the requirements of different customers.
In some embodiments of the present invention, the first upper mold 100 includes a plurality of protrusions 110 disposed at intervals, the protrusions 110 are matched with the unit circuit boards in shape, the first lower mold further includes a plurality of recesses, the recesses are matched with the protrusions 110 in position, the recesses are matched with the unit circuit boards in shape, the protrusions 100 and the recesses are matched to complete the molding of the unit circuit boards, and the positions and sizes of the recesses and the protrusions 110 are adjusted to correspond to the unit circuit boards with different requirements; the thickness of the connection part of the unit circuit board and the substrate can be adjusted by correspondingly adjusting the depth of the concave part and the height of the protrusion 110, so that the pressure bearing capacity of the unit circuit board can be changed, and the requirements of different customers can be met.
In some embodiments of the present invention, the step of punching the hole and the groove on the substrate specifically includes: and putting the substrate into a processing station of a punch press, and punching the substrate through a second upper die 200 and a second lower die so as to punch the technical edges of the unit circuit boards and the groove positions on the periphery of the unit circuit boards.
In some embodiments of the present invention, the second upper mold 200 includes strip-shaped protrusions 210 uniformly distributed, and the second lower mold includes strip-shaped grooves matched with the strip-shaped protrusions 210, and the strip-shaped grooves separate the unit circuit boards on the same substrate, so as to define the area of each unit circuit board, make the subsequent processing more clear, facilitate identification, and make the board more beautiful.
In some embodiments of the present invention, the second upper mold 200 further includes a process edge protrusion disposed on the periphery and a process edge groove disposed on the second lower mold and corresponding to the process edge protrusion, for processing the process edge with a rounded corner of the substrate, so that the substrate is more beautiful and elegant.
In some embodiments of the present invention, the step of performing a flattening and pressing on the substrate specifically includes: and putting the substrate into a processing station of a punch press, and punching the substrate through a third upper die and a third lower die to level the surface of the unit circuit board, so that the appearance of the unit circuit board is more attractive and elegant.
In some embodiments of the present invention, the third upper mold and the third lower mold each include a smooth plane to flatten a surface of the unit circuit board. Specifically, the third upper die and the third lower die with different degrees of finish can be replaced, and unit circuit boards with different degrees of finish can be processed to meet market demands.
In some embodiments of the present invention, the step of using the pressure detection device to detect the pressure of the unit circuit board specifically includes: and placing the substrate below a pressure detection device, enabling a connector 320 of the pressure detection device to be abutted to the unit circuit board, setting the downward pressure of the pressure detection device, enabling the connector 320 to press the unit circuit board with the downward pressure, and observing whether the unit circuit board falls off from the substrate.
In some embodiments of the present invention, the pressure detecting device comprises a pressure gauge 300, the pressure gauge 300 comprises a pressure gauge 310, the joint 320 and the adjusting mechanism, the adjusting mechanism comprises an adjusting handle 330, and the adjusting handle 330 connects the pressure gauge 310 and the joint 320; the adjusting mechanism may also be a wheel or an electronic screen as an input mechanism of the pressure information, and is not limited in particular. The pressure information output by the adjustment mechanism can be observed by the pressure gauge 310 to confirm that the pressure at that time is within the specified range. Further, the connector 320 may be replaced with different sizes and models to correspond to unit circuit boards of different sizes and shapes.
In some embodiments of the present invention, the pressure detection apparatus further includes a pressure-bearing mold 400, the pressure-bearing mold 400 is disposed below the joint 320, and the pressure-bearing mold 400 is provided with a through hole 410 that is shape-fitted to the unit circuit board. Specifically, the shape of the through hole 410 is the same as that of the unit circuit board, but the size of the through hole is larger than that of the unit circuit board, so that the circuit board can fall down through the through hole 410 after falling off, and therefore, a detection result can be obviously observed. Further, the through holes 410 with different shapes and sizes are arranged on the pressure-bearing mold 400 to match the unit circuit boards with different shapes and sizes, so that the use is flexible, and the cost is saved.
The processing method of the embedded unit circuit board as the best embodiment of the invention comprises the following steps:
s01: preparing a substrate and carrying out pre-processing on the substrate, wherein the pre-processing comprises the processes of silk-screen printing, electronic component welding and the like on the substrate, and a plurality of unit circuit boards are obtained by processing on the substrate;
s02: placing the substrate into a processing station of a punch press, and punching the substrate through a first upper die 100 and a first lower die to punch out the appearance of the unit circuit board;
s03: putting the substrate into a processing station of a punch press, and punching the substrate through a second upper die 200 and a second lower die to punch out the technical edge of the unit circuit board and the groove positions on the periphery of the unit circuit board;
s04: will the base plate is put into punch press processing station, and is right through mould and third lower mould on the third the base plate carries out the punching press to level the surface of unit circuit board makes the outward appearance of unit circuit board more elegant appearance:
s05: and placing the substrate below a pressure detection device, enabling a connector 320 of the pressure detection device to be abutted to the unit circuit board, setting the downward pressure of the pressure detection device, enabling the connector 320 to press the unit circuit board with the downward pressure, and observing whether the unit circuit board falls off from the substrate.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (9)
1. A processing method of an embedded unit circuit board is characterized by comprising the following steps:
preparing a substrate and carrying out pre-processing, and obtaining a plurality of unit circuit boards on the substrate, wherein the unit circuit boards are arranged to be matched with each stamping die;
carrying out contour stamping on the substrate to obtain the contours of the unit circuit boards;
carrying out hole and groove punching on the substrate to obtain a hole and groove on the substrate;
carrying out flattening stamping on the substrate to flatten the surface of the unit circuit board;
the whole processing of all the unit circuit boards leads the outlines of all the unit circuit boards on one substrate to be punched and formed at one time, and the pressure applied to each unit circuit board by the punching machine in one-time processing is the same, thus leading the pressure born by each processed board body to be consistent;
and carrying out pressure detection on the unit circuit board, wherein the pressure detection specifically comprises the steps of placing the substrate below a pressure detection device, enabling a joint of the pressure detection device to be abutted against the unit circuit board, setting the downward pressure of the pressure detection device, enabling the joint to press down the unit circuit board by the downward pressure, and observing whether the unit circuit board falls off from the substrate so as to judge whether the pressure bearing capacity of the unit circuit board is qualified.
2. The method of claim 1, wherein the step of outline-stamping the substrate comprises: and putting the substrate into a processing station of a punch press, and punching the substrate through a first upper die and a first lower die so as to punch the appearance of the unit circuit board.
3. The method of processing an in-cell circuit board as claimed in claim 2, wherein: the first upper die comprises a plurality of protrusions arranged at intervals, the protrusions are matched with the unit circuit board in shape, the first lower die further comprises a plurality of concave portions, the concave portions are matched with the positions of the protrusions, and the concave portions are matched with the unit circuit board in shape.
4. The method for processing the embedded unit circuit board according to claim 1, wherein the step of punching the substrate with the hole and the slot comprises: and putting the substrate into a processing station of a punch press, and punching the substrate through a second upper die and a second lower die so as to punch the technical edges of the unit circuit board and the groove positions on the periphery of the unit circuit board.
5. The method of manufacturing an in-cell circuit board as claimed in claim 4, wherein: the second is gone up the mould and is included evenly distributed's bar arch, the second lower mould include with the protruding complex bar recess of bar.
6. The method for processing the embedded unit circuit board according to claim 1, wherein the step of flatly stamping the substrate comprises: and putting the substrate into a processing station of a punch press, and punching the substrate through a third upper die and a third lower die so as to level the surface of the unit circuit board.
7. The method of manufacturing an in-cell circuit board as claimed in claim 6, wherein: and the third upper die and the third lower die both comprise smooth planes.
8. The method of processing an in-cell circuit board as claimed in claim 1, wherein: the pressure detection device comprises a detection main body, wherein the detection main body comprises a pressure gauge, a joint and an adjusting mechanism, the adjusting mechanism comprises an adjusting handle, and the adjusting handle is connected with the pressure gauge and the joint.
9. The method of manufacturing an in-cell circuit board as claimed in claim 8, wherein: the pressure detection device further comprises a pressure-bearing die, the pressure-bearing die is arranged below the joint, and the pressure-bearing die is provided with a through hole matched with the unit circuit board in shape.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011380019.5A CN112367768B (en) | 2020-11-30 | 2020-11-30 | Processing method of embedded unit circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011380019.5A CN112367768B (en) | 2020-11-30 | 2020-11-30 | Processing method of embedded unit circuit board |
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| CN112367768A CN112367768A (en) | 2021-02-12 |
| CN112367768B true CN112367768B (en) | 2022-01-07 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207744236U (en) * | 2017-11-24 | 2018-08-17 | 佛山市浩汛电子科技有限公司 | A kind of pcb board seperator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19906209C2 (en) * | 1999-02-15 | 2003-03-20 | Possehl Electronic Gmbh | Method for removing individual circuit units from a panel |
| JP3915982B2 (en) * | 2003-03-12 | 2007-05-16 | 太平電子工業有限会社 | Processed plate and method for manufacturing the same, mold for processing base plate, and method for manufacturing pushback plate |
| CN100420553C (en) * | 2005-11-02 | 2008-09-24 | 富展电子（上海）有限公司 | Method for die cutting flexible circuit board |
| CN201726605U (en) * | 2010-07-22 | 2011-01-26 | 天津普林电路股份有限公司 | Metal substrate planing device for high-density interconnected circuit board |
| CN103517575A (en) * | 2013-07-24 | 2014-01-15 | 昆山荣迈电子有限公司 | Method for transplant grafting of printed circuit board |
| CN106851995A (en) * | 2017-04-10 | 2017-06-13 | 昆山苏杭电路板有限公司 | The high-accuracy multi-joint removable processing method for filling unit printed board |
| CN209408656U (en) * | 2019-01-19 | 2019-09-20 | 久群精密机械(昆山)有限公司 | A kind of PCB squeezes flat one-pass molding stamping die |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207744236U (en) * | 2017-11-24 | 2018-08-17 | 佛山市浩汛电子科技有限公司 | A kind of pcb board seperator |
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Denomination of invention: The Processing Method of Embedded Unit Circuit Board Effective date of registration: 20231215 Granted publication date: 20220107 Pledgee: China Co. truction Bank Corp Jiangmen branch Pledgor: JIANGMEN GLORY FAITH PCB Co.,Ltd. Registration number: Y2023980072186 |
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