CN112366283B - Display substrate, preparation method thereof and display device - Google Patents

Display substrate, preparation method thereof and display device Download PDF

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Publication number
CN112366283B
CN112366283B CN202011247394.2A CN202011247394A CN112366283B CN 112366283 B CN112366283 B CN 112366283B CN 202011247394 A CN202011247394 A CN 202011247394A CN 112366283 B CN112366283 B CN 112366283B
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Prior art keywords
layer
substrate
metal layer
display area
display
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CN112366283A (en
Inventor
张则瑞
李仁佑
樊浩原
王子峰
李大利
胡勇
李旭伟
陈启程
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BOE Technology Group Co Ltd
Mianyang BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Mianyang BOE Optoelectronics Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens

Abstract

The invention discloses a display substrate, a preparation method thereof and a display device, wherein the display substrate comprises a base, the base is provided with a display area and a non-display area surrounding the display area, the non-display area comprises a Pad area positioned on one side of the display area, and the display substrate further comprises: the blocking structure is positioned in the non-display area; the inorganic film layer covers the display area and the non-display area, the inorganic film layer is arranged on one side of the blocking structure far away from the substrate, and the part of the blocking structure covered by the inorganic film layer and the blocking structure form a blocking dam; the metal layer structure, be located the Pad district, the metal layer structure is located the one side that the basement was kept away from to inorganic rete, the metal layer structure includes first metal layer and the second metal layer that stacks gradually keeping away from in the basement direction, first metal layer has many first metal wires, the second metal layer has many second metal wires, first metal layer overlaps at the orthographic projection of basement and second metal layer at the basement, the barrier dam in the Pad district is the criss-cross setting with first metal layer at the orthographic projection of basement.

Description

Display substrate, preparation method thereof and display device
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a preparation method thereof and a display device.
Background
In an Active-matrix organic light-emitting diode (AMOLED) product, a Pad (wiring) region is generally disposed on one side of a display region, and a Dam (Dam) structure is disposed in the Pad region, and generally, a groove is formed in an edge of a planar Planarization Layer (PLN)/poly-display (PDL) (Pixel definition Layer).
In the AMOLED touch screen technology, after an FMLOC (Flexible Multi-Layer On Cell) process is completed, OC (transparent optical glue) glue is covered for packaging, a Dam structure in a Pad area needs to use thicker OC glue, and if the OC glue is thinned, a metal wire at the place is exposed, so that the problem of poor reliability is caused.
Disclosure of Invention
In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide a display substrate, a method for manufacturing the same, and a display device.
In a first aspect, the present invention provides a display substrate, including a base, where the base has a display area and a non-display area surrounding the display area, and the non-display area includes a Pad area located on one side of the display area, and the display substrate further includes:
a blocking structure located in the non-display area, the blocking structure surrounding the display area;
the inorganic film layer covers the display area and the non-display area, the inorganic film layer is arranged on one side of the barrier structure far away from the substrate, and the part of the inorganic film layer covering the barrier structure and the barrier structure form a barrier dam;
the metal layer structure is located in the Pad area, the metal layer structure is arranged on one side, far away from the substrate, of the inorganic film layer, the metal layer structure comprises a first metal layer and a second metal layer which are sequentially stacked in the direction far away from the substrate, the first metal layer is provided with a plurality of first metal wires, the second metal layer is provided with a plurality of second metal wires, the orthographic projection of the substrate is overlapped with the orthographic projection of the substrate by the first metal layer, and the orthographic projection of the substrate is intersected with the orthographic projection of the substrate by the first metal layer in the Pad area.
Optionally, the display substrate further includes: the interlayer insulating layer covers the display area and the non-display area, and is arranged on one side, far away from the substrate, of the first metal layer;
in the direction perpendicular to the substrate, the first metal layer has a top portion facing the blocking dam, the interlayer insulating layer exposes at least the top portion of the first metal layer, and the second metal layer is connected to the top portion of the first metal layer.
Optionally, the display substrate further includes: and the protective layer is positioned on one side of the metal layer structure, which is far away from the substrate, and covers the display area and the non-display area.
Optionally, the protective layer is transparent optical cement.
Optionally, the display region has a plurality of pixel units, each pixel unit includes a plurality of sub-pixel units, each sub-pixel unit includes a driving device and a light emitting device, the driving device includes at least a planarization layer, the light emitting device includes at least a pixel defining layer, and the blocking structure is disposed on the same layer as the planarization layer and/or the pixel defining layer.
Optionally, the inorganic film layer includes at least two inorganic film layers.
Optionally, the display area is provided with a touch electrode layer; in the direction that the inorganic film layer is far away from the substrate, the touch electrode layer comprises a first electrode layer and a second electrode layer which are arranged in a stacked mode, the first electrode layer and the second electrode layer are arranged in a crisscross mode and in an insulating mode, and one of the first electrode layer and the second electrode layer and the metal layer structure are arranged in the same direction and on the same layer.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a display substrate, including:
providing a substrate, wherein the substrate comprises a display area and a non-display area surrounding the display area, and the non-display area comprises a Pad area positioned on one side of the display area;
forming a blocking structure, wherein the blocking structure is positioned on one side of the substrate and is positioned in the non-display area;
forming an inorganic film layer, wherein the inorganic film layer covers the display area and the non-display area, the inorganic film layer is arranged on one side of the barrier structure far away from the substrate, and the part of the barrier structure, which is wrapped by the inorganic film layer, and the barrier structure form a barrier dam;
forming a first metal layer comprising a plurality of first metal lines, wherein the first metal layer is positioned in the Pad area and on one side of the inorganic film layer opposite to the substrate, and the first metal layer is provided with a top part opposite to the blocking dam;
forming an interlayer insulating layer, wherein the interlayer insulating layer at least exposes the top of the first metal layer;
forming a second metal layer comprising a plurality of second metal lines, wherein the second metal layer is positioned in the Pad area and is positioned on one side, back to the substrate, of the interlayer insulating layer; wherein the content of the first and second substances,
the orthographic projection of the first metal layer on the substrate is overlapped with the orthographic projection of the second metal layer on the substrate, and the orthographic projection of the barrier dam of the Pad area on the substrate is criss-cross with the orthographic projection of the first metal layer on the substrate.
Optionally, after forming the second metal layer, the method for manufacturing a display substrate further includes: forming a protective layer covering the display region and the non-display region.
In a third aspect, an embodiment of the present invention further provides a display device, including the display substrate.
In the display substrate provided by the embodiment of the invention, the first metal layer and the second metal layer which are positioned above Dam of the Pad area are in direct contact, so that an interlayer insulating layer between two metal layers at Dam is omitted, the thickness of a film layer on Dam is effectively reduced, the thickness of a protective layer at Dam can be effectively reduced, and the cost is reduced; the first metal layer and the second metal layer are connected in parallel, so that the impedance can be effectively reduced; the thickness of the film layer is integrally reduced, the occurrence rate of rainbow patterns is reduced, and the integral transmittance of the substrate is improved.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments made with reference to the following drawings:
fig. 1 is a top view of a display substrate according to an embodiment of the invention;
fig. 2 is a schematic structural diagram of a Pad area of a display substrate according to an embodiment of the present invention;
FIG. 3 isbase:Sub>A schematic cross-sectional view taken along the line A-A in FIG. 2;
fig. 4 to 7 are schematic views illustrating a manufacturing process of a display substrate according to an embodiment of the invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In the present invention, the two structures "layered" means that they are formed of the same material layer, and thus they are in the same layer in a layered relationship, but do not represent that they are equidistant from the substrate, nor that they are completely the same as the other layer structure between the substrate.
As shown in fig. 1 to fig. 3, an embodiment of the present invention provides a display substrate, including a substrate 10, the substrate 10 having a display area 1 and a non-display area 2 surrounding the display area 1, the non-display area 2 including a Pad area 3 located on one side of the display area 1, the display substrate further including:
the barrier structure is positioned in the non-display area 2 and surrounds the display area 1;
the inorganic film layer 5 covers the display area 1 and the non-display area 2, the inorganic film layer 5 is arranged on one side of the blocking structure far away from the substrate 10, and the part of the blocking structure covered by the inorganic film layer 5 and the blocking structure form a blocking dam 4;
the metal layer structure is located Pad area 3, the metal layer structure is located the one side that inorganic rete 5 kept away from base 10, the metal layer structure includes first metal layer 6 and the second metal layer 7 that stacks gradually in keeping away from base 10 direction, first metal layer 6 has many first metal wires, second metal layer 7 has many second metal wires, first metal layer 6 overlaps at the orthographic projection of base 10 and second metal layer 7 at the orthographic projection of base 10, the barrier 4 of Pad area 3 is at the orthographic projection of base 10 and first metal layer 6 and is the crisscross setting at the orthographic projection of base 10.
In an embodiment of the present invention, at least one dam (dam) may be disposed in the non-display region to prevent water oxygen from intruding into the display region. As shown in fig. 1, the non-display area is provided with two blocking dams, which can achieve good water and oxygen blocking effect for the display area.
In the display substrate provided by the embodiment of the invention, a plurality of pixel units are arranged in a display area, each pixel unit comprises a plurality of sub-pixel units (such as a red sub-pixel, a blue sub-pixel and a green sub-pixel), each sub-pixel unit is surrounded by a gate line and a data line which are crossed horizontally and vertically, and each sub-pixel unit comprises a driving device (such as a thin film transistor) and a light emitting device. Specifically, an active layer, a first insulating layer, a gate electrode, a second insulating layer and a source drain metal layer containing a source electrode and a drain electrode are sequentially stacked on one side of the substrate from the direction close to the substrate to the direction far away from the substrate, the active layer is provided with a source region and a drain region, the source electrode and the drain electrode are respectively connected with the source region and the drain region of the active layer, and the thin film transistor comprises an active layer, a gate electrode and a source drain metal layer;
the light-emitting device comprises a source drain metal layer, a substrate, a source drain metal layer, a pixel definition layer, a supporting layer, an organic light-emitting layer and a cathode, wherein the source drain metal layer is arranged on one side opposite to the substrate;
the inorganic film layer 5 is arranged on one side of the organic light emitting layer, which is back to the substrate, and the touch module is arranged in the display area and on one side of the inorganic film layer 5, which is back to the substrate, and comprises a first electrode layer and a second electrode layer which are stacked and insulated at intervals.
In this embodiment, the inorganic film layer 5 is preferably a CVD (Chemical Vapor Deposition) layer including at least two inorganic thin film layers, such as a first inorganic thin film layer CVD1 (No. 51) and a second inorganic thin film layer CVD2 (No. 52), and the CVD1/CVD2 functions as a barrier against water and oxygen attack to the inside.
In an embodiment of the present invention, the barrier structure is disposed in a same layer as the planarization layer and/or the pixel defining layer. As shown in fig. 3, the barrier structure includes a planarization layer 12 and a pixel defining layer 13.
For example, the substrate may be polyimide, and a planarization layer may be formed on the substrate before the active layer is formed. In this embodiment, the planarization layer 12 preferably includes a first planarization layer 121 between the substrate and the active layer and a second planarization layer 122 between the source-drain metal layer and the anode.
As an optional implementation, the display substrate further includes: the interlayer insulating layer 9, the interlayer insulating layer 9 covers the display area 1 and the non-display area 2, and the interlayer insulating layer 9 is arranged on one side of the first metal layer 6 far away from the substrate 10; the first metal layer 6 has a top facing the barrier dam 4 in a direction perpendicular to the substrate 10, the interlayer insulating layer 9 exposes at least the top of the first metal layer 6, and the second metal layer 7 is connected to the top of the first metal layer 6.
The first metal lines and the second metal lines are correspondingly stacked one by one, the top of the first metal layer is contacted with the second metal layer by referring to an overlapping area indicated by a number 8, and the first metal layer and the second metal layer are connected in parallel, so that the impedance can be effectively reduced.
In the display area portion of the embodiment of the invention, for example, the first electrode layer includes a plurality of first touch electrodes distributed along the transverse direction, and each first touch electrode is a strip electrode; the second electrode layer comprises a plurality of second touch control electrodes distributed along the longitudinal direction, each second touch control electrode comprises a plurality of independent sub-electrodes, and adjacent sub-electrodes of the same second touch control electrode are connected through the bridging layer. The first touch electrode may be a driving electrode and the second touch electrode may be a sensing electrode, or the first touch electrode may be a sensing electrode and the second touch electrode may be a driving electrode.
For example, a plurality of first grooves and a plurality of second grooves are formed in the CVD2, the first touch electrodes are located in the corresponding first grooves, the sub-electrodes of the second touch electrodes are located in the corresponding second grooves, the interlayer insulating layer 9 covers the CVD2, the interlayer insulating layer 9 has via holes at the intersection of the first touch electrodes and the second touch electrodes, the sub-electrodes of the second touch electrodes are connected with the layer through the via holes, wherein the depth of the first grooves is less than or equal to the thickness of the CVD2, and the thickness of the first touch electrodes is less than the depth of the first grooves; the depth of the second groove is smaller than or equal to the thickness of the CVD2, and the thickness of the second touch electrode is equal to the depth of the second groove.
In the embodiment of the invention, the first touch electrode and the second touch electrode are criss-cross and insulated, and one of the first touch electrode and the second touch electrode is arranged in the same direction and in the same layer as the metal layer structure. In the invention, the first metal layer and the sub-electrodes of the second touch electrode are preferably arranged in the same layer, and the second metal layer and the bridging layer are preferably arranged in the same layer.
As an optional implementation, the display substrate further includes: and the protective layer 11, wherein the protective layer 11 is positioned on one side of the metal layer structure far away from the substrate 10 and covers the display area 1 and the non-display area 2. Because the interlayer insulating layer 9 at least exposes the top of the first metal layer 6, and the second metal layer 7 is connected with the top of the first metal layer 6, the thickness of the protective layer can be reduced, the rainbow texture occurrence rate can be reduced, the overall transmittance of the substrate can be improved, and the cost can be effectively reduced.
Optionally, the protective layer 11 is a transparent optical glue.
As shown in fig. 4 to 7, an embodiment of the present invention further provides a method for manufacturing a display substrate, including:
providing a substrate 10, wherein the substrate 10 comprises a display area 1 and a non-display area 2 surrounding the display area 1, and the non-display area 2 comprises a Pad area 3 positioned on one side of the display area 1;
forming a barrier structure, wherein the barrier structure is positioned on one side of the substrate 10 and is positioned in the non-display area 2;
forming an inorganic film layer 5, wherein the inorganic film layer 5 covers the display area 1 and the non-display area 2, the inorganic film layer 5 is arranged on one side of the barrier structure far away from the substrate 10, and the part of the barrier structure, which is wrapped by the inorganic film layer 5, and the barrier structure form a barrier dam 4;
forming a first metal layer 6 comprising a plurality of first metal wires, wherein the first metal layer 6 is positioned in the Pad area 3 and on one side of the inorganic film layer 5 opposite to the substrate 10, and the first metal layer 6 is provided with a top part opposite to the blocking dam 4;
forming an interlayer insulating layer 9, wherein the interlayer insulating layer 9 exposes at least the top of the first metal layer 6;
forming a second metal layer 7 comprising a plurality of second metal lines, wherein the second metal layer 7 is positioned in the Pad area 3 and on one side of the interlayer insulating layer 9, which faces away from the substrate 10; wherein the content of the first and second substances,
the orthographic projection of the first metal layer 6 on the substrate 10 is overlapped with the orthographic projection of the second metal layer 7 on the substrate 10, and the orthographic projection of the barrier dam 4 of the Pad area 3 on the substrate 10 is crosswise arranged with the orthographic projection of the first metal layer 6 on the substrate 10.
Referring to fig. 4, an interlayer insulating film layer covers a side of the first metal layer 6 facing away from the substrate;
referring to fig. 5, the interlayer insulating film layer covering the top of the first metal layer 6 is removed to form an interlayer insulating layer 9;
referring to fig. 6, a second metal layer is formed on the side of the interlayer insulating layer 9 opposite to the substrate, and the second metal layer 7 is in contact with the top of the first metal layer 6 to form a parallel structure;
referring to fig. 7, after forming the second metal layer 7, the method of manufacturing a display substrate further includes: a protective layer 11 is formed, the protective layer 11 covering the display region 1 and the non-display region 2.
In the embodiment of the invention, the position of the blocking dam is opposite to the direction vertical to the substrate, the second metal layer is in contact with the first metal layer, and no interlayer insulating layer is arranged between the second metal layer and the first metal layer, so that the thickness of the protective layer covered by the blocking dam is reduced.
The embodiment of the invention also provides a display device which comprises the display substrate of the embodiment. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a display, a notebook computer, a digital photo frame, a navigator and the like.
The foregoing description is only exemplary of the preferred embodiments of the invention and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention is not limited to the specific combination of the above-mentioned features, but also encompasses other embodiments in which any combination of the above-mentioned features or their equivalents is possible without departing from the inventive concept. For example, the above features and (but not limited to) features having similar functions disclosed in the present invention are mutually replaced to form the technical solution.

Claims (9)

1. A display substrate comprising a base having a display area and a non-display area surrounding the display area, the non-display area comprising a Pad area located on one side of the display area, the display substrate further comprising:
a blocking structure located in the non-display area, the blocking structure surrounding the display area;
the inorganic film layer covers the display area and the non-display area, the inorganic film layer is arranged on one side of the barrier structure far away from the substrate, and the part of the inorganic film layer covering the barrier structure and the barrier structure form a barrier dam;
the metal layer structure is positioned in the Pad area, the metal layer structure is arranged on one side, away from the substrate, of the inorganic film layer, the metal layer structure comprises a first metal layer and a second metal layer which are sequentially stacked in the direction away from the substrate, the first metal layer is provided with a plurality of first metal wires, the second metal layer is provided with a plurality of second metal wires, the orthographic projection of the first metal layer on the substrate is overlapped with the orthographic projection of the second metal layer on the substrate, and the orthographic projection of the barrier dam of the Pad area on the substrate and the orthographic projection of the first metal layer on the substrate are arranged in a crisscross mode;
the interlayer insulating layer covers the display area and the non-display area, and is arranged on one side, far away from the substrate, of the first metal layer;
in the direction perpendicular to the substrate, the first metal layer has a top portion facing the blocking dam, the interlayer insulating layer exposes at least the top portion of the first metal layer, and the second metal layer is connected to the top portion of the first metal layer.
2. The display substrate of claim 1, further comprising: and the protective layer is positioned on one side of the metal layer structure, which is far away from the substrate, and covers the display area and the non-display area.
3. The display substrate of claim 2, wherein the protective layer is a transparent optical glue.
4. The display substrate according to claim 1, wherein the display region has a plurality of pixel units, each of the pixel units comprises a plurality of sub-pixel units, the sub-pixel units comprise a driving device and a light emitting device, the driving device comprises at least a planarization layer, the light emitting device comprises at least a pixel defining layer, and the barrier structure is disposed in a same layer as the planarization layer and/or the pixel defining layer.
5. The display substrate of claim 1, wherein the inorganic film layer comprises at least two inorganic film layers.
6. The display substrate according to claim 1, wherein the display region is provided with a touch electrode layer; in the direction that the inorganic film layer is far away from the substrate, the touch electrode layer comprises a first electrode layer and a second electrode layer which are arranged in a stacked mode, the first electrode layer and the second electrode layer are arranged in a crisscross mode and in an insulating mode, and one of the first electrode layer and the second electrode layer and the metal layer structure are arranged in the same direction and on the same layer.
7. A method for preparing a display substrate is characterized by comprising the following steps:
providing a substrate, wherein the substrate comprises a display area and a non-display area surrounding the display area, and the non-display area comprises a Pad area positioned on one side of the display area;
forming a blocking structure, wherein the blocking structure is positioned on one side of the substrate and is positioned in the non-display area;
forming an inorganic film layer, wherein the inorganic film layer covers the display area and the non-display area, the inorganic film layer is arranged on one side of the barrier structure far away from the substrate, and the part of the barrier structure, which is wrapped by the inorganic film layer, and the barrier structure form a barrier dam;
forming a first metal layer comprising a plurality of first metal lines, wherein the first metal layer is positioned in the Pad area and on one side of the inorganic film layer opposite to the substrate, and the first metal layer is provided with a top part opposite to the blocking dam;
forming an interlayer insulating layer, wherein the interlayer insulating layer at least exposes the top of the first metal layer;
forming a second metal layer comprising a plurality of second metal lines, wherein the second metal layer is positioned in the Pad area and is positioned on one side, back to the substrate, of the interlayer insulating layer; wherein the content of the first and second substances,
the orthographic projection of the first metal layer on the substrate is overlapped with the orthographic projection of the second metal layer on the substrate, and the orthographic projection of the barrier dam of the Pad area on the substrate is criss-cross with the orthographic projection of the first metal layer on the substrate.
8. The method for manufacturing a display substrate according to claim 7, further comprising, after forming the second metal layer: forming a protective layer covering the display region and the non-display region.
9. A display device comprising the display substrate according to any one of claims 1 to 6.
CN202011247394.2A 2020-11-10 2020-11-10 Display substrate, preparation method thereof and display device Active CN112366283B (en)

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